LG GX300 User manual

Service Manual Model : GX300
Internal Use Only
Service Manual
GX300
Date: May, 2010 / Issue 1.0

- 3 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION .........................................................5
1.1 Purpose....................................................................................5
1.2 Regulatory Information .....................................................5
1.3 Abbreviation..........................................................................7
2. PERFORMANC ............................................................9
2.1 H/W Features .........................................................................9
2.2 Technical Specification.....................................................11
3. TECHNICAL BRIEF.....................................................16
3.1 GX300 Functional Block Diagram ................................16
3.2 Digital Main Processor (PMB8810, U102/U402) ......17
3.3 Power Management..........................................................22
3.4 FEM with integrated Power Amplifier Module
(SKY77547, U300, U302) ..................................................35
3.5 Crystal(26 MHz, X100, X401) ..........................................37
3.6 RF Subsystem of PMB8810 (U102, U402) ..................38
3.7 MEMORY................................................................................43
3.8 Bluetooth module..............................................................49
3.9 Dual SIM Card Interface. ..................................................51
3.10 LCD Interface.....................................................................52
3.11 Battery Charger Interface .............................................55
3.12 Keypad Interface..............................................................56
3.13 Audio Front-End...............................................................58
3.14 Camera Interface(1.3M Fixed Focus Camera) ........64
3.15 Flash LED Driver ...............................................................66
3.16 KEY BACLKLIGHT LED Interface..................................67
3.17 Vibrator Interface.............................................................68
4. TROUBLE SHOOTING ...............................................69
4.1 Trouble shooting test setup...........................................69
4.2 RF Component....................................................................70
4.3 RX Trouble.............................................................................72
4.4 TX Trouble.............................................................................78
4.5 Power On Trouble ..............................................................84
4.6 Charging Trouble................................................................87
4.7 Vibrator Trouble ..................................................................89
4.8 LCD Trouble..........................................................................91
4.9 Camera Trouble...................................................................95
4.10 Speaker Trouble ............................................................ 101
4.11 Earphone Trouble .........................................................104
4.12 Receiver Trouble............................................................107
4.13 Microphone Trouble................................................... 110
4.14 SIM Card Interface Trouble........................................112
4.15 KEY backlight Trouble .................................................114
4.16 Micro SD Trouble...........................................................116
4.17 Bluetooth Trouble.........................................................118
4.18 FM Radio Trouble..........................................................120
5. DOWNLOAD............................................................122
6. BLOCK DIAGRAM ...................................................135
7. CIRCUIT DIAGRAM .................................................137
8. BGA Pin Map...........................................................143
9. PCB LAYOUT ...........................................................149
10. STAND ALONE TEST .............................................153
10.1 Introduction ................................................................... 153
10.2 Setting Method .............................................................153
10.3 Tx Test................................................................................155
10.4 Rx Test.............................................................................. 156
11. AUTO CALIBRATION.............................................157
11.1 Overview..........................................................................157
11.2 Configuration of HotKimchi......................................157
11.3 Description of Basic File .............................................158
11.4 Auto Calibration setup................................................159
11.5 Procedure ........................................................................ 160
11.6 AGC....................................................................................162
11.7 APC ....................................................................................162
11.8 ADC.................................................................................... 162
11.9 Target Power...................................................................162
12. EXPLODED VIEW & REPLACEMENT
PART LIST..............................................................163
12.1 EXPLODED VIEW........................................................... 163
12.2 Replacement Parts .......................................................165
12.3 Accessory.........................................................................189

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LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 5/158
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION

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LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 6/158
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
1. INTRODUCTION

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 7/158
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC
1. INTRODUCTION

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LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 8/158
Wireless Application Protocol
WAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM
1. INTRODUCTION

