Kontron KTQ45/Flex User manual

If it’s embedded, it’s Kontron
KTQ45 Users Guide
KTD-00782-H
KTQ45/Flex
KTQ45/ATXE

KTD-00782-H KTQ45 family Page 2 of 92
Document revision history.
Revision
Date
By
Comment
H July 14th 2011 MLA
Corrected version of the Standard 60950-1. Page 71 correction.
Added BIOS setting “C1E Support” and “Intel VT-d”. New pictures.
G Dec. 23rd 2010 MLA
Corrected maximum RAM support. Note for using 820982
corrected. ADD2-CRT support added. Chapter 2.4 corrections.
Added note for using both Onboard Graphics and PCIe card.
Added
note about using SATA converter.
F Feb. 25th 2010 MLA
Added note on Memory Remap Feature. ATX+12V pining
corrected. Chapter 2.5 updated. Other minor corrections.
E Nov. 25th 2009 JSE/MLA
Connector list corrected. CPU list correction. Table page 17
corrected. Page 36 (& 12), RS485 description & Note 1 changed.
D
Nov. 17th 2009
MLA
Added/corrected info about ETHER1/ETHER2. RAM PN corrected.
C Oct. 12th 2009 MLA
Memory Map corrected. JP8 info on page 36 corrected. Added
“mounting the board to chassis”. PCIe x4 standard 1.1 added.
B Sep. 22nd 2009 MLA
On page 18: DDR2 corrected to DDR3. Other minor corrections.
BIOS part updated and new layout.
A
Aug. 21st 2009
MLA
Layout improvements. Minor additions.
0
July 9th 2009
JSE/MLA
Initial release
Copyright Notice:
Copyright 2007, KONTRON Technology A/S, ALL RIGHTS RESERVED.
No part of this document may be reproduced or transmitted in any form or by any means, electronically or
mechanically, for any purpose, without the express written permission of KONTRON Technology A/S.
Trademark Acknowledgement:
Brand and product names are trademarks or registered trademarks of their respective owners.
Disclaimer:
KONTRON Technology A/S reserves the right to make changes, without notice, to any product, including
circuits and/or software described or contained in this manual in order to improve design and/or
performance.
Specifications listed in this manual are subject to change without notice. KONTRON Technology assumes no
responsibility or liability for the use of the described product(s), conveys no license or title under any patent,
copyright, or mask work rights to these products, and makes no representations or warranties that these
products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
Applications that are described in this manual are for illustration purposes only. KONTRON Technology A/S
makes no representation or warranty that such application will be suitable for the specified use without
further testing or modification.

KTD-00782-H KTQ45 family Page 3 of 92
Life Support Policy
KONTRON Technology’s PRODUCTS ARE NOT FOR USE AS CRITICAL COMPONENTS IN LIFE
SUPPORT DEVICES OR SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL OF THE GENERAL
MANAGER OF KONTRON Technology A/S.
As used herein:
Life support devices or systems are devices or systems which, (a) are intended for surgical implant into
body, or (b) support or sustain life and whose failure to perform, when properly used in accordance with
instructions for use provided in the labelling, can be reasonably expected to result in significant injury to the
user.
A critical component is any component of a life support device or system whose failure to perform can be
reasonably expected to cause the failure of the life support device or system, or to affect its safety or
effectiveness.
KONTRON Technology Technical Support and Services
If you have questions about installing or using your KONTRON Technology Product, check this User’s
Manual first – you will find answers to most questions here. To obtain support, please contact your local
Distributor or Field Application Engineer (FAE).
Before Contacting Support: Please be prepared to provide as much information as possible:
•CPU Board
1. Type.
2. Part Number (find PN on label)
3. Serial Number if available (find SN on label)
•Configuration
1. CPU Type, Clock speed
2. DRAM Type and Size.
3. BIOS Revision (Find the Version Info in the BIOS Setup).
4. BIOS Settings different than Default Settings (Refer to the BIOS Setup Section).
•System
1. O/S Make and Version.
2. Driver Version numbers (Graphics, Network, and Audio).
3. Attached Hardware: Harddisks, CD-rom, LCD Panels etc.

