LG 32LF20FR User manual

LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP91A
MODEL : 32LF20FR 32LF20FR-MA
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL60021546 (0904-REV00)

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
TROUBLE SHOOTING........................................................................... 14
BLOCK DIAGRAM.................................................................................. 17
EXPLODED VIEW .................................................................................. 18
SVC. SHEET ...............................................................................................

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩand 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF
Ω

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
4. Electrical specification
- General Specification
1. Application range
This spec sheet is applied to LCD TV used LP91A chassis.
2. Specification
Each part is tested as below without special appointment.
1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC
2) Relative Humidity : 65±10%
3) Power Voltage : Standard input voltage(100-240V@50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
- EMC : CE, IEC
No Item Specification Measurement Remark
1 Screen Size 32” wide Color Display Module Resolution : 1920*1080
2 Aspect Ratio 16:9
3 LCD Module 32” TFT WUXGA LCD
4 Operating Environment Temp.: 0 ~ 40 deg
Humidity : 0 ~ 85 %
5 Storage Environment Temp.: -20 ~ 60 deg
Humidity : 0~ 85 %
6 Input Voltage AC100-240V~, 50/60Hz
≤170 W 32” FHD
7 LDC Module FHD 760 x 450 x 48 Unit : mm
(Maker : LGD) 0.36375 x 0.36375 [with inverter]
18 EEFL
Coating 3H

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 7 - LGE Internal Use Only
No. Item Min. Typ. Max. Unit Maker Remark
1. Luminance 400 500 cd/m2
(W/O PC mode)
2. VIew angle (R/L, U/D) 178 / 178 degree LGD
3. Color Coordinates White Wx Typ 0.279 Typ LGD 42”(FHD)
Wy -0.03 0.292 +0.03
RED Xr 0.638
Yr 0.334
Green Xg 0.291
Yg 0.607
Blue Xb 0.145
Yb 0.062
4. Contrast ratio 900:1 1300:1
5. Luminance Variation 1.3
5. Chroma& Brightness (Optical)
(1) LCD Module
The Color Coordinates check condition
- 50cm from the surface, Full White Pattern
- Picture mode Vivid
6. Component Video Input (Y, PB, PR)
No Specification Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)
2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)
3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz
4 720* 480 31.47 59.94 27.000 SDTV 480P
5 720* 480 31.50 60.00 27.027 SDTV 480P
6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz
7 1280* 720 44.96 59.94 74.176 HDTV 720P
8 1280* 720 45.00 60.00 74.250 HDTV 720P
9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11 1920* 1080 33.72 59.94 74.176 HDTV 1080I
12 1920* 1080 33.75 60.00 74.25 HDTV 1080I
13 1920* 1080 56.25 50 148.5 HDTV 1080P
14 1920* 1080 67.432 59.94 148.350 HDTV 1080P
15 1920* 1080 67.5 60.00 148.5 HDTV 1080P

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 8 - LGE Internal Use Only
No Specification Proposed Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA
2 720* 400 31.469 70.09 28.32 DOS
3 640* 480 31.469 59.94 25.17 VESA( VGA)
4 800* 600 37.879 60.317 40 VESA( SVGA)
5 1024* 768 48.363 60.004 65 VESA( XGA)
6 1280* 768 47.776 59.87 79.5 VESA( WXGA)
7 1360* 768 47.72 59.799 84.75 VESA( WXGA)
8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model
9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model
7. RGB
(Analog PC, RGB-DTV - NOT SUPPORT)
8. HDMI Input(PC)
(PC-Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 640 x 480 31.469 59.94 25.17 VESA( VGA)
2 800 x 600 37.879 60.317 40.00 VESA( SVGA)
3 1024 x 768 48.363 60.004 65.00 VESA( XGA)
4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)
5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)
6 1366 x 768 47.7 60.00 84.62 WXGA
7 1280 x 1024 63.595 60.00 108.875 SXGA
8 1920 x 1080 66.647 59.988 138.625 WUXGA
9. HDMI Input(DTV)
No Specification Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out
2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display.
3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720 x 480 31.47 59.94 27 SDTV 480P
5 720 x 480 31.5 60.00 27.027 SDTV 480P
6 720 x 576 31.25 50.00 27 SDTV 576P
7 1280 x 720 44.96 59.94 74.176 HDTV 720P
8 1280 x 720 45 60.00 74.25 HDTV 720P
9 1280 x 720 37.5 50.00 74.25 HDTV 720P
10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I
11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I
12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I
13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P
14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P
15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P
16 1920 x 1080 27 24.00 74.25 HDTV 1080P
17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
- 9 -
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV,
LP91A/B/C/D chassis.
2. Specification
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 ±5 °C of temperature and 65±10% of relative humidity if
there is no specific designation.
4) The input voltage of the receiver must keep 100~220V,
50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.
3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software
(IC800, Mstar ISP Utility)
1) Using D/L Jig
2) Using USB Memory Stick.
(2) Input Tool-Option/Area option.
(3) Download the EDID
- EDID datas are automatically download when adjusting
the Tool Option2
(4) ADC Calibration – RGB / Component
(4) Check SW Version.
3.2. SET assembly adjustment items
(1) Input Area option
(2) Adjustment of White Balance : Auto & Manual
(3) Input Tool-Option/Area option
(4) Intelligent Sensor Inspection Guide
(5) Preset CH information
(6) Factoring Option Data input
4. PCB assembly adjustment method
4.1. Mstar Main S/W program download
4.1.1. Using D/L Jig
(1) Preliminary steps
1) Connect the download jig to D-sub(RGB) jack
(2) Download steps
1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
utility Vx.x.x) will be opened
2) Click the “Connect” button and confirm “Dialog Box”
3) Click the “Config.” button and Change speed I2C Speed
setting : 350Khz~400Khz
4) Read and write bin file.
Click “(1)Read” tab, and then load download
file(XXXX.bin) by clicking “Read”.
- LH20/ LH30
1
Filexxx.bin
1
Filexxx.bin

