LG 22LG3DDH User manual

LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LA96E
MODEL : 22LG3DDH 22LG3DDH-UA
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL62195508 (1006-REV00)

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Only for training and service purposes - 2 -
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ......................................................................... 3
SPECIFICATION....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 8
EXPLODED VIEW .................................................................................. 13
SVC. SHEET ...............................................................................................

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Only for training and service purposes - 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩand 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF

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CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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1. Application range
This specification is applied to the 22” Wide LCD TV used
LA96E chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 20±5ºC
2) Relative Humidity: 65±10%
3) Power Voltage : Standard input voltage(100-120V~, 50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: UL, CSA, IEC specification
- EMC: FCC, ICES, IEC specification
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. General Specification(TV)
No Item Specification Remark
1 Receivable System VSB/64& 256 QAM/NTSC-M
2 Available Channel VHF : 02 ~ 13
UHF : 14 ~ 69
DTV : 02 ~ 69
CATV : 01 ~ 135
CADTV : 01 ~ 135
3 Input Voltage AC 100-120V, 50/60Hz Mark : 110V, 60Hz
4 Market North America
5 Screen Size 22 Inch Wide (1680 x 1050 : 21.995 inch)
6 Aspect Ratio 16:10
7 Tuning System FS
8 LCD Module LM220WE1-TLM1 (LGD)
9 Operating Environment Temp : 0 ~ 40 deg
Humidity : ~ 80 %
10 Storage Environment Temp : -20 ~ 50 deg
Humidity : 10 ~ 90 %
Model Market Appliance
22LG3DDH-UA North America Safety : UL1492, CSA C22.2.No.1
EMC : FCC Class B, IEC Class B

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5. HDMI input (PC/DTV)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
PC DDC
1. 800*600 37.879 60.31 40.00 VESA(SVGA) O
2. 1024*768 48.363 60.00 65.00 VESA(XGA) O
4. 1280*768 47.776 59.87 79.50 CVT(WXGA) O
4. 1360*768 47.720 59.799 84.75 CVT(WXGA) O
5. 1366*768 47.13 59.65 72
DTV
6. 720*480 31.469 59.94 27.00 SDTV 480P
7. 720*480 31.500 60.00 27.03 SDTV 480P
8. 1280*720 44.96 59.94 74.17 HDTV 720P
9. 1280*720 45.00 60.00 74.25 HDTV 720P
10. 1920*1080 33.72 59.94 74.17 HDTV 1080I
11. 190*1080 33.75 60.00 74.25 HDTV 1080I
12. 1920*1080 67.5 60.00 148.50 HDTV 1080P

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ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied for all of the LCD TV with
LA96E chassis.
2. Specification
1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2) Power Adjustment : 100-240V~, 50/60Hz
3) Magnetic Field Condition : Nil.
4) Input signal Unit : Product Specification Standard
5) Reserve after operation : Above 30 Minutes
6) Adjustment equipments: Color Analyzer(CA-210 or CA-
110), Pattern Generator (MSPG-925L or Equivalent), DDC
Adjustment Jig equipment, SVC remote control
3. Method of PTC MICOM Download
3.1. Connection of MICOM JIG
1) Connect port(3) with Power Code
2) Connect jack(1) with PTC Micom.
3) Connect USB Cable to the computer
4) Download Program execution (SAP Configuration)
* Notice!
Because PTC Download JIG has internal memory, it can
save download files using download program (SAP
Configuration). Push the START button (4) after file saving,
then it execute download.
3.2. Execution of download program
(SAP Configuration)
3.2.1. Execution of SAP Configuration
(1) Select HCS12
(2) Target Frequency Settings :
1)Checking the factor -> Use Specified Target
Frequency…, Unsecure target….
2) Insert Target Bus Frequency -> 7372800
(3) Specify Algorithm: 9S12dt128_128k .12P
(4) Specify S Record: select download file.
(5) Checking factor: Erase Device, Blank Check Device,
Program Device, Verify Device
* Notice!
Don’t check other checking boxes. You must follow fig.
(6) Push the ‘Save Image to Cyclone PRO’ button, files
transfer from PC to the Download JIG.
4. Start button
3. Power
1. Connect to Micom port of TV board. 2. Connect to computer.
34
1
2
5
6

- 9 -
4. Main PCB check process
* APC - After Manual-Insult, executing APC
4.1. Software download
1) Execute ISP program “Mstar ISP Utility”and then click
“Config”tab.
2) Set as below, and then click “Auto Detect”and check “OK”
message. If display “Error”, Check connect computer, jig,
and set.
3) Click “Connect”tab. If display “Can’t”, Check connect
computer, jig, and set.
4) Click “Read”tab, and then load download file(XXXX.bin) by
clicking “Read”.
5) Click “Auto”tab and set as below
6) click “Run”.
7) After downloading, check “OK”message.
4.2. USB DOWNLOAD
1) Put the USB Stick to the USB socket
2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,
it’s not work. But your downloaded version is High, USB
data is automatically detecting
3) Show the message “Copying files from memory”
4) Updating is staring.
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(1) (3)
(2) OK
Please Check Speed :
To us speed between from 200 KHz
to 400 KHz
(4)
filexxx.bin
(5)
(7) ........ OK
(6)
filexxx.bin
USB PORT

- 10 -
5) Finishing the version updating, you have to put out USB
stick and “AC Power”off
6) After putting “AC Power”on and check updated version on
your TV
4.3. ADC Process
4.3.1. PC input ADC
(1) Auto RGB Gain/Offset Adjustment
1) Convert to PC in Input-source
I2C COMMAND:0xF4(SELECT INPUT) 0x00 0x60(RGB)
cf. 0x10(TV), 0x20(AV), 0x40(COMPONENT),
0x60(RGB), 0x90(HDMI)
2) Signal equipment displays
Output Voltage : 700 mVp-p
Impress Resolution XGA (1024 x 768 @ 60Hz)
Model : 60 in Pattern Generator
Pattern : 29 in Pattern Generator (MSPG-925 Series)
[gray pattern that left & right is black and center is
white signal (Refer below picture)].
3) Adjust by commanding AUTO_COLOR _ADJUST
(0xF1) 0x00 0x02 instruction.
(2) Confirmation
1) We confirm whether “0xB6”address of EEPROM
“0xA2”is “0xAA”or not.
2) If “0xB6(RGB)”address of EEPROM “0xB2”isn’t
“0xAA”, we adjust once more.
3) We can confirm the ADC values from “0xB0~0xB5
(RGB)”addresses in a page “0xA2”
* Manual ADC process using Service Remote control. After
enter Service Mode by pushing “ADJ”key, execute “Auto-
adjust”by pushing “G”key at “0. ADC CALIBRATION”.
4.3.2. COMPONENT input ADC
(1) Component Gain/Offset Adjustment
1) Convert to Component in Input-source
I
2
C command : 0xF4(Select input) 0x00 0x40(Component)
cf. 0x10(TV), 0x20(AV), 0x40(COMPONENT),
0x60(RGB), 0x90(HDMI)
2) Signal equipment displays
Impress Resolution 480i
MODEL : 209 in Pattern Generator(480i Mode)
PATTERN : 08 in Pattern Generator(MSPG-925
Series)
3) Adjust by commanding AUTO_COLOR_ADJUST (0xF1)
0x00 0x02 instruction.
4) Signal equipment display
- Impress Resolution : 1080i
- MODEL: 223 in Pattern Generator(1080i Mode)
- PATTERN: 08 in Pattern generator(MAPG-925
series)
5) Adjust by commanding AUTO_COLOR ADJUST(0xF1)
0x00 0x02 instruction.
* Manual ADC process using Service Remote control. After
enter Service Mode by pushing “ADJ”key, execute “Auto-
adjust”by pushing “G”key at “0. ADC CALIBRATION”.
(2) Confirmation
1) We confirm whether “0xBF(480i)/0xC8(1080i)”address
of EEPROM “0xA2”is “0xAA”or not.
2) If “0xBF(480i)/0xC8(1080i)”address of EEPROM “0xA2”
isn’t “0xAA”, we adjust once more.
3)We can confirm the ADC values from
“0xB9~0xBE(480i)/ 0xC2~(1080i)”addresses in a page
“0xA2”.
* Manual ADC Confirmation using Service Remocon. After
enter Service Mode by pushing “INSTART”key.
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<Adjustment pattern (PC)>
EZ ADJUST
1. ADC ADJUST
2. SUB B/C ADJUST
3. W/B ADJUST
4. WHITE PATTERN : OFF
5. 2HOUR OFF : ON
6. OAD
7. UART DOWNLOAD
8. FACTORY MODE : ON
9. DEBUG MODE : OFF
10. TVLINK-COMM.ADJUST
0. ADC CALIBRATION : RGB
<Adjustment pattern (COMPONENT)>
EZ ADJUST
1. ADC ADJUST
2. SUB B/C ADJUST
3. W/B ADJUST
4. WHITE PATTERN : OFF
5. 2HOUR OFF : ON
6. OAD
7. UART DOWNLOAD
8. FACTORY MODE : ON
9. DEBUG MODE : OFF
10. TVLINK-COMM.ADJUST
0. ADC CALIBRATION : COMPONENT