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» Table of Contents «
Introduction.............................................................................................8
1Installation procedure...................................................................... 9
1.1 Installing the board........................................................................................................................9
1.2 Requirement according to IEC60950..........................................................................................11
2System specification...................................................................... 12
2.1 Component main data.................................................................................................................12
2.2 System overview.........................................................................................................................15
2.3 Processor Support Table ............................................................................................................16
2.4 System Memory support.............................................................................................................18
2.5 KTQ45 Graphics Subsystem ......................................................................................................20
2.5.1 Intel® GMA 4500 .......................................................................................................................20
2.5.2 DVMT 5.0 support......................................................................................................................20
2.5.3 ADD2 card support....................................................................................................................21
2.5.4 PCIe Passive Graphic card support .......................................................................................... 21
2.6 Power Consumption....................................................................................................................22
3Connector Definitions .................................................................... 24
3.1 Connector layout.........................................................................................................................25
3.1.1 KTQ45/Flex................................................................................................................................25
3.1.2 KTQ45 - IO Bracket area...........................................................................................................25
3.1.3 KTQ45/ATXE............................................................................................................................. 26
3.2 Power Connector (ATXPWR) .....................................................................................................27
3.3 Keyboard and Mouse connectors...............................................................................................28
3.3.1 MINI-DIN Keyboard and Mouse Connector (KBD)....................................................................28
3.3.2 Keyboard and Mouse pinrow Connector (KBDMSE) ................................................................28
3.4 Display connector........................................................................................................................29
3.4.1 CRT Connector (CRT)............................................................................................................... 29
3.5 PCI-Express connectors .............................................................................................................30
3.5.1 PCI-Express x16/SDVO Connector (PCIe x16/SDVO) .............................................................30
3.5.2 PCI-Express x4 Connector (PCIe x4)........................................................................................31
3.6 Serial ATA Hard Disk interface...................................................................................................33
3.6.1 SATA Hard Disk Connector (SATA1, SATA2, SATA3, SATA4, SATA5)..................................33
3.7 Printer Port Connector (LPT)......................................................................................................34

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3.8 Serial Ports..................................................................................................................................35
3.8.1 COM1 Connectors.....................................................................................................................35
3.8.2 COM2 and COM3 Header Connectors......................................................................................36
3.8.3 COM4 Header Connectors........................................................................................................36
3.9 Ethernet Connectors...................................................................................................................37
3.9.1Ethernet Connectors 1 and 2 (ETHER1 and ETHER2).............................................................37
3.10 USB Connectors (USB) .............................................................................................................. 38
3.10.1 USB Connector 2/3 (USB2/3)....................................................................................................38
3.10.2 USB Connector 4/5 (USB4/5)....................................................................................................39
3.10.3 USB Connector 0/1/6/7 (USB0/1/6/7)........................................................................................39
3.10.4 USB Connector 8/9 (USB8/9)....................................................................................................40
3.10.5 USB Connector 10/11 (USB10/11)............................................................................................40
3.11 Audio Connectors........................................................................................................................41
3.11.1 Audio Speakers, Line-In, Line-Out and Microphone .................................................................41
3.11.2 CDROM Audio Input (CDROM).................................................................................................42
3.11.3 Audio Header (AUDIO_HEAD)..................................................................................................43
3.12 Fan Connector (FAN_CPU)........................................................................................................44
3.13 Clear CMOS Jumper (Clr-CMOS /JBAT1)..................................................................................45
3.14 The Clear ME register Jumper (Clr-ME / JBAT2).......................................................................45
3.15 The SPI Jumper (SPI-Jumper / JP6) ..........................................................................................45
3.16 Interface BIOS Jumpers (JP3 and JP5))..................................................................................... 45
3.17 TPM Connector (TPM)................................................................................................................46
3.18 SPI Connector (SPI)....................................................................................................................46
3.19 Front Panel Connector (FRONTPNL).........................................................................................47
3.20 Feature Connector (FEATURE)..................................................................................................48
3.21 PCI Slot Connector (PCI Slot).....................................................................................................49
3.21.1 Signal Description – PCI Slot Connector...................................................................................50
3.21.2 KTQ45 PCI IRQ & INT routing...................................................................................................51
4Onboard connectors and Mating connectors ................................. 52
5System Resources ........................................................................ 53
5.1 Memory Map ...............................................................................................................................53
5.2 PCI Devices ................................................................................................................................ 54
5.3 Interrupt Usage ...........................................................................................................................55
5.4 IO Map ........................................................................................................................................56
6Overview of BIOS Features........................................................... 57

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6.1 System Management BIOS (SMBIOS/DMI) ...............................................................................57
6.2 Legacy USB Support...................................................................................................................57
6.3 BIOS Update...............................................................................................................................57
BIOS Configuration/Setup..................................................................... 58
6.4 Introduction .................................................................................................................................58
6.5 Main Menu ..................................................................................................................................58
6.6 Advanced Menu..........................................................................................................................59
6.6.1 Advanced settings – CPU Configuration...................................................................................60
6.6.2 Advanced settings – IDE Configuration..................................................................................... 61
6.6.3 Advanced settings – LAN Configuration....................................................................................64
6.6.4 Advanced settings – Configure Win627DHG Super IO Chipset................................................65
6.6.5 Advanced settings – Hardware Health Configuration................................................................ 67
6.6.6 Advanced settings – Voltage Monitor........................................................................................68
6.6.7 Advanced settings – ACPI Settings...........................................................................................69
6.6.8 Advanced settings – Intel AMT Configuration ...........................................................................70
6.6.9 Advanced settings – Intel VT-d Configuration...........................................................................71
6.6.10 Advanced settings – Remote Access Configuration .................................................................72
6.6.11 Advanced settings – Trusted Support .......................................................................................73
6.6.12 Advanced settings – USB Configuration ...................................................................................74
6.6.13 Advanced settings – USB Mass Storage Device Configuration................................................75
6.7 PCIpnp Menu..............................................................................................................................76
6.8 Boot Menu................................................................................................................................... 77
6.8.1 Boot – Boot Settings Configuration ...........................................................................................78
6.8.2 Boot – Boot Device Priority........................................................................................................79
6.9 Security Menu ............................................................................................................................. 80
6.10 Chipset Menu..............................................................................................................................82
6.10.1 Advanced Chipset Settings – North Bridge Chipset Configuration ...........................................83
6.10.2 Advanced Chipset … – North Br. … – Video Function Configuration.......................................84
6.10.3 Advanced Chipset Settings – South Bridge Chipset Configuration...........................................86
6.10.4 Advanced Chipset Settings – ME Subsystem Configuration.....................................................87
6.10.5 Advanced Chipset Settings – VE Subsystem Configuration.....................................................88
6.10.6 Advanced Chipset Settings – Spread Spectrum Control...........................................................89
6.11 Exit Menu ....................................................................................................................................90
7AMI BIOS Beep Codes.................................................................. 91
8OS Setup....................................................................................... 92

