Leedarson LA02303B User manual

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LA02303B
Bluetooth SMART (BLE) Module
Key features
Support Bluetooth v5.1 core specification, support 2Mbps LE and LE long Range
Embedded a 32-bit ARM Cortex-M4F with float-point unit, with clock up to 90MHz
Data Memory: 256KB internal ROM, 192KB internal RAM, 1MB internal Flash
Frequency of system crystal oscillator: 40MHz\32.768KHz
Power supply voltage: 2.0V～3.6V
Operating temperature: -40℃～100℃
Operating frequency: 2400～2483.5MHz
TX output power:8dBm (Typical)
BLE Receiving sensitivity:
-95dBm @1Mbps; -92dBm @2Mbps; -98dBm @500Kbps; -103dBm @125Kbps
Dimension: 16mm*23.7mm*2.5mm
Interface:
Vertical Mount (Plug-In)
6 PWMs (GPIOs), 1 Available UART, 1 ADC (GPIO), 1 debug UART
Horizontal (SMD)
6 PWMs (GPIOs), 1 Available UART, 3 ADCs (GPIOs), 1 debug UART, 1 GPIO
Built-in PCB trace antenna
Integrates the Afero Secure Connectivity Stack
Supports Afero Easy Onboarding
Supports Afero Secure Over the Air updates

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TABLE OF CONTENTS
1 Introduction.............................................................................................................................................. 3
1.1 Overview ....................................................................................................................................... 3
1.2 Block Diagram ............................................................................................................................... 4
1.3 Ordering Information.................................................................................................................... 4
2 Electrical Characteristics .......................................................................................................................... 5
2.1 Absolute Maximum Ratings.......................................................................................................... 5
2.2 General Operating Conditions...................................................................................................... 5
2.3 DC Specifications........................................................................................................................... 6
2.4 RF Specifications ........................................................................................................................... 6
2.5 Antenna Specifications ................................................................................................................. 7
3 Pin Definition ............................................................................................................................................ 7
3.1 Default and Multiplexing Pin Definition....................................................................................... 7
3.2 Trap Pins ........................................................................................................................................ 9
4 Design Guidelines................................................................................................................................... 10
4.1 Power Supply............................................................................................................................... 10
4.2 Module Placement...................................................................................................................... 10
5 Package Specifications ........................................................................................................................... 12
5.1 Dimension ................................................................................................................................... 12
5.2 PCB Pads Information ................................................................................................................. 13
5.3 Plug-in Land Pattern Example..................................................................................................... 13
5.4 SMD Land Pattern Example ........................................................................................................ 14
6 Production Guide.................................................................................................................................... 15
6.1 Handing Precaution .................................................................................................................... 15
6.2 Soldering Recommendation....................................................................................................... 15
7 Package Information............................................................................................................................... 16
7.1 Tape and Reel .............................................................................................................................. 16
7.2 Package and Weight.................................................................................................................... 16
8 Declaration.............................................................................................................................................. 16

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TABLE OF CHART
Figure 1.1 Module ....................................................................................................................................... 3
Figure 1.2 Product Application ................................................................................................................... 3
Figure 1.3 LA02303B Block Diagram........................................................................................................... 4
Figure 3.1 Module Pin Out.......................................................................................................................... 7
Figure 4.1 Antenna Area ........................................................................................................................... 10
Figure 4.2 Horizontal Mounting................................................................................................................ 10
Figure 4.3 Reference Examples for Horizontal Mounting........................................................................ 11
Figure 4.4 Vertical Mounting .................................................................................................................... 11
Figure 4.5 Reference Examples for Vertical Mounting ............................................................................ 11
Figure 4.6 Distance between Module and Plastic.................................................................................... 12
Figure 5.1 Module Dimensions................................................................................................................. 12
Figure 5.2 Pad Size..................................................................................................................................... 13
Figure 5.3 Plug-in PCB Land Pattern ......................................................................................................... 13
Figure 5.4 Plug-in PCB View ...................................................................................................................... 14
Figure 5.5 SMD Land Pattern .................................................................................................................... 14
Figure 6.1 SMT Temperature Setting Curve ............................................................................................. 15
Figure 7.1 Carrier Tape Dimensions.......................................................................................................... 16
Figure 7.2 Reel Dimensions....................................................................................................................... 16
_________________________________________________________________________________
Table 1.1 Ordering Information .................................................................................................................. 4
Table 2.1 Absolute Maximum Ratings ........................................................................................................ 5
Table 2.2 General Operating Conditions .................................................................................................... 5
Table 2.3 DC Specifications ......................................................................................................................... 6
Table 2.4 BLE Specifications ........................................................................................................................ 6
Table 2.5 Antenna Specifications................................................................................................................ 7
Table 3.1 Pin Definition ............................................................................................................................... 7
Table 3.2 Trap Pins Definition...................................................................................................................... 9

