Lenovo ThinkSystem ST250 V2 User manual

ThinkSystem ST250 V2
Maintenance Manual
Machine Types: 7D8F and 7D8G

Note
Before usin this information and the product it supports, be sure to read and understand the safety
information and the safety instructions, which are available at:
http://thinksystem.lenovofiles.com/help/topic/safety_documentation/pdf_files.html
In addition, ensure that you are familiar with the terms and conditions of the Lenovo warranty for your server,
which can be found at:
http://datacentersupport.lenovo.com/warrantylookup
First Edition (March 2022)
© Copyright Lenovo 2022.
LENO O and THINKSYSTEM are trademarks of Lenovo. All other trademarks are the property of their respective
owners.
LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered pursuant to a General Services
Administration (GSA) contract, use, reproduction, or disclosure is subject to restrictions set forth in Contract No. GS-35F-
05925.

Contents
Safety . . . . . . . . . . . . . . . . . . v
Safety inspection checklist . . . . . . . . . . . vi
Chapter 1. Introduction . . . . . . . . . 1
Server form factor . . . . . . . . . . . . . . . 3
Specifications . . . . . . . . . . . . . . . . 3
Particulate contamination . . . . . . . . . . 8
Firmware updates . . . . . . . . . . . . . . . 9
Tech Tips . . . . . . . . . . . . . . . . . 13
Security advisories . . . . . . . . . . . . . 13
Power on the server . . . . . . . . . . . . . 13
Power off the server . . . . . . . . . . . . . 13
Chapter 2. Server components . . . . 15
Front view . . . . . . . . . . . . . . . . . 17
Front panel . . . . . . . . . . . . . . . . 19
Side view . . . . . . . . . . . . . . . . . 21
Rear view . . . . . . . . . . . . . . . . . 22
Rear view LEDs . . . . . . . . . . . . . . . 24
System-board components . . . . . . . . . . 27
System-board LED . . . . . . . . . . . . . 28
System-board jumpers and buttons . . . . . . . 28
Drive backplates/backplanes . . . . . . . . . 30
Power distribution board . . . . . . . . . . . 32
RAID adapters . . . . . . . . . . . . . . . 34
Server locks . . . . . . . . . . . . . . . . 35
Internal cable routin . . . . . . . . . . . . . 37
Fan power cable. . . . . . . . . . . . . 37
Front panel . . . . . . . . . . . . . . . 38
M.2 adapter, intrusion switch, and RAID flash
power module . . . . . . . . . . . . . 40
Optical/tape drives. . . . . . . . . . . . 40
Fixed power supply . . . . . . . . . . . 41
Redundant power supplies . . . . . . . . 43
Simple-swap drives . . . . . . . . . . . 44
Hot-swap drives. . . . . . . . . . . . . 48
Parts list. . . . . . . . . . . . . . . . . . 58
Power cords . . . . . . . . . . . . . . 62
Chapter 3. Internal cable routing . . . 63
Fan power cable . . . . . . . . . . . . . . 63
Front panel . . . . . . . . . . . . . . . . 64
M.2 adapter, intrusion switch, and RAID flash
power module . . . . . . . . . . . . . . . 66
Optical/tape drives . . . . . . . . . . . . . 66
Fixed power supply . . . . . . . . . . . . . 67
Redundant power supplies . . . . . . . . . . 69
Simple-swap drives . . . . . . . . . . . . . 70
Four 3.5-inch simple-swap drives . . . . . . 70
Ei ht 3.5-inch simple-swap drives . . . . . . 71
Six 3.5-inch simple-swap drives with ODD/
tape drives . . . . . . . . . . . . . . . 72
Hot-swap drives . . . . . . . . . . . . . . 74
Four 3.5-inch hot-swap drives . . . . . . . 74
Ei ht 3.5-inch hot-swap drives . . . . . . . 77
Ei ht 2.5-inch hot-swap drives . . . . . . . 78
Sixteen 2.5-inch hot-swap drives . . . . . . 80
Four 3.5-inch and ei ht 2.5-inch hot-swap
drives . . . . . . . . . . . . . . . . . 82
Chapter 4. Hardware replacement
procedures . . . . . . . . . . . . . . . 85
Installation uidelines . . . . . . . . . . . . 85
Safety inspection checklist. . . . . . . . . 86
System reliability uidelines . . . . . . . . 87
Workin inside the server with the power on . . 87
Handlin static-sensitive devices . . . . . . 88
3.5-inch/2.5-inch drive ca e replacement. . . . . 88
Remove the 3.5-inch/2.5-inch drive ca e . . . 88
Install the 3.5-inch/2.5-inch drive ca e . . . . 91
3.5-inch/2.5-inch hot-swap drive backplane
replacement . . . . . . . . . . . . . . . . 92
Remove the 3.5-inch/2.5-inch hot-swap drive
backplane . . . . . . . . . . . . . . . 92
Install the 3.5-inch/2.5-inch hot-swap drive
backplane . . . . . . . . . . . . . . . 95
3.5-inch simple-swap drive backplate
replacement . . . . . . . . . . . . . . . . 96
Remove the 3.5-inch simple-swap drive
backplate . . . . . . . . . . . . . . . 96
Install the 3.5-inch simple-swap drive
backplate . . . . . . . . . . . . . . . 98
CMOS battery (CR2032) replacement . . . . . . 99
Remove the CMOS battery (CR2032) . . . . 99
Install the CMOS battery (CR2032) . . . . . 101
Drive replacement . . . . . . . . . . . . . . 102
Remove a hot-swap drive . . . . . . . . . 102
Install a hot-swap drive . . . . . . . . . . 104
Remove a simple-swap drive . . . . . . . . 106
Install a simple-swap drive. . . . . . . . . 107
2.5-inch drive replacement from 3.5-inch drive
bay . . . . . . . . . . . . . . . . . . 109
Fan replacement . . . . . . . . . . . . . . 113
Remove the front system fan . . . . . . . . 113
Install the front system fan . . . . . . . . . 115
© Copyri ht Lenovo 2022 i

