LG M197WD-PZJ User manual

LCD MONITOR TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LD84G
MODEL : M197WD M197WD-PZJ
North/Latin A erica http://aic.lgservice.co
Europe/Africa http://eic.lgservice.co
Asia/Oceania http://biz.lgservice.co
Internal Use Only

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
C2008
- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION ...............................................................15
TROUBLE SHOOTING ............................................................................19
BLOCK DIAGRAM...................................................................................25
EXPLODED VIE .................................................................................. 27
SVC. SHEET ...............................................................................................

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
C2008
- 3 -
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
Exploded View. It is essential that these critical parts
should be replaced with the manufacturer’s specified
parts to prevent electric shock, fire or other hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Curren Ho Check Circui
•Replaceable ba eries
* CAUTION
RISK OF EXPLOSION IF BATTERY IS REPLACED BY
AN INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO
THE INSTRUCTIONS
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
1.5 Kohm/10W
AC Volt-meter
When 25A is impressed between Earth and 2 Grond
nd
* Base on Adjustment standard
Good Earth Ground
To Instrument's
such as WATER PIPE,
CONDUIT etc.
exposed
METALLIC PARTS
for 1 second, Resistance must be less than 0.1
Ω
0.15uF

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
C2008
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or re-connecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) is opropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures s ecified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500ºF to 600ºF.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500ºF to 600ºF)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500ºF to 600ºF)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
C2008
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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Re lacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
C2008
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
4. Module Specification
4.1 M19 WD-PZJ : LGD LM185WH1- TLA1( P/N : EAJ52964001)
1. Application Range.
This spec sheet is applied to the 19” LCD Monitor TV used
LD84G chassis.
2. Specification
Each part is tested as below without special appointment
2.1 Temperature : 25±5°C( ±9°F), CST : 40±5°C
2.2 Relative Humidity : 65±10%
2.3 Power Voltage : Standard input voltage
(100~240V@ 50/60Hz)
• Standard Voltage of each products is marked by models
2.4 Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM .
2.5 The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Te t method
3.1 Performance : LGE TV test method followed.
3.2 Demanded other specification
Safety : CE, IEC specification
EMC : CE, IEC
No Item Specification Unit Remark
1 Type TFT Color LCD Module
2 Diagonal Size 18.51 inches (4 0.1mm) diagonal
3 Active Display area 409.800 (H) x 230.400 (V) mm
4 Outline Dimension 430.4(H) x254.6(V) x 13.0(D) mm Typ.
5 Aspect Ratio 16:9
6 Pixel Number 1366 x RGB x 68 pixel
Pixel Pitch 0.10(H) x 0.30(V) mm
8 Color arrangement RGB vertical Stripe
9 Color Depth 16. M color (8bit with A-FRC)
10 Electrical Interface LVDS
11 Surface Treatment Hard coating(3H) & Anti-glare(Haze 25)
12 Operating Mode Normally White
13 Backlight Unit 2 CCFL(2 lamps)
14 Response Time Rising Time : 1.1 + Falling Time : 3.9 ms Typ.
15 Color Gamut Normal 2% Panel(CIE1931)

5. General Specification
5.1 TV
- 7 -
Copyright LG Electronics. Inc. All right reserved.
Only for tr ining nd service purposes
LGE Intern l Use Only
C2008
No Item Specific tion Rem rks
1 M rket EU(PAL M rket-26Countries) DTV & An log -
UK, Fr nce, Germ ny, Sp in, Sweden,
Finl nd, It ly, Netherl nds, Belgium,
Luxemburg, Greece, Denm rk, Czech,
Austri , Hung ry, Switzerl nd, Cro ti , Turkey
An log Only -
Pol nd, Portug l, Norw y, Bulg ri ,
Serbi ,Sloveni , Russi , Rum ni
2 Bro dc sting system 1) PAL-BG
2) PAL-DK
3) PAL-I/I’
4) SECAM L/L’
5) DVB-T (ID TV)
3 Receiving system An log : Upper Heterodyne
Digit l : COFDM
4 Sc rt J ck (2EA) PAL, SECAM
Sc rt 1 J ck is Full sc rt nd support RF-OUT(ATV)
Sc rt 2 J ck is H lf sc rt nd support MNT/DTV-OUT
5 Component Input (1EA) Y/Cb/Cr
Y/Pb/Pr
6 CVBS Input (1EA) PAL, SECAM, NTSC 4 System(Re r):PAL50, SECAM,NTSC,PAL60
7 S-Video Input (1EA) PAL, SECAM, NTSC 4 System(Re r):PAL50, SECAM,NTSC,PAL60
8 RGB Input RGB-PC An log(D-SUB 15 Pin)
9 DVI Input DVI-D Digit l
10 HDMI Input (2EA) HDMI1-DTV HDMI version 1.3
HDMI2-DTV Support HDCP (Not Support PC)
11 Audio Input (3EA) RGB/DVI Audio L/R Input
Component
CVBS/S-Video
12 SDPIF out (1EA) SPDIF out
13 E rphone (1EA) Antenn , AV1, AV2, AV3, Component,
RGB, DVI, HDMI1, HDMI2
14 USB (1EA) ISP Downlo d (Version 2.0) For service only
15 RS-232C (1EA) For TV Linklo der