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9Warranty........................................................................................ 92

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Introduction
This manual describes the KTQ45/Flex and KTQ45/ATXE boards made by KONTRON Technology A/S. The
boards will also be denoted KTQ45 family if no differentiation is required.
The KTQ45 boards supports the Intel® Core™2 Quad processor Q9000 series, the Intel® Core™2 Duo
processor E8000 and E7000 series with a maximum TDP of 95W. These processors belong to the Intel
Yorkfield and Wolfdale families.
KTQ45 family differences
Format
PCI
RS232
RS485
KTQ45/Flex Flex 2 2 0
KTQ45/ATXE ATX 4 3 1
Use of this Users Guide implies a basic knowledge of PC-AT hard- and software. This manual is focused on
describing the KTQ45 Board’s special features and is not intended to be a standard PC-AT textbook.
New users are recommended to study the short installation procedure stated in the following chapter before
switching-on the power.
All configuration and setup of the CPU board is either done automatically or by the user in the CMOS setup
menus. Except for the CMOS Clear jumper (JBAT1), ME Jumper (JBAT2), SPI jumper (JP6), Interface BIOS
jumper (JP3 and JP5), RS485 mode selection jumper (KTQ45/ATXE only) (JP7&JP9).

KTD-00782-H KTQ45 family Page 9 of 92
!
Warning: Turn off PSU (Power Supply Unit) completely (no mains power connected to the
PSU) or leave the Power Connectors unconnected while configuring the board. Otherwise
components (RAM, LAN cards etc.) might get damaged.
Do not use PSU’s without 3.3V monitoring watchdog, which is standard feature in ATX PSU’s.
Running the board without 3.3V connected will damage the board after a few minutes.
!
1 Installation procedure
1.1 Installing the board
To get the board running, follow these steps. In some cases the board shipped from KONTRON Technology
has DDR3 DRAM mounted. In this case Step 2 can be skipped.
1. Turn off the power supply
2. Insert the DDR3 DIMM 240pin DRAM module(s)
Be careful to push it in the slot(s) before locking the tabs. For a list of approved DDR3 DIMM modules
contact your Distributor or FAE.
DDR3-800/1066 DIMM 240pin DRAM modules (PC3-6400/PC3-8500) are supported.
3. Install the processor
The CPU is keyed and will only mount in the CPU socket in one way. Use the handle to open/ close the
CPU socket. The Intel® Core™2 Quad, Intel® Core™2 Duo in the LGA775 package are supported, refer
to supported processor overview for details.
Opening the socket:
Apply pressure to the corner with right hand thumb while opening/closing the load lever, otherwise lever can
bounce back like a “mouse trap” and WILL cause bent contacts (when loaded)
1. Disengage Load Lever by depressing down and out on the hook to clear retention tab
2. Rotate Load Lever to fully open position at approximately 135°
3. Rotate Load Plate to fully open position at approximately 100°
Remove Socket Protective Cover
With left hand index finger and thumb to support the load plate edge, engage protective cover finger tab with
right hand thumb and peel the cover from LGA775 Socket while pressing on center of protective cover to
assist in removal.
Set protective cover aside. Always put cover back on if the processor is removed from the socket.
IMPORTANT: For return goods (RMA): warranty is void if returned without Protective cover.
Do NOT touch socket contacts
NOTE: Regardless of the Memory
configuration used, DDR3 SLOT 1
(J1) must always be populated.