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 9/158
2.1 H/W Features
Item Feature Comment
Standard Battery Lithium-ion r, 3.7V, 1,500mAh
Stand by TIME Up to 370 hrs ( Paging Period 5, RSSI -85dBm )
Talk time Up to 200min : GSM Tx Level 7
Charging time Approx. 4 hours
RX Sensitivity GSM, EGSM: -109dBm, DCS: -109dBm
TX output power GSM, EGSM: 33dBm(Level 5),
DCS , PCS: 30dBm(Level 0)
SIM card type 3V Small
Display MAIN : 2.2” TFT 176 Ý220 pixel 262K Color
Status Indicator
Hard icons. Key Pad
0 ~ 9, #, *, Up/Down Left/Right Navigation Key
Send Key, PWR Key ,Soft Key(Left/Right)
Volume up/down, Camera hot key, SIM switch key
ANT Internal
EAR Phone Jack Yes
PC Synchronization Yes
Speech coding EFR/FR/HR/AMR
Data and Fax Yes
2. SYSTEM SPECIFICATION
GPRS compatibility Class 12
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
Microphone Yes
2. PERFORMANCE
2. PERFORMANCE

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LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 10/158
2. SYSTEM SPECIFICATION
Travel Adapter Yes
Speaker/Receiver 18x12ȰSpeaker/ Receiver
MIDI SW MIDI (Mono SPK)
Item Feature Comment
Camera 2M
Bluetooth / FM Radio Bluetooth version 2.1 / 76~108MHz supported

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 11/158
2.2 Technical Specification
Item Description Specification
1 Frequency Band
EGSM
TX: 880 ~ 915MHz
RX: 925 ~ 960 MHz
DCS
TX: 1710 ~ 1785 MHz
RX: 1805 ~ 1880 MHz
PCS
TX: 1850 ~ 1910 MHz
RX: 1930 ~ 1990 MHz
2 Phase Error RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1 ppm
4 Power Level
Level Power Toler. Level Power Toler.
6 31dBm ·3dB 14 15dBm ·3dB
7 29dBm ·3dB 15 13dBm ·3dB
8 27dBm ·3dB 16 11dBm ·5dB
9 25dBm ·3dB 17 9dBm ·5dB
10 23dBm ·3dB 18 7dBm ·5dB
11 21dBm ·3dB 19 5dBm ·5dB
12 19dBm ·3dB
EGSM
5 33dBm ·2dB 13 17dBm ·3dB
Level Power Toler. Level Power Toler.
1 28dBm ·3dB 9 12dBm ·4dB
2 26dBm ·3dB 10 10dBm ·4dB
3 24dBm ·3dB 11 8dBm ·4dB
4 22dBm ·3dB 12 6dBm ·4dB
5 20dBm ·3dB 13 4dBm ·4dB
6 18dBm ·3dB 14 2dBm ·5dB
7 16dBm ·3dB 15 0dBm ·5dB
DCS/PCS
0 30dBm ·2dB 8 14dBm ·3dB
2. SYSTEM SPECIFICATION
2.2 Technical Specification

- 12 -
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 12/158
5Output RF Spectrum
(due to modulation)
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
6,000 -71
EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
DCS/PCS
6
Output RF Spectrum
(due to switching
transient)
EGSM
Offset from Carrier (kHz). Max. dBm
400 -19
600 -21
1,200 -21
1,800 -24
Item Description Specification
2. SYSTEM SPECIFICATION

- 13 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 13/158
Item Description Specification
6
Output RF Spectrum
(due to switching
transient)
Offset from Carrier (kHz). Max. dBm
400 -22
600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
8 Bit Error Ratio
EGSM
BER (Class II) < 2.439% @-102 dBm
DCS,PCS
BER (Class II) < 2.439% @-102 dBm
9 RX Level Report Accuracy ·3 dB
10 SLR 8·3 dB
11 Sending Response
300 -12
1,000 -6
2,000 -6
3,000 -6
Frequency (Hz) Max.(dB) Min.(dB)
100 -
200 -
4,000 -
3,400 -9
0
0
4
4
-12
0
0
4
12 RLR 2·3 dB
DCS/PCS
2. SYSTEM SPECIFICATION