Remove the rear system fan . . . . . . . . 117
Install the rear system fan . . . . . . . . . 119
Front bezel replacement . . . . . . . . . . . 122
Remove the front bezel . . . . . . . . . . 122
Install the front bezel . . . . . . . . . . . 123
Front door replacement. . . . . . . . . . . . 124
Remove the front door . . . . . . . . . . 124
Install the front door . . . . . . . . . . . 125
Front panel board assembly replacement. . . . . 127
Remove the front panel board assembly . . . 127
Install the front panel board assembly . . . . 128
Heat sink and fan module replacement. . . . . . 130
Remove the heat sink and fan module . . . . 130
Install the heat sink and the fan module. . . . 132
Intrusion switch replacement . . . . . . . . . 135
Remove the intrusion switch . . . . . . . . 135
Install the intrusion switch . . . . . . . . . 136
M.2 boot adapter replacement . . . . . . . . . 137
Remove the M.2 boot adapter . . . . . . . 137
Install the M.2 boot adapter . . . . . . . . 139
M.2 drive replacement . . . . . . . . . . . . 142
Remove an M.2 drive . . . . . . . . . . . 142
Adjust the retainer on the M.2 boot
adapter . . . . . . . . . . . . . . . . 143
Install an M.2 drive . . . . . . . . . . . . 145
Memory module replacement . . . . . . . . . 146
Remove a memory module . . . . . . . . 146
Memory module installation rules and
orders. . . . . . . . . . . . . . . . . 149
Install a memory module . . . . . . . . . 150
Optical drive replacement . . . . . . . . . . . 153
Remove an optical drive. . . . . . . . . . 153
Install an optical drive. . . . . . . . . . . 155
PCIe adapter replacement. . . . . . . . . . . 159
Remove a PCIe adapter . . . . . . . . . . 159
Install a PCIe adapter . . . . . . . . . . . 160
Power distribution board replacement . . . . . . 162
Remove the power distribution board of the
fixed power supply. . . . . . . . . . . . 162
Install the power distribution board of the
fixed power supply. . . . . . . . . . . . 164
Remove the power distribution board of the
hot-swap power supply . . . . . . . . . . 166
Install the power distribution board of the hot-
swap power supply . . . . . . . . . . . 168
Power supply replacement . . . . . . . . . . 170
Remove the fixed power supply. . . . . . . 170
Install the fixed power supply. . . . . . . . 173
Remove a hot-swap power supply. . . . . . 176
Install the hot-swap power supply . . . . . . 179
Processor replacement . . . . . . . . . . . . 184
Remove the processor . . . . . . . . . . 184
Install the processor . . . . . . . . . . . 185
RAID flash power module replacement. . . . . . 187
Remove a RAID flash power module . . . . . 187
Install a RAID flash power module . . . . . . 189
Server replacement . . . . . . . . . . . . . 191
Remove the server from the rails . . . . . . 191
Install the server into the rails. . . . . . . . 194
Server cover replacement . . . . . . . . . . . 199
Remove the server cover . . . . . . . . . 199
Install the server cover . . . . . . . . . . 201
System board replacement (trained technician
only) . . . . . . . . . . . . . . . . . . . 204
Remove the system board . . . . . . . . . 204
Install the system board . . . . . . . . . . 207
Update the machine type and serial
number . . . . . . . . . . . . . . . . 209
Enable TPM . . . . . . . . . . . . . . 211
Enable UEFI Secure Boot . . . . . . . . . 213
Tape drive replacement. . . . . . . . . . . . 214
Remove a tape drive . . . . . . . . . . . 214
Install a tape drive . . . . . . . . . . . . 215
Complete the parts replacement . . . . . . . . 217
Chapter 5. Problem
determination . . . . . . . . . . . . . 219
Event lo s . . . . . . . . . . . . . . . . . 219
General problem determination procedures . . . . 221
Resolvin suspected power problems . . . . 221
Resolvin suspected Ethernet controller
problems . . . . . . . . . . . . . . . 222
Troubleshootin by symptom . . . . . . . . . 222
Power on and power off problems . . . . . . 223
Memory problems . . . . . . . . . . . . 224
Hard disk drive problems . . . . . . . . . 225
Monitor and video problems . . . . . . . . 227
Keyboard, mouse, or USB-device
problems . . . . . . . . . . . . . . . 228
Optional-device problems . . . . . . . . . 229
Serial-device problems . . . . . . . . . . 231
Intermittent problems. . . . . . . . . . . 231
Power problems . . . . . . . . . . . . . 232
Network problems . . . . . . . . . . . . 232
Observable problems. . . . . . . . . . . 233
Software problems. . . . . . . . . . . . 235
Appendix A. Hardware
disassembling for recycle . . . . . . . 237
Disassemble the server for chassis recycle . . . . 237
Appendix B. Getting help and
technical assistance . . . . . . . . . . 239
ii ThinkSystem ST250 V2 Maintenance Manual

