Laird BTM410 Quick setup guide

BTM410/411 DATA MODULE
Hardware Integration Guide
Version 6.2
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REVISION HISTORY
Revision
Date
Description
1.0
1 March 2012
Initial Release
2.0
12 March 2012
General updates and compliant with firmware v16.1.3.0
3.0
13 April 2012
Reformatting and general edits
4.0
15 August 2012
Reformatting. Addition of Table 2-6. Reference to Table 2-6 in Table
2-1. Update to Sniff Mode section (everything following Figure 5). Cross
References. Updated ATI Commands table. Added links to Low Power
and Absolute Current Ratings application notes.
5.0
21 March 2013
Updated mechanical drawings, updated FCC statements, general
formatting edits.
6.0
16 January 2014
Separated document into two documents: Hardware Integration Guide
and User Guide
6.1
06 Feb 2014
Added the Bluetooth SIG Qualification section.
6.2
07 August 2014
Updated shipping tray image and added module package dimension
image.

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CONTENTS
Revision History .............................................................................................................................................. 2
Contents ........................................................................................................................................................ 3
1. Overview and Key Features ...................................................................................................................... 4
2. Specifications ........................................................................................................................................... 5
2.1 Detailed Specifications....................................................................................................................... 5
2.2 Pin Definitions ................................................................................................................................... 7
2.3 Operating Parameters........................................................................................................................ 8
2.4 Voltage Specifications........................................................................................................................ 8
3. FCC Regulatory Statements.................................................................................................................... 10
4. Declarations of Compliance ................................................................................................................... 12
5. Mechanical Drawings ............................................................................................................................. 14
5.1 BTM410 Mechanical Details.............................................................................................................14
5.4 BTM411 Mechanical Details.............................................................................................................17
6. Application Note for Surface Mount Modules ........................................................................................21
6.1 Introduction .................................................................................................................................... 21
6.2 Shipping.......................................................................................................................................... 21
6.3 Reflow Parameters........................................................................................................................... 22
7. Ordering Information ............................................................................................................................. 23
7.1 Product Part Numbers...................................................................................................................... 23
7.2 General Comments .........................................................................................................................23
8. Bluetooth SIG Qualification ....................................................................................................................23
8.1 Additional Assistance....................................................................................................................... 24
9. Related Documents and Files..................................................................................................................25

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1. OVERVIEW AND KEY FEATURES
The BTM410 and BTM411 Bluetooth® modules from Laird are designed to meet the needs of developers who
wish to add robust, short range Bluetooth data connectivity to their products. These modules are based on the
market leading Cambridge Silicon Radio BC04 chipset, providing exceptionally low power consumption with
outstanding range. They support the Bluetooth® version 2.1 specification, providing the important advantage
of Secure Simple Pairing (SSP), which improves security and ease of use for end customers.
With physical sizes as small as 12.5 mm x 18.0 mm and best of class, low-power operation, these modules are
the ideal choice for applications where designers need both performance and minimum size. For maximum
flexibility in systems integration, the modules are designed to support a separate power supply for I/O.
To aid product development and integration, Laird has integrated a complete Bluetooth protocol stack within
the modules, including support for the Bluetooth Serial Port Profile. The modules are fully qualified as
Bluetooth End Products, allowing designers to integrate them within their own products with no further
Bluetooth Qualification. They can then list and promote products on the Bluetooth website free of charge.
A comprehensive AT command interface is included, which simplifies firmware integration. Combined with a
low cost developer’s kit, choosing Laird Bluetooth modules guarantees the fastest route to market.
Features and Benefits
Bluetooth® v2.1+EDR
Adaptive Frequency Hopping to handle interference
from other wireless devices
Secure Simple Pairing (SSP) support
External or internal antenna options
Comprehensive AT interface for simple programming
Bluetooth® End Product Qualified
Compact size
Class 2 output –4 dBm
Low power operation
UART interface
PCM and SCO for external codec
GPIO lines under AT control
Wi-Fi co-existence
Applications
Embedded devices
Phone accessories
Security devices
Medical and wellness devices
Automotive applications
Bluetooth advertising
ePOS

