LG MBD62I User manual

MINI HOME THEATER SYSTEM

SERVICE MANUAL

MODEL: MBD62I, MBS62V

CAUTION

BEFORE SERVICING THE UNIT, READ THE “SAFETY PRECAUTIONS”

IN THIS MANUAL.

MODEL: MBD62I, MBS62V

SERVICE MANUAL

P/NO : AFN35036930

SEPTEMBER, 2007

Website http://biz.lgservice.com

Internal Use Only

1-1

CONTENTS

SECTION 1

SUMMARY

SERVICING PRECAUTIONS......................................1-2

• NOTES REGARDING HANDLING OF THE PICK-UP

•

NOTES REGARDING COMPACT DISC PLAYER REPAIRS

ESD PRECAUTIONS...................................................1-4

SPECIFICATIONS ........................................................1-5

SECTION 2

EXPLODED VIEWS

1. CABINET AND MAIN FRAME SECTION..............2-1

2. DECK MECHANISM SECTION (DP-12A).............2-3

3. SPEAKER SECTION (MBS62V) ............................2-5

4. PACKING ACCESSORY SECTION .......................2-6

SECTION 3

ELECTRICAL

ELECTRICAL TROUBLESHOOTING

GUIDE OF AUDIO PART.............................................3-1

1. MICOM PART CHECK I....................................3-1

2. MICOM PART CHECK II...................................3-2

3. IC103 KS4CD21CS CHECK.............................3-3

4. FLD DISPLAY CHECK ......................................3-4

5. PWM MODULATION PART..............................3-5

6. POWER AMP PART CHECK............................3-6

7. PORTABLE FUNCTION....................................3-7

8. TV-AUDIO FUNCTION......................................3-8

9. TUNER FUNCTION CHECK ............................3-9

10. SMPS POWER TROUBLESHOOTING.........3-10

11. BLUETOOH PART (OPTIONAL PART)..........3-13

12. IPOD PART (OPTIONAL PART).....................3-14

ELECTRICAL TROUBLESHOOTING

GUIDE OF DVD PART...............................................3-15

1. POWER CHECK GUIDE.................................3-15

2. TEST & DEBUG FLOW...................................3-16

3. USB PART........................................................3-21

WAVEFORMS.............................................................3-22

1. WHEN POWER ON, RESET & DATA

ETC WAVEFORM............................................3-22

2. OPEN / CLOSE WAVEFORM AT

POWER ON......................................................3-23

3. STARTING ACTION WAVEFORM

IN MD DEVICE ................................................3-23

4. FOCUS WAVEFORM......................................3-24

5. AT POWER ON, SPINDLE SIGNALAT

MD DECK .........................................................3-25

6. AT FIRSTACTION, FOCUS

SIGNALA, B, C, D............................................3-25

7. TRACKING SIGNAL........................................3-26

8. RF WAVEFORM ..............................................3-26

9. DISK TYPE JUGEMENT WAVEFORM..........3-27

INTERNAL BLOCK DIAGRAM OF ICs...................3-28

1. AK5358..............................................................3-28

2. EM639165 ........................................................3-30

3. ES29LV160E ....................................................3-32

4. HT1000 .............................................................3-34

5. IP9009...............................................................3-37

6. KS24L161.........................................................3-38

7. MC4580 ............................................................3-39

8. PS9829B...........................................................3-40

9. PT6324..............................................................3-41

10. STR-A6252.......................................................3-44

11. µPD78F0546R (R)............................................3-45

WIRING DIAGRAM....................................................3-49

BLOCK DIAGRAMS..................................................3-51

1. SMPS BLOCK DIAGRAM...............................3-51

2. MAIN & FRONT BLOCK DIAGRAM..............3-53

SCHEMATIC DIAGRAMS .........................................3-55

1. SMPS SCHEMATIC DIAGRAM......................3-55

2. MAIN, INTERFACE & PWM

SCHEMATIC DIAGRAM..................................3-57

3. MPEG SCHEMATIC DIAGRAM.....................3-59

4. SERVO SCHEMATIC DIAGRAM...................3-61

5. INTERFACE SCHEMATIC DIAGRAM...........3-63

6. FRONT SCHEMATIC DIAGRAM ..................3-65

7. FRONT MIC SCHEMATIC DIAGRAM...........3-67

IPOD-1 SCHEMATIC DIAGRAM (OPTION)

.....3-69

IPOD-2 SCHEMATIC DIAGRAM (OPTION)

.....3-71

10.