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1Introduction
1.1 Overview
The LA02303B is a Leedarson-developed universal Bluetooth SMART (BLE) module. It uses the
Realtek Inc. RTL8762DKF System in Package that integrates an embedded 1MB flash.
Figure 1.1 Module
It also integrates antenna on PCB which is designed for a variety of IOT products such as Door locker,
Power Drivers, Sensors, Plugs, Lighting, Switches, etc.
Figure 1.2 Product Application

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1.2 Block Diagram
A general block diagram of the module is shown as below.
LA02303B Module Block Diagram
ADC2
ADC1
ADC0
GND
GPIO8
TX1
RX1
GPIO7
NC
NC
RX0
TX0
RESET_N
FACTORY
Antenna
RX1
VCC
TX1
GND
ADC0
PWM6
FACTORY
PWM5
RESET_N
PWM4
TX0
PWM3
RX0
PWM2
GND
PWM1
Modem
ARM
Cortex-M4F
Patchable
ROM
256KB
Crystal
40M Hz
IO PINMUX
UART x2
SPI x2
I2C x2
GPIOs
Timers
AUXADC
IR
RC
Log UART
PGA+SDM_ADC
PMU
RTL8762DKF Chip
Diagram
Key Scan
Watchdog
Low Power
Comparator
DC/DC
Converter
6-channel
DMA Engine
Program Memory
Flash
1MB
Data Memory
RAM
192KB
OCP BUS
Crystal 40MHz DC/DC Inductor
GND GND
RF
tranceiver
APB
Crystal
32.768KHz
Crystal 32.768KHz
Figure 1.3 LA02303B Block Diagram
1.3 Ordering Information
Table 1.1 Ordering Information
Product
Protocol
IC Solution.
Operating
Temperature
Dimension
Antenna
LA02303B
BLE
RTL8762DKF
-40 ~100℃
16mm*23.7mm*2.5mm
PCB
antenna

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2Electrical Characteristics
2.1 Absolute Maximum Ratings
Stresses above those listed below may cause permanent damage to the device. This is a stress rating
only and functional operation of the devices at those or any conditions above those indicated in the
operation listing of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Table 2.1 Absolute Maximum Ratings
Symbol
Parameter
Min.
Max.
Units
VCC
Power supply
-0.3
+3.6
V
GND
Ground of module
0
V
VIO
Voltage of module IO
-0.3
+3.6
V
ST
Storage temperature
-40
+125
℃
MSL
Moisture sensitivity level
3
-
ESD HBM
Human body mode
±3.5
KV
2.2 General Operating Conditions
This table specifies the general operating temperature range and supply voltage range for all
supplies, the minimum and maximum values of all other tables are specified over this operating
range, unless otherwise noted.
Table 2.2 General Operating Conditions
Symbol
Parameter
Min.
Typ.
Max.
Units
VCC
Supply voltage, normal
2.0
3.3
3.6
V
TA
Operation temperature1
-40
25
85
℃
ICC Peak
Supply current peak2
-
22
-
mA
ICC Average
Supply current average2
-
7.24
-
mA
Note:
1. It refers in particular to the surface temperature on components of LA02303B when the
module is working. If the surface temperature of components is above 100℃, the RF parameters
will be worse;
2. It is measured when the module runs the RF test Firmware @25℃ambient temperature, it is
provided here for reference only.