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2. SPECIFICATIONS
2.1 Detailed Specifications
Table 2-1: Detailed specifications
Categories
Feature
Implementation
Wireless Specification
Bluetooth®
Version 2.1+EDR
Transmit Class
Class 2
Frequency
2.402 –2.480 GHz
Channels
79 channels Frequency Hopping
Adaptive Frequency Hopping
Max. Transmit Power
+4 dBm at antenna pad –BTM410
+4 dBmi from integrated antenna –BTM411
Min. Transmit Power
-27 dBm at antenna pad –BTM410
-27 dBmi from integrated antenna –BTM411
Receive Sensitivity
-84 dBm
Range
30 m
Data Transfer Rate
Up to 300 kbps
Antenna Modes
External Antenna
50 Ohm matched SMT pad –BTM410
Integrated Antenna (option)
+0 dBi multilayer ceramic –BTM411
UART Interface
Serial Interface
RS-232 bi-directional for commands and data
16550 compatible
Baud Rate
Configurable from 1,200 to 921,600 bps
Non-standard baud rates supported
Bits
8
Parity
Odd, even, none
Stop bits
1 or 2
Default Serial parameters
9600,n,8,1
Levels
Set by VDD_USB input
Modem Control
DTR, DSR, DCD, RI, RTS, CTS
General Purpose
Interface
I/O
8 general purpose I/O pins
Audio
Support
1 PCM channel @ 64 kbps
SCO Channels
Support SCO and eSCO
PCM Interface
Configurable as master or slave
8 bit A-law
8 bit μ-law
13 bit linear
PCM Clock available when in slave mode

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Categories
Feature
Implementation
Protocols And Firmware
Bluetooth Stack
Version 2.1 compliant. Fully integrated.
Profiles
GAP (Generic Access Profile)
SDP (Service Discovery Profile)
SPP (Serial Port Profile)
Firmware Upgrade
Available over UART
Connection Modes
Point to point (cable replacement)
Command Interface
AT Instructions set
Comprehensive control of connection and
module operation S Registers for non-volatile
storage of parameters
Current Consumption
Data Transfer
Typically 32 mA
Note: For an Absolute Current Ratings
summary, see Table 2-6.
Low Power Sniff Mode
Less than 2.5mA
Supply Voltage
Supply
3.0 V –3.3 V DC
I/O
1.7 V –3.3 V DC (independent of Supply)
USB & UART
1.7 V –3.6 V DC (independent of Supply)
Coexistence/
Compatibility
WLAN (802.11)
2-wire and 3-wire hardware coexistence
schemes supported
Connections
Interface
Surface Mount Pads
External Antenna (BTM410)
Pad for 50 Ohm antenna
Physical
Dimensions
12.5 mm x 18.0 mm x 3.4 mm BTM410
12.5 mm x 22.0 mm x 3.4 mm BTM411
Weight
3 grams
Environmental
Operating Temperature
-40° C to +85° C
Storage Temperature
-40° C to +85° C
Approvals
Bluetooth
Qualified as an Bluetooth End product
FCC
Limited Modular Approval (BTM410)
Full Modular Approval (BTM411)
CE & R&TTE
Meets CE and R&TTE requirements
Miscellaneous
Lead free
Lead-free and RoHS compliant
Warranty
12 Months
Development Tools
Development Kit
Development board and software tools
DVK-BTM410 Dev Kit with BTM410 module
DVK-BTM411 Dev Kit with BTM411 module

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2.2 Pin Definitions
Table 2-2: Pin definitions
Pin #
Signal
Description
Voltage Specification
1
Unused
2
GND
3
UART_CTS
Clear to Send I/P
VUSB
4
UART_RXD
Receive data I/P
VUSB
5
UART_RTS
Request to Send O/P
VUSB
6
UART_TXD
Transmit data O/P
VUSB
7
GND
8
SPI_CSB
SPI bus chip select I/P
VIO
9
SPI_MISO
SPI bus serial O/P
VIO
10
SPI_MOSI
SPI bus serial I/P
VIO
11
SPI_CLK
SPI bus clock I/P
VIO
12
VDD_USB
USB & UART supply voltage
13
VDD_IO
I/O supply voltage
14
VDD_IN
Main supply voltage
15
GND
16
PCM_IN
PCM data I/P
VIO
17
PCM_SYNC
PCM sync I/P
VIO
18
PCM_CLK
PCM clock I/P
VIO
19
PCM_OUT
PCM data O/P
VIO
20
RESET
Module reset I/P
See note 2
21
GPIO4
I/O for host - BT_Active / BT_State
VIO
22
GPIO2 / UART_DCD
I/O for host
VIO
23
GND
24
Unused
25
Unused
See note 3
26
Unused
See note 3
27
Unused
See note 3
28
GND (BTM410 only)
See note 3
29
ANT (BTM410 only)
Antenna connection (50 ohm matched)
See note 3
30
GND (BTM410 only)
See note 3
31
Unused
See note 3
32
Unused
See note 3
33
Unused
See note 3
34
Unused
See note 3
35
Unused
See note 3
36
Unused
See note 3
37
Unused
See note 3
38
Unused
39
Unused