Before you call . . . . . . . . . . . . . . . 239
Collectin service data . . . . . . . . . . . . 240
Contactin Support . . . . . . . . . . . . . 241
Appendix C. Notices. . . . . . . . . . 243
Trademarks . . . . . . . . . . . . . . . . 244
Important notes . . . . . . . . . . . . . . . 244
Telecommunication re ulatory statement. . . . . 244
Electronic emission notices . . . . . . . . . . 245
Taiwan BSMI RoHS declaration . . . . . . . 245
Taiwan import and export contact information . . . 245
Index . . . . . . . . . . . . . . . . . . 247
© Copyri ht Lenovo 2022 iii

iv ThinkSystem ST250 V2 Maintenance Manual

Safety
Before installin this product, read the Safety Information.
Antes de instalar este produto, leia as Informações de Se urança.
在安装本产品之前，请仔细阅读 Safety Information （安全信息）。
Læs sikkerhedsforskrifterne, før du installerer dette produkt.
Lees voordat u dit product installeert eerst de veili heidsvoorschriften.
Ennen kuin asennat tämän tuotteen, lue turvaohjeet kohdasta Safety Information.
Avant d'installer ce produit, lisez les consi nes de sécurité.
Vor der Installation dieses Produkts die Sicherheitshinweise lesen.
Prima di installare questo prodotto, le ere le Informazioni sulla Sicurezza.
Les sikkerhetsinformasjonen (Safety Information) før du installerer dette produktet.
Antes de instalar este produto, leia as Informações sobre Se urança.
© Copyri ht Lenovo 2022 v