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2.3 DC Specifications
Unless otherwise indicated, typical conditions are: VCC=3.3V. TA=25℃.
Table 2.3 DC Specifications
Symbol
Parameter(condition)
Min.
Typ.
Max.
Units
VIH
Input high voltage
0.65xVCC
-
VCC
V
VIL
Input low voltage
GND
-
0.28xVCC
V
VOH
Output high voltage
0.9xVCC
-
-
V
VOL
Output low voltage
-
-
0.1xVCC
V
IOH
Output high current
-
8
-
mA
IOL
Output low current
-
8
-
mA
RPU
Pull-up resistance
-
20
100
kΩ
RPD
Pull-down resistance
-
20
100
kΩ
ITX Peak
Pout=7dBm
-
17.7
-
mA
IRX
Rx average current
-
5.8
-
mA
Note:
The current is measured with the module running the RF test Firmware, it is provided here for
reference only.
2.4 RF Specifications
Unless otherwise indicated, typical conditions are: VCC=3.3V TA=25℃.
Table 2.4 BLE Specifications
Description
Min.
Typ.
Max.
Units
Operating Frequency
2400
-
2483.5
MHz
Modulation
GFSK
-
Channel Number
40
-
Channel Bandwidth
2
MHz
Basic Transmitting Rate
1Mbps/2Mbps/500Kbps/125Kbps
-
Frequency Offset
-100
-
100
KHz
TX Power
8
dBm
Receiving Sensitivity@1Mbps
-
-95
-
dBm
Receiving Sensitivity@2Mbps
-
-92
-
dBm
Receiving Sensitivity@500Kbps
-
-98
-
dBm
Receiving Sensitivity@125Kbps
-
-103
-
dBm
Maximum Receiving Level
-1
dBm

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2.5 Antenna Specifications
Table 2.5 Antenna Specifications
Parameter
Value
Frequency Range
2.4 ~ 2.4835GHz
Impedance
50 Ohm
VSWR
≤ 2.5
Antenna Gain
≤ 4dBi
Efficiency
≥ 50%
Remark: Different products have different configurations, which will result in different antenna performances. The
above parameters are based on the module being mounted on the evaluation board, horizontally or vertically,
shown as followed:
3Pin Definition
3.1 Default and Multiplexing Pin Definition
Figure 3.1 Module Pin Out
Table 3.1 Pin Definition
The Pin (1-18) is used for Plug-in application. The Pin on Bottom layer used for SMD application.
Pin 1 is adjacent to Pin 2.