5) Click “(2)Auto”tab and set as below
6) Click “(3)Run”.
7) After downloading, you can see the “(4)Pass”message.
4.1.2. Using the Memory Stick
* USB download : Service Mode
1) Insert the USB memory stick to the ISB port.
2) Automatically detect the SW Version.
-> S/W download process is executed automatically.
3) Show the message “Copy the file from the Memory”
4) After Finished the Download, Automatically DC Off -> On
5) Check The update SW Version.
4.2. Input tool option.
Adjust tool option refer to the BOM.
- Tool Option Input : PCBA Check Process
- Area Option Input : Set Assembly Process
After Input Tool Option and AC off
Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
(1) Profile : Must be changed the option value because being
different with some setting value depend on
module maker, inch and market
(2) Equipment : adjustment remote control.
(3). Adjustment method
- The input methods are same as other chassis.(Use IN-
START Key on the Adjust Remocon.)
(If not changed the option, the input menu can differ the
model spec.)
Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value
Caution : Don’t Press “IN-STOP”key after completing the
function inspection.
4.3. EDID D/L method
Recommend that don’t connect HDMI and RGB(D-SUB) cable
when downloading the EDID.
If not possible, recommend that connect the MSPG equipment.
There are two methods of downloading the edid data
4.3.1. 1st Method
EDID datas are automatically downloaded when adjusting the
Tool Option2.
Automatically downloaded when pushing the enter key after
adjusting the tool option2.
It takes about 2seconds.
4.3.2. 2nd Method
* Caution :
Must be checked that the tool option is right or not.
If tool option is wrong, hdmi edid data could not be
downloaded well.
1) Press the ADJ key
2) Move to the EDID D/L and Press the right direction key(G)
3) Press the right direction key(G) at Start.
4) After about a few seconds, appear “OK”, then compele.
4.3.3. RS-232C command Method
(1) Command : AE 00 10
* Caution
Don’t connect HDMI and RGB(D-SUB) cable when
downloading the EDID.
If the cables are connected, Downloading of edid could be
failed.
- 10 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
1
Filexxx.bin

4.3.4. EDID data
(1) Analog(RGB): 128bytes>
(2) HDMI 1 : 256Bytes
(3) HDMI 2 : 256Bytes
(4) HDMI 3 : 256Bytes
4.4. ADC Calibration
4.4.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to Component1 or 2 mode.
2) Input the Component 480i@60Hz 100% Color Bar
YPbPr signal into Component1 or 2.
(MSPG-925F Model: 209 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.
4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : Component”by using D/E
(CH +/-) and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
4.4.2. ADC Calibration - RGB (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to RGB mode..
2) Input the PC 1024x768@60Hz Horizontal Color Bar
signal into RGB.
(MSPG-925F Model: 60 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.
4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : RGB”by using D/E(CH +/-)
and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
- 11 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
OK
OK

4.5. Check SW Version
(1) Method
1) Push In-star key on Adjust remote-controller.
2) SW Version check
Check “SW VER : V3.xx”
5. PCB assembly adjustment method
5.1. Input Area-Option
(1) Profile : Must be changed the Area option value because
being different of each Country’s Language and
signal Condition.
(2) Equipment : adjustment remote control.
(3) Adjustment method
- The input methods are same as other chassis.(Use IN-
START Key on the Adjust Remocon.)
Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value.
* White Balance Adjustment
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192 (default data)
and decrease the others.
- Adjustment mode : Three modes –Cool / Medium / Warm
- Required Equipment
1) Remote controller for adjustment
2) Color Analyzer : CA100+ or CA-210 or same product -
LCD TV( ch : 9 ),
(should be used in the calibrated ch by CS-1000)
3) Auto W/B adjustment instrument(only for Auto adjustment)
5.2. Adjustment of White Balance
: (For automatic adjustment)
* LP91A~D Support RS-232C & I2C DDC Communication-
White Balance Mode.
(1) Enter the adjustment mode of DDC
- Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key
- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat-
run pattern display)
(2) Release the DDC adjustment mode
- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode
- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment.
- Need to transmit the aging off command to TV set after
finishing the adjustment.
- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance)
- Enter the white balance adjustment mode with aging
command (F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
5 .3. Adjustment of White Balance
(for Manual adjustment)
(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing “POWER
ON”key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push “Exit”key.
3) Change to the AV mode by remote control.
4) Input external pattern (85% white pattern)
5) Push the ADJ key -> Enter “0000”(Password)
6) Select “3. W/B ADJUST”
7) Enter the W/B ADJUST Mode
8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
D/E(CH +/-) key on R/C..
9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.
10) Adjust three modes all (Cool / Medium / Warm) : Fix
the one of R/G/B gain and change the others
11) When adjustment is completed, Enter “COPY ALL”.
12) Exit adjustment mode using EXIT key on R/C.
- 12 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

* CASE
First adjust the coordinate far away from the target value(x, y).
1. x, y > target
i) Decrease the R, G.
2. x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3. x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4. x < target, y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using the
CA100+ or CA210 equipment
To check the Coordinates of White Balance, you have to
measure at the below conditions.
Picture Mode : User 1
Dynamic Contrast : Off
Dynamic Colour : Off
(If you miss the upper condition, the coordinates of W/B
can be lower than the spec.)
- 13 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
Coordinate
Mode x y Temp uv∆
Cool 0.276±0.002 0.283±0.002 11,000K 0.000
Medium 0.285±0.002 0.293±0.002 9,300K 0.000
Warm 0.313±0.002 0.329±0.002 6,500K 0.003

