Lantronix Qualcomm HDK8450 User manual

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Qualcomm Technologies, Inc.
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© 2021 Qualcomm Technologies, Inc. and/or its subsidiaries. All rights reserved.
HDK8450 (SM8450P) Processor
User Guide
Lantronix Document ID: PMD-00133
December 2021
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Revision history
Revision
Date
Description
A
September 2021
Initial release
B
September 2021
Optimize mainboard top/bottom items list sequence
C
November 2021
Updated Figure 3-1.
Updated Figure 3-3.
Updated Figure 3-4.
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Contents
1 Introduction........................................................................................................................... 5
1.1 Purpose .....................................................................................................................................................5
1.2 Conventions...............................................................................................................................................5
1.3 Technical assistance..................................................................................................................................5
2 System block diagram.......................................................................................................... 6
3 Main board............................................................................................................................. 9
3.1 Main board mechanical properties...........................................................................................................10
3.2 Hardware specification.............................................................................................................................11
3.3 Dip switch configuration option ................................................................................................................15
3.3.1 Development kit setup –display mode(default)......................................................................17
3.3.2 Development kit setup –HDMI mode.....................................................................................17
3.3.3 Development kit setup –emergency download......................................................................18
3.4 Main board connectors and features........................................................................................................19
3.4.1 DC power jack........................................................................................................................20
3.4.2 Battery connector ...................................................................................................................21
3.4.3 Debug serial UART over USB ................................................................................................22
3.4.4 Headset jack...........................................................................................................................22
3.4.5 USB3.1 Type-C connector......................................................................................................22
3.4.6 HDMI connector......................................................................................................................22
3.4.7 SD socket...............................................................................................................................23
3.4.8 Rear Camera card connector .................................................................................................23
3.4.9 Front camera card connector..................................................................................................26
3.4.10 Sensor1 expansion GenX connector....................................................................................27
3.4.11 Sensor2 expansion GenX connector....................................................................................28
3.4.12 Vertigo sensor connector......................................................................................................30
3.4.13 High speed expansion connector .........................................................................................30
3.4.14 High speed expansion connector-2 ......................................................................................32
3.4.15 Low speed expansion connector..........................................................................................33
3.4.16 On-board PCB WLAN antenna.............................................................................................34
3.4.17 M.2 connector.......................................................................................................................35
4 Display card..........................................................................................................................36
4.1 Display card mechanical properties.........................................................................................................37
4.2 Expansion card connectors and features.................................................................................................37
4.2.1 Sensor3 expansion GenX connector......................................................................................38
4.2.2 Sensor4 legacy sensor connector ..........................................................................................39
4.2.3 JTAG expansion connector ....................................................................................................39
4.2.4 Audio expansion connector ....................................................................................................40
4.3 Display panel...........................................................................................................................................41