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No.
Pin of IC
Definition
Pin Function Description
Default
Pull State
Direction
1
29_P0_0
PWM1/IO0
PWM Channel 1 output / GPIO 0
Pull Down
I/O
2
49
GND
Ground of Module
-
-
3
28_P0_1
PWM2/IO1
PWM Channel 2 output / GPIO 1
Pull Down
I/O
4
43_P3_1
RX0
FACTORY_UART_RX data in
Pull Up
I
5
27_P0_2
PWM3/IO2
PWM Channel 3 output / GPIO 2
Pull Down
I/O
6
44_P3_0
TX0
FACTORY_UART_TX data out
Pull Up
O
7
25_P0_4
PWM4/IO3
PWM Channel 4 output / GPIO 3
Pull Down
I/O
8
16_RST_N
RESET_N
Reset, Low Active
Pull Up
I
9
20_P4_0
PWM5/IO4
PWM Channel 5 output / GPIO 4
Pull Down
I/O
10
23_P0_5
FACTORY
FACTORY MODE enable, low active
Pull Down
I
11
19_P4_1
PWM6/IO5
PWM Channel 6 output / GPIO 5
Pull Down
I/O
12
2_P2_2
ADC0/IO6
Analog-to-Digital Converter 0/GPIO 6
Pull Down
I/O
13
49
GND
Ground of Module
-
-
14
17_P4_3
TX1/SDA/
IR_RX
HOST_UART_RX (data out from
RTL8762D)/I2C data
Pull Up
O
15
-
VCC
Power Supply
-
I
16
18_P4_2
RX1/SCL/
IR_TX
HOST_UART_TX (data in to
RTL8762D )/I2C clock
Pull Down
I
17
23_P0_5
FACTORY
FACTORY MODE enable, low active
Pull Down
I
18
18_P4_2
RX1/SCL/
IR_TX
HOST_UART_TX (data in to
RTL8762D )/I2C clock
Pull Down
I
19
16_RST_N
RESET_N
Reset, Low Active
Pull Up
I
20
17_P4_3
TX1/SDA/
IR_RX
HOST_UART_RX (data out from
RTL8762D)/I2C data
Pull Up
O
21
44_P3_0
TX0
FACTORY_UART_TX data out
Pull Up
O
22
22_P0_6
IO8
GPIO 8
Pull Down
I/O
23
43_P3_1
RX0
FACTORY_UART_RX data in
Pull Up
I
24
49
GND
Ground of Module
-
-
25
-
NC
-
-
-
26
2_P2_2
ADC0/IO6
Analog-to-Digital Converter 0/GPIO 6
Pull Down
I/O
27
-
NC
-
-
-

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3.2 Trap Pins
Table 3.2 Trap Pins Definition
No.
Pin of IC
Trap Pin Description
Note
29
26_P0_3
Power On Trap Pin Description
1:Normal operation mode(default)
0:Enter download mode
Don’t pull down when Power on,
and otherwise the module will
enter download mode.
26
2_P2_2
There must not be any voltage drop
placed on ADC pin before module is
powered, because current input that
over 1mA will damage ADC channel
connect to this pin. (Digital function will
not be affected).
If used as ADC, There are two
modes for module:
Bypass mode (range: 0~0.9V):
ADC maximum input voltage
cannot exceed 0.9V in this mode,
and AUXADC full-scale voltage is
about 0.9V. If the input voltage
exceeds the ADC range, IC will be
damaged.
Divide mode (range: 0~3.3V)：
In this mode, AUXADC full-scale is
3.3V in this mode. When the input
voltage is 3.3~3.6V, the ADC value
may be out of range, causing
measurement error.
28
4_P2_4
30
5_P2_5
19
16_RST_N
The module has RC circuit connect to
the Reset pin, there is no need to add
RC externally, and otherwise it will cause
abnormal operation.
-
20
17_P4_3
If used as I2C SDA, an external pull up
resistor is suggested to be reserved.
-
18
18_P4_2
If used as I2C SCL, an external pull up
resistor is suggested to be reserved.
-
28
4_P2_4
ADC1/IO9
Analog-to-Digital Converter 1/GPIO 9
Pull Down
I/O
29
26_P0_3
IO7
GPIO 7
Pull Up
I/O
30
5_P2_5
ADC2/IO10
Analog-to-Digital Converter 2/GPIO
10
Pull Down
I/O
31
49
GND
Ground of Module
-
-
32
49
GND
Ground of Module
-
-

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4Design Guidelines
4.1 Power Supply
The LA02303B requires a single nominal supply level of 3.3V. All the necessary decoupling and
filtering components are included in the module. To secure the best RF performance, the power
supply for the module is recommended to have the output current higher than 30mA and have the
ripple voltage less than 100mV
4.2 Module Placement
Figure 4.1 Antenna Area
Figure 4.2 Horizontal Mounting
The copper clearance area under the antenna must be void of traces or components;
It should be clear of any metal, no metal structures, no metal compositions like metallic paint
etc.;
The ground length should be 30mm at least.
Reference examples are shown as below:

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Figure 4.3 Reference Examples for Horizontal Mounting
Figure 4.4 Vertical Mounting
Space around the module should be clear of metal, there should be no metal and no metal
compositions. (no copper clearance on the application board);
For better performance, keep metal away from the module as far as possible, especially heavy
metal components;
The best position we suggest is at the edge of the application board, which provides more
distance from the metal.
Reference examples are shown as below:
Figure 4.5 Reference Examples for Vertical Mounting
Regardless of which mounting method you choose, keep at least 1.5mm distance between module
and plastic part, especially between the antenna and plastic housing.