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4.4. Function Check
4.4.1. Check display and sound
- Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (CVBS/ S-Video)
3) COMPONENT (480i)
4) RGB (PC : 1024 x 768 @ 60hz)
5) HDMI
6) PC Audio In and H/P Out
* Display and Sound check is executed by Remote control.
5. Total Assembly line process
5.1. Adjustment Preparation
1) W/B Equipment condition
CA210 : CH 9, Test signal: Inner pattern (85IRE)
2) Above 5 minutes H/run in the inner pattern. (“power on”key
of adjust remote control)
3)15 Pin D-Sub Jack is connected to the AUTO W/B
EQUIPMENT.
4) Adjust Process will start by execute I2C Command (Inner
pattern (0xF3, 0xFF)).
* Manual ADC process using Service Remo-con. After enter
Service Mode by pushing “ADJ”key, enter “W/B ADJUST”by
pushing “G”key at “3. W/B ADJUST”. (CA-210, CH-9)
* Adjust “R/G/B - GAIN”by pushing “F”, “G”key at “Cool”
* Adjust “R/G/B - GAIN”by pushing “F”, “G”key at “Medium”
* Adjust “R/G/B - GAIN”by pushing “F”, “G”key at “Warm”
5.2. DDC EDID WRITE
1) Connect D-sub Signal Cable to D-Sub Jack.
2) Connect HDMI Signal Cable to HDMI Jack.
3) Write EDID DATA to EEPROM (24C02) by using DDC2B
protocol.
4) Check whether written EDID data is correct or not. (Refer to
Product spec).
5) Remark
A week manufacture in address 0x10 can be changed. And
thus Checksum (Address: 0x7F) can be also changed.
5.2.1. EDID DATA
(1) DIGITAL DATA 256Byte
- Remark: A week manufacture in address 0x10 can be
changed. And thus Checksum (Address: 0x7F) can be
also changed.
EZ ADJUST
0. ADC CALIBRATION : RGB
1. ADC ADJUST
2. SUB B/C ADJUST
4. WHITE PATTERN : OFF
5. 2HOUR OFF : ON
6. OAD
7. UART DOWNLOAD
8. FACTORY MOD : ON
9. DEBUG MODE : OFF
10. TVLINK-COMM.ADJUST
3. W/B ADJUST
Color Temperature
Cool 11,000 K X=0.276 ± 0.003 <Test Signal>
Y=0.283 ± 0.003 Inner pattern
Medium 9,300 K X=0.285 ± 0.003 (216gray, 85IRE)
Y=0.293 ± 0.003
Warm 6,500 K X=0.313 ± 0.003
Y=0.329 ± 0.003
W/B ADJUST
0. MODE : RGB
1. WHITE PATTERN : White
2. TEMPERATURE : Cool
4. G - GAIN : 172
5. B - GAIN : 192
6. R – OFFSET : 128
7. G – OFFSET : 128
8. B – OFFSET : 128
9. RESET
3. R - GAIN : 172
MODEL : 32LG30/AUO_32LG3DC
S/W VER : 1.33.0/ 0.0024
UTT : 1
ADC CAL. RGB : OK
YPbPr(SD) : OK
YPbPr(HD) : OK
1. POWER OFF HISTORY
2. SS CONROL
3. BAUD RATE 9600
4. AUDIO EQ ON
5. CHANNEL MUTE ON
6.DTV SNR
0. AREA OPTION : USA

- 12 -
1) All Data : HEXA Value
2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***:Year : Controlled
****:Check sum
5.3. HDCP setting
(High-Bandwidth Digital Contents Protection)
1) Connect D-sub Signal Cable to D-Sub Jack.
2) Input HDCP key with HDCP-key- in-program.
3) HDCP Key value is stored on EEPROM(AT24C512) which
is 80~A1 addresses of 0xA0~0xA2 page
4) Write data by 64bytes.
5) AC off/ on and on HDCP button of MSPG925 and confirm
whether picture is displayed or not of using MSPG925
6) HDCP Key value is different among the sets.
5.4. Outgoing condition Configuration
1) After all function test., press IN-STOP Key by SVC Remote
controller. And Make Ship Condition.
2) When pressing IN-STOP key by SVC remocon, Red LED
are blinked alternatively. And then turn off automatically.
(Must not AC power OFF during blinking)
5.5. Internal pressure
1) Test Voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
2) Test Point
- GND Test = between power cord GND and Signal cable
metal GND
- Internal pressure test = between power cord GND and
AC input Live.
3) leakage current: 0.5mArms (but, 32LG3DCH as hospital TV
limited by 0.1mArms.)
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 13 -
300
200
510
830
500
120
122
123
540
530
560
820
400
401
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DSUB_B
008:D28
0
R1305
COMP1_L_IN
008:R33
DSUB_G
008:D29
18pF
50V
C1222
470K
R1247
0
OPT
R1268
4.7K
R1249
PC_L_IN
008:R31
470K
R1245
COMP1_R_IN
008:R33
12K
R1263
10K
R1270
OPT
75
R1238
BG2012B080TF
L1208
100pF
C1227
75
R1243
EEPROM_WP
008:AR22;002:T21
12K
R1264
10K
R1251
0R1232
12K
R1255
0.1uF
16V
C1228
75
R1242
10K
R1252 12K
R1303
SIDEAV_R_IN
008:R33
100pF
50V
C1240
75
R1235
100pF
50V
C1224
SIDEAV_CVBS_IN
008:D26
ISP_TXD
008:AB27;008:AR31
SIDEAV_L_IN
008:R33
0R1233
100
R1269
10K
R1259
470K
R1298
COMP1_PB
008:D31
10K
R1301
ENKMC2838-T112
D1223
A1
C
A2
75
R1236
SIDEAV_SW
009:AA29
BG2012B080TF
L1207
10K
R1262
BG2012B080TF
L1206
ISP_RXD
008:AB27
1000pF
50V
C1221
470K
R1246
10K
R1258
22
R1257
12K
R1256
470K
R1244
10K
R1300
DSUB_VSYNC
008:D29
100pF
C1219
PC_R_IN
008:R32
1000pF
50V
C1220
100pF
50V
C1225
COMP1_Y
008:D31
22
R1265
75
R1234
4.7K
R1253
0
R1307
PEJ024-01
JK1205
6B T_TERMINAL2
8SHIELD_PLATE
7B B_TERMINAL2
5T_SPRING
4R_SPRING
7A B_TERMINAL1
6A T_TERMINAL1
3E_SPRING
COMP1_PR
008:D31
18pF
50V
C1223
100pF
50V
C1241
DSUB_R
008:D29
1K
R1254
DSUB_HSYNC
008:D29
12K
R1304
470K
R1297
75
R1241
100pF
50V
C1251
12K
R1207
12K
R1210
AV_R_IN
008:R32
AV_L_IN
008:R32
100pF
50V
C1250
470K
R1208
470K
R1206
10K
R1205
10K
R1211
AV_CVBS_IN
008:D26
47pF
50V
C1252
75
1%
R1215
BG2012B080TF
L1218
BG2012B080TF
L1217
+3.3V
+5V_GENERAL
10K
R1248
KCN-DS-1-0089
JK1204
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
AT24C02BN-10SU-1.8
IC1200
3
A2
2
A1
4
GND
1
A0
5SDA
6SCL
7WP
8VCC
5.6V
D1222
ADMC5M03200L
OPT
5.6V
D1212
ADMC5M03200L
OPT
5.6V
D1221
ADMC5M03200L
5.6V
D1235
ADMC5M03200L
OPT
5.6V
D1234
ADMC5M03200L
OPT
5.6V
D1214
ADMC5M03200L
OPT
5.6V
D1211
ADMC5M03200L
OPT
5.6V
D1243
ADMC5M03200L
OPT
5.6V
OPT
D1224
ADMC5M03200L
5.6V
D1242
ADMC5M03200L
OPT 5.6V
OPT
D1225
ADMC5M03200L
5.6V
D1213
ADMC5M03200L
OPT
30V
D1216
ADUC30S03010L
30V
D1217
ADUC30S03010L
30V
D1208
ADUC30S03010L OPT
30V
D1209
ADUC30S03010L
OPT
30V
D1218
ADUC30S03010L
30V
D1215
ADUC30S03010L
OPT
30V
D1207
30V
D1245
ADUC30S03010L
OPT
30V
D1219
ADUC30S03010L
30V
D1210
ADUC30S03010L
OPT
+5V_ST_PTC
0.1uF
OPT
C1217
0.1uF
OPT
C1218
0.1uF
OPT
C1216
PPJ218-01
JK1202
5C [RD]CONTACT
2C [RD]U_CAN
4C [RD]O_SPRING
2B [WH]U_CAN
3B [WH]C_LUG
2A [YL]U_CAN
5A [YL]CONTACT
4A [YL]O_SPRING
PPJ209-02
JK1207
4A [GN]CONTACT
2A [GN]1P_CAN
3A [GN]O_SPRING
2B [BL]1P_CAN
5B [BL]C_LUG_L
2C [RD]1P_CAN1
5C [RD]C_LUG_L
2D [WH]1P_CAN
5D [WH]C_LUG_L
2E [RD]1P_CAN2
4E [RD]CONTACT
3E [RD]O_SPRING
PPJ148-07
JK1206
2[YL]O-SPRING
1[YL]GND
3[YL]CONTACT
4[WH]GND
5[WH]C-LUG-L
6[RD]GND
7[RD]O-SPRING
8[RD]CONTACT
SIGN25
1
IN/OUT 14
SIDE_AV
R,G,B PC&DDC
PC AUDIO
REAR AV JACK
COMP JACK
26/32LG3DDH
TUNER
PStoPDF trial version. http://www.oakdoc.com