Antes de instalar este producto, lea la información de se uridad.
Läs säkerhetsinformationen innan du installerar den här produkten.
Safety inspection checklist
Use the information in this section to identify potentially unsafe conditions with your server. As each machine
was desi ned and built, required safety items were installed to protect users and service technicians from
injury.
Note: This device is not intended for use in the direct field of view at visual display workplaces. To avoid
incommodin reflections at visual display workplaces, this device must not be placed in the direct field of
view.
Attention: This is a Class A product. In a domestic environment, this product may cause radio interference
in which case the user may be required to take adequate measures.
CAUTION:
This equipment must be installed or serviced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard for Safety of Electronic Equipment within the Field of Audio/ ideo,
Information Technology and Communication Technology. Lenovo assumes you are qualified in the
servicing of equipment and trained in recognizing hazards energy levels in products.
Important: Electrical roundin of the server is required for operator safety and correct system function.
Proper roundin of the electrical outlet can be verified by a certified electrician.
Use the followin checklist to verify that there are no potentially unsafe conditions:
1. Make sure that the power is off and the power cord is disconnected.
2. Check the power cord.
• Make sure that the third-wire round connector is in ood condition. Use a meter to measure third-
wire round continuity for 0.1 ohm or less between the external round pin and the frame round.
• Make sure that the power cord is the correct type.
To view the power cords that are available for the server:
a. Go to:
vi ThinkSystem ST250 V2 Maintenance Manual

http://dcsc.lenovo.com/#/
b. Click Preconfigured Model or Configure to order.
c. Enter the machine type and model for your server to display the confi urator pa e.
d. Click Power ➙ Power Cables to see all line cords.
• Make sure that the insulation is not frayed or worn.
3. Check for any obvious non-Lenovo alterations. Use ood jud ment as to the safety of any non-Lenovo
alterations.
4. Check inside the server for any obvious unsafe conditions, such as metal filin s, contamination, water or
other liquid, or si ns of fire or smoke dama e.
5. Check for worn, frayed, or pinched cables.
6. Make sure that the power-supply cover fasteners (screws or rivets) have not been removed or tampered
with.
© Copyri ht Lenovo 2022 vii

viii ThinkSystem ST250 V2 Maintenance Manual

Chapter 1. Introduction
The ThinkSystem ST250 V2 server is a 4U tower server desi ned for performance and expansion for various
IT workloads. With the modular desi n, the server is flexible to be customized for maximum stora e capacity
or hi h stora e density with selectable input/output options and tiered system mana ement.
Performance, ease of use, reliability, and expansion capabilities were key considerations in the desi n of the
server. These desi n features make it possible for you to customize the system hardware to meet your needs
today and provide flexible expansion capabilities for the future.
The server comes with a limited warranty. For details about the warranty, see:https://support.lenovo.com/us/
en/solutions/ht503310
For details about your specific warranty, see:http://datacentersupport.lenovo.com/warrantylookup
Identifying your server
When you contact Lenovo for help, the machine type and serial number information helps support
technicians to identify your server and provide faster service.
The machine type and serial number are on the ID label on the front of the server.
The followin illustration shows the location of the ID label.
Note: The illustrations in this document mi ht differ sli htly from your server.
Figure 1. Location of the ID label
© Copyri ht Lenovo 2022 1

XClarity Controller network access label
The XClarity Controller network access label is attached on the front bezel as shown. After you et the
server, peel the XClarity Controller network access label away and store it in a safe place for future use.
Figure 2. Location of the XClarity Controller network access label
Quick response code
The system service label, which is on the inside of the server cover, provides a quick response (QR) code for
mobile access to service information. Scan the QR code with a mobile device and a QR code reader
application to et quick access to the Lenovo Service web site for this server. The Lenovo Service web site
provides additional information for parts installation and replacement videos, and error codes for server
support.
The followin illustration shows the QR code.
2ThinkSystem ST250 V2 Maintenance Manual

Figure 3. QR co e
Server form factor
The ThinkSystem ST250 V2 server is desi ned to support both tower and rack form factors.
You can chan e the server from tower form factor to rack form factor by installin the tower-to-rack
conversion kit. For instructions on how to install the tower-to-rack conversion kit, refer to the documentation
that comes with the conversion kit.
Specifications
The followin information is a summary of the features and specifications of the server. Dependin on the
model, some features mi ht not be available, or some specifications mi ht not apply.
Chapter 1.Introduction 3