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Figure 4.6 Distance between Module and Plastic
Remark: due to the size and the shape of the application board could have impact on antenna patterns and
efficiency, and different components make different coupling, different end products would have different antenna
performance.
5Package Specifications
5.1 Dimension
Figure 5.1 Module Dimensions

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5.2 PCB Pads Information
Figure 5.2 Pad Size
5.3 Plug-in Land Pattern Example
Figure 5.3 Plug-in PCB Land Pattern
Note:
Black printing is PCB slot, the size tolerance should be +0.1/-0mm, the thickness of the PCB
should be 1.2mm or 1.6mm;
The red solder pad is to drag solder water across, it is not the solder pad for the module. During
wave soldering it is used to drag the solder paste water across, so that it will not be soldered
together with the module’s solder pads;
It is suggested to add silk printing between the pads to avoid them welded together;

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It is suggested to put metallized through holes between the module pad and PCB slots to
improve connectivity. See the recommended lay-out in Figure 5.4.
Figure 5.4 Plug-in PCB View
5.4 SMD Land Pattern Example
Figure 5.5 SMD Land Pattern
Note:
Antenna area refer to 4.2 Module Placement for antenna integration guidelines for optimal
performance;
The area marked by the R2 circle should be copper keep-out.

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6Production Guide
6.1 Handing Precaution
The modules packed with the anti-moisture bag shall be stored in the environment with ambient
temperature under 40℃and ambient humidity less than 90%RH;
The module is suggested to be applied to end product in 12 months after the production date;
With respect to the storage condition for the module after it’s unpacked, the ambient
temperature shall be controlled at 25±5℃and humidity shall be less than 10%RH;
All the surface mounting processes (reflow process including rework process) must be completed
in 168 hours after the bag is opened (including any other processes);
All the operators shall use ESD protective floor mats, wrist straps, ESD protective footwear, air
ionizers etc..,
While operating, water and dirt should not make any contact with the modules.
6.2 Soldering Recommendation
Refer to below information for SMT temperature settings, which has been used at the module
production site. It is provided here for reference only. Note that the reflow times should not be more
than 2 times.
Figure 6.1 SMT Temperature Setting Curve
25
120
175
198
225
240 245
80
0
50
100
150
200
250
300
050 100 150 200 250 300 350
Temperature(℃)
Time(sec.)
SMT TEMPERATURE SETTING
Reflow Zone
Soldering Time>30s
Cooling Zone
Preheating Zone
120~225℃50~200s
Ramp-up Zone
0~50℃

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7Package Information
7.1 Tape and Reel
All dimensions are given in mm unless otherwise indicated.
Figure 7.1 Carrier Tape Dimensions
Figure 7.2 Reel Dimensions
7.2 Package and Weight
Each reel contains 700 pcs, weight of single module is 1.47g±15 %( 1.25g-1.69g).
8Declaration
FCC Statement
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection

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against harmful interference in a residential installation. This equipment generates, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the following
measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
- Consult the dealer or an experienced radio/TV technician for help.
This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause
undesired operation.
Any changes or modifications not expressly approved by the party responsible for compliance could
void the user’s authority to operate the equipment.
Please notice that if the FCC identification number is not visible when the module is installed inside
another device, then the outside of the device into which the module is installed must also display a
label referring to the enclosed module. This exterior label can use wording such as the following:
“Contains FCC ID: 2AB2Q-LA02303B” any similar wording that expresses the same meaning may be
used.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with a minimum distance of 20cm
between the radiator & your body. This transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
The device must be professionally installed.
The intended use is generally not for the general public. It is generally for industry/commercial use.
The connector is within the transmitter enclosure and can only be accessed by disassembly of the
transmitter that is not normally required. The user has no access to the connector.
Installation must be controlled. Installation requires special training

