LG 32CS410 User manual

Printed in KoreaP/NO : MFL67452804 (1204-REV00)
LCD TV
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
CHASSIS : LP24B
MODEL : 32CS410/410Y/411/411Y/412
32CS410/410Y-TB 32CS411/411Y-TA
32CS412-TD
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

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CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS .................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
TROUBLESHOOTING GUIDE ................................................................ 13
BLOCK DIAGRAM .................................................................................. 16
EXPLODED VIEW .................................................................................. 17
SCHEMATIC CIRCUIT DIAGRAM ..............................................................

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Only for training and service purposes
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS

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SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent poten-
tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electri-
cally shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

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Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application range
This specification is applied to the LP24B chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
4. Model General Specification
No. Item Specication Remarks
1. Market NON EU
2. Broadcasting system
1) PAL/SECAM B/G/D/K
2) PAL-I/II
3) NTSC-M
3. Channel Storage
PAL NTSC China(DK)
E2-C69
S21~S47
2~78
1~71
C1~C62
S1~S41
4. Receiving system Upper Heterodyne
5. Video Input PAL, SECAM, NTSC Rear (1EA)
6. Component Input Y/Cb/Cr, Y/Pb/Pr Rear (1EA)
7. USB Input MP3, JPEG Side(1EA)
8. AV Audio Output RF/AV/HDMI Audio Output Rear (1EA)
9. D-SUB INPUT S/W Upgrade Only Rear (1EA)
10. HDMI Input HDMI-DTV, Only PCM MODE Rear (1EA)
11. Audio Input (1EA) AV&Component L/R Input(1EA)

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5. Component Video Input (Y, PB, PR)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed
1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4. 720*480 31.47 59.94 27.000 SDTV 480P
5. 720*480 31.50 60.00 27.027 SDTV 480P
6. 720*576 31.25 50.00 27.000 SDTV 576P 50Hz
7. 1280*720 44.96 59.94 74.176 HDTV 720P
8. 1280*720 45.00 60.00 74.250 HDTV 720P
9. 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz
10. 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11. 1920*1080 33.72 59.94 74.176 HDTV 1080I
12. 1920*1080 33.75 60.00 74.25 HDTV 1080I
13. 1920*1080 56.25 50 148.5 HDTV 1080P
14. 1920*1080 67.432 59.94 148.350 HDTV 1080P
15. 1920*1080 67.5 60.00 148.5 HDTV 1080P
6. HDMI Input
6.1. PC Mode
* Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable
* Monitor Range Limits
Min Vertical Freq - 58 Hz / Max Vertical Freq - 63 Hz
Min Horiz. Freq - 28 kHz / Max Horiz. Freq - 68 kHz
Pixel Clock - 150 MHz
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remarks
1. 640×480 31.469 59.94 25.17 VESA(VGA)
2. 800×600 37.879 60.317 40.00 VESA(SVGA)
3. 1024×768 48.363 60.004 65.00 VESA(XGA)
4. 1280×768 47.776 59.87 79.5 VESA(WXGA)
5. 1360×768 47.72 59.799 84.62 VESA(WXGA)
6 1366×768 47.7 60.00 84.62 WXGA
7. 1280×1024 63.595 60.00 108.875 SXGA
8. 1920×1080 66.647 59.988 138.625 WUXGA

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No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks
1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
Spec. out but display.2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4. 720*480 31.47 59.94 27 SDTV 480P
5. 720*480 31.5 60.00 27.027 SDTV 480P
6. 720*576 31.25 50.00 27 SDTV 576P
7. 1280*720 44.96 59.94 74.176 HDTV 720P
8. 1280*720 45 60.00 74.25 HDTV 720P
9. 1280*720 37.5 50.00 74.25 HDTV 720P
10. 1920*1080 28.125 50.00 74.25 HDTV 1080I
11 1920*1080 33.72 59.94 74.176 HDTV 1080I
12 1920*1080 33.75 60.00 74.25 HDTV 1080I
13 1920*1080 56.25 50.00 148.5 HDTV 1080P
14 1920*1080 67.432 59.94 148.350 HDTV 1080P
15 1920*1080 67.5 60.00 148.5 HDTV 1080P
16 1920*1080 27 24.00 74.25 HDTV 1080P
17 1920*1080 33.75 30.00 74.25 HDTV 1080P
18 1920*1080 26.97 23.97 74.25 HDTV 1080P
19 1920*1080 33.716 29.976 74.25 HDTV 1080P
6.2. DTV Mode