Table 1. Specifications
Specification Description
Dimension 4U server
• Hei ht: 175 mm (6.89 inches)
• Width: 430 mm (16.93 inches)
• Depth: 565.7 mm (22.27 inches)
Weight (depending on the
configuration)
• Maximum without packa e:
– 2.5-inch drive confi uration: 21.98 k (48.46 lb)
– 3.5-inch drive confi uration: 24.28 k (53.53 lb)
• Minimum with packa e:
– 2.5-inch drive confi uration: 17.96 k (39.60 lb)
– 3.5-inch drive confi uration: 20.04 k (44.18 lb)
Processor This server comes with one LGA 1200 socket that supports one of the followin Intel®
processors scalable up to ei ht cores:
• Xeon® E
• Pentium ®
For a list of supported processors, see: http://datacentersupport.lenovo.com.
Memory See “Memory module installation rules and orders” on pa e 149 for detailed information
about memory confi uration and setup.
• Minimum: 8 GB
• Maximum: 128 GB
• Slots: four DIMM slots (two channels, two DIMMs per channel)
• Supports 8 GB, 16 GB, and 32 GB TruDDR4 3200 MHz ECC UDIMMs
Drive bays (varies by
model)
Available drive bays mi ht vary by model.
• Stora e drive bays:
– 3.5-inch simple-swap drive confi urations
– Ei ht 3.5-inch drives
• Bay 0 to 6 support SATA drives
• Bay 7 supports one of the followin :
– SATA drive
– NVMe drive
– Six 3.5-inch SATA drives
• Bay 0 to 3, 4 and 5 support SATA drives
• Optical-drive bay 1 (lower bay) supports one of the followin :
– Optical drive
– Tape drive (RDX or LTO)
• Optical-drive bay 2 (upper bay) supports one optional optical drive
– 2.5/3.5-inch hot-swap drive confi urations
– Ei ht 3.5-inch SAS/SATA drives (Bay 0 to 3 and Bay 4 to 7)
– Sixteen 2.5-inch SAS/SATA drives (Bay 0 to 7 and Bay 8 to 15)
– Four 3.5-inch (Bay 0 to 3) and ei ht 2.5-inch SAS/SATA drives (Bay 4 to 11)
– Optical/tape drive bays
• Optical-drive bay 1 (lower bay) supports one of the followin :
– Optical drive
– Tape drive (RDX or LTO)
• Optical-drive bay 2 (upper bay) supports one optional optical drive
4ThinkSystem ST250 V2 Maintenance Manual

Table 1. Specifications (continue )
Specification Description
M.2 drive Supports up to two SATA M.2 drives of the followin drive form factors:
• 42 mm (2242)
• 60 mm (2260)
• 80 mm (2280)
• 110 mm (22110)
Supports the followin M.2 drive capacity:
• 128 GB
• 240 GB
• 480 GB (supported only when the ambient temperature is below 30°C)
Expansion slots Four PCIe expansion slots are available:
• Slot 1: PCIe Gen3 x4 lane in x4 slot, FH/HL
• Slot 2: PCIe Gen4 x16 lane in x16 slot, FH/HL
• Slot 3: PCIe Gen3 x4 lane in x4 slot, FH/HL
• Slot 4: PCIe Gen3 x4 lane in x8 slot, FH/HL
Notes:
1. PCIe slot 4 supports an M.2 module.
2. Slot 1 and Slot 3 in the ST250 V2 are open-end desi n, which means that the slots
can accept adapters with a lon er ed e connector than the physical len th of the
slot connector. For example, if a x8 adapter is installed in the x4 slot 3 of the server,
half of the ed e connector will not be connected to the slot. The adapter will still
function, however performance will be impacted.
Input/Output (I/O)
features
• Front panel
– One Lenovo XClarity Controller USB 2.0 connector
– One USB 3.2 Gen 1 (5Gb) connector
• Rear panel
– One Video Graphics Array (VGA) connector
– One serial connector
– One Lenovo XClarity Controller network connector
– Two Ethernet connectors (shared with Lenovo XClarity Controller network
connector)
– Four USB 3.2 Gen 2 (10Gb) connectors
Network • Two 1Gbps RJ45 with BCM 5720
• One 1Gbps Mana ement RJ45
RAID (depending on
model)
The followin options are available:
• Hardware RAID (RAID level 0, 1, 5, and 10):
– ThinkSystem RAID 9350-16i 4GB Flash PCIe 12Gb Adapter (with flash power
module)
– ThinkSystem RAID 9350-8i 2GB Flash PCIe 12Gb Adapter (with flash power
module)
– ThinkSystem RAID 5350-8i PCIe 12Gb Adapter
– ThinkSystem 4350-8i SAS/SATA 12Gb HBA
– ThinkSystem M.2 SATA 2-Bay RAID Enablement Kit
Note: When ThinkSystem 4350/5350/9350 series RAID adapters are installed, drive
number starts from 1 instead of from 0.
• Software RAID (RAID level 0, 1, 5, and 10):
– Intel VROC SATA RAID
For a list of supported adapters, see:
http://datacentersupport.lenovo.com
Chapter 1.Introduction 5