5 Software notice....................................................................................................................42
5.1 NV Items..................................................................................................................................................42
5.2 CDT 42
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Figures
Figure 2-1 HDK8450 platform top ..................................................................................................................................6
Figure 2-2 HDK8450 platform bottom ............................................................................................................................7
Figure 2-3 HDK8450 block diagram...............................................................................................................................8
Figure 3-1 HDK8450 main board top .............................................................................................................................9
Figure 3-2 HDK8450 main board bottom .....................................................................................................................10
Figure 3-3 Display Mode Setup....................................................................................................................................17
Figure 3-4 HDMI Mode Setup......................................................................................................................................18
Figure 3-5 Emergency Download Setup ......................................................................................................................18
Figure 3-6 J5101 12V DC Power Jack.........................................................................................................................21
Figure 3-7 J2401 and J2402 Battery Connector...........................................................................................................21
Figure 3-8 J5301 Debug UART over USB ...................................................................................................................22
Figure 3-9 J4501 Headset Jack ...................................................................................................................................22
Figure 3-10 J3701 USB3.1 Type-C Connector.............................................................................................................22
Figure 3-12 J5001 HDMI Connector ............................................................................................................................22
Figure 3-13 J5501 SD socket.......................................................................................................................................23
Figure 3-14 J4701 Rear Camera Connector................................................................................................................23
Figure 3-15 J5902 Sensor1 Expansion GenX Connector ............................................................................................27
Figure 3-16 J5903 Sensor2 Expansion GenX Connector ............................................................................................28
Figure 3-17 J5901 Vertigo Connector..........................................................................................................................30
Figure 3-18 J6001 High Speed Expansion Connector.................................................................................................30
Figure 3-19 J6101 High Speed Expansion Connector -2.............................................................................................32
Figure 3-20 J6201 Low Speed Expansion Connector..................................................................................................33
Figure 3-21 On-Board PCB WLAN Antennas ..............................................................................................................34
Figure 3-10 J6302 M.2 Connector................................................................................................................................35
Figure 4-1 HDK Display Card.......................................................................................................................................37
Figure 4-2 J701 Sensor3 Expansion GenX Connector ................................................................................................38
Figure 4-3 J702 Sensor4 Legacy Sensor Connector ...................................................................................................39
Figure 4-4 J601 JTAG Connector ................................................................................................................................39
Tables
Table 3-1 HDK8450 MAIN BOARD Mechanical Properties .........................................................................................10
Table 3-2 HDK8450 Hardware Features......................................................................................................................11
Table 4-1 HDK8450 Expansion Card Mechanical Properties.......................................................................................37
Table 4-2 Expansion Card Connectors and Features..................................................................................................37
Table 4-3 Sensor3 Expansion GenX Connector Pinout...............................................................................................38
Table 4-4 Sensor4 Expansion GenX Connector Pinout...............................................................................................39
Table 4-5 JTAG Header J601 Pin out..........................................................................................................................40
Table 5-1 NV items ......................................................................................................................................................42
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1 Introduction