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ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV with
LP24B chassis.
2. Designation
(1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
(4) The input voltage of the receiver must keep 100-220 V,
50/60Hz.
(5) The standard signal level is approved in 65 dBµV ± 1 dBµV.
(6) The receiver must be operated for over 5 minutes prior to
the adjustment when module is in the circumstance of
above 15 °C.
► In case of keeping module is in the circumstance of 0
°C, it should be placed in the circumstance of above 15
°C for 2 hours.
► In case of keeping module is in the circumstance of
below -20 °C, it should be placed in the circumstance of
above 15 °C for 3 hours.
3. PCB assembly adjustment method
3.1. Mstar Main S/W program download
3.1.1. Using D/L Jig
(1) Preliminary steps
1) Connect the download jig to D-sub(JK201) Jack.
(2) Download steps
1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
utility Vx.x.x) will be opened.
2) Click the “Connect” button and confirm “Dialog Box”.
3) Click the “Config.” button and Change speed
I2C Speed setting : 350Khz~400Khz
4) Read and write bin file
Click “(1)Read” tab, and then load download file(XXXX.
bin) by clicking “Read”.
5) Click “(2)Auto” tab and set as below
6) Click “(3)Run”.
7) After downloading, you can see the “(4)Pass” message.
3.1.2. Using the Memory Stick
** USB DOWNLOAD : Service Mode
1) Insert the USB memory Stick to the USB port. (The file
name of bin file should start as “M8R…”. and Bin file
should not be encrypted)
2) Automatically detect the bin file and ask download or not.
G

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3) Press OK key then Message will be changed as below.
4) Plug off and on TV set, then you can see downloading
process.
5) Then, Plug off and on TV set again, and Download is
finished
3.2. Input tool option.
- Adjust tool option refer to the BOM.
■ Tool Option Input : PCBA Check Process
■ Area Option Input : Set Assembly Process
- After Input Tool Option and AC off
Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
(1) Profile : Must be changed the option value because being
different with some setting value depend on module
maker, inch and market
(2) Equipment : adjustment remote control.
(3) Adjustment method
- The input methods are same as other chassis. (Use
IN-START key on the Adjust Remote control.)
(If not changed the option, the input menu can differ the
model spec.)
Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value.
*Caution: Don’t Press “IN-STOP” key after completing the
function inspection.
* Caution: Don’t connect HDMI cable when downloading the
EDID. If the cables are connected, Downloading of
edid could be failed.
3.3. EDID data
- EDID D/L method: The EDID data is automatically saved.
■ HD MODEL
3.4. ADC Calibration
3.4.1. ADC Calibration-Component
(Using External pattern)
* Required Equipments
■ Remote controller for adjustment
■ MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
3.4.2. Process
(1) Change the Input to Component mode.
(2) Input the Component 480P@60 Hz 100% color Bar Y Pb
Pr signal into Component. (MSPG-925F Model: 212/
Pattern: 65)
(3) Press ADJ key on R/C for adjustment.
(4) Enter Password number. Password is “0413”.
(5) Select “Auto-RGB” and press OK(■) key.
(6) ADC adjustment is executed automatically.
(7) When ADC adjustment is finished, this OSD appear
“COMPONENT - OK”.
3.4.3. Confirmation
(1) Adjust by commanding AUTO_COLOR_ADJUST (0xF1)
0x00 0x02 instruction
(2) We confirm whether “0x77 (offset), 0x78 (gain)” address of
EEPROM “0xBE” is “0xAA” or not.
(3) If “0x77”, “0x78” address of EEPROM “0xBE” isn’t “0xAA”,
we adjust once more
(4) We can confirm the ADC values from “0x56~0x5B”
addresses in a page “0xBE”
3.4.4. EEPROM Address
G