Table 1. Specifications (continue )
Specification Description
System fans This server comes with the followin fans:
• One heat sink and fan assembly (80 x 80 x 25 mm)
• Two front system fans for drives (92 x 92 x 25 mm)
• One rear system fan (120 x 120 x 25 mm)
Electrical input Universal input:
• Low ran e: 100 to 127 Vac
• Hi h ran e: 200 to 240 Vac
• Input frequency ran e: 50 to 60 Hz
Note: ThinkSystem ST250 V2 only supports AC input power. Do not use 240 DC
input.
Power supply Dependin on your confi uration, the server comes with one of the followin power
supply confi urations:
• One 250W or 300W fixed power supply
• One or two 550W redundant power supplies
Acoustical noise
emissions
The server has the followin acoustic noise emissions declaration:
• Sound power level (LWAd):
– Idlin : 4.3 Bel (Typical), 4.4 Bel (Max)
– Operatin : 4.3 Bel (Typical), 4.5 Bel (Max)
• Sound pressure level (LpAm):
– Idlin : 27.4 dBA (Typical), 28.6 dBA (Max)
– Operatin : 27.6 dBA (Typical), 29.0 dBA (Max)
Notes:
• These sound levels were measured in controlled acoustical environments accordin
to procedures specified by ISO7779 and are reported in accordance with ISO 9296,
SPL is measured by bystander position(1m).
• The declared acoustic sound levels are based on the followin confi urations, which
may chan e dependin on confi uration/conditions, for example M.2 drive,
Broadcom 57414 25Gb NIC, Broadcom 57416 10Gb NIC, T1000, etc.
– Typical: 1x 80W CPU, 4x 32GB DIMM, 2x HDD or SSD, RAID 5350-8i, 1x 300W
PSU
– Max: 1x 95W CPU, 4x 32GB DIMM, 2x HDD or SSD, 2x 550W PSU
Approximate heat output • Minimum confi uration: 358.05 BTU per hour (105 watts)
• Maximum confi uration: 1029.82 BTU per hour (302 watts)
6ThinkSystem ST250 V2 Maintenance Manual

Table 1. Specifications (continue )
Specification Description
Ambient temperature
management
Adjust ambient temperature when specific confi uration is applied:
• Ei ht 3.5-inch drives
– When a 95W TDP CPU and a 95W performance heatsink are installed:
– Keep ambient temperature to 35°C or lower. M.2 drives (up to 240GB) are
supported in this confi uration.
– Keep ambient temperature to 30°C or lower when a 480GB M.2 drive is
installed.
– When an 80W (or lower) TDP CPU and an 80W heatsink are installed:
– Keep ambient temperature to 35°C or lower. M.2 drives (up to 240GB) are
supported in this confi uration.
– Keep ambient temperature to 30°C or lower when a 480GB M.2 drive is
installed.
• Sixteen 2.5-inch drives
– When a 95W TDP CPU and a 95W performance heatsink are installed:
– Keep ambient temperature to 35°C or lower. M.2 drives (up to 240GB) are
supported in this confi uration.
– Keep ambient temperature to 30°C or lower when a 480GB M.2 drive is
installed.
– When an 80W (or lower) TDP CPU and an 80W heatsink are installed:
– Keep ambient temperature to 35°C or lower. M.2 drives (up to 240GB) are
supported in this confi uration.
– Keep ambient temperature to 30°C or lower when a 480GB M.2 drive is
installed.
• Ei ht 2.5-inch drives and four 3.5-inch drives
– When an 80W TDP CPU and an 80W heatsink are installed:
– Keep ambient temperature to 40°C or lower.
– M.2 drives, 10/25GbE Ethernet adapters, and redundant power supplies should
not be installed in this confi uration.
– When a 70W (or lower) TDP CPU and an 80W heatsink are installed:
– Keep ambient temperature to 45°C or lower.
– M.2 drives, 10/25GbE Ethernet adapters, and redundant power supplies should
not be installed in this confi uration.
Environment The ThinkSystem ST250 V2 server complies with ASHRAE Class A2 specifications.
Dependin on the hardware confi urations, some models comply with ASHRAE Class
A3 and A4 specifications. System performance may be impacted when operatin
temperature is outside ASHRAE A2 specification.
• Air temperature:
– Operatin
– ASHRAE Class A2: 10°C to 35°C (50°F to 95°F); the maximum ambient
temperature decreases by 1°C for every 300 m (984 ft) increase in altitude
above 900 m (2,953 ft).
– ASHRAE Class A3: 5°C to 40°C (41°F to 104°F); the maximum ambient
temperature decreases by 1°C for every 175 m (574 ft) increase in altitude
above 900 m (2,953 ft).
– ASHRAE Class A4: 5°C to 45°C (41°F to 113°F); the maximum ambient
temperature decreases by 1°C for every 125 m (410 ft) increase in altitude
above 900 m (2,953 ft).
Chapter 1.Introduction 7