KTD-00782-H KTQ45 family Page 10 of 92
!
Warning: When mounting the board to chassis etc. please notice that the board contains
components on both sides of the PCB which can easily be damaged if board is handled
without reasonable care. A damaged component can result in malfunction or no function at all.
Visually inspect protective cover for damage
If damage observed, replace the cover.
Note: After cover removal, make sure socket load plate and contacts are free of foreign material. Debris may
be removed with compressed air.
Note: Removing protective cover after CPU insertion will compromise the ability to visually inspect socket.
Processor Installation
Locate Connection 1 indicator and the two orientation key notches.
Grasp the processor with thumb and index finger. (Grasp the edges without the orientation notches.)
The socket has cutouts for your fingers to fit into.
Carefully place the package into the socket body using a purely vertical motion. (Tilting the processor into
place or shifting it into place on the socket can damage the sensitive socket contacts.)
CAUTION: Recommend not to use a Vacuum Pen for installation.
Verify that package is within the socket body and properly mated to the orientation keys
Close the socket by:
A. Close the Load Plate
B. While pressing down lightly on Load Plate, engage the Load Lever.
C. Secure Load Lever with Load Plate tab under retention tab of Load Lever
4. Cooler Installation
Use heat paste or adhesive pads between CPU and cooler and connect the Fan electrically to the
FAN_CPU connector.
5. Connecting Interfaces
Insert all external cables for hard disk, keyboard etc. A CRT monitor must be connected in order to
change CMOS settings. When using bootable SATA disk, then connect to SATA0 or SATA2 or select in
BIOS “ATA/IDE Configuration” = Enhanced.
6. Connect Power supply
Connect power supply to the board by the ATX/ BTXPWR and 4-pin ATX connectors. For board to operate
connection of both the ATX/BTX and 4-pin ATX (12V) connectors are required.
7. Turn on the power on the ATX/ BTX power supply
8. Power Button
The PWRBTN_IN must be toggled to start the Power supply; this is done by shorting pins 16
(PWRBTN_IN) and pin 18 (GND) on the FRONTPNL connector (see Connector description). A “normally
open” switch can be connected via the FRONTPNL connector.
9. BIOS Setup
Enter the BIOS setup by pressing the <Del> key during boot up.
Enter Exit Menu and Load Optimal Defaults.
Refer to the “BIOS Configuration / Setup“ section of this manual for details on BIOS setup.
10. Mounting the board to chassis
When fixing the Motherboard on a chassis it is recommended using screws with integrated washer and
having diameter of ~7mm.
Note: Do not use washers with teeth, as they can damage the PCB mounting hole / cause short circuit.
Note: To clear all CMOS settings, including Password protection, move the Clr-CMOS jumper
(with/without power) for ~1 minute. This will also disable any Secure CMOS setup on the board.
Alternatively, turn off power and remove the battery for 1 minute, but be careful to orientate the battery
correctly when reinserted.

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1.2 Requirement according to IEC60950
Users of KTQ45 family boards should take care when designing chassis interface connectors in order to fulfil
the IEC60950 standard:
Lithium Battery precautions:
CAUTION!
Danger of explosion if battery is incorrectly replaced.
Replace only with same or equivalent type
recommended by manufacturer.
Dispose of used batteries according to the
manufacturer’s instructions.
VORSICHT!
Explosionsgefahr bei unsachgemäßem Austausch
der Batterie.
Ersatz nur durch den selben oder einen vom
Hersteller empfohlenen gleichwertigen Typ.
Entsorgung gebrauchter Batterien nach Angaben
des Herstellers.
ADVARSEL!
Lithiumbatteri – Eksplosionsfare ved fejlagtig
håndtering.
Udskiftning må kun ske med batteri
af samme fabrikat
og type.
Levér det brugte batteri tilbage til leverandøren.
ADVARSEL
Eksplosjonsfare ved feilaktig skifte av batteri.
Benytt samme batteritype eller en tilsvarende type
anbefalt av apparatfabrikanten.
Brukte batterier kasseres i henhold til fabrikantens
instruksjoner.
VARNING
Explosionsfara vid felaktigt batteribyte.
Använd samma batterityp eller en ekvivalent typ som
rekommenderas av apparattillverkaren.
Kassera använt batteri enligt fabrikantens instruktion.
VAROITUS
Paristo voi räjähtää, jos se on virheellisesti
asennettu.
Vaihda paristo ainoastaan laltevalmistajan
suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden
mukaisesti.
When an interface/connector has a VCC (or other power) pin, which is directly connected to a power
plane like the VCC plane:
To protect the external power lines of the peripheral devices, the customer has to take care about:
•That the wires have suitable rating to withstand the maximum available power.
•That the enclosure of the peripheral device fulfils the fire protecting requirements of IEC60950.