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GND
CK+_HDMI1
008:D39
0
R509
DDC_SDA_1
008:D38;002:S20
D1-_HDMI1
008:D38
0R510
HPD1
008:D37
0.1uF
16V
C501
CK-_HDMI1
008:D39
D2+_HDMI1
008:D38
5V_HDMI_1
0
R511
D1+_HDMI1
008:D38
D0-_HDMI1
008:D39
DDC_SCL_1
008:D37;002:S20
D2-_HDMI1
008:D38
JP503
D0+_HDMI1
008:D39
JP502
0
R576
0
R572
0
R569
0
R573
0
R570
0
R571
0
R574
0
R575
8pF
50V
OPT
C515
8pF
50V
OPT
C512
4.7K
R536
DDC_SDA_1
008:D38;002:I24
CAT24C02WI-GT3
IC500
3
A2
2
A1
4
VSS
1
A0
5SDA
6SCL
7WP
8VCC
DDC_SCL_1
008:D37;002:I23
5V_HDMI_1
4.7K
R539
+5V_GENERAL
100
R545
10K
OPT
R542
22
R530
EEPROM_WP
008:AR22;001:AK23
ENKMC2838-T112
D501
A1
C
A2
22
R531
0.1uF
50V
C509
AVRL161A1R1NT
VR500
OPT
+3.3V_ST
47K
OPT
R556
1K
R552
JP500
820
R501
2SC3052
Q504
E
B
C
10K
R513
QJ41193-CFEE1-7F
JK500
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
HDMI
HDMI1
2 14
EDID
HDMI1
26/32LG3DDH
HDMI
PStoPDF trial version. http://www.oakdoc.com