Table 1. Specifications (continue )
Specification Description
– Server off: 5°C to 45°C (41°F to 113°F)
– Shipment/stora e: -40°C to 60°C (-40°F to 140°F)
• Maximum altitude: 3,050 m (10,000 ft)
• Relative Humidity (non-condensin ):
– Operatin
– ASHRAE Class A2: 8% to 80%; maximum dew point: 21°C (70°F)
– ASHRAE Class A3: 8% to 85%; maximum dew point: 24°C (75°F)
– ASHRAE Class A4: 8% to 90%; maximum dew point: 24°C (75°F)
– Shipment/stora e: 8% to 90%
• Particulate contamination
Attention: Airborne particulates and reactive ases actin alone or in combination
with other environmental factors such as humidity or temperature mi ht pose a risk to
the server. For information about the limits for particulates and ases, see
“Particulate contamination” on pa e 8.
Operating systems
Supported and certified operatin systems:
• Microsoft Windows Server 2019, 2022
• VMware ESXi 7.0 U3 or later versions
• Red Hat Enterprise Linux 8.4 or later versions
• SUSE Linux Enterprise Server 15 SP3 or later versions
References:
• Complete list of available operatin systems: https://lenovopress.com/osi .
• OS deployment instructions: See “Deploy the operatin system” in Setup Gui e.
Minimal configuration for
debugging
• One processor
• One UDIMM in slot 3
• One power supply unit
• One drive with RAID adapter and backplane or backplate (if OS is needed for
debu in )
• One system fan, one processor and heat sink fan, and one front system fan for drives
Particulate contamination
Attention: Airborne particulates (includin metal flakes or particles) and reactive ases actin alone or in
combination with other environmental factors such as humidity or temperature mi ht pose a risk to the
device that is described in this document.
Risks that are posed by the presence of excessive particulate levels or concentrations of harmful ases
include dama e that mi ht cause the device to malfunction or cease functionin alto ether. This
specification sets forth limits for particulates and ases that are intended to avoid such dama e. The limits
must not be viewed or used as definitive limits, because numerous other factors, such as temperature or
moisture content of the air, can influence the impact of particulates or environmental corrosives and aseous
contaminant transfer. In the absence of specific limits that are set forth in this document, you must
implement practices that maintain particulate and as levels that are consistent with the protection of human
health and safety. If Lenovo determines that the levels of particulates or ases in your environment have
caused dama e to the device, Lenovo may condition provision of repair or replacement of devices or parts
on implementation of appropriate remedial measures to miti ate such environmental contamination.
Implementation of such remedial measures is a customer responsibility.
8ThinkSystem ST250 V2 Maintenance Manual