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2 System specification
2.1 Component main data
The table below summarizes the features of the KTQ45/Flex and KTQ45/ATXE embedded motherboards.
Form factor
KTQ45/Flex: Flex-ATX (190,5 millimetres by 228,6 millimetres)
KTQ45/ATXE: Embedded-ATX (190,5 millimetres by 304,80millimeters)
Processor
•Support for Supports Intel® Core™2 Quad processor Q9000 series, Supports Intel®
Core™2 Duo processor E8000 and E7000 in LGA775 package with up to 1333MHz
system bus and 3/6/12MB internal cache.
•Support for Yorkfield (45 nanometre) and Wolfdale (45 nanometre) family processors.
Memory
•4 pieces DDR3 DIMM 240pin DRAM sockets.
•Dual channel interleaved mode support.
•Support for DDR 800/1066MHz (PC3-6400/PC3-8500)
•Support system memory from 512MB and up to 16GB. Less than 4GB displayed in
System Properties using 32bit OS.
(Shared Video Memory/PCI resources is withdrawn).
•ECC not supported
Chipset
Intel Q45+ICH10DO Chipset consisting of:
•Intel® AC82Q45 Graphics Memory Controller Hub (GMCH)
•Intel® ICH10DO I/O Controller Hub
Security
•Intel® Integrated TPM 1.2 support
Management
•Intel® Active Management Technology (Intel® AMT) 5.0
Video
•Intel® GMA 4500 graphics engine
•Dynamic Video Memory Technology (DVMT 5.0), allowing up to 384MB dynamically
allocated Video Memory (System memory is allocated when it is needed).
•Analogue Display Support CRT, 350-MHz, 24 bit integrated RAMDAC with support for
analogue monitors up to 2048 x 1536 @ 75 Hz
•Native Display port and DVI support. The digital ports are multiplexed on to the PEG
interface using passive PEG card (Accessory).
•Serial Digital Video Out (SDVO) ports (2 channels) for additional CRT, LVDS panel,
DVI, TV-Out and/or HDMI support via Advanced Digital Disp
lay 2 (ADD2) cards or
Media Expansion Cards.
•Dual independent pipe support, Mirror and Dual independent display support
Dual Monitor support with combinations of SDVO port devices and onboard CRT
Audio
Audio, 7.1 Channel High Definition Audio Codec using the VIA 1708B codec
•Line-out
•Line-in
•Surround output: SIDE, LFE, CEN, BACK and FRONT
•Microphone: MIC1
•CDROM in
•SPDIF Interface
•Onboard speaker
(Continues)

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I/O Control
Winbond W83627DHG LPC Bus I/O Controller
Peripheral
interfaces
•Eight USB 2.0 ports on I/O area
•Four USB 2.0 ports on internal pinrows
•Two Serial ports (RS232) KTQ45/Flex, Four Serials ports 3x(RS323), 1x(RS485)
(Galvanic isolated) with full duplex support on KTQ45/ATXE
•One Parallel port, SPP/EPP/ECP
•Five Serial ATA-300 IDE interfaces with RAID 0/1/5/10 support
•PS/2 keyboard and mouse ports
LAN
Support
•1x 10/100/1000Mbits/s using NIC Intel® Boazman-LM WG82567LM (ETHER1)
(connected to ICH10DO Integrated GbE MAC supporting AMT 5.0)
•1x 10/100/1000Mbits/s using NIC Intel® Hartwell 82574L (ETHER2)
•PXE netboot supported. Wake On LAN (WOL) supported.
BIOS
•Kontron Technology / AMI BIOS (core version)
•Support for Advanced Configuration and Power Interface (ACPI 3.0), Plug and Play
oSuspend To Ram
oSuspend To Disk
oIntel Speed Step
•Secure CMOS/ OEM Setup Defaults
•“Always On” BIOS power setting
•RAID Support (RAID modes 0, 1, 5 and 10) (for Linux O/S only RAID 0 and 1)
Expansion
Capabilities
•PCI Bus routed to PCI slot(s) (PCI Local Bus Specification Revision 2.3)
oKTQ45/Flex: 2 slots PCI 2.3, 32 bits, 33 MHz, 5V compliant
oKTQ45/ATXE: 4 slots PCI 2.3, 32 bits, 33 MHz, 5V compliant
•PCI-Express bus routed to PCI Express slot(s) (PCI Express 2.0)
oKTQ45/Flex and KTQ45/ATXE:
1 slot PCI-Express x16 (PCI Express 2.0)
1 slot PCI-Express x4 (PCI Express 1.1)
•SMBus routed to FEATURE, PCI slot, PCI Express
•LPC Bus routed to TPM connector
•DDC Bus routed to CRT connector
•8 x GPIOs (General Purpose I/Os) routed to FEATURE connector
Hardware
Monitor
Subsystem
•Smart Fan control system, support Thermal® and Speed® cruise for three onboard
Fan control connectors: FAN_CPU, FAN_SYS and FEATURE
•
Three thermal inputs: CPU die temperature, System temperature and External
temperature input routed to FEATURE connector. (Precision +/- 3ºC)
•Voltage monitoring
•Intrusion detect input
•
SMI violations (BIOS) on HW monitor not supported. Supported by API (Windows).
Operating
Systems
Support
•WinXP
•WinVista
•Linux: Red Hat 5 U2, SuSe 10 SP2 (limitations may apply)
(Continues)