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
- 14 -
TROUBLESHOOTING
No power
(LED indicator off)
Check 24V, 12V, 5,2V
of Power B/D Check short of Main B/D or Change Power B/D
Pass
Check Output of
IC1001, IC1003, IC1007
Check P307 Connector
Change LEDAssy
: [A] PROCESS
Fail
Fail
Pass
Pass
Check LEDAssy
Change IC1002,, Q1003
Pass
Check short of IC1001,
IC1003, IC1007
Fail
Re-soldering or Change defect
part of IC1001, IC1003, IC1007
Fail
No Raster [B]: Process
Check LED status
On Display Unit Repeat A PROCESS
Pass
Fail
Check Output of IC802 Change IC802
Fail
Change Inverter Connector
Or Inverter
Fail
Pass
Fail
Pass
Change Module
Fail
Check LVDS Cable
Pass
Check Panel Link Cable
Or Module Change Panel Link Cable
Or Module
Check Inverter Connector
Or Inverter
Pass

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
- 15 -
No Raster on PC Signal
Check Input source Cable
and Jack
Pass
Re-soldering or
Change the defect part
Pass
Check the Input/Output
Of IC100 Fail
Re-soldering or
Change the defect part,
Check RGB EDID Data
Repeat [A], & [B] Process
Pass
Check the Input/Output
Of J104 Fail
Pass
Check the Input/Output
Of IC800 Fail Re-soldering or
Change the defect part
Pass
No Raster on COMMPONENT Signal
Check Input source
Cable And Jack
Pass
Re-soldering or
Change the defect part
Pass
Check the Input/Output
Of IC800 Fail Re-soldering or
Change the defect part
Repeat [A], & [B] Process
Check The Input/Output
Of JK101 Fail
Pass
No Raster on HDMI Signal
Check Input source
Cable And Jack
Pass
Check the Input/Output
Of JK301, JK302, JK303 Fail Re-soldering or Change the defect part
Pass
Pass
Check the Input/Output
Of IC300, IC301, JK302 Fail
Re-soldering or
Change the defect part
Check HDMI EDID Data
Re-download HDCP
Pass
Pass
Check the Input/Output
Of IC800 Fail Re-soldering or
Change the defect part
Repeat [A], & [B] Process

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
- 16 -
No Sound
Check The Input Sourse.
Check The Input/Output
Of IC600. Re-soldering or
Change the defect part.Fail
Pass
Pass
Check The Speaker. Change Speaker.
Fail
Check The Speaker Wire.
Pass
Change The Source Input.
Fail
No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal
Check Input source
Cable And Jack
Pass
Check Input source
Cable And Jack
Pass
Check The Input/Output
Of JK101, JK201
Pass
Re-soldering or
Change the defect part
Pass
Fail
Pass
Repeat [A], & [B] Process
Check the Input/Output
Of IC800 Fail Re-soldering or
Change the defect part
Pass
Check The Input/Output
Of TU500
Pass
Re-soldering or
Change the defect part
Pass
Fail
Check the Input/Output
Of IC800 Fail Re-soldering or
Change the defect part
Repeat [A], & [B] Process

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
- 17 -
BLOCK DIAGRAM
RGB_PC PC_Audio TV (RF) COMP1
HDMI1 HDMI2
RS232
TX
232C Driver
ST3232C
Tx/ Rx : 15Vpp PC_R/G/B/HS/VS PC_Audio_L/R :700mVrms MNT_OUT: 1Vpp
SIDE_V :1Vpp SIDE_L/SIDE_R :500mVrms
DDR2(512MB)
L_SPK_OUT R_SPK_OUT
EEPROM
24C02
Comp1_L/R :500mVrms
TUNER
AV1_VIN:1Vpp AV11_LIN/RIN :500mVrms
PWM
NTP3100L
MNT_OUT
MNT_LOUT/ROUT: 500mVrms
AV2 (Side AV)
MAIN SCALER
TXD /RXD :5VDigital
COMP1_Y/Pb/Pr: 1/0.7Vpp COMP2_Y/Pb/Pr: 1/0.7Vpp IR HDMI_DATA_1 HDMI_DATA_2
HDMI1_SCL/SDA
OUT_E_TX_CLK
OUT_E_TX_E OUT_E_TX_D OUT_E_TX_C OUT_E_TX_B OUT_E_TX_A
TU_MAIN
S I F
COMP1_Y/Pb/Pr 1/0.7Vpp
AV1_VIN
PC_Audio_L/R COMP1_LIN/RIN
L_CH
R_CH
LVDSconnector
TU_MAIN SUB_SCLSDA
EEPROM
24C02
EEPROM
24C02
SIF
AV1_LIN/RIN MNT_L/R OUT
AV1 MNT_OUT
Comp2_L/R :500mVrms COMP2_Y/Pb/ :1/0.7Vpp
COMP2_LIN/RIN
COMP2
OUT_O_TX_CLK
OUT_O_TX_E OUT_O_TX_D OUT_O_TX_C OUT_O_TX_B OUT_O_TX_A
PC_R/G/B/HS/VS
HDM 2_SCL/SDA
PC_SCL/SDA
MNT_VOUT
AV2_VIN AV2_LIN/RIN
IIS_OUT
USB USB_DN/PN
AUDIO
AMP
HDMI3_SCL/SDA
EEPROM
24C02 HDMI_DATA_3
TMDS TMDS TMDS
HDMI3
USB For D/L
EEPROM(256K) Serial Flash (8MByte)
RGB_PC PC_Audio TV (RF) COMP1
HDMI1 HDMI2
RS232
TX
232C Driver
ST3232C
–
PC_R/G/B/HS/VS PC_Audio_L/R :700mVrms MNT_OUT: 1Vpp
SIDE_V :1Vpp SIDE_L/SIDE_R :500mVrms
DDR2(512MB)
EEPROM
24C02
Comp1_L/R :500mVrms
TUNER
AV1_VIN:1Vpp AV11_LIN/RIN :500mVrms
PWM
NTP3100L
MNT_OUT
MNT_LOUT/ROUT: 500mVrms
AV2 (Side AV)
MAIN SCALER
TXD /RXD :5VDigital
COMP1_Y/Pb/Pr: 1/0.7Vpp COMP2_Y/Pb/Pr: 1/0.7Vpp HDMI_DATA_1 HDMI_DATA_2
_
OUT_E_TX_CLK–
OUT_E_TX_ – OUT_E_TX_ – OUT_E_TX_C– OUT_E_TX_B– OUT_E_TX_A–
TU_MAIN
S I F
COMP1_Y/Pb/P :1/0.7Vpp
AV1_VIN
PC_Audio_L/R COMP1_LIN/RIN
L_CH
R_CH
LVDSconnector
TU_MAIN /
EEPROM
24C02
EEPROM
24C02
SIF
AV1_LIN/RIN MNT_L/R OUT
AV1 MNT_OUT
Comp2_L/R :500mVrms COMP2_Y/Pb/Pr 1/0.7Vpp
COMP2_LIN/RIN
COMP2
OUT_O_TX_C –
OUT_O_TX_E– OUT_O_TX_D– OUT_O_TX_C– OUT_O_TX_B– OUT_O_TX_A–
PC_R/G/B/HS/VS
PC_SCL/SDA
PC_SCL/SDA
MNT_VOUT
AV2_VIN AV2_LIN/RIN
IIS_OUT
USB USB_DN/PN
AUDIO
AMP
HDMI3_SCL/SDAHDMI3_SCL/SDA
EEPROM
24C02 HDMI_DATA_3
TMDS TMDS TMDS
HDMI3
USB For D/L
EEPROM(256K) Serial Flash (8MByte)