1.1 Purpose
This document provides a quick reference or evaluation platform for Qualcomm’s latest 8450
series - Snapdragon 8450 processor. This is suited for Android/Linux application developers,
OEMs, consumer manufacturers, hardware component vendors, video surveille, robotics, camera
vendors, and flash chip vendors to evaluate, optimize, test and deploy applications that can utilize
the Qualcomm Snapdragon 8450 series technology.
1.2 Conventions
Function declarations, function names, type declarations, attributes, and code samples appear in a
different font, for example, #include.
Code variables appear in angle brackets, for example, <number>.
Commands to be entered appear in a different font, for example, copy a:*.* b:.
Button and key names appear in bold font, for example, click Save or press Enter.
Shading indicates content that has been added or changed in this revision of the document.
1.3 Technical assistance
For assistance or clarification on information in this document go to: https://tech.intrinsyc.com
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2 System block diagram
The HDK8450 development platform consists of two major components:
■Main board
■Display card (Display panel + Expansion card)
The following diagrams show the top and bottom on the development platform.
Figure 2-1 HDK8450 platform top
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Figure 2-2 HDK8450 platform bottom
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The following diagram explains the interconnectivity and peripherals on the development kit.
Figure 2-3 HDK8450 block diagram
Sensor
Card ALS/Prox
HallPressureAccel/Gy ro Mag
Rear Camera Card
Front Camera Card
802.11ax/BT
WCN6856
Display/Touch System
Touchscreen
Legacy Touch
2xDSI
LPDDR (PoP)
3200 MHz (LP5)
I2C/SPI
PM8350
PM8350C
SCLK/SDATA
PON_RESET_N
4x16bit
USB3.1 +DP1.4
JTAG/SWD
UFS3-G4-2L
Slimbus
Debug
Board
USB
Type-C
I2C
PM8350BH
SW_CTL
PCIe0_G3-1L
PMK8450
Qlink(5L)
I2C/SPI
SPI
PS_HOLD
BLE UART
AMIC
76.8
MHz
PM8450
SPI
I2C
PM8010x2
WLAN UART
BT HCI
Fingerprint
Connector
4XAMICs
USB 3 .1 Gen 2(10.0 Gbps)
Charging, EUD
DisplayPort 1.4 v ideo output
VGA out using USB-C VGA Adapter
HDMI A/V out u sing USB-C Digital AV Ad apter
Headset Audio
INO-0650G40422-V2
Truly 6.497" FHD+
1080x2400, 120Hz
TDDI: NT36672C(NOVATEK) Battery
HDK8450
SDR735
(4G/5G-sub6)
SM8450P
GPU
Audio
Multimedia
EBI
CSI
SPMI
JTAG/SWD
Sensors
CPUs
CCI
SPU
Security
Compute DSP
LPI
LPI
QUP
DSI
4w UART
2w UART (sQUP)
QUP
SLIMBus
2w UART
UART
2w URAT/WSI
Qlink0
Qlink1
WCD9385 SWR
AMIC SndWire
3.5mm
Jack
HPH
QUP
UART
UART
UART
SMB1394
COEX
Qlink2
Analog
Swith
1x WSA8835 1xSWR
1x SPK SndWire
1x WSA8835
1x SAR
QUP
QUP
Flicker Detection
Range Finder QUP
QUP
SPI JTAG/SWD JTAG
WLAN/BT
I2C
SPI
SPI
CSI
SMB1394
QUP
USB
UFS
SDIO
PCIe1
PCIe0
UFS
GPIO
Debug
12V
DCJACK
3.9V
BUCK
LNA
LNA
M.2
B Key
Connector
NFC
Connector
PCIe
MIPI SW
MIPI SW
HDMI
Bridge
2x 4-Lane DSI
HDMI
Connector
1xDSI (3L CPHY)
Rear Facing Camera Systems
ToF + Triple
S5K3M5SX04
13 MP
RFC RGB
S5K33D TOF
Sensor +
Emitter
IMX686
64 MP
RFC RGB
Dual LED
Illumination
S5KJD1SP
32 MP
RFC RGB
Front Facing Camera Systems
S5KJD1SP
32 MP
FFC RGB
UART-USB
Transceiver
20p JTAG
USB 2.0, µ-B
LCDB Driver
WLED Driver
I2C QUP
QUP
GPIO
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3 Main board
The main board provides the basic common set of features with minimal integration efforts for
end users. It contains the followings:
■Snapdragon 8450 (SM8450P) main application processor
■Memory: 256 GB UFS 3.0 + LPDDR5 up to 3200 MHz 12 GB RAM
■PMIC: PMK8450+ PM8450 + PM8350 + PM8350C + PM8350B + PM8010 + PMR735A
■WCN6856 Wi-Fi + BT combo chip over SLIMbus, PCIE, UART, PCM
■WCD9385 Audio Code
■SDR735
Figure 3-1 HDK8450 main board top
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Figure 3-2 HDK8450 main board bottom
3.1 Main board mechanical properties
The HDK8450 Main Board measuring 100 mm x 85 mm is where all the processing occurs. It is
connected to the Expansion Card via two 60 pin high speed, and one 40 pin low speed board-to-
board connectors. The purpose of the connectors is to bring out essential signals so that other
peripherals can interface with the platform.
Table 3-1 HDK8450 MAIN BOARD Mechanical Properties
Dimension
85 cm2(100 mm x 85 mm)
Interface
2 x 60 pin high speed and 1 x 40 pin low speed board-to-board connectors
Thermal
A top side graphite sheet is stuck by default.
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3.2 Hardware specification
Table 3-2 HDK8450 Hardware Features
Subsystem /
Connectors
Feature Set
Description
Specification
Chipset
SM8450P
Qualcomm®
Snapdragon™
8450 Processor
▪Qualcomm® Kryo™ 780 CPU built on Arm Cortex
technology
▪Qualcomm® Adreno™ 730 GPU for the highest in
graphics performance and power efficiency
▪Qualcomm Spectra™ 680 Image Signal Processor for
the ultimate photography and videography experiences
▪Adreno 665 VPU for high-quality, ultra HD video
encode and decode
▪Adreno 1195 DPU for on-device and external ultra HD
display support
▪3G/4G/5G modem –mmWave and sub-6 GHz bands
(Rel 16 integrated modem)
▪Low-power audio subsystem combined with the
Qualcomm Aqstic™ Audio Technologies
WCD9380/WCD9385 audio codec for low-power voice
processing and audiophile quality audio playback
▪Qualcomm® Snapdragon Sensors Core Technology for
contextual awareness and always-on sensor support
▪Qualcomm® Secure Processing Unit (SPU260) for
advanced secure use cases
▪Qualcomm® Hexagon™ Tensor Processor (HTP) with
Hexagon Vector eXtensions (HVX) and Hexagon
Matrix eXtensions (HMX)
▪Qualcomm® FastConnect™ 6900 System with
WCN685x, 802.11ax, 2 × 2 MIMO, Bluetooth 5.2
▪Quad-channel package-on-package (PoP) high-speed
LPDDR5 SDRAM
▪14.0 × 15.0 mm MPSP1518 PoP
Qualcomm®
PMIC,
Companion
PMIC for
SM8450P
processor
(PMK8450,
PM8450,
PM8350,
PM8350C,
PM8150B,
PM8010 and
PM735A)
PMK8450
The PMK8450 device serves as a clock generation and
distribution IC.