+24V_AMP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MLB-201209-0120P-N2
L603
100V
OPT
D604
100R608
AMP_RST
008:AB21
100R606
0.47uF
50V
C633
5.6
R616
1000pF
50V
C629
0.1uF
50V
C620
4.7K
R620
1000pF
50V
C630
0.01uF
50V
C639
1uF16V
C622
AUDIO_MASTER_CLK
008:V26
1000pF
50V
C607
3.3K
R602
MS_SCK
008:V26
100V
OPT
D602
0.47uF
50V
C634
0.1uF
C608
0
R600
4.7K
R617
22000pF
50V
C614
33K OPT
R609
+3.3V
3.3
R622
1000pF
50V
C632
1000pF
50V
C606
+1.8V_AMP
10uF
10V
C610
5.6
R615
SDA_SUB/AMP
008:AI4;010:B8
2SC3052
Q600
E
B
C
33pF
50V
OPT
C616
100pF
50V
C604
0.1uF
50V
C636
0.1uF
50V
C637
5.6
R613
MS_LRCK
008:V26
SCL_SUB/AMP
008:AI4;010:B10
DA-8580
EAP38319001
L607
2S
1S 1F
2F
3.3
R624
100R607
0.01uF
50V
C615
100V
OPT
D603
1uF 10V
C611
1000pF
50V
C631
100R604
100R605
0.1uF
50V
C638
10K
R611
0.01uF
50V
C640
1uF
16V
C619
0.1uF
50V
C627
4.7K
R619
0
R603
1uF
10V
C617
100V
OPT
D601
22000pF
50V
C623
0.01uF
50V
C642
0.01uF
50V
C641
100
R601
5.6
R614
22000pF
50V
C624
MS_LRCH
008:V26
4.7K
R618
0
R610
0.1uF
50V
C635
10K
R612
+1.8V_AMP
22000pF
50V
C618
DA-8580
EAP38319001
L606
2S
1S 1F
2F
MLB-201209-0120P-N2
L604
3.3
R621
33pF
50V
C609
+1.8V_AMP
3.3
R623
33pF
50V
C612
AMP_MUTE
008:C13
MLB-201209-0120P-N2
L605
CB3216PA501E
L602
3.3
R625
3.3
R626
+3.3V_ST
0.01uF
C643
0.01uF
50V
C644
0.1uF
50V
C645
0.1uF
16V
C601 0.1uF
16V
C605
0.1uF
16V
C613
0.01uF
50V
C626
0.1uF
50V
C625
POWER_DET
68uF
C602
68uF
C628
AZ1117H-1.8TRE1(EH13A)
IC601
2
OUTPUT
3
INPUT 1ADJ/GND
0.1uF
16V
C648 22uF
16V
C649
+1.8V_AMP
22uF
16V
C646
+3.3V
0.1uF
16V
C647
GND
10uF
16V
C600 10uF
16V
C603
10K R2223
EXT_SPK_L-
003:P20
6.8K
OPT
R2236
1.6K
R2227
390 R2226 1K
R2225
3.3K
R2234
2SC3875S(ALY)
Q1103
E
B
C
4.7K
R2242
10uF
6.3V
C2140
1uF
10V
C2142
4.7K
R2240
100
R2237
100
R2232
PEJ024-01
JK300
6B
T_TERMINAL2
8
SHIELD_PLATE
7B
B_TERMINAL2
5
T_SPRING
4
R_SPRING
7A
B_TERMINAL1
6A
T_TERMINAL1
3
E_SPRING
0
R2250
EXT_SPK
008:U28
TPA6011A4PWPRG4
IC300
3
PVDD_1
2
ROUT-
4
RHPIN
1
PGND_1
6
RIN
5
RLINEIN
7
VDD
8
LIN
9
LLINEIN
10
LHPIN
11
PVDD_2
12
LOUT- 13 PGND_2
14 LOUT+
15 SHUTDOWN
16 FADE
17 BYPASS
18 AGND
19 SEMAX
20 SEDIFF
21 VOLUME
22 HP/LINE
23 SE/BTL
24 ROUT+
OPT
R2230
1K R2233
SUB_MUTE
008:AB19;003:AC20
1uF
10V
OPT C2149
3K R2224
0.1uF
C2144
1uF
50V
C2145
+5V_GENERAL
0
R2231
OPT
R2229
EXT_SPK_L+
003:AF24
0
R2251
2SA1530A-T112-1R
Q1104
E
B
C
0.1uF
OPT
C2141
15pF
50V
C2139
1uF
10V
OPT
C2148
9.1K
R2239
2SC3052
Q1105
E
B
C
10uF
16V
C2143
OPT
R2235
OPT
R2238
EXT_SPK_L-
003:AF24
SUB_MUTE
008:AB19;003:Z25
1K R2228
EXT_SPK_L+
003:W20
47K
R627
CB3216PA501E
L300
L_SOUND+ 003:AL13
R_SOUND+ 003:AL13
L_SOUND- 003:AL13
R_SOUND- 003:AL12
+24V_AMP
+24V_AMP
WAFER-ANGLE
P1400
1
2
3
4
R_SOUND+
003:AE12
R_SOUND-
003:AE10
L_SOUND+
003:AE16
L_SOUND-003:AE14
+24V_AUDIO
+5V_ST_PTC
4.7K
OPT
R2555
+5V_GENERAL
THERMAL
NTP-3100L
EAN60664001
IC600
1
BST1A
2
VDR1A
3
RESET
4
AD
5
DVSS_1
6
VSS_IO
7
CLK_I
8
VDD_IO
9
DGND_PLL
10
AGND_PLL
11
LFM
12
AVDD_PLL
13
DVDD_PLL
14
TEST0
15
DVSS_2
16
DVDD
17
SDATA
18
WCK
19
BCK
20
SDA
21
SCL
22
MONITOR_0
23
MONITOR_1
24
MONITOR_2
25
FAULT
26
VDR2B
27
BST2B
28
PGND2B_1
29 PGND2B_2
30 OUT2B_1
31 OUT2B_2
32 PVDD2B_1
33 PVDD2B_2
34 PVDD2A_1
35 PVDD2A_2
36 OUT2A_1
37 OUT2A_2
38 PGND2A_1
39 PGND2A_2
40 BST2A
41 VDR2A
42 NC
43 VDR1B
44 BST1B
45 PGND1B_1
46 PGND1B_2
47 OUT1B_1
48 OUT1B_2
49 PVDD1B_1
50 PVDD1B_2
51 PVDD1A_1
52 PVDD1A_2
53 OUT1A_1
54 OUT1A_2
55 PGND1A_1
56 PGND1A_2
57
[EP]GND
SIGN69
SIGN73
SIGN75
SIGN76
SIGN85
SIGN89 SIGN97
SIGN102
Audio Amp 3 14
Mstar Application
SPEAKER_R
SPEAKER_L
EXTERNAL SPEAKER OUT
+1.8V_AMP & +24V_AMP
NTP3100L
BTL Type
BTL Type
26/32LG3DDH
AMP
PStoPDF trial version. http://www.oakdoc.com