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 18 - LGE Internal Use Only
300 200
120
122
A10 A9
400
500
510
521
530
540
550
801 805
802
804
803
800
821
900
910
LV1
A2
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE

MULTI_PW_SW
10R859
56
AR812
SUB_SDA
HPD_MST_3
+1.8V_DDR
COMP2_PB
RT1C3904-T112 Q802
B C
DDR2_DQM0
100R825
0.047uFC828
K Y1
RL_ON
MX25L6405DMI-12G
IC802
3NC_1 2 VCC 4NC_2 1HOLD 6NC_4 5NC_3 7CS 8 SO/SIO1 9
WP/ACC
10GND 11NC_5 12NC_6 13NC_7 14NC_8 15SI.SIO0 16SCLK
0.01uF C864
0.1uFC882
I2S_SCK
TMDS2_RX2-
0.1uFC833
I2S_MCLK
USB_DN
100R882
MAIN_SIF
PC_G
100R8024
33R844
10R801 HDMI3_SID
0.047uFC830
PAN L_STATUS
TMDS2_RX0+
MNT_VOUT_T
TMDS3_RX0+
0.1uFC842
SW_R S T
RXD
0.01uF C858
TMDS2_RX2+
+3.3V_MULTI_MST
0.1uFC813
12MHz
X801
10R874
1M
R839
4.7uF C812
RL_ON
M_SDA
DDC_SDA3
+3.3V_MULTI_MST
+3.3V_MST
MUT _LIN
P_SCL
-DIM
SID _RIN
10R862
56 AR805
DDR2_DQM1
10R848 HDMI3_SID
P_SCL
C C_C
10uF
C866
0.01uF C860
47R834
56
AR813
TMDS3_RX1+
SYS_R S T
SPI_CZ
I2S_SDO
0.1uFC815
22KR842
TMDS2_RXC+
DDC_SCL1
0.047uFC837
POW R_SW
47R832
TMDS2_RXC-
+5VST_MST
0.1uFC848
56 AR810
10R841 HDMI3_SID
0.1uFC838
+1.2V_VDDC_MST
+3.3V_MULTI_MST
JTP-1127W M SW800
1
24
3
MNT_L_AMP
0.1uF C811
MNT_VOUT
DDR2_CASZ
PAN L_ON
1000pFC835
0.1uFC849
PC_B
TMDS3_RX2+
+3.3V_MULTI_MST
0.047uFC829
DDC_SCL3
DDR2_BA1
DISP_ N/VAVS_ON
DDR2_RASZ
DDR2_D[0-15]
TMDS3_RX0-
10R854
COMP2_Y
33
AR818
0.047uFC832
PC_AUD_L
PC_VS
CVBS_LIN
SPI_DI
402R807
R ADY
0.1uFC883
DDR2_BA0
P_SCL
10R820 HDMI3_SID
0.01uF C859
+3.3V_MULTI_MST
DDR2_DQS0M
SID _LIN
SID _V
0.047uFC831
0.01uF C803
TMDS2_RX1+
+1.8V_DDR
DDC_SDA1
SUB_SCL
DSUB_SDA
10R890 100R881
CAT24WC08W-T IC803 3
A2
2
A1
4
VSS
1
A0
5SDA 6SCL 7WP 8VCC
DDR2_CK
+12V_AUDIO
SPI_CLK
+3.3V_MULTI_MST
DDR2_DQS1M
0.01uF C807
KDS181 D803
USB_DP
+3.3V_MST
100R8025
+3.3V_MULTI_MST
56 AR809
I-DIM
SPI_CZ
0.1uFC808
0.1uFC804
56R852
IR
0.01uFC841
P_SDA
DDR2_A[0-12]
+3.3V_MULTI_MST
10R822 HDMI3_SID
CVBS_VIN
10R851
DDR2_DQS1P
10R823 HDMI3_SID
TMDS3_RXC-
MNT_VOUT_T
TMDS2_RX0-
+3.3V_MULTI_MST
DDR2_DQS0P
10R821 HDMI3_SID
10R869
47R837
DDR2_MCLKZ
DDR2_W Z
TXD
56 AR806
0.047uFC834
P_SDA
TMDS1_RXC+
24LC256-I/SM IC801 3
A2
2
A1
4
VSS
1
A0
5SDA 6SCL 7WP 8VCC
COMP2_R
M_SCL
+3.3V_MULTI_MST
PC_HS
TMDS1_RX2-
0.01uFC850
+3.3V_MULTI_MST
TMDS3_RXC+
47uF25V C870
+3.3V_MULTI_MST
470R835
10R891
KDS181 D802
TV_MAIN
1000pFC818
COMP2_PR
RT1C3904-T112 Q804
NON 19_22"
B
C
0.1uF C867
22KR845
100R8026
TMDS3_RX1-
P_24V_SMALL_15V
0.01uFC840
2.2uFC861
HPD_MST_1
10R873 10R880
SPI_DO
PC_AUD_R
0.01uFC810
56
AR814
+1.2V_VDDC_MST
100R8023
TMDS2_RX1-
DDC_SCL2
10R858 10R892
TMDS1_RX1+
10R871
TMDS1_RX2+
P_SDA
56
AR800
10R805 HDMI3_SID
KDS181 D801
DDR2_ODT
TMDS1_RXC-
SPI_DI
I2S_WS
DDR2_MCLK
0.047uFC826
TMDS1_RX0-
10R872
MNT_R_AMP
10R879
HPD_MST_2
0.1uFC853
0.01uFC839
DSUB_SCL
0.01uF C865
COMP2_L
10uF16VC809
+1.8V_DDR
0.01uF C862
+1.2V_VDDC_MST
TMDS1_RX1-
4.7uFC820
100R824
100R829
K Y2
56
AR815
TMDS1_RX0+
0.01uF C857
CVBS_RIN
2.2uFC856 0.1uFC869
+5VST_MST
0.1uF C814