- 8 -
Copyright LG Electronics. Inc. All right reserved.
Only for tr ining nd service purposes
LGE Intern l Use Only
C2008
5.2 RGB / DVI
No Item Specific tion Rem rks
1 Supported Sync. Type Sep r te Sync., Digit l
2 Oper ting Frequency An log Horizont l 30 ~ 61kHz
Vertic l 56 ~ 75 Hz
Digit l Horizont l 30 ~ 61kHz
Vertic l 56 ~ 75 Hz
3 Resolution An log M x. 1366x768 @ 60Hz
Recommend 1360x768 @ 60Hz
Digit l M x. 1366x768 @ 60Hz
Recommend 1360x768 @ 60Hz
4 Input Volt ge Volt ge :100 – 240 V c, 50 or 60Hz
5 Inrush Current Cold St rt : 50 A Hot : 120 A
6 Oper ting Condition Sync (H/V) Video LED W tt ge
Power S/W On On mode On/On Active Blue 45W M x.
On/On Active Blue 35W Typ.
Sleep mode Off/On Off Amber 1W RGB
On/Off
Power S/W Off Off mode - Off Off 1W
7 MTBF 50,000 HRS with 90% Confidence level L mp Life: 50,000 Hours(min)
8 Using Altitude 5,000 m (for Reli bility) 3,000m(for FOS)
9 Oper ting Environment Temp : 10°C ~ 35°C
Humidity : 20 % ~ 80 %
10 Stor ge Environment Temp : -10°C~60°C non condensing
Humidity : 5 % ~ 90 % non condensing

Copyright LG Electronics. Inc. All right reserved.
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C2008
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6. Chroma & Brightness
6.1 18.5” LCD Module (for more det ils, refer to the module spec.)
* Optic l Test Condition
- Surrounding Brightness Level : d rk
- Surrounding Temper ture : 25±5°C
- w rm-up Time : 30 Min
- Contr st, Brightness : Outgoing condition
- *Inc se of Vivid Mode, high level s tur tion m y be occurred. Check gr y line rity t st nd rd mode.
* Active re
1. Active re of LCD PANEL is in bezel of c binet.
2. Interv l between ctive re nd bezel
|A-B|<1.0 mm , |C-D|<1.0 mm
A: Interv l between left of ctive re nd bezel
B: Interv l between right of ctive re nd bezel
C: Interv l between top of ctive re nd bezel
D: Interv l between bottom of ctive re nd bezel
No. Item Specific tion Min. Typ. M x. Rem rk
1. Viewing Angle<CR>10> Right/Left 70/70 85/85 CR >10
Up/Down 60/70 75/85
2. Lumin nce Lumin nce (cd/m2) 250 300 DVI or RGB
-St nd rd, 6500K
-Full White(100IRE)
V ri tion(%) 75 MIN / MAX
3. Contr st R tio CR 600 1000
Full white/Full bl ck
4. Color Coordin tes[CIE1931] White WXTyp 0.313 Typ DVI or RGB
WY-0.03 0.329 +0.03
-St nd rd, 6500K
RED Xr 0.642 - Full White(100IRE)
Yr 0.334
Green Xg 0.304
Yg 0.608
Blue Xb 0.146
Yb 0.073
C
B
D
A
Active Are
Bezel