0 1 2 3 4 5 6 7 8 9 A B C D E F
0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01
10 01 16 01 03 80 A0 5A 78 0A F3 30 A4 54 46 96 26
20 0F 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28
40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 A6
80 02 03 25 F1 4F 84 07 01 16 02 03 11 12 13 14 05
90 20 22 1F 10 23 09 07 07 83 01 00 00 68 03 0C 00
A0 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20 40 80 35
B0 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10
C0 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 51 F0 16
D0 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D 80 18 71
E0 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 2A
EEPROM Address
EEPROM Sub Address 0XBE
Red Gain 0X59
Green Gain 0X5A
Blue Gain 0X5B
Red Offset 0x56
Green Offset 0X57
Blue Offset 0X58

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3.5 Check SW Version
3.5.1 Method
(1) Push In-star key on Adjust remote-controller.
(2) SW Version check
Check “Main : Vx.xx” :
4. SET assembly adjustment method
4.1. Input Area-Option
(1) Profile : Must be changed the Area option value because
being different of each Country’s
(2) Equipment : adjustment remote control.
(3) Adjustment method
- The input methods are same as other chassis.(Use
IN-START key on the Adjust Remote control.)
Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value.
4.2. Adjustment of White Balance.
■ Purpose: Adjust the color temperature to reduce the
deviation of the module color temperature.
■ Principle: To adjust the white balance without the saturation,
Fix the one of R/G/B gain to C0 and decrease the others.
■ Adjustment mode : Three modes - Cool / Medium / Warm
(Medium data is automatically calibrated by the Cool data)
■ Adj. condition: normal temperature
1) Surrounding Temperature: 25 °C ± 5 °C
2) Warm-up time: About 5 Min
3) Surrounding Humidity: 20 % ~ 80 %
■ Required Equipment
■ Remote controller for adjustment
■ Color Analyzer : CA100+ or CA-210 or same product - LCD
TV(CH: 9), (should be used in the calibrated ch by CS-1000)
■ Auto W/B adjustment instrument (only for Auto adjustment)
4.2.1. Connecting diagram of equipment for measuring
(For Automatic Adjustment)
(1) Enter the adjustment mode of DDC
■ 22Set command delay time : 50ms
■ Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key)
■ Maintain the DDC adjustment mode with same condition
of Heat-run → Maintain after AC off/on in status of Heat-
run pattern display
(2) Release the DDC adjustment mode
■ Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode.
■ Release the Adjust mode when receiving the aging off
command(WB 00 FF) from adjustment equipment.
■ Need to transmit the aging off command to TV set after
finishing the adjustment.
■ Check DDC adjust mode release by exit key and release
DDC adjust mode.
(3) Enter the adjust mode of white balance
■ Enter the white balance adjustment mode with aging
command(F3, 00, 00).
(4) Release the adjust mode of white balance
■ Enter the white balance adjustment mode with aging
command(F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
G
Tool Option Area Option
Module
Maker
0 : CMI
1 : THTF
2 : LPL
Lang Group 0 : NONEU A
1 : NONEU H
2 : NONEU ALL
Inch 0 : 22” (Default)
1 : 23”
2 : 32”
Def. Lang 0 : ENGLISH
1 : CHINESE
2 : ESPANOL
3 : PORTUGUES
Frame 0 : LK230 (Default) TTX Group 0 : OFF
1 : ON
Module
Rev.
0 : Rev.0 (Default)
1 : Rev.1
I II SAVE 0 : OFF
1 : ON
HDEV
MONO
BlueBack
Country