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Environmental
Conditions Operating:
0°C – 55°C operating temperature (forced cooling). It is the customer’s responsibility
to provide sufficient airflow around each of the components to keep them within
allowed temperature range. Note: KTQ45 operating temperature range is 0°C – 60°C
(forced cooling) but CPU cooling limitations typically lowers the maximum
temperature to 55ºC.
10% - 90% relative humidity (non-condensing)
Storage:
-20°C – 70°C
5% - 95% relative humidity (non-condensing)
Electro Static Discharge (ESD) / Radiated Emissions (EMI):
All Peripheral interfaces intended for connection to external equipment are ESD/ EMI
protected.
EN 61000-4-2:2000 ESD Immunity
EN55022:1998 class B Generic Emission Standard.
Safety:
IEC 60950-1: 2005, 2nd edition
UL 60950-1
CSA C22.2 No. 60950-1
Product Category: Information Technology Equipment Including Electrical Business
Equipment
Product Category CCN: NWGQ2, NWGQ8
File number: E194252
Theoretical MTBF:
449.463 / 226.855 hours @ 40ºC / 60ºC for the KTQ45/Flex
352.559 / 174.306 hours @ 40ºC / 60ºC for the KTQ45/ATXE
Restriction of Hazardous Substances (RoHS):
All boards in the KTQ45 family are RoHS compliant.
Capacitor utilization:
No Tantalum capacitors on board
Only Japanese brand Solid capacitors rated for 100degrees Celsius used on board
Battery
Exchangeable 3.0V Lithium battery for onboard Real Time Clock and CMOS RAM.
Manufacturer Panasonic / Part-number CR-2032L/BN, CR2032NL/LE or CR-
2032L/BE.
Approximate 4-5 years retention.
Current draw is 5-6µA when PSU is disconnected.
CAUTION: Danger of explosion if the battery is incorrectly replaced. Replace
only with the same or equivalent type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.

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2.2 System overview
The block diagram below shows the architecture and main components of the KTQ45 boards. The two key
components on the board are the Intel®Q45 and Intel®ICH10DO Chipsets.
Components shown shaded are optional depending on board type (KTQ45/Flex and ATXE) and variants of
the board.

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2.3 Processor Support Table
The KTQ45/Flex and ATXE are designed to support the following LGA775 processors:
Intel® Core™ 2 Quad Processor
Intel® Core™ 2 Quad Mobile Processor
Intel® Core™ 2 Duo Processor
Intel® Pentium® Processor (2 cores)
Intel® Celeron®
In the following list you will find all CPU’s supported by the chipset in according to Intel but also other CPU’s
if successfully tested.
Embedded CPU’s are indicated by green text.
Successfully tested CPU’s are indicated by highlighted text.
Successfully tested embedded CPU’s are indicated by green and highlighted text
Failed CPU’s are indicated by red text.
Some of the processors in the list are distributed from Kontron, those CPU’s are marked by an * (asterisk)
right after the CPU number. However please notice that this marking is only guide line and maybe not fully
updated.
Processor Brand
Clock
Speed
[GHz]
Bus
Speed
[MHz]
Cache
[MB]
CPU
Number
sSpec no.
Thermal
Guideline
[Watt]
Intel® Core™2 Quad
3.00
1333
12
Q9650 *
SLB8W
95
(Yorkfield)
2.83
1333
12
Q9550
95
2.83
1333
12
Q9550S
86.5
2.66
1333
12
Q9450
SLAWR
95
2.66
1333
6
Q9400 *
SLB6B
95
2.66
1333
6
Q9400S
65
2.50
1333
6
Q9300
95
2.66
1333
4
Q8400
95
2.66
1333
4
Q8400S
65
2.50
1333
4
Q8300
95
2.33
1333
4
Q8200
95
2.33
1333
4
Q8200S
65
Intel® Core™2 Quad
2.66
1066
8
Q6700
105
(Kentsfield)
2.40
1066
8
Q6600
105
Intel® Core™ 2 Duo
3.33
1333
6
E8600
65
(Wolfdale)
3.16
1333
6
E8500
65
3.00
1333
6
E8400
SLAPL
65
3.00
1333
6
E8400 *
SLB9J
65
2.83
1333
6
E8300
65
2.66
1333
6
E8200
65
2.66
1333
6
E8190
65
3.06
1066
3
E7600
65
2.93
1066
3
E7500
65
2.93
1066
2
E6500
SLGUM
65
2.80
1066
3
E7400
SLGW3
65
2.80
1066
2
E6300
SLGU9
65
2.70
800
2
E5400
65
2.66
1066
3
E7300
65
2.60
800
2
E5300
SLGTL
65
2.50
800
2
E5200
65
2.53
1066
3
E7200
65
(Continues)