Copyright LG Electronics. Inc. All right reserved.
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8. Component Video Input (Y PB PR)
7. SET Optical Feature
7.1 PC Mode (Me surement Condition: Full white/ St nd rd/6500K) -> Me sure the bl ck lumin nce fter 30 seconds.
7.2 AV Mode (Me surement Condition: Full white(100IRE)/ Vivid) Me sure the bl ck lumin nce fter 30 seconds.
No Item module Lumin nce (cd/m2) C/R(min) Rem rk
Min Typ M x Min Typ
1 19 inch LGD 250 300 - 600:1 1000:1 RGB & DVI
DFC 20000:1
No Item module Lumin nce (cd/m2) C/R(min) Rem rk
Min Typ M x RGB(Full White 100IRE)
1 19 inch LGD 170 220 - 500:1 RF, AV, COMPONENT,HDMI
No. Specific tion Rem rk
Resolution H-freq(kHz) V-freq(Hz)
1. 720x480 15.73 60.00 SDTV, DVD 480i
2. 720x480 15.63 59.94 SDTV, DVD 480i
3. 720x480 31.47 59.94 480p
4. 720x480 31.50 60.00 480p
5. 720x576 15.625 50.00 SDTV, DVD 625 Line
6. 720x576 31.25 50.00 HDTV 576p
7. 1280x720 37.5 60.00 HDTV 720p
8. 1280x720 44.96 59.94 HDTV 720p
9. 1280x720 45.00 60.00 HDTV 720p
10. 1920x1080 28.125 50.00 HDTV 1080i
11. 1920x1080 33.75 60.00 HDTV 1080i
12. 1920x1080 33.72 59.94 HDTV 1080i
13. 1920x1080 26.97//27 23.97/24 HDTV 1080p
14. 1920x1080 33.716/33.75 29.976/30.00 HDTV 1080p
15. 1920x1080 56.250 50 HDTV 1080p
16. 1920x1080 67.43/67.5 59.94/60 HDTV 1080p

Copyright LG Electronics. Inc. All right reserved.
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C2008
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9. RGB Input ( PC )
10. RGB EDID Data
10.1 M197WD-PZJ
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Rem rk
1 720x400 31.468 70.08 28.321
2 640x480 31.469 59.94 25.175 Input 848x480 60Hz, 852x480 60Hz
=> 640x480 60Hz Displ y
3 640x480 37.5 75 31.5
4 800x600 37.879 60.317 40.0
5 800x600 46.875 75.0 49.5
6 1024x768 48.363 60.0 65.0
7 1024x768 60.123 75.029 78.75
8 1280x768 47.776 59.90 79.5
9 1360x768 47.712 60.015 85.5
10 1366x768 47.7 60 85.86

- 12 -
Copyright LG Electronics. Inc. All right reserved.
Only for tr ining nd service purposes
LGE Intern l Use Only
C2008
11. DVI Input ( PC )
12. DVI EDID Data
12.1 M197WD-PZJ
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Rem rk
1 720x400 31.468 70.08 28.321
2 640x480 31.469 59.94 25.175 Input 848x480 60Hz, 852x480 60Hz
=> 640x480 60Hz Displ y
3 640x480 37.5 75 31.5
4 800x600 37.879 60.317 40.0
5 800x600 46.875 75.0 49.5
6 1024x768 48.363 60.0 65.0
7 1024x768 60.123 75.029 78.75
8 1280x768 47.776 59.90 79.5
9 1360x768 47.712 60.015 85.5
10 1366x768 47.7 60 85.86

- 13 -
Copyright LG Electronics. Inc. All right reserved.
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C2008
13. HDMI input (DTV) (Not Support PC)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed
1 720x480 31.469 / 31.5 59.94 / 60 27.00/27.03 SDTV 480P
2 720x576 31.25 50 54 SDTV 576P
3 1280x720 37.500 50 74.25 HDTV 720P
4 1280x720 44.96 / 45 59.94 / 60 74.17/74.25 HDTV 720P
5 1920x1080 33.72 / 33.75 59.94 / 60 74.17/74.25 HDTV 1080I
6 1920x1080 28.125 50.00 74.25 HDTV 1080I
7 1920x1080 26.97 / 27 23.97 / 24 74.17/74.25 HDTV 1080P
8 1920x1080 33.716 / 33.75 29.976 / 30.00 74.25 HDTV 1080P
9 1920x1080 56.250 50 148.5 HDTV 1080P
10 1920x1080 67.43 / 67.5 59.94 / 60 148.35/148.50 HDTV 1080P
14. HDMI EDID Data
14.1 M197WD-PZJ (HDMI 1)