- 12 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.3. Adjustment of White Balance
(for Manual adjustment)
■ Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
■ Operate the zero-calibration of the CA100+ or CA-210, then
stick sensor to the module when adjusting.
■ For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operate
heat run longer than 5 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push “Exit” key.
3) Change to the AV mode by remote control.
4) Input external pattern (85% white pattern)
5) Push the ADJ key two times (entering White Balance
mode) → Enter “0413” (Password)
6) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
▲/▼(CH +/-) key on R/C..
7) Adjust R/ G/ B Gain using ◄/►(VOL +/-) key on R/C.
8) Adjust three modes all (Cool / Medium / Warm) : Fix the
one of R/G/B gain and change the others
9) When adjustment is completed, Exit adjustment mode
using EXIT key on R/C.
* CASE
First adjust the coordinate far away from the target value(x, y).
1) x, y > target
i) Decrease the R, G.
2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3) x > target , y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4) x < target , y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
■ Standard color coordinate and temperature when using the
CA100+ or CA210 equipment (Small size inch’s color
coordinate is different from others, So use below table)
1) All Edge LED(except LGD), lamp over 26 and None
Edge LED(LGD Direct LED 42inch) and LGD Edge LED
26inch Over
Mode Color coordinate Temp ∆uv
x y
Cool 0.271 ± 0.002 0.276 ± 0.002 13,000 K 0.000
Medium 0.287 ± 0.002 0.296 ± 0.002 9,300 K 0.000
Warm 0.315 ± 0.002 0.332 ± 0.002 6,500 K 0.003

- 13 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
TROUBLE SHOOTING
No power
(LED indicator off)
Check 24V, 12V, 3.5V
of Power B/D
Check short of Main B/D
or Change Power B/D
Pass
Check Output of
IC701, IC702, IC705,
IC704, IC709
Check P400 Connector
Change LED Assy
: [A] Process (for non-adapter models)
Fail
Fail
Pass
Pass
Check LED Assy
Check Output of Q720
Pass
Check short of
IC701, IC702, IC705,
IC704, IC709
Fail
Re-soldering or Change defect part
Fail
No power
(LED indicator off)
Check output of adapter
(JK700 : 24V)
Check short of Main B/D
or Change adapter
Pass
Check Output of
IC701, IC702, IC704,
IC705, IC706,IC707,IC708,
IC709,IC800
Check P400 Connector
Change LED Assy
: [A-1] Process (for adapter models)
Fail
Fail
Pass
Pass
Check LED Assy
Check Output of Q720
Pass
Check short of
IC701, IC702, IC704,
IC705, IC706,IC707,IC708,
IC709,IC800
Fail
Re-soldering or Change defect part
Fail

- 14 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
No Raster : [B] Process
Check LED status
On Display Unit Repeat [A]/[A-1] Process
Fail
Check PANEL_VCC of LVDS wafer Check Output of Q720
Fail
Change Inverter Connector
Or Inverter
Fail
Pass
Fail
Pass
Change LVDS Cable
Fail
Check LVDS Cable
Pass
Check Panel Link Cable
Or Module
Change Panel Link Cable
Or Module
Check Inverter Connector
Or Inverter
Pass
No Raster on COMPONENT Signal
Check Input source
Cable And Jack
Pass
Re-soldering or
Change the defect part
Pass
Check the Input/Output
Of IC501
Fail Re-soldering or
Change the defect part
Repeat [A]/[A-1], & [B] Process
Check The Input/Output
Of JK101
Fail
Pass
No Raster on HDMI Signal
Check Input source
Cable And Jack
Pass
Check the Input/Output
Of JK203
Fail Re-soldering or
Change the defect part
Pass
Pass
Pass
Check the Input/Output
Of IC501
Fail Re-soldering or
Change the defect part
Repeat [A]/[A-1], & [B] Process
Pass