- 14 -
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 14/158
Item Description Specification
13 Receiving Response
300 -7
500 -5
1,000 -5
3,000 -5
Frequency (Hz) Max.(dB) Min.(dB)
100 -
200 -
4,000
3,400 -10
2
*
0
2
-12
0
2
2
14 STMR 18·5 dB
* Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
15 Stability Margin > 6 dB
-20
-10
0
7
dB to ARL (dB) Level Ratio (dB)
-35
-30
10
30.7
33.3
33.7
31.7
17.5
22.5
25.5
16 Distortion
17 Side Tone Distortion Three stage distortion < 10%
18 System frequency
(26 MHz) tolerance ˺2.5 ppm
19 32.768KHz tolerance ˺30 ppm
20 Ringer Volume
At least 65 dBspl under below conditions:
1. Ringer set as ringer.
2. Test distance set as 50 cm
2. SYSTEM SPECIFICATION

- 15 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 15/158
2. SYSTEM SPECIFICATION
Item Description Specification
21 Charge Current
Fast Charge : Typ. 650 mA
Slow Charge : Typ. 80mA
Total Charging Time : < 4 hours
2 -> 1
0 -> OFF
Bar Number Power
4 -> 2
-104 ·2
-106 Under
-98 ·2
-101 ·2
22 Antenna Display
2 -> 1
1 -> 0
Battery Bar Number Voltage
3
3 -> 2 3.77 ·0.05 V
23 Battery Indicator
24 Low Voltage Warning
( Blinking Bar)
˺3.60 ·0.05V (Call), one time per one minute
˺3.60 ·0.05V (Standby), one time per three minute
25 Forced shut down
Voltage 3.33 ·0.05V
27 Battery Type
Lithium-Ion Battery
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 1,500mAh
28 Travel Charger
Switching-mode charger
Input: 100 ~ 240V, 50/60 Hz
Output: 5.1V, 700 mA
˻3.77
26 Sustain RTC
without battery Over 50 hours
3.67 ·0.05 V
3.60 ·0.05 V
7
7 -> 5
5 -> 4
-92 Over
-93 ·2
1 -> 0 -106 ·2

- 16 -
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 16/158
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 GX300 Functional Block Diagram
The functional component arrangement is mentioned below diagram.
Figure. 3.1.1 GX300 Functional Block Diagram
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
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- 17 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 17/158
3. TECHNICAL BRIEF
3.2 Digital Main Processor (PMB8810, U102/U402)
Figure. 3.2.1 X-Gold tm 213 Hardware Block Diagram
3. TECHNICAL BRIEF

- 18 -
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 18/158
3. TECHNICAL BRIEF
3.2.1 General
Technology:
– SoC, Monolithic, 65 nm CMOS
• Package:
– eWLB, 8x8x0.8 mm
– 0.5 mm pitch
– 217 balls / 6-layer PCB
3.2.2 RF Transceiver
• Dual-band direct conversion receiver
• Tri/Quad-band possible with external circuitry
• Fully integrated digital controlled X0
• Additional buffer for 2 external system clocks
• Fully digital RF-Synthesizer incl. ȭȟ-Transmitter
3.2.3 Baseband
• DSP:
– 156 MHz TeakLite™
• MCU:
– ARM1176® @ 208 MHz
• MCU RAM:
– 3.00Mbit
• Memory I/F:
– 512 Mbit (can be extended to 2 Gbit in AD-Mux/Demux, and up to 4 Gbit in AAD-Mux mode)
• Modem:
– GPRS class 12, (RX/TX CS1-CS4)
– EGPRS class 12, (RX MCS1-MCS9, TX MCS1-MCS4)
• Cipher Units:
– A51/2/3
– GEA-1/2/3
• Security:
– OMTP TR0
– Secure Boot
– RSA(ROM)/SHA-1(HW accel.)
– OCDS disabling
– Certificate Management