PC_R
SPI_CLK
33R843
0.1uFC844
10R856
TMDS3_RX2-
0.01uFC876
DDC_SDA2
SPI_DO
P_12V_SMALL_15V
+5VST_MST
POW R_D T
POW R_D T
RT1C3904-T112 Q803
B
C
+5VST_MST
SYS_R S T
100R8012
0.01uF C877 0.01uF
C878 0.01uF
C879
TXD
RXD
0.1uFC863
ISA1530AC1 Q800
BC
ISA1530AC1 Q801
B C
2.2uF 16V
C8000
R ADY
+3.3V_MULTI_MST
0
R806
0R870
S_VID O_D T
SID _Y
SID _C
DDC_WP OPC_ N
4.7K R877
4.7K R8004
4.7K R817
470 R809
47
R8041
220R808
68 R810
0
R800
R ADY
0 R8001
390R840
47R814 47R816 47R818 47R838 47R833 47R836 470R803 47R804 47R815 47R897 47R802 47R831 47R857 47R830 47R875 47R876
100R846 100R847
100
R8039 HDMI3_SID
100
R8040 HDMI3_SID
4.7K R863 4.7K R864
100
R8042
1KR8038
1K
R8018
4.7KR865 4.7KR866
1KR867
1KR868
100 R8021
100 R8022
100R850
100R849
100R895
0R ADY R8017
0R ADY R8016
0R8033 R ADY
0R8034
0R8035
10K R8020
10K
R8003
0.047uFC800 0.047uFC801 0.047uFC827 0.047uF
C825
0.047uFC847 0.047uFC845 0.047uFC843 0.047uFC836 0.1uFC868 1000pFC846
1K R884 R ADY
1K R889 1K R811 R ADY 1K
R883
4.7K R8028
4.7K R8027
22R812 22R813
0.1uFC819
0.1uFC806 0.1uFC805
4.7K
Non_Small_FHD
R8010-*2
4.7K
Small_FHD
R8010-*1
4.7K
Small_HD
R896
4.7K
Apollo
R8010-*3
4.7K
Small_FHD
R896-*1
4.7K
Non_Small_HD
R8011-*1
4.7K
Non_Small_HD
R896-*2
4.7K
Apollo
R8011-*2
4.7K
Apollo
R898-*1
4.7K
Non_Small_FHD R898
4.7K
100Hz
R8011-*3 4.7K
100Hz
R898-*2
4.7K R8011
Small_FHD
4.7K R8010
Small_HD
22
R8005
22R8006
0R826
0R827
4.7uF
10V
C871
R ADY
120-ohm
L800
120-ohm
L801
120-ohm
L802
2.2uFC823
2.2uFC824
2.2uFC821
2.2uFC873
2.2uFC822
2.2uFC874
2.2uFC802
2.2uFC875
MST99A88ML(MATRIX BASIC)
IC800
1 RXBCKN 2 RXBCKP 3 RXB0N 4 RXB0P 5 HOTPLUGB 6 RXB1N 7 RXB1P 8 AVDD_33_1 9 RXB2N 10 RXB2P 1 1 RXACKN 12 RXACKP 13 RXA0N 14 RXA0P 15 AVDD_33_2 16 RXA1N 17 RXA1P 18 GND_1 19 RXA2N 20 RXA2P 21 HOTPLUGA 22 R XT 2 3 VCLAMP 24 R FP 25 R FM 26 BIN1P 27 SOGIN1 28 GIN1P 29 RIN1P 30 BINM 31 BIN0P 32 GINM 33 GIN0P 34 SOGIN0 35 RINM 36 RIN0P 37 AVDD_33_3 38 GND_2 39 BIN2P 40 GIN2P 41 SOGIN2 42 RIN2P 43 CVBS6 44 CVBS5 45 CVBS4 46 CVBS3 47 CVBS2 48 CVBS1 4 9 VCOM1 50 CVBS0 5 1 VCOM0 52 AVDD_33_4 53 CVBSOUT 54 GND_3 55 SIF0P 56 SIF0M 57 VDDC_1 58 AUL5 59 AUR5 6 0 AUVRM 61 AUOUTL2 62 AUOUTR2 63 AUOUTL1 64 AUOUTR1
65 AUL0
66 AUR0
67 AUL1
68 AUR1
69 AUL2
70 AUR2
71 AUL3
72 AUR3
7 3 AUCOM
74 AUL4
75 AUR4
76 GND_4
7 7 AUVRP
7 8 AUVAG
7 9 AVDD_AU
80 GND_5
81 VDDC_2
82 DDCA_CK
8 3 DDCA_DA
8 4 DDCDA_CK
8 5 DDCDA_DA
86 DDCDB_CK
8 7 DDCDB_DA
88 GPIO20
89 VDDP_1
90 VDDC_3
91 UART2_RX
92 UART2_TX
93 DDCDC_CK
9 4 RXCCKN
95 RXCCKP
9 6 DDCDC_DA
97 RXC0N
98 RXC0P
99 GND_6
10 0 RXC1N
10 1 RXC1P
1 0 2 AVDD_DM
10 3 RXC2N
10 4 RXC2P
10 5 HOTPLUGC
106 USB1_DM
107 USB1_DP
108 SCK
109 SDI
110 SDO
111 SCZ
112 PWM0
113 PWM1
114 PWM2
115 PWM3
11 6 LVA4P
117 LVA4M
11 8 LVA3P
119 LVA3M
12 0 LVACKP
1 2 1 LVACKM
12 2 LVA2P
123 LVA2M
12 4 LVA1P
125 LVA1M
12 6 LVA0P
127 LVA0M
12 8 VDDP_2
