Leedarson LA02303B User manual

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LA02303B
Bluetooth SMART (BLE) Module
Key features
Support Bluetooth v5.1 core specification, support 2Mbps LE and LE long Range
Embedded a 32-bit ARM Cortex-M4F with float-point unit, with clock up to 90MHz
Data Memory: 256KB internal ROM, 192KB internal RAM, 1MB internal Flash
Frequency of system crystal oscillator: 40MHz\32.768KHz
Power supply voltage: 2.0V～3.6V
Operating temperature: -40℃～100℃
Operating frequency: 2400～2483.5MHz
TX output power:8dBm (Typical)
BLE Receiving sensitivity:
-95dBm @1Mbps; -92dBm @2Mbps; -98dBm @500Kbps; -103dBm @125Kbps
Dimension: 16mm*23.7mm*2.5mm
Interface:
Vertical Mount (Plug-In)
6 PWMs (GPIOs), 1 Available UART, 1 ADC (GPIO), 1 debug UART
Horizontal (SMD)
6 PWMs (GPIOs), 1 Available UART, 3 ADCs (GPIOs), 1 debug UART, 1 GPIO
Built-in PCB trace antenna
Integrates the Afero Secure Connectivity Stack
Supports Afero Easy Onboarding
Supports Afero Secure Over the Air updates

LA02303B BLE Module Specification
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TABLE OF CONTENTS
1 Introduction.............................................................................................................................................. 3
1.1 Overview ....................................................................................................................................... 3
1.2 Block Diagram ............................................................................................................................... 4
1.3 Ordering Information.................................................................................................................... 4
2 Electrical Characteristics .......................................................................................................................... 5
2.1 Absolute Maximum Ratings.......................................................................................................... 5
2.2 General Operating Conditions...................................................................................................... 5
2.3 DC Specifications........................................................................................................................... 6
2.4 RF Specifications ........................................................................................................................... 6
2.5 Antenna Specifications ................................................................................................................. 7
3 Pin Definition ............................................................................................................................................ 7
3.1 Default and Multiplexing Pin Definition....................................................................................... 7
3.2 Trap Pins ........................................................................................................................................ 9
4 Design Guidelines................................................................................................................................... 10
4.1 Power Supply............................................................................................................................... 10
4.2 Module Placement...................................................................................................................... 10
5 Package Specifications ........................................................................................................................... 12
5.1 Dimension ................................................................................................................................... 12
5.2 PCB Pads Information ................................................................................................................. 13
5.3 Plug-in Land Pattern Example..................................................................................................... 13
5.4 SMD Land Pattern Example ........................................................................................................ 14
6 Production Guide.................................................................................................................................... 15
6.1 Handing Precaution .................................................................................................................... 15
6.2 Soldering Recommendation....................................................................................................... 15
7 Package Information............................................................................................................................... 16
7.1 Tape and Reel .............................................................................................................................. 16
7.2 Package and Weight.................................................................................................................... 16
8 Declaration.............................................................................................................................................. 16

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TABLE OF CHART
Figure 1.1 Module ....................................................................................................................................... 3
Figure 1.2 Product Application ................................................................................................................... 3
Figure 1.3 LA02303B Block Diagram........................................................................................................... 4
Figure 3.1 Module Pin Out.......................................................................................................................... 7
Figure 4.1 Antenna Area ........................................................................................................................... 10
Figure 4.2 Horizontal Mounting................................................................................................................ 10
Figure 4.3 Reference Examples for Horizontal Mounting........................................................................ 11
Figure 4.4 Vertical Mounting .................................................................................................................... 11
Figure 4.5 Reference Examples for Vertical Mounting ............................................................................ 11
Figure 4.6 Distance between Module and Plastic.................................................................................... 12
Figure 5.1 Module Dimensions................................................................................................................. 12
Figure 5.2 Pad Size..................................................................................................................................... 13
Figure 5.3 Plug-in PCB Land Pattern ......................................................................................................... 13
Figure 5.4 Plug-in PCB View ...................................................................................................................... 14
Figure 5.5 SMD Land Pattern .................................................................................................................... 14
Figure 6.1 SMT Temperature Setting Curve ............................................................................................. 15
Figure 7.1 Carrier Tape Dimensions.......................................................................................................... 16
Figure 7.2 Reel Dimensions....................................................................................................................... 16
_________________________________________________________________________________
Table 1.1 Ordering Information .................................................................................................................. 4
Table 2.1 Absolute Maximum Ratings ........................................................................................................ 5
Table 2.2 General Operating Conditions .................................................................................................... 5
Table 2.3 DC Specifications ......................................................................................................................... 6
Table 2.4 BLE Specifications ........................................................................................................................ 6
Table 2.5 Antenna Specifications................................................................................................................ 7
Table 3.1 Pin Definition ............................................................................................................................... 7
Table 3.2 Trap Pins Definition...................................................................................................................... 9