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This module has been assessed against the following FCC rule parts: CFR 47 FCC Part 15 C (15.247,
DTS) and CFR 47 FCC Part 15 E (NII). It is applicable to the modular transmitter.
Canada Statement
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the
following two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio
exempts de licence. L’exploitation est autorisée aux deux conditions suivantes:
(1) l’appareil ne doit pas produire de brouillage;
(2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d’en compromettre le fonctionnement.
Please notice that if the ISED certification number is not visible when the module is installed inside
another device, then the outside of the device into which the module is installed must also display a
label referring to the enclosed module. This exterior label can use wording such as the following:
“Contains IC: 10256A-LA02303B” any similar wording that expresses the same meaning may be
used. l'appareil hôte doit porter une étiquette donnant le numéro de certification du module
d'Industrie Canada, précédé des mots « Contient un module d'émission », du mot « IC: 10256A-
LA02303B» ou d'une formulation similaire exprimant le même sens, comme suit.
The device meets the exemption from the routine evaluation limits in section 2.5 of RSS 102 and
compliance with RSS-102 RF exposure, users can obtain Canadian information on RF exposure and
compliance.
Le dispositif rencontre l'exemption des limites courantes d'évaluation dans la section 2.5 de RSS 102
etla conformité à l'exposition de RSS-102 RF, utilisateurs peut obtenir l'information canadienne
surl'exposition et la conformité de rf.
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter. This equipment should be installed and operated with a minimum distance of 20
centimeters between the radiator and your body.
Cet émetteur ne doit pas être Co-placé ou ne fonctionnant en même temps qu'aucune autre antenne
ouémetteur. Cet équipement devrait être installé et actionné avec une distance minimum de 20
centimètres

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entre le radiateur et votre corps.
Notice to OEM integrator
Must use the device only in host devices that meet the FCC/ISED RF exposure category of mobile,
which means the device is installed and used at distances of at least 20cm from persons.
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
The end user manual shall include FCC Part 15 /ISED RSS GEN compliance statements related to the
transmitter as show in this manual(FCC/IC Canada statement).
Host manufacturer is responsible for compliance of the host system with module installed with all
other applicable requirements for the system such as Part 15 B, ICES 003.
Host manufacturer is strongly recommended to confirm compliance with FCC/ISED requirements for
the transmitter when the module is installed in the host.
The use condition limitations extend to professional users, then instructions must state that this
information also extends to the host manufacturer’s instruction manual.
This module is stand-alone modular. If the end product will involve the multiple simultaneously
transmitting condition or different operational conditions for a stand-alone modular transmitter in a
host, host manufacturer have to consult with module manufacturer for the installation method in
end system.
Any company of the host device which install this modular should perform the test of radiated &
conducted emission and spurious emission etc. according to FCC Part 15C: 15.247 and 15.209 &
15.207, 15B class B requirement, only if the test result comply with FCC part 15C: 15.247 and
15.209 & 15.207, 15B class B requirement. Then the host can be sold legally.
This modular transmitter is only FCC authorized for the specific rule parts (47CFR Part 15.247
and 15.407) listed on the grant, and that the host product manufacturer is responsible for
compliance to any other FCC rules that apply to the host not covered by the modular transmitter
grant of certification.
Host manufacturer is strongly recommended to confirm compliance with FCC/ISED
requirements for the transmitter when the module is installed in the host.
Must have on the host device a label showing Contains FCC ID: 2AB2Q-LA02303B or IC: 10256A-
LA02303B
Both FCC ID and IC ID are not to be placed on the host at the same time and only hosts going into the
US can use the FCC ID and only hosts going into Canada can use the IC ID.
Antenna: PCB Antenna & 4 dBi
l'hôte doit utiliser l'instrument uniquement dans des dispositifs qui répondent à la fcc / (catégorie
d'exposition rf mobile, ce qui signifie le dispositif est installé et utilisé à une distance d'au moins 20