2 CHANNELAMP SCHEMATIC DIAGRAM

......3-73

11. BLUTHOOTH MODULE

SCHEMATIC DIAGRAM (OPTION)................3-75

CIRCUIT VOLTAGE CHART.....................................3-77

PRINTED CIRCUIT BOARD DIAGRAMS ...............3-79

1. MAIN P.C.BOARD............................................3-79

2. FRONT P.C.BOARD........................................3-83

3. SMPS P.C.BOARD ..........................................3-85

4. MIC JACK P.C.BOARD ...................................3-87

5. IPOD P.C.BOARD (OPTION)..........................3-87

SECTION 4

REPLACEMENT PARTS LIST

........4-1

Only for training and service purposes LGE Internal Use Only

1-2

NOTES REGARDING HANDLING OF THE PICK-UP

1.Notes for transport and storage

1) The pick-up should always be left in its conductive bag until immediately prior to use.

2) The pick-up should never be subjected to external pressure or impact.

2.Repair notes

1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic materials.

2) The pick-up should always be handled correctly and carefully, taking care to avoid external pressure and

impact. If it is subjected to strong pressure or impact, the result may be an operational malfunction and/or

damage to the printed-circuit board.

3) Each and every pick-up is already individually adjusted to a high degree of precision, and for that reason

the adjustment point and installation screws should absolutely never be touched.

4) Laser beams may damage the eyes!

Absolutely never permit laser beams to enter the eyes!

Also NEVER switch ON the power to the laser output part (lens, etc.) of the pick-up if it is damaged.

5) Cleaning the lens surface

If there is dust on the lens surface, the dust should be cleaned away by using an air bush (such as used

for camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a cotton

swab should be used, taking care not to distort this.

6) Never attempt to disassemble the pick-up.

Spring by excess pressure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab. (Do not

use any other liquid cleaners, because they will damage the lens.) Take care not to use too much of this

alcohol on the swab, and do not allow the alcohol to get inside the pick-up.

SERVICING PRECAUTIONS

SECTION 1 SUMMARY

Only for training and service purposes

LGE Internal Use Only

1-3

NOTES REGARDING COMPACT DISC PLAYER REPAIRS

1.Preparations

1) Compact disc players incorporate a great many ICs as well as the pick-up (laser diode). These components

are sensitive to, and easily affected by, static electricity. If such static electricity is high voltage, components

can be damaged, and for that reason components should be handled with care.

2) The pick-up is composed of many optical components and other high-precision components. Care must be

taken, therefore, to avoid repair or storage where the temperature of humidity is high, where strong

magnetism is present, or where there is excessive dust.

2.Notes for repair

1) Before replacing a component part, first disconnect the power supply lead wire from the unit

2) All equipment, measuring instruments and tools must be grounded.

3) The workbench should be covered with a conductive sheet and grounded.

When removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This is

because there is the possibility of damage by static electricity.)

4) To prevent AC leakage, the metal part of the soldering iron should be grounded.

5) Workers should be grounded by an armband (1MΩ)

6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to prevent

static electricity changes in the clothing to escape from the armband.

7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin.

Only for training and service purposes LGE Internal Use Only

1-4

ESD PRECAUTIONS

Electrostatically Sensitive Devices (ESD)

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components

commonly are called electrostatically sensitive devices (ESD). Examples of typical ESD devices are

integrated circuits and some field-effect transistors and semiconductor chip components. The following

techniques should be used to help reduce the incidence of component damage caused by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain

off any electrostatic charge on your body by touching a know earth ground. Alternatively, obtain and

wear a commercially available discharging wrist strap device, which should be removed for potential

shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive

surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static"

can generate electrical charges sufficient to damage ESD devices.