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Pin #
Signal
Description
Voltage Specification
40
Unused
41
GND
42
GPIO1 / UART_RI
I/O for host
VIO
43
GPIO7 / UART_ DTR
I/O for host
VIO
44
GPIO8 / UART_DSR
I/O for host
VIO
45
GND
46
D-
Not used for AT module variants
VUSB
47
D+
Not used for AT module variants
VUSB
48
GPIO6
I/O for host - RF_Active
VIO
49
GPIO5
I/O for host - WLAN_Active
VIO
50
GPIO3
I/O for host - BT_Priority
VIO
1. Unused pins may have internal connections and must not be connected.
2. Reset input is active low. Input is pulled up to VDD_IN via 22k. Minimum reset pulse width is 5 ms.
3. Pins 8 –11 (SPI related) are only for Laird internal production purposes.
4. Pins 25-37 should be left not connected on modules with integrated antenna.
2.3 Operating Parameters
Table 2-3: Operating parameters
Operating Condition
Min
Max
VDD_USB (USB compatibility not required)
1.7
3.6
VDD_USB (USB compatibility required)
3.1
3.6
VDD_IO
1.7
3.3
VDD_IN
3.0
3.3
2.4 Voltage Specifications
Table 2-4: Voltage specifications (VUSB)
Min
Typ
Max
Input Voltage Levels
Vih
0.7VDD_USB
Vil 2.7<VDD_USB<3.0
1.7<VDD_USB<1.9
-0.4
-0.4
+0.8
-0.4
Output Voltage Levels (1.7<VDD_USB<1.9)
Voh (Iout = -4mA)
VDD_USB –0.4
Vol (Iout = 4mA)
0.4
Output Voltage Levels (2.7<VDD_USB<3.0)
Voh (Iout = -4mA)
VDD_USB –0.2
Vol (Iout = 4mA)
0.2
Note: VDD_USB must be connected to power the USB and UART interfaces.

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Table 2-5: Voltage specifications (VIO)
Min
Typ
Max
Input Voltage Levels
Vih
0.7VDD_IO
Vil 2.7<VDD_USB<3.0
1.7<VDD_USB<1.9
-0.4
-0.4
+0.8
-0.4
Output Voltage Levels (1.7 < VDD_IO < 1.9)
Voh (Iout = -4 mA)
VDD_USB –0.4
Vol (Iout = 4 mA)
0.4
Output Voltage Levels (2.7 < VDD_IO < 3.0)
Voh (Iout = -4 mA)
VDD_USB –0.2
Vol (Iout = 4 mA)
0.2
Table 2-6: Absolute Current Rating Summary
Power up / reset
I_avg_reset
20.7 mA
t_reset_current_dur.
3.0 s
Idle(2)
I_avg @ 9600 baud
2.60 mA
5 second average, no data at
UART(2)
I_avg @ 38400 baud
2.75 mA
I_avg @ 115200 baud
2.95 mA
I_avg @ 460800 baud
4.37 mA
Connectable and
Discoverable
I_avg_cycle
23.1 mA
AT+BTP / ATS512=4, 9600 Baud,
average over 1 interval
Inquiry
I_avg_inquiry
42.1 mA
Initiate pairing
I_avg_pair_ini
28.8 mA
Accept pairing
I_avg_pair_acc
42.0 mA
Initiate a connection (SPP)
I_avg_connect_ini
39.8 mA
Accept a connection (SPP)
I_avg_connect_ini
37.2 mA
Connected as master, no
data exchange
I_avg_conn_master_idle
13.3 mA
Active mode
I_avg_master_sniff_idle
13.6 mA
Sniff interval=50 ms
I_avg_master_ssr_idle
9.9 mA
SSR, interval=300 ms
Connected as slave, no data
exchange
I_avg_conn_slave_idle
29.0 mA
Active mode
I_avg_slave_sniff_idle
12.7 mA
Sniff interval=50 ms
I_avg_slave_ssr_idle
9.9 mA
SSR, interval=300 ms
1. All current peaks measured were less than 86 mA.
2. Even when no data transmits, higher baud rates cause a higher standby current.
3. For additional information on Absolute Current Rating, see Application Note –BTM41x Absolute Current Ratings located at
www.lairdtech.com/wireless.