KTD-00782-H KTQ45 family Page 17 of 92
Processor Brand
Clock
Speed
[GHz]
Bus
Speed
[MHz]
Cache
[MB]
CPU
Number
sSpec no.
Thermal
Guideline
[Watt]
Intel® Core™ 2 Duo
3.00
1333
4
E6850
65
(Conroe)
2.66
1333
4
E6750
65
2.66
1333
4
E6700
65
2.60
800
2
E4700
65
2.40
1066
4
E6600
65
2.33
1066
4
E6550
65
2.33
1066
4
E6540
65
2.13
1066
4
E6420
65
2.13
1066
2
E6400 *
SLA97
65
1.86
1066
4
E6320
65
1.86
1066
2
E6300
SL9TA
65
2.40
800
2
E4600
65
2.20
800
2
E4500
65
2.00
800
2
E4400
65
1.80
800
2
E4300
SL9TB
65
1.80
800
2
E4300 *
SLA99
65
Intel® Pentium® (2 Cores)
2.40
800
1
E2220
65
(Conroe)
2.20
800
1
E2200
65
2.00
800
1
E2180
65
1.80
800
1
E2160 *
SLA8Z
65
1.60
800
1
E2140
65
Intel® Celeron®
2.40
800
0.5
E1600
65
(Conroe)
2.20
800
0.5
E1500 *
SLAQZ
65
2.20
800
0.5
450
35
2.00
800
0.5
440 *
SL9XL
35
2.00
800
0.5
E1400
65
1.80
800
0.5
430
35
1.60
800
0.5
420
35
1.60
800
0.5
E1200
65

KTD-00782-H KTQ45 family Page 18 of 92
2.4 System Memory support
The KTQ45 boards have four onboard DDR3 DIMM sockets and support the following memory features:
DDR3-800/1066 DIMM 240pin DRAM modules (PC3-6400/PC3-8500)
•1.5V (only) 240-pin DDR3 SDRAM DIMMs with gold-plated contacts
•DDR3-800 (PC3-6400), DDR3-1066 (PC3-8500) SDRAM DIMMs
•DDR3-800/1066 DIMM with SPD timings supported
•Unbuffered, single-sided x8/x16 or double-sided x8/x16 DIMMs
•16 GB (4 x 4GB) maximum total system memory using 64-bit OS. (Shared Video Memory is
withdrawn).
•4 GB maximum total system memory using 32-bit OS. ~3GB is displayed in System Properties.
(Shared Video Memory is withdrawn).
•Minimum total system memory: 512 MB
•Non-ECC DIMMs
•Serial Presence Detect
The installed DDR3 SDRAM should support the Serial Presence Detect (SPD) data structure. This allows the
BIOS to read and configure the memory controller for optimal performance. If non-SPD memory is used, the
BIOS will attempt to configure the memory settings, but performance and reliability may be impacted.
Memory Operating Frequencies
Regardless of the DIMM type used, the memory frequency will either be equal to or less than the processor
system bus frequency. For example, if DDR3 800 memory is used with an 800 MHz system bus frequency
processor, the memory clock will operate at 400 MHz. The table below lists the resulting operating memory
frequencies based on the combination of DIMMs and processors.
DIMM Type
Module
name
Memory
Data
transfers
[Mill/s]
Processor
system bus
frequency
[MHz]
Resulting
memory clock
frequency
[MHz]
Peak transfer
rate
[MB/s]
DDR3 800
PC3-6400
800
800
400
6400
DDR3 800
PC3-6400
800
1066
400
6400
DDR3 800
PC3-6400
800
1333
400
6400
DDR3 1066
PC3-8500
1066
800
400
6400
DDR3 1066
PC3-8500
1066
1066
533
8533
DDR3 1066
PC3-8500
1066
1333
533
8533
Notes: Kontron offers the following memory modules:
•P/N 1028-6891, DDR3-RAM, 1GB, 240p, 800MHZ, PC3-8500, DIMM
•P/N 1028-6892, DDR3-RAM, 2GB, 240p, 800MHZ, PC3-8500, DIMM
•Faster RAM like PC3-10600 can be used but will run at lower speed.
Memory Configurations
The KTQ45 boards support the following three types of memory organization:
1. Dual channel (Interleaved) mode. This mode offers the highest throughput. Dual channel mode is enabled
when the installed memory capacities of both DIMM channels are equal. Technology and device width can
vary from one channel to the other but the installed memory capacity for each channel must be equal. If
different speed DIMMs are used between channels, the slowest memory timing will be used.
2. Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation. This
mode is used when only a single DIMM is installed or the memory capacities of channel A is bigger than of
channel B. Technology and device width can vary from one channel to the other. If different speed DIMMs
are used between channels, the slowest memory timing will be used.
3. Flex mode. This mode provides the most flexible performance characteristics and is used if both channels
are populated and at the same time the memory capacities of channel A is smaller than of channel B.