▪Three dedicated low dropouts (LDOs) for clocks
One for the crystal oscillator
One for the RFCLK output buffers
One for the LNBB output buffers
▪38.4/76.8 MHz XO support
▪Special-purpose clock outputs
▪Five 76.8/38.4 MHz RF clock outputs
Three 19.2 MHz LNBB clock output
One 32.7645 kHz sleep clock output
▪Two-line serial power management interface (SPMI)
▪On-chip ADC
▪Real time clock (RTC)
▪4 GPIOs (1.8 V)
▪Package
36-pin fanout wafer picoscale package (FOWPSP36)
2.13 × 2.13 × 0.55 mm; 0.35 mm pitch
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Subsystem /
Connectors
Feature Set
Description
Specification
PM8450
The PM8450 device integrates most of the wireless
product’s power management, general housekeeping, and
IC-level interface support functions into a single mixed-
signal IC.
▪PM8450 is optimized for the SM8450 chipset.
▪Six FTS520 SMPS
▪Four LDO512 linear regulators
▪Overtemperature protection
▪SPMI
▪Four GPIOs
▪81-pin fan-out wafer-level pico-scale package
(81 FOWPSP)
PM8350
The PM8350 device integrates most of the wireless
product’s power management, general housekeeping, and
IC-level interface support functions into a single mixed-
signal IC.
▪PM8350 is optimized for the SM8450 chipset.
▪Three HFS510 SMPS and nine FTS520 SMPS
▪10 LDO512 linear regulators
▪On-chip ADC
▪Overtemperature protection
▪SPMI
▪10 GPIOs
▪144-pin fan-out wafer-level nano-scale package (144
FOWNSP)
PM8350C
The PM8350C PMIC supplements the core PM8350
PMIC and the slave PM8350B PMIC to integrate all
wireless handset power management, general
housekeeping, IC-level interface, and user interface
support functions into an integrated solution.
▪PM8350C is optimized for the SM8450 chipset.
▪Nine FTS520 SMPS and one HFS515 SMPS
regulators
▪13 LDO linear regulators
▪System rail buck-or-boost (BoB) SMPS regulator
▪RGB LED drivers and camera flash drivers
▪Overtemperature protection
▪SPMI
▪9 GPIOs
▪143-pin fanout wafer-level nanoscale package
(FOWNSP143)
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Subsystem /
Connectors
Feature Set
Description
Specification
PM8350B
The PM8350B/PM8350BH/PM8350BHS interface PMIC,
supplements the master core PM8350 PMIC and the
slave core PM8350C PMIC to integrate all wireless
handset power management, general housekeeping, and
user interface support functions into an integrated three-
IC solution.
▪Best in class high-efficiency 6A 3-level buck/Div2
charge pump combination architecture Li-ion battery
charger (> 97% peak efficiency)
▪Dedicated paths for USB and wireless charging with
charger operation up to 21.5 V (25 V absolute max)
▪Supports up to a 6A charge current (single path) and a
12 A charge current (dual path using
SMB1396/SMB1398 companion ICs)
▪Supports USB Type-C Specification Rev. 1.4 and USB
Power Delivery Specification Rev. 3.0
▪Supports Qualcomm® Quick Charge™ 2.0, Quick
Charge 3.0, and Quick Charge 4.0 technology
▪Supports 2S battery with charge balancing (SMB1399
needed). See Section 1.3 for details.
▪Simultaneous wireless charging and OTG support
using external 5 V boost
▪Simultaneous USB charging and reverse wireless
charging support using external 5 V boost
▪Qualcomm battery gauge with improved SoC accuracy
▪Analog-to-digital converter (ADC) subsystem with
analog multiplexer (AMUX) and voltage/current analog-
to-digital converter (VADC/IADC)
▪Battery interface module (BIM) that includes battery
serial interface (BSI) or PMIC serial interface (PSI) and
battery missing detection (BMD)
▪Battery current limiting (BCL) subsystem that provides
both hardware and software alarms, which are used by
the system for reducing battery current.