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1Introduction
1.1 Overview
The LA02303B is a Leedarson-developed universal Bluetooth SMART (BLE) module. It uses the
Realtek Inc. RTL8762DKF System in Package that integrates an embedded 1MB flash.
Figure 1.1 Module
It also integrates antenna on PCB which is designed for a variety of IOT products such as Door locker,
Power Drivers, Sensors, Plugs, Lighting, Switches, etc.
Figure 1.2 Product Application

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1.2 Block Diagram
A general block diagram of the module is shown as below.
LA02303B Module Block Diagram
ADC2
ADC1
ADC0
GND
GPIO8
TX1
RX1
GPIO7
NC
NC
RX0
TX0
RESET_N
FACTORY
Antenna
RX1
VCC
TX1
GND
ADC0
PWM6
FACTORY
PWM5
RESET_N
PWM4
TX0
PWM3
RX0
PWM2
GND
PWM1
Modem
ARM
Cortex-M4F
Patchable
ROM
256KB
Crystal
40M Hz
IO PINMUX
UART x2
SPI x2
I2C x2
GPIOs
Timers
AUXADC
IR
RC
Log UART
PGA+SDM_ADC
PMU
RTL8762DKF Chip
Diagram
Key Scan
Watchdog
Low Power
Comparator
DC/DC
Converter
6-channel
DMA Engine
Program Memory
Flash
1MB
Data Memory
RAM
192KB
OCP BUS
Crystal 40MHz DC/DC Inductor
GND GND
RF
tranceiver
APB
Crystal
32.768KHz
Crystal 32.768KHz
Figure 1.3 LA02303B Block Diagram
1.3 Ordering Information
Table 1.1 Ordering Information
Product
Protocol
IC Solution.
Operating
Temperature
Dimension
Antenna
LA02303B
BLE
RTL8762DKF
-40 ~100℃
16mm*23.7mm*2.5mm
PCB
antenna

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2Electrical Characteristics
2.1 Absolute Maximum Ratings
Stresses above those listed below may cause permanent damage to the device. This is a stress rating
only and functional operation of the devices at those or any conditions above those indicated in the
operation listing of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Table 2.1 Absolute Maximum Ratings
Symbol
Parameter
Min.
Max.
Units
VCC
Power supply
-0.3
+3.6
V
GND
Ground of module
0
V
VIO
Voltage of module IO
-0.3
+3.6
V
ST
Storage temperature
-40
+125
℃
MSL
Moisture sensitivity level
3
-
ESD HBM
Human body mode
±3.5
KV
2.2 General Operating Conditions
This table specifies the general operating temperature range and supply voltage range for all
supplies, the minimum and maximum values of all other tables are specified over this operating
range, unless otherwise noted.
Table 2.2 General Operating Conditions
Symbol
Parameter
Min.
Typ.
Max.
Units
VCC
Supply voltage, normal
2.0
3.3
3.6
V
TA
Operation temperature1
-40
25
85
℃
ICC Peak
Supply current peak2
-
22
-
mA
ICC Average
Supply current average2
-
7.24
-
mA
Note:
1. It refers in particular to the surface temperature on components of LA02303B when the
module is working. If the surface temperature of components is above 100℃, the RF parameters
will be worse;
2. It is measured when the module runs the RF test Firmware @25℃ambient temperature, it is
provided here for reference only.

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2.3 DC Specifications
Unless otherwise indicated, typical conditions are: VCC=3.3V. TA=25℃.
Table 2.3 DC Specifications
Symbol
Parameter(condition)
Min.
Typ.
Max.
Units
VIH
Input high voltage
0.65xVCC
-
VCC
V
VIL
Input low voltage
GND
-
0.28xVCC
V
VOH
Output high voltage
0.9xVCC
-
-
V
VOL
Output low voltage
-
-
0.1xVCC
V
IOH
Output high current
-
8
-
mA
IOL
Output low current
-
8
-
mA
RPU
Pull-up resistance
-
20
100
kΩ
RPD
Pull-down resistance
-
20
100
kΩ
ITX Peak
Pout=7dBm
-
17.7
-
mA
IRX
Rx average current
-
5.8
-
mA
Note:
The current is measured with the module running the RF test Firmware, it is provided here for
reference only.
2.4 RF Specifications
Unless otherwise indicated, typical conditions are: VCC=3.3V TA=25℃.
Table 2.4 BLE Specifications
Description
Min.
Typ.
Max.
Units
Operating Frequency
2400
-
2483.5
MHz
Modulation
GFSK
-
Channel Number
40
-
Channel Bandwidth
2
MHz
Basic Transmitting Rate
1Mbps/2Mbps/500Kbps/125Kbps
-
Frequency Offset
-100
-
100
KHz
TX Power
8
dBm
Receiving Sensitivity@1Mbps
-
-95
-
dBm
Receiving Sensitivity@2Mbps
-
-92
-
dBm
Receiving Sensitivity@500Kbps
-
-98
-
dBm
Receiving Sensitivity@125Kbps
-
-103
-
dBm
Maximum Receiving Level
-1
dBm

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2.5 Antenna Specifications
Table 2.5 Antenna Specifications
Parameter
Value
Frequency Range
2.4 ~ 2.4835GHz
Impedance
50 Ohm
VSWR
≤ 2.5
Antenna Gain
≤ 4dBi
Efficiency
≥ 50%
Remark: Different products have different configurations, which will result in different antenna performances. The
above parameters are based on the module being mounted on the evaluation board, horizontally or vertically,
shown as followed:
3Pin Definition
3.1 Default and Multiplexing Pin Definition
Figure 3.1 Module Pin Out
Table 3.1 Pin Definition
The Pin (1-18) is used for Plug-in application. The Pin on Bottom layer used for SMD application.
Pin 1 is adjacent to Pin 2.