KTD-00782-H KTQ45 family Page 19 of 92
Channel B will be divided into two parts. One part of channel B is used together with channel A and mapped
to dual channel operation. The second part of channel B is mapped to single channel operation.
Note:
Regardless of the memory configuration Dual Channel, Single Channel or Flex, the DIMMA1 must always
be populated. This is a requirement of the Intel® Management Engine.
The below tables shows examples of possible Memory slot configurations for the support of the various
Memory modes.
Dual Channel Interleaved Mode Configurations
Channel A
Channel B
DDR3 DIMMA1
(SLOT 1)
DDR3 DIMMB1
(SLOT 2)
DDR3 DIMMC1
(SLOT 3)
DDR3 DIMMD1
(SLOT 4)
2 GB
2 GB
1 GB
1 GB
2 GB
1 GB
2 GB
1 GB
2 GB
In these examples the combined capacity of the two DIMMs in Channel A equals the combined capacity of
the two DIMMs in Channel B.
Single Channel Asymmetric Mode Configurations
Channel A
Channel B
DDR3 DIMMA1
(SLOT 1)
DDR3 DIMMB1
(SLOT 2)
DDR3 DIMMC1
(SLOT 3)
DDR3 DIMMD1
(SLOT 4)
2 GB
1 GB
2 GB
2 GB
In these examples the combined capacity of the two DIMMs in Channel A does not equal the capacity of the
DIMMs in Channel B.
Dual Channel Flex Mode Configurations
Channel A
Channel B
DDR3 DIMMA1
(SLOT 1)
DDR3 DIMMB1
(SLOT 2)
DDR3 DIMMC1
(SLOT 3)
DDR3 DIMMD1
(SLOT 4)
1 GB
2 GB
The 1 GB DIMM in the Channel A, DIMM 0 socket and the lower 1 GB of the DIMM in the Channel B, DIMM
0 socket operate together in dual channel mode. The remaining (upper) 1 GB of the DIMM in Channel B
operates in single channel mode.
Channel A, DDR3 DIMMA1 (SLOT 1)
Channel A, DDR3 DIMMB1 (SLOT 2)
Channel B, DDR3 DIMMC1 (SLOT 3)
Channel B, DDR2 DIMMD1 (SLOT 4)

KTD-00782-H KTQ45 family Page 20 of 92
2.5 KTQ45 Graphics Subsystem
The KTQ45 boards use the Intel Q45 chipset for the graphical control. This chipset contains two separate,
mutually exclusive graphics options. Either the GMA 4500 graphics controller (contained within the AC82Q45
GMCH) is used, or a PCI Express x16 add-in card can be used. When a PCI Expressx16 add-in card is
installed, the GMA 4500 graphics controller is disabled.
2.5.1 Intel® GMA 4500
Features of the Intel GMA (Graphic Media Accelerator) 4500 graphics controller includes:
•High quality graphics engine supporting
oDX10* and OpenGL* 2.0 compliant
oCore frequency of 400 MHz
o1.6 GP/s pixel rate
oHigh-Quality 3D Setup and Render Engine
oHigh-Quality Texture Engine
o3D Graphics Rendering Enhancements
o2D Graphics
oVideo Overlay
oMultiple Overlay Functionality
•Analogue Display (CRT)
o350 MHz Integrated 24-bit RAMDAC
oUp to 2048x1536 @ 75 Hz refresh
oHardware Colour Cursor Support
oDDC2B Compliant Interface
•Multiplexed PCIe x16, SDVO and TMDS.
oPCIe x16 supports also PCIe Graphics card. Using PCIe Graphics card in combination with
onboard graphics (VGA) is possible if BIOS setting Initial Graphics Adaptor = IGD. In this
case onboard graphic will be Primary desktop and PCIe Graphics will be extended desktop.
Note that PCIe Graphics driver shall be installed before the Intel Graphics driver
oSDVO (Serial Digital Video Out) ports (2 channels single mode) for additional ADD2
(Advanced Digital Display 2) cards supporting second CRT monitor or Dual LVDS (Low
Voltage Differential Signalling) panels or DVI (Digital Visual Interface) panels.
oTMDS (Transition Minimized Differential Signalling)(2 channels) for additional, HDMI (High-
Definition Multimedia Interface) support with HDCP (High-bandwidth Digital Content
Protection) and HD Audio, DVI support, or DP (DisplayPort) support with 8/10 bit colours in
WQXGA (2560x1600 pixels) and HDCP.
oDVI, HDMI and DP support Hot-Plug.
o200 MHz dot clock on each 12-bit interface
oDual independent display options with digital display
•Dynamic Video Memory Technology (DVMT 5.0) support up to 352 MB
2.5.2 DVMT 5.0 support
DVMT (Dynamic Video Memory Technology driven by OS driver) enables enhanced graphics and memory
performance through highly efficient memory utilization. DVMT ensures the most efficient use of available
system memory for maximum 2-D/3-D graphics performance. Up to 352 MB of system memory can be
allocated to DVMT on systems that have 512 MB or more of total system memory installed. DVMT returns
system memory back to the operating system when the additional system memory is no longer required by
the graphics subsystem.
DVMT will always use a minimal fixed portion of system physical memory (as set in the BIOS Setup) for
compatibility with legacy applications. An example of this would be when using VGA graphics under DOS.
Once loaded, the operating system and graphics drivers allocate additional system memory to the graphics
buffer as needed for performing graphics functions.