▪Triple supply high performance and high efficiency
boost regulators for OLED panels
▪Full H-bridge haptics driver with dedicated 5 V to 10 V
programmable boost for LRA application and
SoundWire interface. See Section 1.3 for details.
▪SPMI interface
▪Eight GPIOs
▪165-pin fan-out wafer-level nanoscale package (165
FOWNSP)
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Subsystem /
Connectors
Feature Set
Description
Specification
PM8010
The PM8010 device is a dedicated camera PMIC that
integrates all the necessary power management,
housekeeping, and interface support functions into a
single IC.
▪I2C/SPMI interface support for interrupt communication
(default slave I2C address is 0x08).
▪Seven low-dropout linear (LDO) linear regulators
▪Overtemperature protection
▪I2C/SPMI with 400 kHz and 2.2 kΩ pull-up resistor
▪Undervoltage lockout (UVLO) support
▪High PSRR and low-noise regulators for camera
sensor applications
▪20-pin wafer-level picoscale package (WLPSP)
PMR735A
The PMR735A device is a power management IC that is
designed to power RF circuits. It integrates all the
necessary power management, housekeeping, and
interface support functions into a single IC.
▪One HFS515 SMPS and two FTS520 SMPS
▪Seven LDO linear regulators
▪On-chip ADC
▪Four GPIOs
▪SPMI
▪48-pin wafer-level nanoscale package (WLNSP)
Memory
LPDDR5
12 GB LPDDR5
LPDDR5 up to 3200MHz
UFS
256 GB UFS3.0
UFS 3.0
Connectivity
Wi-Fi 2.4
GHz/5GHz
via
WCN6856 –
PCIE,UART
Wi-Fi WCN6856
Wi-Fi + BT Combo
Chip
802.11a/b/g/n/ac/ax 2.4/5.0 GHz
BT 2.4 GHz
via
WCN6856 –
UART /
SLIMbus
Wi-Fi WCN6856
Wi-Fi + BT +FM
Combo Chip
Support BT 5.2+ HS and backward compatible with
BT 1.x, 2.x + EDR
Camera
Expansion
4 x 4-Lane
MIPI CSI
DPHY or
4 x 3-Trio
MIPI CSI
CPHY
1 x 160-pin Camera
Connector for
CSI0, CSI1, CSI2
and CSI3
D-PHY v1.2 2.5 Gbps per lane
C-PHY v1.2 10.26 Gbps per T
1 x 4-Lane/1
x 2-Lane
MIPI CSI
DPHY or
4 x 3-Trio
MIPI CSI
CPHY
1 x 60-pin Camera
Connector for
CSI4, CSI5 on
expansion card
D-PHY v1.2 2.5 Gbps per lane
C-PHY v1.2 10.26 Gbps per T
Sensor
Expansion
2 x 60-pin
GenX
connector
60-pin GenX
connector
I3C, I2C, SPI
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Subsystem /
Connectors
Feature Set
Description
Specification
1 x 30-pin
Vertigo
connector
30-pin Vertigo
connector
I3C, I2C, SPI
1 x 60-pin
GenX
connector
60-pin GenX
connector on
expansion card
I3C, I2C, SPI
1 x 24-pin
legacy
sensor
connector
24-pin legacy
sensor connector
on expansion card
I3C/I2C, SPI
Audio
Onboard
Audio Codec
WCD9385
1x Headset
headphone output
Analog differential output
1x loud-speaker
output
Digital output
1x Earpiece output
Analog differential output
4 x Digital MIC
input
Digital input
2 x Analog MIC
input(reserved
interface on
expansion card)
Analog differential input
1 x I2S (reserved
interface on
expansion card)
Digital input/output
Display
Expansion
2 x 4-Lane
MIPI DSI
DPHY or
2 x 3-Trio
MIPI DSI
CPHY
2 x 60-pin High
Speed Display
Connector
D-PHY1.2 2.5 Gbps per lane
C-PHY1.1 2.5 Gsymbols per trio
HDMI
Resolution
Up to 4K
60Hz via
LT9611UXC
2-Port MIPI to
HDMI2.0 Converter
Compliant with HDMI2.0
3.3 Dip switch configuration option
There are two DIP switches S5701 and S5702 on the bottom side of the HDK8450 Main board.
The 8-bit switch of S5701 allows the user to control the system configuration and boot option.