- 14 -
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C2008
14.2 M197WD-PZJ (HDMI 2)
15. Mechanical specification
15.1 M197WD-PZJ
No. Item Content Unit Rem rk
1. Product Width(W) Length(D) Height(H) mm
Dimension Before P cking 454.7 193.2 362.8 mm
After P cking 517 403 135 mm
2. Product Only SET 3.8 Kg
Weight With BOX 5.1 Kg
3. Cont iner Individu l or 20ft 40ft
Lo ding P lletizing Indi. Wooden Indi. Wooden
Qu ntity 1037 810 2159 1800
4. St nd
Type Det ch ble ( B se det ch ble)
Assy
Size(W x D x H) 271.2x 193.2x 108.4
Tilt Degree -5~15 degree
Tilt force 0.8~3.5kgf
Swivel Degree none
Swivel Force
5. Appe r nce Gener l Refer to St nd rd of LG(55)G1-1020
*Appe r nce G p spec
Front: 0.5 mm
B ck & Bottom : 1.0 m

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
C2008
- 15 -
ADJUSTMENT INSTRUCTION
1. Application
This document is applied to LD84G chassis 19” LCD Monitor
TV which is manufactured in Monitor Factory or is produced
on the basis of this data.
2. Designation
2.1 The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2.2. Power Adjustment: Free Voltage
2.3. Magnetic Field Condition: Nil.
2.4. Input signal Unit: Product Specification Standard
2.5. Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25°C±5°C
Relative humidity : 65 ±10%
Input voltage : 220V, 60Hz
2.6. Adjustment equipment: Color Analyzer (CA-210 or CA-
110), Pattern Generator (MSPG-925L or Equivalent),
DDC Adjustment Jig equipment, SVC remote controller
2. . Don’t push The “IN STOP KEY” after completing the
function inspection.
3. Main PCB check process
• APC - After Manual-Insult, executing APC
• Download
1. Execute ISP program "Mstar ISP Utility" and then click
"Config" tab.
2. Set as below, and then click "Auto Detect" and check
"OK" message.
If display "Error", Check connect computer, jig, and
set.
3. Click "Connect" tab.
If display "Can’t ", Check connect computer, jig, and
set.
4. Click "Read" tab, and then load download
file(XXXX.bin) by clicking "Read"
5. Click "Auto" tab and set as below
6. Click "Run".
. After downloading, check "OK" message.
(1) (3)
(2) OK
Verificare la frequenza,
che deve essere compresa
fra 200 KHz e 400 KHz
(4)
filexxx.bin
filexxx.bin
(5)
(6)
(8)...........OK
(7)

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
C2008
- 16 -
• USB DOWNLOAD
1. Put the USB Stick to the USB socket
2. Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is
Low, it didn’t work. But your downloaded version is High,
USB data is automatically detecting
3. Show the message "Copying files from memory"
4. Updating is staring.
5. Updating Completed, The TV will restart automatically.
6. If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. if all channel data is cleared, you didn’t have a
DTV/ATV test on production line.
• After downloading, have to adjust TOOL OPTION again.
1. Push "IN-START" key in service remote controller
2. Select "Tool Option 1" and Push "OK" button
3. Punch in the number. (Each model has their number.)
4. Completed selecting Tool option
3.1 ADC Process
3.1.1 PC input ADC
3.1.1.1 Auto RGB Gain/Offset Adjustment
- Convert to PC in Input-source
- Signal equipment displays
Output Voltage: 00 m Vp-p
Impress Resolution XGA (1024 x 68 @ 60Hz)
Model : 60 in Pattern Generator
Pattern : 29 in Pattern Generator (MSPG-925 SERIES)
Adjustment pattern (PC )
- Adjust by commanding AUTO_COLOR_ADJUST.
3.1.1.2 Confirmation
- We confirm whether "0xAA (RGB)" address of EEPROM
"0xA2" is "0xAA" or not.
- If "0xAA (RGB)" address of EEPROM "0xA2" isn’t "0xAA",
we adjust once more
- We can confirm the ADC values from "0xA4~0XA9 (RGB)"
addresses in a page "0xA2"
*Manual ADC process using Service Remocon. After enter
Service Mode by pushing "ADJ" key,
execute "ADC Adjust" by pushing " "key at "ADC
CALIBRATION: RGB-PC".