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+5V_EXT+5V_GENERAL
1uF
10V
C769
CB3216PA501E
L736
0.1uF
16V
C766
10uF
10V
C765
NR8040T3R6N
3.6uH
L726
22uF
C733
OPT
0.1uF
16V
C710
5V_ST
0.1uF
16V
C746
9.1K
1%
R713
10K
R718
1/8W
75K
1%
R722
22uF
16V
C714
10
R724
10K
R726
1uF
16V
C788
1/10W
10K
OPT
R731
22uF
C786
MP2212DN
IC705
3
IN
2
GND
4
BS
1
FB
5VCC
6SW_1
7SW_2
8EN/SYNC
CB3216PA501E
L715
NR8040T3R6N
3.6uH
L710
10K
R727
+3.3V_AVDD_MPLL
22uF
16V
C750
1/10W
18K
1%
R769
SC4215ISTRT
IC701
3
VIN
2
EN
4
NC_2
1
NC_1
5NC_3
6VO
7ADJ
8GND
+5V
10uF
6.3V
C708
0.1uF
16V
C760
0
R750
BLM18PG121SN1D
L720
0.1uF
C793
4.7uF
25V
C743
CB3216PA501E
L708
0.1uF
16V
C717
CB3216PA501E
L729
0.1uF
16V
C705
5V_ST
+3.3V
47K
R739
+5V
10K
R728
OPT
22uF
25V
C755
POWER_ON/OFF1
008:AR31;004:S14
POWER_EN
008:AR30;005:AA6
+5V_GENERAL
+3.3V
10K
OPT
R747
1/10W
10K
R738
4.7uF
6.3V
OPT
C762
0.1uF
C749
2SC3052
Q704
E
B
C
MP2212DN
IC704
3
IN
2
GND
4
BS
1
FB
5VCC
6SW_1
7SW_2
8EN/SYNC
+12V
+3.3V_ST
CB3216PA501E
L711
100
OPT
R756
10uF
10V
C704
1N4148W_DIODES
100V
D703 OPT
5V_ST
120K
R725
OPT
1N4148W_DIODES
100V
D700 OPT
10K
R733
OPT
BLM18PG121SN1D
L717
0.1uF
16V
C715
22uF
C787
OPT
0.1uF
16V
C780
AP1117E33G-13
IC702
2
OUT
3
IN 1ADJ/GND
10K
R729
1uF
25V
C748
0.1uF
16V
OPT
C790
+1.26V_VDDC
22uF
16V
C791
PANEL_POWER
2SC3052
OPT
Q707
E
B
C
+5V_GENERAL
10uF
C742 OPT
22K
R735
CB3216PA501E
L714
1/10W
10
1%
R734
0.1uF
16V
C758
2SC3052
Q705
E
B
C
12K
1%
R711
1/10W
56K
1%
R770
10uF
10V
C757
BLM18PG121SN1D
L702
22uF
16V
C732
47K
R740
22uF
16V
C792
+3.3V_FE
22K
R732
10uF
10V
C712
+3.3V
BLM18PG121SN1D
L703
22uF
16V
C752
+5V_ST
2SC3052
Q703
E
B
C
PANEL_CTL
008:AR32
4.7uF
6.3V
OPT
C761
CB3216PA501E
L716
1/10W
22K
1%
R723
BLM18PG121SN1D
L727
1uF
10V
C737
0.1uF
16V
C713
+1.8V_DDR
+3.3V_ST
+3.3V_ST
10uF
6.3V
C751
10uF
C756
POWER_ON_DELAY
008:V17
0
R745
0
R746
1/8W24KR736
2.2uF
25V
C405
10K
R413
100uF
16V
C406
2SC3875S(ALY)
Q403
E
B
C
220uF
16V
C407
1K
OPT
R412
22K
R414
MSTAR_POWER_ON
004:S14;009:Y28
+5V_ST
560pF
50V
C411
100K
5%
R421
1uF
10V
C412
82K
R422
3.3K
R710
CB3216PA501E
L728
74LVC1G32GW
IC706
OPT
3
GND
2
A
4Y
1
B5VCC
OR_RELAY_ON
004:A27
0
R2542
OPT
RL_ON
008:AR33
RELAY_PTC
009:AF28 0
R2540
OPT
0
R2541
OPT
0.1uF
16V
C2253
+5V_ST_PTC
0
R2550
220uF
16V
C2254
0.1uF
50V
C741
0.1uF
50V
C789
0
R737
0
R744
AO4813
Q706
3S1
2G2
4G1
1S2
5D1_1
6D1_2
7D2_1
8D2_2
AO4813
Q404
3S1
2G2
4G1
1S2
5D1_1
6D1_2
7D2_1
8D2_2
47uF
25V
C1407
0
OPT
R1408
0.1uF
16V
OPT
C1409
MLB-201209-0120P-N2
L1408
A_DIM
008:AF11
JP604
120-ohm
L1400
68uF
35V
C1424
100uF
16V
C1403
68uF
35V
C1422
0.1uF
50V
C1404
JP600
22uF
16V
C1401
22uF
16V
C1402
JP602
1uF
50V
C1423
0
OPT
R1418
4.7K
R1421
JP603
+12V
4.7K
R1410
0.1uF
50V
OPT
C1408
L1406
OPT
ERROR_OUT
008:AB20
MLB-201209-0120P-N2
L1401
L1405
L1404
OPT
+3.5V_ST
1uF
25V
OPT
C1418
JP601
0
OPT
R1409
PWM_DIM
008:AF11;007:N24
100uF
16V
C1405
22uF
16V
C1400
4.7K
R1405
OPT
OPC_OUT
007:N24
0R1419
0.1uF
50V
C1419
BLM18PG121SN1D
L1407
OPT
1uF
25V
C1420
RT1P141C-T112
Q1409
1
2
3
0R1400
15pF
50V
C1410
10K
R1401
4.7K
R1403
+5V_ST_PTC
OR_RELAY_ON
004:AA27
0
OPT
R1402
2SC3875S(ALY)
Q1408
E
BC
OPT
R1406
33K
OPT
R1407
BG2012B121F
L1402
100
R1414
10K
OPT
R1425
3.3K
R1417
INV_CTL
008:AR32
2SC3052
Q1412
E
B
C
2SC3875S(ALY)
OPT
Q1413
E
B
C
INV_ON_DEBUG 10K
OPT
R1423
10K
R1420
6.8K
OPT
R1415 10K
R1422
0
R1424
1K R1308
0R2603
+24V_AUDIO
FM20020-24
P1408
19
12V
14 GND
9
3.5V
424V
18 INV ON
13
GND
8GND
3
24V
17
12V
12 3.5V
7
GND
224V
16 GND/V-sync
11
3.5V
6GND
1
PWRON
20 A.DIM
15
GND
10 3.5V
5
GND
21
12V 22 P.DIM1
23
GND/P.DIM2 24 Err OUT
25
5.1K
R730
15K
R415
10K
R4003
MSTAR_POWER_ON
004:L5;009:Y28
1K
OPT
R4002
220uF
16V
C4001
AO4813
Q4001
3S1
2G2
4G1
1S2
5D1_1
6D1_2
7D2_1
8D2_2
2SC3875S(ALY)
Q4000
E
B
C
POWER_ON/OFF1
008:AR31;004:AB25
0OPT
R4000
0
R4001
0
R4005
10K
R4004
10uF
16V
OPT
C4000
THERMAL
SC632ULTRT
IC3000
3
C1-
2
C1+
4
IN
1
GND
5EN
6OUT
7C2+
8C2-
9
[EP]GND
100K
1%
R3016
15K
1%
R3018
47uF
10V
C3008
Si4800BDY
Q3000
3S3
2S2
4G
1S1
5
D5
6
D6
7
D7
8
D8
2.2uF
10V
C3005
47uF
10V
C3009
2.2uF
10V
C3000
0.1uF
C3006
22uF
25V
C3020
BD9306AFVM
IC3003
3ENB
2CT
4GD
1RT
5
VCC
6
GND
7
COMP
8
FB
1K
R3002
MBRA340T3G
40V
D3000
47K
R3005
20K
R3012
+3.5V_ST
22uH
L3002
100pF
50V
C3012
0
R3006
100pF
50V
C3019
1K
R3019
10uF
25V
C3007
30K
1%
R3017
12V_DCDC
DCDC_EN
009:Y26
+5V_ST_PTC
4.7K
1%
R3003
3.3V
0.1uF
16V
C3001
MLB-201209-0120P-N2
L3000
22uF
16V
C3017
0.1uFC3015
+12V
47K
R3014
27K
1%
R3007
10K
1%
R3000
AOZ1073AIL
IC3001
3
AGND
2
VIN
4
FB
1
PGND
5COMP
6EN
7LX_1
8LX_2
22uF
16V
C3003
1/10W
11K
5%
R3009
10uF
10V
C3013
3.6uH
L3003
1000pF
50V
C3010
3.3V 3.3V
10uF
10V
C3014
47K
R3015
AOZ1073AIL
IC3002
3
AGND
2
VIN
4
FB
1
PGND
5COMP
6EN
7LX_1
8LX_2
10K
1%
R3001
22uF
16V
C3018
3.6uH
L3004
0.1uF
16V
C3002
0.1uFC3016
MLB-201209-0120P-N2
L3001
1000pF
50V
C3011
22uF
16V
C3004
+12V
1/10W
11K
5%
R3010
+12V
+12V
1/10W
5.1K
5%
R3004 47K
1%
R3008
5V_ST 5V_ST
5V_ST
1/10W
200
5%
R6017
+5V_ST_PTC
10K
OPT
R3021
+3.5V_ST
10K
OPT
R3020
+5V_ST_PTC
22K
OPT
R3022
10K
R3011
10K
R3013
+3.5V_ST
4.7K
R1404
+3.5V_ST
+3.3V
2.2uF
10V
C4002
THERMAL
SC632ULTRT
IC3004
3
C1-
2
C1+
4
IN
1
GND
5EN
6OUT
7C2+
8C2-
9
[EP]GND
2.2uF
10V
C4003
+3.5V_ST
47uF
10V
C4006
10uF
25V
C4004
47uF
10V
C4005
5VST_1
SIGN150
Power 4 14
3A, DCR=0.025 ohm
C IN
Placed on SMD-TOP
C OUT
Placed on SMD-TOP
R1/R2 : 27K / 20K => Vout=1.88
Close to IC
R1
4.9A 0.0150OHM 34MHZ
Vout=0.8*(1+R1/R2)
Placed on SMD-TOP
Vout=0.8*(1+R1/R2)
MAX 3A
R1/R2 : 12K / 9.1K => Vout=1.85
465 mA @85% efficiency
FROM LIPS & POWER B/D
Close to IC
$0.24
Close to IC
1600 mA
R2
R1
R2
R1/R2 : 15K / 12K => Vout=1.80
$0.07
Placed on SMD-TOP
MSTAR CORE ON
26/32LG3DDH
3.5V TO 5V / 12V
12V TO 5V / 3.3V MSTAR CORE
5V/5V_G/PANEL/1.26/3305
12V TO 3.3V / DDR
PStoPDF trial version. http://www.oakdoc.com