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No.
Pin of IC
Definition
Pin Function Description
Default
Pull State
Direction
1
29_P0_0
PWM1/IO0
PWM Channel 1 output / GPIO 0
Pull Down
I/O
2
49
GND
Ground of Module
-
-
3
28_P0_1
PWM2/IO1
PWM Channel 2 output / GPIO 1
Pull Down
I/O
4
43_P3_1
RX0
FACTORY_UART_RX data in
Pull Up
I
5
27_P0_2
PWM3/IO2
PWM Channel 3 output / GPIO 2
Pull Down
I/O
6
44_P3_0
TX0
FACTORY_UART_TX data out
Pull Up
O
7
25_P0_4
PWM4/IO3
PWM Channel 4 output / GPIO 3
Pull Down
I/O
8
16_RST_N
RESET_N
Reset, Low Active
Pull Up
I
9
20_P4_0
PWM5/IO4
PWM Channel 5 output / GPIO 4
Pull Down
I/O
10
23_P0_5
FACTORY
FACTORY MODE enable, low active
Pull Down
I
11
19_P4_1
PWM6/IO5
PWM Channel 6 output / GPIO 5
Pull Down
I/O
12
2_P2_2
ADC0/IO6
Analog-to-Digital Converter 0/GPIO 6
Pull Down
I/O
13
49
GND
Ground of Module
-
-
14
17_P4_3
TX1/SDA/
IR_RX
HOST_UART_RX (data out from
RTL8762D)/I2C data
Pull Up
O
15
-
VCC
Power Supply
-
I
16
18_P4_2
RX1/SCL/
IR_TX
HOST_UART_TX (data in to
RTL8762D )/I2C clock
Pull Down
I
17
23_P0_5
FACTORY
FACTORY MODE enable, low active
Pull Down
I
18
18_P4_2
RX1/SCL/
IR_TX
HOST_UART_TX (data in to
RTL8762D )/I2C clock
Pull Down
I
19
16_RST_N
RESET_N
Reset, Low Active
Pull Up
I
20
17_P4_3
TX1/SDA/
IR_RX
HOST_UART_RX (data out from
RTL8762D)/I2C data
Pull Up
O
21
44_P3_0
TX0
FACTORY_UART_TX data out
Pull Up
O
22
22_P0_6
IO8
GPIO 8
Pull Down
I/O
23
43_P3_1
RX0
FACTORY_UART_RX data in
Pull Up
I
24
49
GND
Ground of Module
-
-
25
-
NC
-
-
-
26
2_P2_2
ADC0/IO6
Analog-to-Digital Converter 0/GPIO 6
Pull Down
I/O
27
-
NC
-
-
-

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3.2 Trap Pins
Table 3.2 Trap Pins Definition
No.
Pin of IC
Trap Pin Description
Note
29
26_P0_3
Power On Trap Pin Description
1:Normal operation mode(default)
0:Enter download mode
Don’t pull down when Power on,
and otherwise the module will
enter download mode.
26
2_P2_2
There must not be any voltage drop
placed on ADC pin before module is
powered, because current input that
over 1mA will damage ADC channel
connect to this pin. (Digital function will
not be affected).
If used as ADC, There are two
modes for module:
Bypass mode (range: 0~0.9V):
ADC maximum input voltage
cannot exceed 0.9V in this mode,
and AUXADC full-scale voltage is
about 0.9V. If the input voltage
exceeds the ADC range, IC will be
damaged.
Divide mode (range: 0~3.3V)：
In this mode, AUXADC full-scale is
3.3V in this mode. When the input
voltage is 3.3~3.6V, the ADC value
may be out of range, causing
measurement error.
28
4_P2_4
30
5_P2_5
19
16_RST_N
The module has RC circuit connect to
the Reset pin, there is no need to add
RC externally, and otherwise it will cause
abnormal operation.
-
20
17_P4_3
If used as I2C SDA, an external pull up
resistor is suggested to be reserved.
-
18
18_P4_2
If used as I2C SCL, an external pull up
resistor is suggested to be reserved.
-
28
4_P2_4
ADC1/IO9
Analog-to-Digital Converter 1/GPIO 9
Pull Down
I/O
29
26_P0_3
IO7
GPIO 7
Pull Up
I/O
30
5_P2_5
ADC2/IO10
Analog-to-Digital Converter 2/GPIO
10
Pull Down
I/O
31
49
GND
Ground of Module
-
-
32
49
GND
Ground of Module
-
-