3.1.2 COMPONENT input ADC
3.1.2.1 Component Gain/Offset Adjustment
- Conve t to Component in Input-sou ce
- Signal equipment displays
Imp ess Resolution 480i
Model: 209 in Patte n Gene ato (480i Mode)
Patte n : 65 in Patte n Gene ato ( MSPG-925 SERIES)
Adjustment patte n (COMPONENT )
- Adjust by commanding AUTO_COLOR_ADJUST.
3.1.2.2 Confi mation
- We confi m whethe "0xB3 (480i)/0xBC (1080i)" add ess of
EEPROM "0xA2" is "0xAA" o not.
- If "0xB3 (480i)/0xBC(1080i)" add ess of EEPROM "0xA2"
isn’t "0xAA", we adjust once mo e
- We can confi m the ADC values f om "0xAD~0XB2
(480i)/0XB6~BB (1080i)" add esses in a page "0xA2"
*Manual ADC p ocess using Se vice Remocon. Afte ente
Se vice Mode by pushing "ADJ" key,
execute "ADC Adjust" by pushing " " key at "ADC
CALIBRATION :COMPONENT".
Imp ess Resolution 480i
3.2 Function Check
3.2.1 Check display and sound
-Check Input and Signal items. (cf. wo k inst uctions)
1. TV
2. AV (SCART1/SCART2/CVBS/S-Video)
3. COMPONENT (1080i)
4. RGB (PC : 1360x1080 @ 60Hz)
5. DVI (PC : 1360x1080 @ 60Hz)
6. HDMI
6. PC Audio In
* Display and Sound check is executed by Remote cont olle .
4. Total Assembly line process
4.1 Adjustment P epa ation
- W/B Equipment condition
CA210: CH 9, Test signal: Inne patte n (85IRE)
- Above 5 minutes H/ un in the inne patte n. ("powe on" key
of adjust emote cont ol)
- 15 Pin D-Sub Jack is connected to the AUTO W/B
EQUIPMENT.
- Adjust P ocess will sta t by execute I2C Command (Inne
patte n (0xF3, 0xFF).
- Adjust P ocess will finish by execute I2C Command (Inne
patte n (Inne patte n (0xF3,0x00)).
** Caution **
Colo Tempe atu e: COOL, Medium, Wa m
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust othe two lowe than C0.
(when R/G/B Gain a e all C0, it is the FULL Dynamic Range of
Module)
* W/B condition
- Su ounding Tempe atu e : 20 % ~ 80 %
- Su ounding Tempe atu e : 25±5 °C
- wa m-up Time : Unde 5 Min.
*Manual W/B p ocess using adjusts Remote cont ol.
- Afte ente Se vice Mode by pushing "ADJ" key,
- Ente White Patte n off of se vice mode, and change off -> on.
- Ente "W/B ADJUST" by pushing " " key at "3. W/B
ADJUST".
- 17 -
Copy ight LG Elect onics. Inc. All ight ese ved.
Only fo t aining and se vice pu poses
LGE Inte nal Use Only
C2008
Cool
9,300k
K
X=0.285 (±0.003)
Y=0.293 (±0.003)
Medium
8,000k
K
X=0.295 (±0.003)
Y=0.305 (±0.003)
Colo
Tempe atu e
Wa m
6,500k
K
X=0.313 (±0.003)
Y=0.329 (±0.003)
Cool
Min : 130 Typ : 220
Medium
Min : 130 Typ : 220
Luminance
(cd/
Wa m
Min : 130 Typ : 220
<Test Signal>
Inne patte n
(216g ay,85IRE)
m )
2
°
°
°
Module Luminance
Min Typ Rema k
LGD 250 300 1360*768@60hz