Table 2. Limits for particulates an gases
Contaminant Limits
Reactive ases Severity level G1 as per ANSI/ISA 71.04-19851:
• The copper reactivity level shall be less than 300 An stroms per month (Å/month ≈ 0.0039 μ /
cm2-hour wei ht ain).2
• The silver reactivity level shall be less than 200 Å/month (Å/month ≈ 0.0035 μ /cm2-hour
wei ht ain).3
• The reactive monitorin of aseous corrosivity must be conducted approximately 5 cm (2 in.) in
front of the rack on the air inlet side at one-quarter and three-quarter frame hei ht off the floor
or where the air velocity is much hi her.
Airborne
particulates Data centers must meet the cleanliness level of ISO 14644-1 class 8.
For data centers without airside economizer, the ISO 14644-1 class 8 cleanliness mi ht be met by
choosin one of the followin filtration methods:
• The room air mi ht be continuously filtered with MERV 8 filters.
• Air enterin a data center mi ht be filtered with MERV 11 or preferably MERV 13 filters.
For data centers with airside economizers, the choice of filters to achieve ISO class 8 cleanliness
depends on the specific conditions present at that data center.
• The deliquescent relative humidity of the particulate contamination should be more than 60%
RH.4
• Data centers must be free of zinc whiskers.5
1 ANSI/ISA-71.04-1985. Environmental con itions for process measurement an control systems: Airborne
contaminants. Instrument Society of America, Research Trian le Park, North Carolina, U.S.A.
2 The derivation of the equivalence between the rate of copper corrosion rowth in the thickness of the corrosion
product in Å/month and the rate of wei ht ain assumes that Cu2S and Cu2O row in equal proportions.
3 The derivation of the equivalence between the rate of silver corrosion rowth in the thickness of the corrosion
product in Å/month and the rate of wei ht ain assumes that A 2S is the only corrosion product.
4 The deliquescent relative humidity of particulate contamination is the relative humidity at which the dust absorbs
enou h water to become wet and promote ionic conduction.
5 Surface debris is randomly collected from 10 areas of the data center on a 1.5 cm diameter disk of sticky
electrically conductive tape on a metal stub. If examination of the sticky tape in a scannin electron microscope
reveals no zinc whiskers, the data center is considered free of zinc whiskers.
Firmware updates
Several options are available to update the firmware for the server.
You can use the tools listed here to update the most current firmware for your server and the devices that are
installed in the server.
• Best practices related to updatin firmware is available at the followin site:
– http://lenovopress.com/LP0656
• The latest firmware can be found at the followin site:
– http://datacentersupport.lenovo.com/us/en/products/servers/thinksystem/st250v2/7D8F/downloads
• You can subscribe to product notification to stay up to date on firmware updates:
– https://datacentersupport.lenovo.com/tw/en/solutions/ht509500
Chapter 1.Introduction 9

Update method terminology
• In-band update. The installation or update is performed usin a tool or application within an operatin
system that is executin on the server’s core CPU.
• Out-of-band update. The installation or update is performed by the Lenovo XClarity Controller collectin
the update and then directin the update to the tar et subsystem or device. Out-of-band updates have no
dependency on an operatin system executin on the core CPU. However, most out-of-band operations
do require the server to be in the S0 (Workin ) power state.
• On-Target update. The installation or update is initiated from an Operatin System executin on the
server’s operatin system.
• Off-Target update. The installation or update is initiated from a computin device interactin directly with
the server’s Lenovo XClarity Controller.
• UpdateXpress System Packs (UXSPs). UXSPs are bundled updates desi ned and tested to provide the
interdependent level of functionality, performance, and compatibility. UXSPs are server machine-type
specific and are built (with firmware and device driver updates) to support specific Windows Server, Red
Hat Enterprise Linux (RHEL) and SUSE Linux Enterprise Server (SLES) operatin system distributions.
Machine-type-specific firmware-only UXSPs are also available.
Firmware updating tools
See the followin table to determine the best Lenovo tool to use for installin and settin up the firmware:
Tool Update
Methods
Supported
Core
System
Firmware
Updates
I/O Devices
Firmware
Updates
Graphical
user
interface
Command
line
interface
Supports
UXSPs
Lenovo XClarity
Provisioning Manager
(LXPM)
In-band2
On-Tar et
√ √
Lenovo XClarity
Controller
(XCC)
Out-of-band
Off-Tar et
√Selected I/O
devices
√
Lenovo XClarity
Essentials OneCLI
(OneCLI)
In-band
Out-of-band
On-Tar et
Off-Tar et
√All I/O
devices
√ √
Lenovo XClarity
Essentials
UpdateXpress
(LXCE)
In-band
Out-of-band
On-Tar et
Off-Tar et
√All I/O
devices
√ √
Lenovo XClarity
Essentials Bootable
Media Creator
(BoMC)
In-band
Out-of-band
Off-Tar et
√All I/O
devices
√
(BoMC
application)
√
(BoMC
application)
√
10 ThinkSystem ST250 V2 Maintenance Manual