- 15 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
No Raster On AV Video Signal No Signal On TV(RF) Signal
Check Input source
Cable And Jack
Pass
Check Input source
Cable And Jack
Pass
Check The Input/Output
Of JK101
Pass
Re-soldering or
Change the defect part
Pass
Fail
Pass
Repeat [A]/[A-1], & [B] Process
Check the Input/Output
Of IC501
Fail Re-soldering or
Change the defect part
Pass
Check The Input/Output
Of TU401
Pass
Re-soldering or
Change the defect part
Pass
Fail
Check the Input/Output
Of IC501
Fail Re-soldering or
Change the defect part
Repeat [A]/[A-1], & [B] Process
No Sound
Check The Input Source
Check The Input/Output
Of IC301
Re-soldering or
Change the defect part
Fail
Pass
Pass
Check The Speaker Change Speaker
Fail
Check The Speaker Wire
Pass
Change The Source Input
Fail

- 16 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
POWER BOARD
Sound AMP
NTP7500
IC301
(
(
(
(
(
(( (
(
(( (
Module
JK101
Common L In
Common V In
Audio
Out
MST7833LNT
5
4
6
7
10 11
Tuner SDA Tuner SCL
TUNER
RF_AGC
B+
IR/KEY
R3
24Mhz
A13
B13
R6
T6
IC502
Serial Flash
2Mbytes
IC503
EEPROM
24C64
IC705
LDO
IC501
48
LPF 47
53
54
P301
Common R In
OP-AMP
IC302
x4 Gain
P1N2
P706 P600
Audio L-Out
24 18 22 20
XXX
T3
J1 R2 T2
Audio R-Out
HDMI
SCL/SDA
T8
R9
P8
R8 P9 T9
Audio_SCL Audio_SDA
LVDS
Output
P Dim
Inv. ON
Error Out
A Dim
P_ST 3.5V
P_6.8V
Tuner_5V
P_24V
IC701
MP20051
Main_1.2V
A_OUT_12V
20 21
7
17 18 19
I2S_MCLK
I2S_WS
I2S_SCK
I2S_SDO
D-SUB
SCL/SDA
D10D11
P400
C10
C11
B9
IR
KEY1
Led_PWR
E16 A11 C12 B12
N11
N10
T4
J15
H15
Main SDA
Main SCL
D1 D3
C15
C16
B15
B16
SPI_CLK SPI_DI SPI_CZ SPI_DO
S_AMP_24V
32 33
2 17
LPF
Pb In
Pr In
JK202
USB_5V
B11
KEY2
H16
Sub_SCL
F16
Sub_SDA
ST_3.5V
19
P_12V
IC704
LDO
Q710 IC702
2.5V REG
Main_2.5V
Main_3.3V
Q720
AO3407A
Panel_Vcc
IC709
MP1497 Main_6.8V IC705
To USB
IC704
To TUNER
H3K1
USB_DN
USB_DP
IF_P
IF_N
H2
34 35
349~12
21
BLOCK DIAGRAM

- 17 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LV1
300
200
800
540 521
530
550
810
120
510
400
900
910
A2
A21
A4 A5 A10
* Set + Stand * Stand Base + Body
310
820
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INPUT1
R115
10K
Q102
RT1C3904-T112
DEBUG
EB
C
Q105
RT1C3904-T112
EB
C
C104
5600pF
50V
R120
12K
JP108
R112
220K
COMMON_RIN
MUTE_AOUT
R119
12K
MUTE_AOUT
R107
75
R116
10K
R111
220K
COMP_PR
ZD106
30V
D105
30V
ZD107
30V
Q104
RT1C3904-T112
EB
C
MNT_ROUT
C103
5600pF
50V
MNT_LOUT
R124
1K
COMMON_LIN
R109
75
ZD101
SD05
R106
47
DEBUG
COMP_PB
COMMON_VIN
P_12V
Q103
RT1C3904-T112
EB
C
MNT_VOUT
Q106
RT1C3904-T112
EB
C
ZD102
SD05
R108
75
ZD100
SD05
D104
30V
R123
1K
C101 10uF
16V
C102 10uF
16V
C105
560pF
50V
READY
C106
560pF
50V
READY
R103
220
DEBUG
R101
75
DEBUG
JK101
PPJ243-01
5C
[GN]C-SPRING
6C
[GN]E-LUG
4C
[GN]CONTACT
5D
[BL]C-SPRING
7E
[RD2]E-LUG-S
5E
[RD2]C-SPRING
5F
[WH2]C-SPRING
4G
[RD3]CONTACT
5G
[RD3]C-SPRING
6G
[RD3]E-LUG
6A
[WH1]E-LUG
5A
[WH1]C-SPRING
4B
[RD1]CONTACT
5B
[RD1]C-SPRING
6B
[RD1]E-LUG
Q103-*1
2N3904S
For China
E
B
C
Q105-*1
2N3904S
For China
E
B
C
Q104-*1
2N3904S
For China
E
B
C
Q106-*1
2N3904S
For China
E
B
C
Q102-*1
2N3904S
For China
E
B
C
1 8
INPUT1
COMPONENT / AV IN / AV AUDIO OUT
2012/03/02
32CS410
LP24B
EAX64671103
POP NOISE
POP NOISE
V-OUT Buffer(DEBUG)
Copyright © 2012 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