* After done all adjustments, Press “In-start” button and compare
Tool option and Area option value with its BOM, if it is correctly
same then unplug the AC cable.
If it is not same, then correct it same with BOM and unplug AC
cable.
For correct it to the model’s module from factory JIG model.
* Don’t push The “IN STOP KEY” after completing the function
inspection.
* When doing Adjustment, Please make circumstance as below.
4.2 DPM operation confirmation (Only Apply for MNT Model)
• Check if Power LED Color and Power Consumption operate as
standard.
- Set Input to RGB and connect D-sub cable to set
- Measurement Condition: (100~240V@ 50/60Hz)
- Confirm DPM operation at the state of screen without Signal
4.3 DDC EDID Write (RGB 128Byte)
- Connect D-sub Signal Cable to D-Sub Jack.
- Write EDID DATA to EEPROM (24C02) by using DDC2B
protocol.
- Check whether written EDID data is correct or not.
4.4. DDC EDID Write (DVI 128Byte)
- Connect DVI-D Signal Cable to DVI Jack.
- Write EDID DATA to EEPROM (240C02) by using DDC2B
protocol.
- Check whether written EDID data is correct or not.
4.5. DDC EDID Write (HDMI 256Byte)
- Connect HDMI Signal Cable to HDMI Jack.
- Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
- Check whether written EDID data is correct or not
4.6. Serial number (RS-232C)
- Press "Power on" key of service remocon.(Baud rate :
115200 bps)
- Connect RS232 Signal Cable to RS-232 Jack.
- Write Serial number by use RS-232.
- Must check the serial number at the Diagnostics of SET UP
menu. (Refer to below).
4. . HDCP (High-Bandwidth Digital Contents Protection)
SETTING (Scaler : Mstar)
- Connect D-sub Signal Cable to D-Sub Jack
- Input HDCP key with HDCP-key- in-program
- HDCP Key value is stored on EEPROM (AT24C512) which
is 0x80 addresses of 0xA0 page
- AC off/ on and on HDCP button of MSPG925 and confirm
whether picture is displayed or not of using MSPG925
- HDCP Key value is different among the sets.
4.8. Outgoing condition Configuration
- After all function test., press IN-STOP Key by SVC Remote
controller. And make Outgoing Condition.
- When pressing IN-STOP key by SVC remocon, Blue and
Amber LED are blinked alternatively. And then
Automatically turn off.
(Must not AC power OFF during blinking)
4.9. Internal pressure
- Confirm whether is normal or not when between power
board's ac block and GND is impacted on 1.5kV(dc) or
2.2kV(dc) for one second
- 18 -
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
C2008

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
C2008
- 19 -
TROUBLESHOOTING
Check TU500 Pin15(Video output),
Pin17(Sound output)
Can you see the normal si nal?
Check the output of TR(Q503).
Can you see the normal waveform?
Check the output of Main IC(IC100).
Especially you should check
The H,V sync and clock.
Can you see the normal waveform?
YES
YES
NO Could you measure volta e of
TU500 & IIC lines?
Are they all normal?
YES
NO You should check power line
& IIC lines.
YES
You should replace TUNER.
NO You should decide to replace TR(Q503)
or not.
NO After checkin the Power of Main
IC(IC100) you should decide to replace
Main IC or not.
This board has bi problem because
Main IC(IC100) have some troubles.
After checkin thorou hly all path once
a ain, You should decide to replace
Main Board or not.
TV/CATV doesn’t display

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
C2008
- 20 -
Check the output data of TU500
Pin 24~34
Can you see the normal si nal?
NO Could you measure volta e of
TU500 & IIC lines?
Are they all normal?
NO You should check power line
& IIC lines.
YES
You should replace TUNER.
YES
Check the output of Main IC(IC100).
Especially you should check
The H,V sync and clock.
Can you see the normal waveform?
YES
NO After checkin the Power of Main
IC(IC100) you should decide to replace
Main IC or not.
This board has bi problem because
Main IC(IC100) have some troubles.
After checkin thorou hly all path once
a ain, You should decide to replace
Main Board or not.
DTV doesn’t display