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
IF_AGC
+5V_TU
0.1uF
C1021
OPT
3216
10uF
16V
C1028
+1.2V_DVDD_PVSB
FE_SIF
+3.3V_PVSB
47
R1016
OPT
FE_TUNER_SCL
10K
R1008
3216
10uF
16V
C1023
3216
10uF
16V
C1038
0.01uF
50V
C1009
0
5%
1/4W
R1034
+1.2V_PVSB
12K
R1007
+3.3V_AVDD_PVSB
6.8uH
L1004
SIFMO
470
R1010
0.1uF
50V
C1007
4.7K
R1013
2.2K
R1004
OPT
VCOMO
0.047uF
50V
C1012
0.1uF
50V
C1005
10K
R1006
OPT
+3.3V_DVDD_PVSB
4.7K
R1017
+5V_TU
FE_TUNER_SDA
+3.3V_PVSB
0
R1005
+5V_GENERAL
VSB_CTRL
0.1uF
50V
C1020
100uF
16V
OPT
C1002
100uF
16V
C1018
MLB-201209-0120P-N2
OPT
L1000
+3.3V_PVSB
8.2K OPT
R1015
15K OPT
R1014
4.7K
OPT
R1001
1K
OPT
R1002
0.1uF
50V
OPT
C1003
+3.3V_FE
SC156515M-1.8TR
OPT
IC1001
2
VIN
1
EN
3
GND
5ADJ
4VO
VSB_RESET
TS_0
0.1uFC1068
1K
R1063
TS_SYNC
25MHz
X1005
22R1077
0.1uF
C1067
0
R1065 OPT
TS_VALID
100
AR1070
+3.3V_DVDD_PVSB
TS_CLK
22R1078
27pF
C1072
+3.3V_DVDD_PVSB
0
R1073
470
R1069
1/16W
100
AR1079
LD1000
FE_DEMOD_SCL
27pF
C1071
1N4148W
D1000
1MR1072
FE_DEMOD_SDA
+3.3V_AVDD_PVSB
+3.3V_AVDD_PVSB
1uF
10V
C1073
100
AR1071
OPT
R1076
47K
R1074
0.01uF C1070
OPT
R1075
OPT
R1066
+1.2V_DVDD_PVSB
IF_AGC
IF_N
0.01uF C1069
5.1K
R1068
OPT
1K
R1060
100
R1064
IF_P
0.1uF
50V
C1026 0.1uF
50V
C1030 0.1uF
50V
C1032 0.1uF
50V
C1033
0.1uF
50V
C1043
0.1uF
50V
C1044
0.1uF
C1066
100
R1061
100
R1062
AS7809DTRE1
IC1003
2
GND
3OUTPUT 1
INPUT
100uF
16V
C1035
0.1uF
16V
C1037
OPT
0.01uF
25V
C1041
0.1uF
16V
C1034
47uF
16V
C1039
PANEL_POWER
KIA78R05F
IC1002
1
VIN
2
VC
3
VOUT
4
NC
5
GND1
6
GND2
0.1uF
C1040
BG2012B800
L1010
100
R1028
OPT
FE_VMAIN
008:D24
0
R1021
0.1uF
50V
C1014
270
R1019
+5V_TU
0OPT
R1018
270
R1020
+5V_TU
0.01uF
25V
C1008 10uF
10V
C1011
22
R1023
22
R1022 0 R1027
0
R1026
27pF
50V
OPT
C1024 27pF
50V
OPT
C1025
100pF
50V
C1017
100pF
50V
C1015
L1012
L1001
82pF
50V
C1004
500
L1005
500
L1003
500
L1007 500
L1008
220uF
16V
C1013
0
OPT
R1031
0
R1033
0
R1032
ISA1530AC1
Q1001 E
B
C
ISA1530AC1
Q1000
E
B
C
OPT
R1067
1uF
16V
C1076
20K
R1011
100
R1035
OPT
SC4215ISTRT
IC1000
3
VIN
2
EN
4
NC_2
1
NC_1
5NC_3
6VO
7ADJ
8GND
POWER_EN
008:AR30;004:AI10
100uF
16V
C1019
+1.2V_PVSB
0.1uF
50V
C1079
10K
R1012
0
R1003
100uF
16V
C1082
0.1uF
16V
C1081
0.33uF
16V
C1036
+5V_TU
IF_P
IF_N
LGDT3305
IC1004
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
CB3216PA501E
L1219
0.1uF
50V
C2138
100pF
50V
OPT
C1027
20K
R1036
0
OPT
R1009
220uF
16V
C2250
0L1014
5%
1/10W
0L1013
5%
1/10W
TS_1
TS_2
TS_3
TS_4
TS_5
TS_6
TS_7
47pF
C1006
270nH
L1002
TDVW-H104P
TU1001
14 NC_3
13 SIF
5RF_AGC
12 IF_AGC
11 DIF[-]
2NC_2
10 DIF[+]
4+B1[5V]
1NC_1
9AS
8CLOCK
3GND_1
16 VIDEO
7DATA
6GND_2
15 AUDIF
17
SHIELD
2.2uF
25V
C1078
2.2uF
25V
C1077
OPT
C1075
OPT
C1074
SIGN273
TS_0
TS_1
TS_2
TS_3
TS_4
TS_5
TS_6
TS_7
VSB +1.0V B+ BLOCK
VSB +3.3V B+ BLOCK
VDD33
VSSAD10
VCCAAD10A
VDD
VSS33
SLIM_SCAN
OPM
VSS
XTALI
TPDATA[1]
TPDATA[2]
TPDATA[3]
TPDATA[4]
TPDATA[5]
TPDATA[6]
TPERR
TPDATA[7]
VDD33
TPVALID
TPDATA[0]
VSS33
VSSAAD10A
IF OUT
I2CRPT_SDA
I2CRPT_SCL
VINA1
I2CSEL
VINA2
RF OUT
VDD
INCAP
ANTCON
VROA
VSS
VDD33
SCL
TPCLK
SDA
VSS33
VDD
PLLAVDD
PLLAVSS
TPSOP
VSS
NIRQ
XM
XTALO
NRST
Close to tuner
(I2C Channel 6)
V0 = 0.8(R1+R2) / R2
R1
R2
Mercury Option
Tuner/3305 5 14
FM Rejection Option
The value of coil & cap’ could be changed to optimized each
MStar Option
MStar Option
TUNER 5V
LGDT3305 POWER
TUNER LGDT3305
26/32LG3DDH
TUNER
PStoPDF trial version. http://www.oakdoc.com