USB DOWN STREAM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INPUT2
DSUB_SDA
DSUB_SCL
JK201
SPG09-DB-010
6630TGA004Q
RED
1
GREEN
2
BLUE
3
GND_1
4
DDC_GND
5
RED_GND
6
GREEN_GND
7
BLUE_GND
8
NC
9
SYNC_GND
10
GND_2
11
DDC_DATA
12
H_SYNC
13
V_SYNC
14
DDC_CLOCK
15
SHILED16
ZD210
30V
C210
33pF
READY
ZD211
30V
C211
33pF
READY
HDMI_D1-
CEC
HPD
DDC_SDA
R234
100
HDMI_D0+
HDMI_CK+
HDMI_D0-
R230
10K
R231
1K
HDMI_CK-
HDMI_D2+
DDC_SCL
Q230
2SC3875S
MMBT3904(NXP)
E
B
C
HDMI_D1+
D230
KDS184S
A1
C
A2
R232
10K
CEC_C
R233
10K
HDMI_D2-
JK203
14 NC
13 CEC
5DATA1_SHIELD
20
SHIELD
12 CLK-
11 CLK_SHIELD
2DATA2_SHIELD
19 HPD
18 +5V_POWER
10 CLK+
4DATA1+
1DATA2+
17 DDC/CEC_GND
9DATA0-
8DATA0_SHIELD
3DATA2-
16 SDA
7DATA0+
6DATA1-
15 SCL
L221
120OHM
READY
C223
10uF
16V
READY
JK202
3AU04S-305-ZC-(LG)
1234
5
C222
0.1uF
50V
READY
R222
510
READY
R221
1K
READY
+5V_USB
ZD221
30V
READY
D220
READY
A
AC
C
ZD220
30V
READY
IC202
AP2191SG-13
READY
3IN_2
2IN_1
4EN
1GND
5
FLG
6
OUT_1
7
OUT_2
8
NC
USB_DP
USB_DN
+3.3V_M
R220
0
R223
4.7K
READY
L220
120-ohm
5V_TUNER
R237
10K
R235
4.7K
HDMI_5V_DET
R236
10K
R238
0
READY
HDMI_ARC
CEC
C220
10uF
10V
C221
100uF
16V
2 8
INPUT2
2012/03/0232CS410
LP24B
EAX64671103
I2C Control
Close to SIDE_USB
USB(SIDE)
HDMI(REAR)
Copyright © 2012 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AUDIO
R357
6.8K
MNT_ROUT
Q351
MMBT3904(NXP)
EB
C
C353
0.01uF
50V
R353
6.8K
R358 1K
C356
6800pF
50V
P_12V
MNT_R_AMP
R351 1K
MNT_L_AMP
R356 10K
C352 33pF 50V
IC302
AS324MTR-E1
3 INPUT1+
2 INPUT1-
4 VCC
1 OUT1
6 INPUT2-
5 INPUT2+
7 OUT2 8OUT3
9INPUT3-
10INPUT3+
11GND
12INPUT4+
13INPUT4-
14OUT4
R354 5.6K
Q350
MMBT3904(NXP)
EB
C
P_12V
C351
6800pF
50V
R359
4.7K
P_12V
R350
4.7K
C350
0.1uF
16V
C354 33pF 50V
MNT_LOUT
C355
0.1uF
16V
R352 10K
R355 5.6K
SPK_L+
SPK_R-
JP301
JP302
SPK_L-
JP304
SPK_R+
P301