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3. FCC REGULATORY STATEMENTS
3.1 BTM410 FCC and Industry Canada Statements
The Final Equipment user manual must show the following statements:
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s
authority to operate the equipment.
To comply with the FCC RF exposure compliance requirements, this device and its antenna must not be
co-located or operating to conjunction with any other antenna or transmitter.
3.1.1 Considerations for OEM Integration
This module has a limited modular approval. Approval with any other antenna configuration or layout other
than that approved will necessitate additional radiated emission testing to be performed.
To inherit the modular approval, the antennas for this transmitter must be installed to provide a separation
distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any
other antenna or transmitter.
This module was approved with the following antenna:
RF Solutions: ANT-24G-WHJ-SMA 0dBi
Operation of this module with any other antenna will require additional testing to be performed.
Co-location with other radio transmitting devices operating concurrently in the same band will require
additional testing and certification.
Designers should note the distinction that the FCC makes regarding portable and mobile devices. Mobile
devices are defined as products that are not used closer than 20cm to the human body, whereas portable
devices can be used closer that 20cm to the body. A device may be used in portable exposure conditions with
no restrictions on host platforms when the averaged output power is less than the low power threshold for an
uncontrolled environment ≤60/f(GHz) i.e. 25mW for a 2.4Ghz device. The Maximum Power Exposure for the
BTM410 has been evaluated and found to comply with the low power threshold for an uncontrolled
environment.
Refer to FCC document KDB 447498 for more information on RF exposure procedures and equipment
authorization policies for mobile and portable devices.
3.1.2 FCC Labelling Requirement
If the FCC ID is not visible when the module is installed inside another device, then the outside of the device
into which the module is installed must also display a label referring to the enclosed module. This exterior label
can use wording such as the following: “Contains Transmitter Module FCC ID: PI4410B” or “Contains FCC ID:
PI4410B.” Any similar wording that expresses the same meaning may be used.

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3.2 BTM411 FCC and Industry Canada Statements
The user manual must show the following statements:
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s
authority to operate the equipment.
To comply with the FCC RF exposure compliance requirements, this device and its antenna must not be
co-located or operating to conjunction with any other antenna or transmitter.
3.2.1 Considerations for OEM Integration
To inherit the modular approval, the antennas for this transmitter must be installed to provide a separation
distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any
other antenna or transmitter.
Co-location with other radio transmitting devices operating concurrently in the same band will require
additional testing and certification.
Designers should note the distinction that the FCC makes regarding portable and mobile devices. Mobile
devices are defined as products that are not used closer than 20cm to the human body, whereas portable
devices can be used closer that 20cm to the body. A device may be used in portable exposure conditions with
no restrictions on host platforms when the averaged output power is less than the low power threshold for an
uncontrolled environment ≤60/f (GHz) i.e. 25 mW for a 2.4 GHz device. The Maximum power Exposure for
the BTM411 has been evaluated and found to comply with the low power threshold for an uncontrolled
environment.
Refer to FCC document KDB 447498 for more information on RF exposure procedures and equipment
authorization policies for mobile and portable devices.
3.2.2 FCC Labelling Requirement
If the FCC ID is not visible when the module is installed inside another device, then the outside of the device
into which the module is installed must also display a label referring to the enclosed module. This exterior label
can use wording such as the following: “Contains Transmitter Module FCC ID: PI4411B” or “Contains FCC ID:
PI4411B.” Any similar wording that expresses the same meaning may be used.