129LVB4P 130LVB4M 131LVB3P 132LVB3M 133LVBCKP 134LVBCKM 135LVB2P 136LVB2M 137LVB1P 138LVB1M 139LVB0P 140LVB0M 141AVDD_LPLL 142GND_7 143VDDC_4 144GPIO150/I2C_OUT_MUT 145GPIO151/I2C_OUT_SD2 146GPIO152/I2C_OUT_SD3 147GND_8 148GPIO51 149GPIO52 150GPIO53 151GPIO54 152GPIO55 153GPIO56 154GPIO57 155GPIO58 156VDDP_3 157VDDC_5 158B_MDATA[4] 159B_MDATA[3] 160GND_9 161B_MDATA[1] 162B_MDATA[6] 163AVDD_DDR_1 164B_MDATA[11] 165B_MDATA[12] 166GND_10 167B_MDATA[9] 168B_MDATA[14] 169AVDD_DDR_2 170B_DDR2_DQM[1] 171B_DDR2_DQM[0] 172GND_11 173B_DDR2_DQS[0] 174B_DDR2_DQSB[0] 175AVDD_DDR_3 176VDDP_4 177GND_12 178B_DDR2_DQS[1] 179
B_DDR2_DQSB[1]
180AVDD_DDR_4 181B_MDATA[15] 182B_MDATA[8] 183GND_13 184B_MDATA[10] 185B_MDATA[13] 186AVDD_DDR_5 187B_MDATA[7] 188B_MDATA[0] 189B_MDATA[2] 190B_MDATA[5] 191B_MCLK 192B_MCLKZ
193GND_14
194AVDD_M MPLL
195MVR F
196A_ODT
197A_RASZ
198A_CASZ
199A_MADR[0]
200A_MADR[2]
201A_MADR[4]
202GND_15
203A_MADR[6]
204A_MADR[8]
205A_MADR[11]
206A_W Z
207A_BADR[1]
208A_BADR[0]
209A_MADR[1]
210A_MADR[10]
211AVDD_DDR_6
212A_MADR[5]
213A_MADR[9]
214A_MADR[12]
215A_MADR[7]
216A_MADR[3]
217A_MCLK
218VDDC_6
219I2S_IN_WS/GPIO67
220I2S_IN_BCK/GPIO68
221I2S_IN_SD
222I2S_OUT_MCK
223I2S_OUT_WS
224VDDP_5
225GND_16
226VDDC_7
227I2S_OUT_BCK
228I2S_OUT_SD
229SPDIFO
230UART2_RX/I2CM_SDA
231UART2_TX/I2CM_SCK
232UART1_RX/GPIO86
233UART1_TX/GPIO87
234GND_17
235GND_18
236USB0_DM
237USB0_DP
238SAR0
239SAR1
240SAR2
241SAR3
242AVDD_MPLL
243
XOUT
244XIN
245GPIO134
246GPIO135
247GPIO138
248GPIO139
249GPIO140
250IRIN
251HSYNC0
252VSYNC0
253HSYNC1
254VSYNC1
255C C
256HWR S T
LG 3767A [MST99A88ML(MATRIX ONLY SD DIVX_ NON RM) ]
IC800-*1
1
RXBCKN
2
RXBCKP
3
RXB0N
4
RXB0P
5
HOTPLUGB
6
RXB1N
7
RXB1P
8
AVDD_33_1
9
RXB2N
10
RXB2P
11
RXACKN
12
RXACKP
13
RXA0N
14
RXA0P
15
AVDD_33_2
16
RXA1N
17
RXA1P
18
GND_1
19
RXA2N
20
RXA2P
21
HOTPLUGA
22
RXT
23
VCLAMP
24
RFP
25
RFM
26
BIN1P
27
SOGIN1
28
GIN1P
29
RIN1P
30
BINM
31
BIN0P
32
GINM
33
GIN0P
34
SOGIN0
35
RINM
36
RIN0P
37
AVDD_33_3
38
GND_2
39
BIN2P
40
GIN2P
41
SOGIN2
42
RIN2P
43
CVBS6
44
CVBS5
45
CVBS4
46
CVBS3
47
CVBS2
48
CVBS1
49
VCOM1
50
CVBS0
51
VCOM0
52
AVDD_33_4
53
CVBSOUT
54
GND_3
55
SIF0P
56
SIF0M
57
VDDC_1
58
AUL5
59
AUR5
60
AUVRM
61
AUOUTL2
62
AUOUTR2
63
AUOUTL1
64
AUOUTR1
65
AUL0
66
AUR0
67
AUL1
68
AUR1
69
AUL2
70
AUR2
71
AUL3
72
AUR3
73
AUCOM
74
AUL4
75
AUR4
76
GND_4
77
AUVRP
78
AUVAG
79
AVDD_AU
80
GND_5
81
VDDC_2
82
DDCA_CK
83
DDCA_DA
84
DDCDA_CK
85
DDCDA_DA
86
DDCDB_CK
87
DDCDB_DA
88
GPIO20
89
VDDP_1
90
VDDC_3
91
UART2_RX
92
UART2_TX
93
DDCDC_CK
94
RXCCKN
95
RXCCKP
96
DDCDC_DA
97
RXC0N
98
RXC0P
99
GND_6
100
RXC1N
101
RXC1P
102
AVDD_DM
103
RXC2N
104
RXC2P
105
HOTPLUGC
106
USB1_DM
107
USB1_DP
108
SCK
109
SDI
110
SDO
111
SCZ
112
PWM0
113
PWM1
114
PWM2
115
PWM3
116
LVA4P
117
LVA4M
118
LVA3P
119
LVA3M
120
LVACKP
121
LVACKM
122
LVA2P
123
LVA2M
124
LVA1P
125
LVA1M
126
LVA0P
127
LVA0M
128
VDDP_2