- 19 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 19/158
3. TECHNICAL BRIEF
• Speech Codec:
– FR / HR / EFR / NB-AMR
• Audio Codec (running on ARM1176):
– SP-MIDI
– SB-ADPCM
– MP3
– WB-AMR
– AAC/AAC+/eAAC+
• Others:
– DARP (SAIC)
– TTY
• Customization:
– E-Fuses
3.2.4 External Memory
• External Bus Unit
– 25-bit address bus (512 Mbit) - can be extended to 27 address bits (2 Gbit)
– 16-bit data bus
– 1.8V & 2.8V support
• Flash / RAM
– NOR Type
– Serial Flash SPI and SPI-4
– Parallel Flash (Page & Burst Mode)
- 16-bit Demultiplexed
- 16-bit AD-multiplexed
- 16-bit AAD-multiplexed
– iNAND Type e.g. oneNAND
• Memory card
– SD/MMC card interface with 1 or 4 data lines
3.2.5 Connectivity
• 3xUSIF (configurable either as SPI or UART), I2C, I2S; Interfaces @ 1.8V
• Direct (U)SIM 1.8/3V
• USB2.0 up to 480 Mbit/s (High Speed) w/ external USB Phy over ULPI interface
• Stereo Headset (Amplifier integrated)
• 3 external analog measurement PIN’s
• Bluetooth, A-GPS, WLAN support (I2C, I2S, SPI)

- 20 -
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 20/158
3. TECHNICAL BRIEF
3.2.6 Mixed Signal
• Improved audio performance
• Loudspeaker Audio Class D Amplifier, 700 mW@8 ȳmono for hands-free and ringing
• Stereo Headset 2x30 mW@16 ȳw/o coupling C
• Mono Earpiece 100 mW@16 ȳ
• Digital microphone supported
• Differential microphone inputs
3.2.7 FM Radio
• Integrated FM radio
– FM Stereo RDS Receiver
– Sensitivity 2 ɆV EMF
– Support for US & EU bands
– Stereo recording
3.2.8 Power Management
• Direct-to-Battery Connection
– LDOs (incl. capless)
– DC/DC step-down converter
– DC/DC step-up for white LED supply
• Battery Type
– Li-Ion
• Charging control
– Battery temperature
– Watchdog protection
– Start-up on flat battery
• External Charger
– Switch mode
• USB battery charging
– USB charging spec 1.0 compliant
• Backlight
– Up to 4 serial white LEDs (integrated LDO)

- 21 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 21/158
3. TECHNICAL BRIEF
3.2.9 Display
• Type
– 176*220, QCIF, 262k color (parallel)
• Interface
– Parallel 8/9bit MIPI-DBI Type B
– Serial MIPI-DBI Type C
– Interf. voltage at 1.8V or 2.8V
• gRacr - Display Controller (Hardware)
– 30 fps Display update without DMA (up to 60 fps) (full or partial)
– Video post processing Scaling, Rotation (90¶steps), Mirroring
– Overlay with alpha blending
– Color conversion YUV -> RGB
– 2D vector graphics (Lines, filled rectangles, Bit block transfer (e.g. sprites, scrolling, antialiased
bitmap fonts)
3.2.10 Camera
• 2.0 Mpx CMOS
• HW JPEG encoder (39 Mpx/sec)
• 39 MHz Pixel Rate
• 15 [email protected] Mpx full resolution
3.2.11 Video Capabilities
• Video Decoding MPEG-4/H.263
– QCIF@30 fps
– QVGA@15fps
• Video Encoding MPEG-4/H.263
– QCIF@15 fps
3.2.12 Audio Capabilities
• Polyphonic ring tones
– 64 voices MIDI, SP-MIDI
– FM synthesizer
• AMR-WB
• True ring tones (MP3)
• MP3, eAAC+
• G.722 SB-ADPCM encoding/decoding