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4. DECLARATIONS OF COMPLIANCE
4.1 EU Declaration of Conformity –BTM410
Manufacturer:
Laird Technologies
Product:
BTM410
EU Directive:
RTTE 1995/5/EC
Conformity Assessment:
Annex IV
4.1.1 Reference Standards used for Presumption of Conformity
Article Number
Requirement
Reference standard(s)
3.1a
Health and Safety
EN 60950-1:2006
3.1b
Protection requirements with
respect to electromagnetic
compatibility
EN 301 489-1 V1.8.1
EN 301 489-17 V2.1.1
Emissions:
EN55022:2006/A1:2000/A2:2006(ClassB)
Immunity:
EN61000-4-2:1995/A1:1998/A2:2001
EN61000-4-3:2002/A1:2002
3.2
Means of the efficient use of the
radio frequency spectrum
EN 300 328 V1.7.1 (2006-10)
4.1.2 Declaration
We, Laird Technologies, declare under our sole responsibility that the essential radio test suites have been
carried out and that the above product to which this declaration relates is in conformity with all the applicable
essential requirements of Article 3 of the EU Directive 1995/5/EC, when used for its intended purpose.
Place of Issue:
Ezurio Ltd dba Laird Technologies
Saturn House, Mercury Park
Wooburn Green
HP100HH,
United Kingdom
tel: [phone]
fax: [phone]
Date of Issue:
October 2009
Name of Authorized Person:
Andrew Dobbing –Engineering Manager
Signature:

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4.2 EU Declaration of Conformity –BTM411
Manufacturer:
Laird Technologies
Product:
BTM411
EU Directive:
RTTE 1995/5/EC
Conformity Assessment:
Annex IV
4.2.1 Reference Standards used for Presumption of Conformity
Article Number
Requirement
Reference standard(s)
3.1a
Health and Safety
EN 60950-1:2006
3.1b
Protection requirements with
respect to electromagnetic
compatibility
EN 301 489-1 V1.8.1
EN 301 489-17 V2.1.1
Emissions:
EN55022:2006/A1:2000/A2:2006 (ClassB)
Immunity:
EN61000-4-2:1995/A1:1998/A2:2001
EN61000-4-3:2002/A1:2002
3.2
Means of the efficient use of the
radio frequency spectrum
EN 300 328 V1.7.1 (2006-10)
4.2.2 Declaration:
We, Laird Technologies, declare under our sole responsibility that the essential radio test suites have been
carried out and that the above product to which this declaration relates is in conformity with all the applicable
essential requirements of Article 3 of the EU Directive 1995/5/EC, when used for its intended purpose.
Place of Issue:
Laird Technologies
Saturn House, Mercury Park
Wooburn Green
HP100HH,
United Kingdom
tel: [phone]
fax: [phone]
Date of Issue:
October 2009
Name of Authorized Person:
Andrew Dobbing –Engineering Manager
Signature:

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5. MECHANICAL DRAWINGS
5.1 BTM410 Mechanical Details
Note: An area of 1.5 mm around the module should be reserved as a keep-out area.
Development Kit Schematics can be accessed here: Development Kit Schematics –BTM410 / BTM411

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5.2 BTM410 Mechanical Details
Note: An area of 1.5 mm around the module should be reserved as a keep-out area. No other
components should be placed in this area.
Development Kit Schematics can be accessed here: Development Kit Schematics –BTM410 / BTM411

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5.3 BTM410 Mechanical Details
WARNING: Test point dimensions are for reference only. DO NOT make electrical connections to
these test points, this will void the warranty. Laird does not recommend routing on the top layer
underneath the module.
Development Kit Schematics can be accessed here: Development Kit Schematics –BTM410 / BTM411

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5.4 BTM411 Mechanical Details
Note: An area of 1.5 mm around the module should be reserved as a keep-out area.

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Development Kit Schematics can be accessed here: Development Kit Schematics –BTM410 / BTM411
5.5 BTM411 Mechanical Details
Note: An area of 1.5 mm around the module should be reserved as a keep-out area.

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Development Kit Schematics can be accessed here: Development Kit Schematics –BTM410 / BTM411
5.6 BTM411 Mechanical Details
Note: An area of 1.5 mm around the module should be reserved as a keep-out area.

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Development Kit Schematics can be accessed here: Development Kit Schematics –BTM410 / BTM411
5.7 BTM411 Mechanical Details
WARNING: Test point dimensions are for reference only. DO NOT make electrical connections to
these test points, this will void the warranty. Laird does not recommend routing on the top layer
underneath the module.