Table 3-3 Dip Switch S5701 Configuration
Function
DIP
Switch
Description
Notes
FORCED_USB_BOOT
S5701-1
Enable Emergency Download when
DIP switch turned on. Controlled by
GPIO47.
Default out of the box
configuration is OFF
FASTBOOT(0)
S5701-2
Enable other boot configuration when
DIP switch turned on. Controlled by
GPIO67.
Default out of the box
configuration is OFF.
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Function
DIP
Switch
Description
Notes
FASTBOOT(1)
S5701-3
Enable other boot configuration when
DIP switch turned on. Controlled by
GPIO158.
Default out of the box
configuration is OFF
FASTBOOT(2)
S5701-4
Enable other boot configuration when
DIP switch turned on. Controlled by
GPIO161.
Default out of the box
configuration is OFF
WDG_DISABLE
S5701-5
Enable WATCHDOG_DISABLE
when DIP switch turned on.
Controlled by GPIO164.
Default out of the box
configuration is OFF.
BUCK_PWR_CTRL
S5701-6
Manually disable external 5V/3.3V
buck output.
Default out of the box
configuration is OFF
M2_PWR_CTRL
S5701-7
Manually disable 1.8V and 3.3V
power suply
Default out of the box
configuration is OFF
AOC_DET
S5701-8
Manually connect USB-C headset
detect signal to CODEC
Default is disconnected.
Default out of the box
configuration is OFF.
The detailed configuration for boot sequence choice is listed in below table.
Table 3-4 Boot Sequence
FAST_BOOT
GPIO#
Boot Sequence
59
161
158
67
0b0000
0
0
0
0
Default: UFS0 -> SDC2 -> eDL(USB0)
0b0001
0
0
0
1
SDC2 -> UFS0 -> eDL(USB0)
0b0010
0
0
1
0
SDC2 -> eDL (USB0)
0b0011
0
0
1
1
USB0 boot only
0b0100
0
1
0
0
QSPI -> SDC2 -> eDL (USB0)
0b0101
0
1
0
1
SPI -> SDC2 -> eDL (USB0)
0b0110
0
1
1
0
UFS0 -> eDL (USB0)
0b0111
0
1
1
1
Same as Fastboot[3:0] = 0000
UFS0 -> SDC2 -> eDL(USB0)
The 8-bit switch of S5702 allows the user to do some general configuration.
Table 3-5 Dip Switch S5702 Configuration
Function
DIP
Switch
Description
Notes
SYS_PWR_CTRL
S5702-1
Manually disable external 3.9V buck
output. Default the buck is ON when
DC adapter is plugged in.
Default out of the box
configuration is OFF.
BATT_FET_CTRL
S5702-2
Manually disable battery supply path to
system. Default the path is controlled
by hardware automatically.
Default out of the box
configuration is OFF.
BATT_ID0
S5702-3
Connect BATT_ID to resistor 1(7.5K).
Default is disconnected.
Default out of the box
configuration is OFF
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Function
DIP
Switch
Description
Notes
BATT_ID1
S5702-4
Connect BATT_ID to resistor
2(reserved). Default is disconnected.
Default out of the box
configuration is OFF
BATT_THERM0
S5702-5
Connect BATT_THERM to resistor
1(100K). Default is disconnected.
Default out of the box
configuration is OFF
BATT_THERM1
S5702-6
Connect BATT_THERM to resistor
1(reserved). Default is disconnected.
Default out of the box
configuration is OFF
DSI0_SW
S5702-7
Manually select DSI0 data path
between display panel and HDMI.
Default route DSI0 to the display
panel.
Default out of the box
configuration is OFF
DSI1_SW
S5702-8
Manually select DSI1 data path
between display panel and HDMI.
Default route DSI1 to the display
panel.
Default out of the box
configuration is OFF
3.3.1 Development kit setup –display mode(default)
Display panel is the default output. Make sure switch7&8 of S5702 is OFF before turning on the
device.
Software detects the status of Switch7&8 and automatically configurate the output to support
display panel.
Figure 3-3 Display Mode Setup
3.3.2 Development kit setup –HDMI mode
Make sure switch7&8 of S5702 is ON before turning on the device.
Software detects the status of Switch8 and automatically config the output to support HDMI
output.