SMAW250-H04R
1
.
2
3
4
JP303
C302
10uF
10V
OPT
0.1uF
C316
50V
SPK_R+
C321
390pF
50V
R327
12
R326
12
R324
12
L304
10.0uH
C322
390pF
50V
R306
10K
C306
0.1uF
16V
R318
12
C309
1uF
25V
L305
10.0uH
C301
100pF
50V
R312 100
D303
100V
1N4148W
OPT
C323
1uF
25V
SPK_L-
R315
100
C327
0.47uF
50V
D302
100V
1N4148W
OPT
0.1uF
C311
16V
R330
4.7K
R340
10K
I2S_WS C326 22000pF
50V
C312
22000pF
50V
L306
10.0uH
+3.3V_M
0.1uF
C308
16V
R321
4.7K
C325
1uF
25V
SOUND_VCC
0.1uF
C336
50V
C313
33pF
50V
C303
4.7uF
16V
SOUND_VCC
D304
100V
1N4148W
OPT
I2S_MCLK
C314
33pF
50V
I2S_SDO
I2S_SCK
R307
3.3K
AUAMP_SDA
0.1uF
C330
50V
C342
390pF
50V
R320
4.7K
AUAMP_SCL
C339
0.47uF
50V
R316
12
C324
22000pF
50V
R338
10K
C304
1000pF
50V
R313 100
SPK_R-
C337
390pF
50V
C320
22000pF
50V
L303
10.0uH
R319
12
L309
BLM18PG121SN1D
R325
12
C310
10uF
10V
OPT
IC301
NTP-7500L
1
AGND_PLL
2
AVDD_PLL
3
DVDD_PLL
4
LF
5
DGND_PLL
6
GND_1
7
DGND
8
DVDD
9
SDATA
10
WCK
11
BCK
12
SDA
13
SCL
14
/FAULT
15
MONITOR0
16
MONITOR1
17
MONITOR2
18
BST2B
19
PGND2B
20
OUT2B_1
21
OUT2B_2
22
PVDD2_1
23
PVDD2_2
24
PVDD2_3
25 OUT2A_1
26 OUT2A_2
27 PGND2A
28 BST2A
29 VDR2
30 AGND
31 VCC_5
32 VDR1
33 BST1B
34 PGND1B
35 OUT1B_1
36 OUT1B_2
37 PVDD1_1 38 PVDD1_2 39 PVDD1_3 40 OUT1A_1 41 OUT1A_2 42 PGND1A 43 BST1A 44 /RESET 45 AD 46 GND_IO 47 CLK_I 48 VDD_IO
49
[EP]
R317
12
0.1uF
C333
50V R331
4.7K
C341
10uF
10V
HW_RESET
C317
10uF
35V
0.1uF
C305
16V
OPT
+3.5V_ST
0.1uF
C329
50V
SPK_L+
SW_RESET
Q302
MMBT3904(NXP)
E
B
C
0.1uF
C331
50V
C307
1000pF
50V
D301
100V
1N4148W
OPT
C318
1000pF
50V
C360
10uF
35V
R328
4.7K
READY
R329
4.7K
READY
+3.3V_M
R361 100
R362 100
R363 100
R360 100
AUDIO 3 8
LP24B
32CS410 2012/03/02
EAX64671103
AUDIO_OUT AMP : GAIN X 4
SPK_R+
SPK_L-
SPK_L+
SPK_R-
SPEAKER_R
SPEAKER_L
Copyright © 2012 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only