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
56R40
0.1uF
C38
56R41
56
AR5
56
AR7
56R39
0.1uF
C25
0.1uF
C32
0.1uF
C22
56
AR10
56
AR3
10uF
C30
56
R21
56R16
56R6
0.1uF
C31
1000pF
C18
56R34
56R10
10uF
C13
0.1uF
C20
1000pF
C2
0.1uF
C27
0.1uF
C11
0.1uF
C24
10uF
C3
1K 1%
R24
0.1uF
C37
56R35
56R14
56R17
+1.8V_S_DDR
56
AR8
0.1uF
C41
56R19
1K 1%R5
56R15
56R20
1K 1%
R23
0.1uF
C8
0.1uF
C34
0.1uF
C29
0.1uF
C14
+1.8V_S_DDR
56
AR13
56R29
56
AR1
56
AR4
0.1uF
C10
56R42
56R33
56R12
56R38
0.1uF
C17
0.1uF
C39
56
AR12
56
AR9
56R11
0.1uF
C5
56R28
BLM18PG121SN1D
L1
56R27
56
AR11
0.1uF
C35
1000pF
C42
0.1uF
C7
56R13
56R30
+1.8V_DDR
56
AR2
1K 1%
R4
0.1uF
C6
56
AR14
0.1uF
C4
0.1uF
C40
56R18
0.1uF
C43
56R37
0.1uF
C15
0.1uF
C12
56R43
0.1uF
C1
150
OPT
R2 150
OPT
R45
0.1uF
C33
1K
1%
R44
56R36
0.1uF
C9
56
AR6
+1.8V_S_DDR
10uF
C23
+1.8V_S_DDR
0.1uF
C19
0.1uF
C16
+1.8V_S_DDR
0.1uF
C21
56R7
0.1uF
C36
1K
1%
R47
56R22
33R8
33R9 33R32
33R31
+1.8V_S_DDR
+1.8V_S_DDR
+1.8V_S_DDR
0R50 OPT
0
R51
0R49
0
R48
OPT
LGE3369A (SATURN6 NON RM)
IC100
B_DDR2_A0 T26
B_DDR2_A1 AF26
B_DDR2_A2 T25
B_DDR2_A3 AF23
B_DDR2_A4 T24
B_DDR2_A5 AE23
B_DDR2_A6 R26
B_DDR2_A7 AD22
B_DDR2_A8 R25
B_DDR2_A9 AC22
B_DDR2_A10 AD23
B_DDR2_A11 R24
B_DDR2_A12 AE22
B_DDR2_BA0 AC23
B_DDR2_BA1 AC24
B_DDR2_BA2 AB22
B_DDR2_MCLK V25
/B_DDR2_MCLK V24
B_DDR2_CKE AB23
B_DDR2_ODT U26
/B_DDR2_RAS U25
/B_DDR2_CAS U24
/B_DDR2_WE AB24
B_DDR2_DQS0 AB26
B_DDR2_DQS1 AA26
B_DDR2_DQM0 AC25
B_DDR2_DQM1 AC26
B_DDR2_DQSB0 AB25
B_DDR2_DQSB1 AA25
B_DDR2_DQ0 W25
B_DDR2_DQ1 AE26
B_DDR2_DQ2 W24
B_DDR2_DQ3 AF24
B_DDR2_DQ4 AF25
B_DDR2_DQ5 V26
B_DDR2_DQ6 AE25
B_DDR2_DQ7 W26
B_DDR2_DQ8 Y26
B_DDR2_DQ9 AD25
B_DDR2_DQ10 Y25
B_DDR2_DQ11 AE24
B_DDR2_DQ12 AD26
B_DDR2_DQ13 Y24
B_DDR2_DQ14 AD24
B_DDR2_DQ15 AA24
A_MVREF
D15
A_DDR2_A0
C13
A_DDR2_A1
A22
A_DDR2_A2
B13
A_DDR2_A3
C22
A_DDR2_A4
A13
A_DDR2_A5
A23
A_DDR2_A6
C12
A_DDR2_A7
B23
A_DDR2_A8
B12
A_DDR2_A9
C23
A_DDR2_A10
B22
A_DDR2_A11
A12
A_DDR2_A12
A24
A_DDR2_BA0
C24
A_DDR2_BA1
B24
A_DDR2_BA2
D24
A_DDR2_MCLK
B14
/A_DDR2_MCLK
A14
A_DDR2_CKE
D23
A_DDR2_ODT
D14
/A_DDR2_RAS
D13
/A_DDR2_CAS
D12
/A_DDR2_WE
D22
A_DDR2_DQS0
B18
A_DDR2_DQS1
C17
A_DDR2_DQM0
C18
A_DDR2_DQM1
A19
A_DDR2_DQSB0
A18
A_DDR2_DQSB1
B17
A_DDR2_DQ0
B15
A_DDR2_DQ1
A21
A_DDR2_DQ2
A15
A_DDR2_DQ3
B21
A_DDR2_DQ4
C21
A_DDR2_DQ5
C14
A_DDR2_DQ6
C20
A_DDR2_DQ7
C15
A_DDR2_DQ8
C16
A_DDR2_DQ9
C19
A_DDR2_DQ10
B16
A_DDR2_DQ11
B20
A_DDR2_DQ12
A20
A_DDR2_DQ13
A16
A_DDR2_DQ14
B19
A_DDR2_DQ15
A17
H5PS5162FFR-S6C
IC2
J2
VREF
J8
CK
H2 VSSQ2
B7
UDQS
N8
A4
P8
A8
L1
NC4
L2
BA0
R8
NC3
K7
RAS
F8 VSSQ3
F3
LDM
P3
A9
M3
A1
N3
A5
K8
CK
R3
NC5
L3
BA1
J7
VSSDL
L7
CAS
F2 VSSQ4
B3
UDM
M2
A10/AP
K2
CKE
R7
NC6
M7
A2
N7
A6
M8
A0
J1
VDDL
K3
WE
E8
LDQS
P7
A11
K9
ODT
A2
NC1
N2
A3
P2
A7
H8 VSSQ1
F7
LDQS
A8
UDQS
R2
A12
L8
CS
E2
NC2
E7 VSSQ5
D8 VSSQ6
D2 VSSQ7
A7 VSSQ8
B8 VSSQ9
B2 VSSQ10
P9 VSS1
N1 VSS2
J3 VSS3
E3 VSS4
A3 VSS5
G9 VDDQ1
G7 VDDQ2
G3 VDDQ3
G1 VDDQ4
E9 VDDQ5
C9 VDDQ6
C7 VDDQ7
C3 VDDQ8
C1 VDDQ9
A9 VDDQ10
R1 VDD1
M9 VDD2
J9 VDD3
E1 VDD4
A1 VDD5
B9 DQ15
B1 DQ14
D9 DQ13
D1 DQ12
D3 DQ11
D7 DQ10
C2 DQ9
C8 DQ8
F9 DQ7
F1 DQ6
H9 DQ5
H1 DQ4
H3 DQ3
H7 DQ2
G2 DQ1
G8 DQ0
HY5PS1G1631CFP-S6
IC1
J2 VREF
J8 CK
H2
VSSQ2
B7 UDQS
N8 A4
P8 A8
L1 BA2
L2 BA0
R8 NC3
K7 RAS
F8
VSSQ3
F3 LDM
P3 A9
M3 A1
N3 A5
K8 CK
R3 NC5
L3 BA1
J7 VSSDL
L7 CAS
F2
VSSQ4
B3 UDM
M2 A10/AP
K2 CKE
R7 NC6
M7 A2
N7 A6
M8 A0
J1 VDDL
K3 WE
E8 LDQS
P7 A11
K9 ODT
A2 NC1
N2 A3
P2 A7
H8
VSSQ1
F7 LDQS
A8 UDQS
R2 A12
L8 CS
E2 NC2
E7
VSSQ5 D8
VSSQ6 D2
VSSQ7 A7
VSSQ8 B8
VSSQ9 B2
VSSQ10
P9
VSS1 N1
VSS2 J3
VSS3 E3
VSS4 A3
VSS5
G9
VDDQ1 G7
VDDQ2 G3
VDDQ3 G1
VDDQ4 E9
VDDQ5 C9
VDDQ6 C7
VDDQ7 C3
VDDQ8 C1
VDDQ9 A9
VDDQ10
R1
VDD1 M9
VDD2 J9
VDD3 E1
VDD4 A1
VDD5
B9
DQ15 B1
DQ14 D9
DQ13 D1
DQ12 D3
DQ11 D7
DQ10 C2
DQ9 C8
DQ8 F9
DQ7 F1
DQ6 H9
DQ5 H1
DQ4 H3
DQ3 H7
DQ2 G2
DQ1 G8
DQ0
SDDR_A[4]
BDDR2_D[15]
TDDR_D[4]
SDDR_A[0]
TDDR_A[8]
SDDR_D[8]
TDDR_D[12]
ADDR2_D[0]
TDDR_D[9]
ADDR2_DQM1_P
BDDR2_D[3]
ADDR2_D[0-15]
TDDR_D[8]
BDDR2_A[0]
ADDR2_A[2]
SDDR_A[2]
BDDR2_A[10]
TDDR_D[11]
BDDR2_BA[1]
TDDR_A[10]
ADDR2_D[13]
ADDR2_D[13]
TDDR_D[10]
SDDR_D[3]
ADDR2_D[9]
ADDR2_A[0]
TDDR_D[7]
ADDR2_DQS0_N
ADDR2_A[8]
ADDR2_D[0]
/BDDR2_MCLK
SDDR_D[8]
ADDR2_A[10]
TDDR_BA[0]
TDDR_A[7]
BDDR2_A[3]
TDDR_A[11]
BDDR2_A[5]
SDDR_D[11]
ADDR2_A[12]
SDDR_A[4]
BDDR2_D[13]
ADDR2_A[1]
ADDR2_DQS1_P
SDDR_D[6]
ADDR2_D[5]
TDDR_D[13]
ADDR2_A[0]
BDDR2_D[13]
ADDR2_A[5]
BDDR2_A[11]
ADDR2_D[12]
BDDR2_D[14]
BDDR2_D[11]
BDDR2_A[2]
SDDR_A[12]
TDDR_D[9]
SDDR_D[2]
ADDR2_A[5]
ADDR2_BA[1]
ADDR2_A[12]
SDDR_A[5]
BDDR2_D[1]
ADDR2_CKE
ADDR2_A[2] BDDR2_A[7]
BDDR2_D[7]
ADDR2_A[7]
TDDR_D[14]
SDDR_A[11]
ADDR2_D[6]
TDDR_A[2]
SDDR_A[0]
SDDR_D[4]
BDDR2_D[0]
BDDR2_A[4]
BDDR2_A[12]
BDDR2_D[6] BDDR2_D[1]
SDDR_D[5]
BDDR2_D[3]
BDDR2_DQM1_P
SDDR_D[0-15]
SDDR_D[0]
ADDR2_A[1]
BDDR2_A[5]
BDDR2_D[2]
ADDR2_DQM0_P
BDDR2_A[7]
TDDR_D[7]
BDDR2_D[10]
BDDR2_DQS0_P
ADDR2_D[2]
ADDR2_D[8]
ADDR2_D[10]
BDDR2_A[4]
SDDR_D[1]
SDDR_D[14]
TDDR_A[6]
TDDR_A[9]
ADDR2_A[6]
TDDR_D[1]
BDDR2_A[12]
TDDR_D[15]
BDDR2_D[5]
BDDR2_CKE
SDDR_D[13]
BDDR2_D[7]
SDDR_A[9]
SDDR_D[14]
TDDR_D[8]
ADDR2_BA[0]
BDDR2_D[4]
TDDR_D[5]
BDDR2_DQM0_P
SDDR_D[12]
SDDR_A[6]
SDDR_A[8] TDDR_D[13]
ADDR2_ODT
SDDR_D[4] SDDR_A[2]
SDDR_D[10]
BDDR2_D[14]
ADDR2_D[15]
TDDR_A[4]
SDDR_D[11]
/ADDR2_MCLK
BDDR2_D[12]
ADDR2_DQS1_N
ADDR2_D[12]
SDDR_A[10]
SDDR_A[1]
SDDR_D[1]
BDDR2_A[11]
BDDR2_DQS0_N
ADDR2_D[8]
SDDR_BA[0]
BDDR2_A[1]
ADDR2_D[15]
SDDR_A[9]
BDDR2_D[9]
TDDR_D[6]
ADDR2_D[3]
ADDR2_DQS0_P
ADDR2_D[14]
BDDR2_A[6]
/ADDR2_CAS
SDDR_A[7]
TDDR_D[12]
TDDR_A[8]
BDDR2_BA[0]
TDDR_D[11]
ADDR2_A[11]
TDDR_A[0-12]
SDDR_D[10] BDDR2_A[0]
BDDR2_D[8]
BDDR2_DQS1_P
ADDR2_D[10]
ADDR2_A[7]
SDDR_A[6]
TDDR_D[3]
BDDR2_D[9]
SDDR_DQS1_N
ADDR2_D[14]
ADDR2_A[11]
TDDR_A[3]
TDDR_A[7]
BDDR2_D[5]
BDDR2_A[8]
/BDDR2_WE
BDDR2_ODT
BDDR2_D[0-15]
SDDR_A[3]
TDDR_D[0]
BDDR2_D[15]
SDDR_A[7]
TDDR_D[1]
SDDR_DQM1_P
SDDR_D[13]
ADDR2_A[4]
TDDR_D[5]
TDDR_A[0]
ADDR2_D[5]
TDDR_A[12]
SDDR_D[5]
TDDR_D[15]
ADDR2_D[7]
SDDR_A[0-12]
SDDR_BA[1]
SDDR_D[0]
TDDR_D[0-15]
SDDR_D[7]
BDDR2_A[6]
ADDR2_D[6]
SDDR_A[11]
SDDR_A[8]
SDDR_A[5]
SDDR_D[6]
TDDR_D[2]
TDDR_A[9]
ADDR2_A[9]
SDDR_D[15]
ADDR2_D[7]
SDDR_A[3]
SDDR_DQS1_P
SDDR_A[12]
SDDR_D[15]
BDDR2_A[0-12]
TDDR_D[10]
TDDR_D[6]
BDDR2_A[9]
TDDR_A[1]
ADDR2_D[1]
BDDR2_A[10]
/ADDR2_WE
BDDR2_D[8]
/SDDR_WE
ADDR2_A[4]
ADDR2_A[3]
ADDR2_A[10]
BDDR2_A[3]
ADDR2_MCLK
TDDR_A[3]
SDDR_D[9]
ADDR2_D[1]
BDDR2_DQS1_N
SDDR_A[1]
ADDR2_A[0-12]
BDDR2_D[4]
TDDR_A[0]
/BDDR2_CAS
TDDR_D[14]
BDDR2_D[12]
BDDR2_D[6]
BDDR2_D[0]
SDDR_D[12]
/BDDR2_RAS
BDDR2_D[10]
TDDR_A[10]
TDDR_A[4]
TDDR_D[4]
TDDR_A[2]
TDDR_D[0]
ADDR2_D[2]
/ADDR2_RAS
BDDR2_A[2]
TDDR_A[5]
BDDR2_A[1]
BDDR2_MCLK
SDDR_D[9]
SDDR_D[2]
BDDR2_D[2]
BDDR2_A[8]
SDDR_CKE
TDDR_A[6]
ADDR2_D[9]
BDDR2_D[11]
TDDR_D[3]
ADDR2_D[4]
ADDR2_D[11]
TDDR_BA[1]
ADDR2_D[11]
TDDR_A[5]
TDDR_D[2]
ADDR2_A[8]
ADDR2_A[9]
SDDR_D[7]
BDDR2_A[9]
ADDR2_A[3]
SDDR_A[10]
ADDR2_D[3]SDDR_D[3]
TDDR_A[12]
ADDR2_D[4]
ADDR2_A[6]
TDDR_A[11]
TDDR_A[1]
ADDR2_BA[2] BDDR2_BA[2]
SDDR_CK
SDDR_ODT
/SDDR_RAS
/SDDR_CAS
SDDR_DQS0_P
SDDR_DQM0_P
SDDR_DQS0_N
TDDR_BA[2]
TDDR_MCLK
TDDR_CKE
/TDDR_WE
TDDR_DQM1_P
TDDR_DQS1_N
DDR2 6 14
DDR2 1.8V By CAP - Place these Caps near Memory
DDR
512M_HYNIX1G_HYNIX
26/32LG3DDH
DDR
PStoPDF trial version. http://www.oakdoc.com