129LVB4P 130LVB4M 131LVB3P 132LVB3M 133LVBCKP 134LVBCKM 135LVB2P 136LVB2M 137LVB1P 138LVB1M 139LVB0P 140LVB0M 141AVDD_LPLL 142GND_7 143VDDC_4 144GPIO150/I2C_OUT_MUT 145GPIO151/I2C_OUT_SD2 146GPIO152/I2C_OUT_SD3 147GND_8 148GPIO51 149GPIO52 150GPIO53 151GPIO54 152GPIO55 153GPIO56 154GPIO57 155GPIO58 156VDDP_3 157VDDC_5 158B_MDATA[4] 159B_MDATA[3] 160GND_9 161B_MDATA[1] 162B_MDATA[6] 163AVDD_DDR_1 164B_MDATA[11] 165B_MDATA[12] 166GND_10 167B_MDATA[9] 168B_MDATA[14] 169AVDD_DDR_2 170B_DDR2_DQM[1] 171B_DDR2_DQM[0] 172GND_11 173B_DDR2_DQS[0] 174B_DDR2_DQSB[0] 175AVDD_DDR_3 176VDDP_4 177GND_12 178B_DDR2_DQS[1] 179B_DDR2_DQSB[1] 180AVDD_DDR_4 181B_MDATA[15] 182B_MDATA[8] 183GND_13 184B_MDATA[10] 185B_MDATA[13] 186AVDD_DDR_5 187B_MDATA[7] 188B_MDATA[0] 189B_MDATA[2] 190B_MDATA[5] 191B_MCLK 192B_MCLKZ
193GND_14
194AVDD_M MPLL
195MVR F
196A_ODT
197A_RASZ
198A_CASZ
199A_MADR[0]
200A_MADR[2]
201A_MADR[4]
202GND_15
203A_MADR[6]
204A_MADR[8]
205A_MADR[11]
206A_W Z
207A_BADR[1]
208A_BADR[0]
209A_MADR[1]
210A_MADR[10]
211AVDD_DDR_6
212A_MADR[5]
213A_MADR[9]
214A_MADR[12]
215A_MADR[7]
216A_MADR[3]
217A_MCLK
218VDDC_6
219I2S_IN_WS/GPIO67
220I2S_IN_BCK/GPIO68
221I2S_IN_SD
222I2S_OUT_MCK
223I2S_OUT_WS
224VDDP_5
225GND_16
226VDDC_7
227I2S_OUT_BCK
228I2S_OUT_SD
229SPDIFO
230UART2_RX/I2CM_SDA
231UART2_TX/I2CM_SCK
232UART1_RX/GPIO86
233UART1_TX/GPIO87
234GND_17
235GND_18
236USB0_DM
237USB0_DP
238SAR0
239SAR1
240SAR2
241SAR3
242AVDD_MPLL
243XOUT
244XIN
245GPIO134
246GPIO135
247GPIO138
248GPIO139
249GPIO140
250IRIN
251HSYNC0
252VSYNC0
253HSYNC1
254VSYNC1
255C C
256HWR S T
3.3KR819
DSUB_SDA
L D_R
RT1C3904-T112 Q805
R ADY
B C
DDC_WP
10K
R828
R ADY
4.7K R878
4.7KR893
1KR861
0
R8037
NON 19_22"
0R894
0R899
2K
R886
150R885
1KR860
10K R8000
33KR8007
NON 19_22"
10K R855
1K
R853
100R888
33K R887
20K
R8036
19_22_26"
20pFC817
20pFC816
DDR2_A[2]
DDR2_D[1]
DDR2_A[6]
GND
DDR2_D[5]
DDR2_A[10]
DDR2_D[0]
DDR2_D[10]
DDR2_A[12]
DDR2_D[14]
DDR2_A[0]
DDR2_D[6]
DDR2_A[5]
DDR2_D[3]
DDR2_A[4]
DDR2_D[4]
DDR2_D[12]
DDR2_A[9]
DDR2_D[11]
DDR2_A[8]
DDR2_D[8] DDR2_D[7]
DDR2_D[15]
DDR2_D[9]
DDR2_A[3]
DDR2_D[13]
DDR2_A[11]
DDR2_D[2]
DDR2_A[1]
DDR2_A[7]
TXC 4-
TXC 4+
TXC 3-
TXC 3+
TXCLK -
TXCLK +
TXC 2-
TXC 2+
TXC 1-
TXC 1+
TXC 0-
TXC 0+
TXCO4-
TXCO4+
TXCO3-
TXCO3+
TXCLKO-
TXCLKO+
TXCO2-
TXCO2+
TXCO1-
TXCO1+
TXCO0-
TXCO0+
I2S_OUT
HDMI_3
PROM
HDMI_1
[MOD S L CTION]
HDMI_2
C804/C805/C806:Close to IC as close as possible
GAIN X 4
R S T
Close to IC
with width trace
Close to IC as close as possible
HDCP PROM
USB PART
S RIAL FLASH 64M
S-VID O
4.7K X
4.7K
4.7K
X
4.7K
R8010
X
R898
Non Small FHD
4.7K
X4.7K
Small HD
*H/W OPTION
4.7K
4.7K 4.7K
100HZ
4.7K 4.7K4.7K
Apollo Non Small HD
R8011
X
X
X
4.7K X
R896
X
Small FHD (27)
4.7K
X
** Small HD : 19/22/26 Inch
** Non Small FHD : Normal(non 100Hz) FHD Model
TH SYMBOL MARK OF THIS SCH M TIC DIAGRAM INCORPORAT S SP CIAL F ATUR S IMPORTANT FOR PROT CTION FROM X-RADIATION. FILR AND L CTRICAL SHOCK HAZARDS, WH N S RVICING IF IS SS NTIAL THAT ONLY MANUFATUR S SP CFI D PARTS B US D FOR TH CRITICAL COMPON NTS IN TH SYMBOL MARK OF TH SCH M TIC.
SCHEMATIC DIAGRAM
Copyright LG lectronics. Inc. All right reserved.
Only for training and service purposes
LG Internal Use Only
MSTAR