5. Do not use freon-propelled chemicals These can generate electrical charges sufficient to damage ESD

devices.

6. Do not remove a replacement ESD device from its protective package until immediately before you are

ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together

by conductive foam, aluminum foil or comparable conductive materials).

7. Immediately before removing the protective material from the leads of a replacement ESD device, touch

the protective material to the chassis or circuit assembly into which the device will by installed.

CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL

OTHER SAFETY PRECAUTIONS.

8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless

motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor

can generate static electricity sufficient to damage an ESD device).

[CAUTION. GRAPHIC SYMBOLS]

THE LIGHTNING FLASH WITH ARROWHEAD SYMBOL. WITHIN AN EQUILATERAL

TRIANGLE, IS INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE

OF UNINSULATED "DANGEROUS VOLTAGE" THAT MAY BE OF SUFFICIENT

MAGNITUDE TO CONSTITUTE A RISK OF ELECTRIC SHOCK.

THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENED TO

ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY

INFORMATION IN SERVICE LITERATURE.

Only for training and service purposes

LGE Internal Use Only

1-5

SPECIFICATIONS

• GENERAL

Power supply Refer to the back panel of the unit.

Power consumption Refer to the back panel of the unit.

Net Weight 3.00kg

External dimensions (WxHxD) 300 x 130 x 243mm

• CD/DVD

Laser Semiconductor laser, wavelength 650nm

Signal system PAL 625/50, NTSC 525/60

Frequency response (audio) 40Hz to 20kHz

Signal-to-noise ratio (audio) More than 75dB (1kHz, NOP -3dB, 20kHz LPF/A-Filter)

Dynamic range (audio) More than 75dB

Harmonic distortion (audio) 0.5 % (1kHz, at 1W position) (20kHz LPF)

• VIDEO

Video output 1.0V (p-p), 75Ω, negative sync./ RCA jack x 1/ SCART (TO TV)

COMPONENT VIDEO OUT (Y) 1.0V (p-p), 75ohms, negative sync, RCA jack x 1

(Pb)/(Pr) 0.7V (p-p), 75ohms, RCA jack x 1

• TUNER

FM Tuning Range 87.5 ~ 108.0MHz or 65 ~ 74MHz, 87.5 ~ 108.0MHz

Intermediate Frequency 10.7MHz

Signal to Noise Ratio 60/55dB

Frequency Response 50 ~ 10000Hz

AM Tuning Range 522 ~ 1620kHz or 520 ~ 1720kHz

Intermediate Frequency 450kHz

Signal to Noise Ratio 30dB

Frequency Response 80 ~ 1800Hz

• AMPLIFIER

Output Power 30W + 30W

T.H.D 0.5%

Frequency Response 40 ~ 20000Hz

Signal-to-noise ratio 75dB

• SPEAKERS

Speaker Name MBS62V

Type Bass Reflex 2 Way 2 Speaker

Impedance 4Ω

Frequency Response 60 ~ 20000Hz

Sound Pressure Level 82dB/W (1m)

Rated Input Power 30W

Max. Input Power 60W

Net Dimensions (WxHxD) 160 X 308 X 204mm

Net Weight (1EA) 2.5kg

Designs and specifications are subject to change without notice.

Only for training and service purposes LGE Internal Use Only

1-6

MEMO

Only for training and service purposes

LGE Internal Use Only

A43

A50

272

259

256

258

A26 A47

275

A46

A44

463

261

463

461

274

276

300

250

273

461

257

461

CABLE3

CABLE2

IPOD

2-1 2-2

SECTION 2 EXPLODED VIEWS

1. CABINET AND MAIN FRAME SECTION

Only for training and service purposes LGE Internal Use Only

2-3 2-4

2. DECK MECHANISM SECTION (DP-12A)

012

010

012

012A

019 442

442

A26

A02 A01

A03

026

001

002

003

439 018

013

017

014 020

016

440

015

015B

015A

435

Only for training and service purposes

LGE Internal Use Only

2-5

3. SPEAKER SECTION (MBS62V)

750

751

752

754

755

757

A70A

758

Only for training and service purposes LGE Internal Use Only

A70

756

753

757A

759

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