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LVDS_TXA2+
LVDS_TXA0+
LVDS_TXA3+
LVDS_TXA2-
LVDS_TXA0-
LVDS_TXA1+
TXA1+[8]
TXA4-[1]
0R847
0R850
TXAC-[5] 0R851
TXA2-[7]
LVDS_TXA1-
TXA3+[2]
LVDS_TXAC-
TXA2+[6]
0R848
0R856
TXAC+[4]
TXA1-[9]
0R849
0R853
LVDS_TXAC+
TXA3-[3]
LVDS_TXA3-
TXA4+[0]
0R854
0R855
0R852
LVDS_TXA0-
LVDS_TXA0+
LVDS_TXA3-
LVDS_TXA1-
LVDS_SEL
008:AR30
LVDS_TXAC+
0
R859
OPT
0
OPT
R857
0
R860
OPT
PWM_DIM 008:AF11;004:R21
OPC_OUT 004:R20
LVDS_TXA2-
OPC_EN
008:AQ28
LVDS_TXA2+
0
OPT
R858
GND
GND
FI-X30SSL-HF
P800
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
LVDS_TXAC-
LVDS_TXA1+
LVDS_TXA3+
PANEL_POWER
0.1uF
OPT
C804
22uF 25V
C803
1000pF
C805
+3.3V_ST
10K
OPT
R801
0
R861OPT
MDS61887702
M3
MDS61887702
M4
MDS61887702
M2
MDS61887702
M1
LVDS 714
LVDS
26/32LG3DDH
PStoPDF trial version. http://www.oakdoc.com