+1.8V_DDR
DDR2_A[0-12]
DDR2_BA0 DDR2_BA1 DDR2_MCLK DDR2_MCLKZ DDR2_CK DDR2_ODT DDR2_RASZ DDR2_CASZ DDR2_W Z DDR2_DQS0P DDR2_DQS1P DDR2_DQM0 DDR2_DQM1 DDR2_DQS0M DDR2_DQS1M
+1.8V_DDR
+1.8V_DDR
DDR2_D[0-15]
1000pF C905
V_R F
56 R900
56
R901
56 R902
56 R903
56
R904
56 R905
0.01uF C904
0.01uF 50V C900
0.01uF C901
0.01uF C902
0.01uF C903
0.01uF C906
0.01uF C907
0.01uF C908
0.01uF C909
0.01uF C910
0.01uF C911
0.01uF C912
0.01uF C913
0.01uF C914
0.01uF C915
0.01uF C916
0.01uF C917
+1.8V_DDR
150
R906
R ADY
TH SYMBOL MARK OF THIS SCH M TIC DIAGRAM INCORPORAT S SP CIAL F ATUR S IMPORTANT FOR PROT CTION FROM X-RADIATION. FILR AND L CTRICAL SHOCK HAZARDS, WH N S RVICING IF IS SS NTIAL THAT ONLY MANUFATUR S SP CFI D PARTS B US D FOR TH CRITICAL COMPON NTS IN TH SYMBOL MARK OF TH SCH M TIC.
V_R F
0.1uF 50V C918
HYB18TC512160B2F-2.5
IC900
J2
VR F
J8
CK
H2 VSSQ2
B7
UDQS
N8
A4
P8
A8
L1
NC4
L2
BA0
R8
NC3
K7
RAS
F8 VSSQ3
F3
LDM
P3
A9
M3
A1
N3
A5
K8
CK
R3
NC5
L3
BA1
J7
VSSDL
L7
CAS
F2 VSSQ4
B3
UDM
M2
A10/AP
K2
CK
R7
NC6
M7
A2
N7
A6
M8
A0
J1
VDDL
K3
W
8
LDQS
P7
A11
K9
ODT
A2
NC1
N2
A3
P2
A7
H8 VSSQ1
F7
LDQS
A8
UDQS
R2
A12
L8
CS
2
NC2
7 VSSQ5
D8 VSSQ6 D2 VSSQ7 A7 VSSQ8
B8 VSSQ9 B2 VSSQ10
P9 VSS1
N1 VSS2
J3 VSS3
3 VSS4
A3 VSS5 G9 VDDQ1 G7 VDDQ2 G3 VDDQ3 G1 VDDQ4
9 VDDQ5
C9 VDDQ6 C7 VDDQ7 C3 VDDQ8 C1 VDDQ9
A9 VDDQ10
R1 VDD1
M9 VDD2
J9 VDD3
1 VDD4
A1 VDD5
B9 DQ15 B1 DQ14
D9 DQ13 D1 DQ12 D3 DQ11 D7 DQ10
C2 DQ9 C8 DQ8
F9 DQ7 F1 DQ6
H9 DQ5 H1 DQ4 H3 DQ3 H7 DQ2 G2 DQ1 G8 DQ0
10uF 10V C919
1K
R907
1K
R908
DDR2_A[0] DDR2_A[12] DDR2_A[11] DDR2_A[1] DDR2_A[2] DDR2_A[3] DDR2_A[4] DDR2_A[5] DDR2_A[6] DDR2_A[7] DDR2_A[8] DDR2_A[9] DDR2_A[10]
DDR2_D[0-15]
DDR2_D[0] DDR2_D[1] DDR2_D[2] DDR2_D[3] DDR2_D[4] DDR2_D[5] DDR2_D[6] DDR2_D[7] DDR2_D[8] DDR2_D[9]
DDR2_D[10] DDR2_D[11] DDR2_D[12] DDR2_D[13] DDR2_D[14] DDR2_D[15]
DDR2 M MORY
Close to DDR2 IC
Close to DDR2 IC
Copyright LG lectronics. Inc. All right reserved.
Only for training and service purposes
LG Internal Use Only
DDR2