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Figure 3-4 HDMI Mode Setup
3.3.3 Development kit setup –emergency download
Put switch1 of S5701 on when entering Emergency Download (EDL) mode. Remember to switch
it back when exiting EDL mode and entering normal power on mode.
Figure 3-5 Emergency Download Setup
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3.4 Main board connectors and features
Table below lists the connectors, expansions and their usages on the main board.
Table 3-6 Main Board Connectors and Features
Domain
Description
Specification
Usage
Power
AC / Barrel charger
12V/5A DC Power Supply
Power Supply
Battery connector
2 x 16-pin connector
For providing power
from 4.4V/3780mAh
battery(optional)
Debug Serial via
USB
Debug Serial UART
console over USB for
development
USB Micro B connector
Development Serial
Connector for
debug output via
USB
Buttons
Power On
SMD Button
Red Power Button
for Suspend /
Resume and Power
off
Volume +
SMD Button
Volume + Key
Volume –
SMD Button
Volume –Key
Headset Jack
Supported by WCD9385
Normal Open, support US
Standard CTIA headset by
default
Audio headset
support
USB
1x Type-C USB3.1
Type-C USB3.1 GEN2
10Gbps
Data transfer
HDMI
HDMI2.0
4K60Hz
HDMI output
SD Card
Micro SD card
4bit Micro SD card
External Storage
Camera Expansion
1 x 160-pin connector with
MCLK, GPIOS, CCI
Supports CSI0, CSI1, CSI2
and CSI3 via the 160-pin
connector
▪4x 4-Lane MIPI-CSI
DPHY1.2 or
▪4x 3-Trio MIPI CSI
CPHY1.0
▪External flash driver
control
▪Support for 3D camera
configuration
▪Separate MCLK / CCI
control
▪Single Rear,
Front camera
▪Dual Camera
▪Iris Camera
Sensor Expansion
2x 60 pin-GenX sensor
connector
60-pin GenX sensor
connector
Connector for
sensor card
Vertigo
CDP sensor connector
CDP sensor connector
Connection for
sensor bar
High Speed
Expansion
60-pin B2B connector for
DSI0 and CSI4/5 signals.
Compliant with 96boards
HS expansion spec
Supports DSI0 via the 60-
pin connector
▪4-Lane MIPI-CSI
DPHY1.2 or
▪3-Trio MIPI CSI
CPHY1.1
▪I2C/SPI/GPIO
FHD 1080x2340
120Hz panel is
supported on
HDK8450
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Domain
Description
Specification
Usage
High Speed
Expansion-2
60-pin B2B connector for
DSI1, touch, display
powers(OLED bias,
display, touch) to
supplement the display
support.
JTAG, MICs, sensor
powers are also included.
Supports DSI1 via the 60-
pin connector
▪4-Lane MIPI-CSI
DPHY1.2 or
▪3-Trio MIPI CSI
CPHY1.1
▪I2C/SPI/GPIO
Power suppliers for OLED
and sensors
Support JTAG signals
Support MIC input
▪2 Analog MICs
▪MIC bias supplier
The supplement to
support dual DSI
display panel with
power suppliers.
Also connect JTAG,
MICs to expansion
card
Low Speed
Expansion
1x 40-pin B2B connector
for low speed signals
Compliant with 96boards
HS expansion spec
Supports
SPI/I3C/I2C/UART/I2S/ and
GPIOs via the 40-pin
connector
Support sensor
connectors and
Power/Volume
Buttons on the
Expansion Card
WLAN Antenna
2x PCB Antenna
2.4GHz 5GHz
On-board antenna
LED
1x Power LED
▪Blue
Adaptor in
4x User LED
▪Red: PMIC Driven
▪Green: PMIC Driven
▪Blue: PMIC Driven
▪Green2: GPIO Control
User LED
1x WLAN LED (reserve)
1x BT LED (reserve)
▪Orange: GPIO Control
▪Blue: GPIO Control
WLAN on
BT on
The following sections provide in depth information on each expansion connectors on the Main
board. The information listed below is of particular use for those who want to interface other
external hardware devices with HDK8450. Before connecting anything to the development kit,
ensure the device meets the specific hardware requirements of the processor.
3.4.1 DC power jack
The HDK development kit is powered by a 12V DC adaptor through J3001. Starting from the
power jack, the 12V power supply branches off into different voltage rails via step down
converters. The system is powered by 3.9V via Silergy step down converter U5101.
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