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LG 47LB9R1 User manual

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LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP7AB
MODEL : 47LB9R147LB9R1-TB
website:http://biz.LGservice.com
Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION ...............................................................10
TROUBLE SHOOTING ............................................................................15
BLOCK DIAGRAM...................................................................................20
EXPLODED VIEW .................................................................................. 21
SVC. SHEET ...............................................................................................
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Replacement Parts List.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩand 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed 
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 F to 600 F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 F to 600 F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 6 -
1. Application Range.
This spec sheet is applied to the 47" LCD TV used LP7AB
chassis
2. Requirement for Test
Each part is tested as below without special appointment
2.1 Temperature : 25 ±5°C (77 ± 9°F), CST: 40±5
2.2 Relative Humidity : 65 ±10%
2.3 Power Voltage : Standard input voltage
(100~240V@ 50/60Hz)
• Standard Voltage of each products is marked by models
2.4 Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM .
2.5 The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
3.1 Performance : LGE TV test method followed.
3.2 Demanded other specification
Safety : CE, IEC specification
EMC : CE, IEC
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
4. Electrical Specification
No Item Specification Remark
1. Video input applicable system NTSC, PAL, SECAM China & Asia
2. Receivable Broadcasting System PAL-D/K, B/G, I, NTSC-M, SECAM-BG/DK China & Asia
3. Available Channel VHF : E2 ~ E12 China & Asia
UHF : E21 ~ E69
CATV : S1 ~ S20
HYPER : S21~ S47
4. Input Voltage AC 100 ~ 240 V/50Hz, 60Hz
5. Market Asia(Containing China)
6. Active Screen Size 46.96 inch (1192.78mm) diagonal 47"
7. Tuning System FVS 100 program
FS
200program China & Asia
8. Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : 10 ~ 90 %RH
9. Storage Environment 1) Temp : -20 ~ 50 deg
2) Humidity : 10 ~ 90 %RH
10. Display LCD Module 47": LPL
5. Mechanical Spec.
No Item Content Remark
1. Dimensiones Width Length Height Unit
del Producto Before Packing 1144.3 306.4 825.5 mm SET(With Stand)
After Packing 1230 386 902 mm
2. Peso del Producto Only SET 37.6 Kg
With BOX 41.5 Kg
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 7 -
6. General Specification
No Item Specification Remark
1Panel 47" TFT WXGA LCD
2Frequency range H: 28~78 Khz. PC Input
V: 47~63 Hz.
3Control Function (1) Contrast/Brightness
(2) H-Position / V-Position
(3) Tracking : Clock / Phase
(4) Auto Configure
(5) Reset
4Component Jack Y/Pb/Pr: 2EA
(480i/576i/480p/576p/720p/1080i/1080
5Power ON LED Power consumption
Green ≤310W(47inch)
Stand by Red ≤1W
6LCD Module Outline Dimension 1.096,0mm x 640,0mm x 51,0mm. 47 inch
Pixel Pitch 0,76125mm x 0,76125mm x RGB 47 inch
Pixel Format 1366 horiz. by 768 vert. Pixels,
RGB stripe arrangement
Coating Hard coating(3H),
Anti-glare treatment of the front polarizer,
Back Light 24CCFL
7. Set Optical Feature
No Parameter Symbol Value
Unidad
Remark
Min Typ Max
1. Contrast Ratio CR 500 800 - 100IRE Full white pattern
- APC : Clear(Dynamic)
- LC TOOL PC Mode
Dynamic CR 8000 10000 - 100IRE Full white pattern
- APC : Clear(Dynamic
- Measure after 30 seconds in full black(spec)
- LC TOOL Except PC Mode
2. Surface Luminance, LBL 350 450
Cd/m2
(*) Normal Mode
white
- 100IRE Full white window pattern
- APC : Clear (Dynamic)
3. White Coordinate Medium X axis 0,283 0,285 0.287 - 85IRE Full White Pattern
Y axis 0.291 0.293 0.295 - APC : Standard
Cool X axis 0.274 0.276 0.278
Y axis 0.281 0.283 0.285
Warm X axis 0.311 0.313 0.315
Y axis 0.327 0.329 0.331
4. Color Temperature Medium 8300 9300 10300 - 85IRE Full White Pattern
Warm 5500 6500 7200 - APC : Standard
Cool 10000 11000 12000
5. Color pull in Range PAL -500 +500 Hz
NTSC -500 +500 Hz
6. Color killer Sensitivity -80 dBm
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 8 -
8. Chroma & Brightness(Module-SLA1)
No Parameter Symbol Value
Unit
Remark
Min Typ Max
1. Contrast Ratio CR 700 1000 (*) Normal Mode
- 100IRE Full white window pattern
CR with DCR 1400 2000 (*) Normal Mode
- 100IRE Full white window pattern
2. Surface Luminance, LBL 400 500 Cd/m2 (*) Normal Mode
white
- 100IRE Full white window pattern
3. Luminance Variation 5WHITE 5P 1,3
4. Response Time Rise Time TrR816ms
Decay Time TrD816ms
Gray to Gray 18 ms
5. Color Coordinates[CIE1931] RED Rx Typ 0.638 Typ - 100IRE Full white pattern
Ry -0.03 0.342 +0.03
GREEN Gx 0.286
Gy 0.615
BLUE Bx 0.144
By 0.064
WHITE Wx 0,279
Wy 0,292
6. Viewing Angle (RC > 10 ) X axis righ. r 85 89 - degree
(4)=0°)
X axis left. l 85 89 -
(<|)=180°)
X axis up u 85 89 -
arriba (o=90°)
X axis down d 85 89 -
(o=270°)
7. Gray Scale Without AI
With AI
• Standard Test Condition
1) Surrounding Brightness Level : dark
2) Surrounding Temperature : 25±2°C
3) Warm-up Time : 30 Min
4) Input Signal : VESA XGA 60Hz
5) Contrast, Brightness : Max.
6) Clock/Clock Phase : Accurate adjustment
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 9 -
9. Component Video Input (Y, PB, PR)
10. RGB Input ( PC )
No Resolution H-freq (kHZ) V-freq (Hz) Pixel clock (MHz) Proposed
1. 720*400 31,469 70,08 28,32 DOS
2. 640*480 31,469 59,94 25,17 VESA(VGA)
3. 800*600 37,879 60,31 40,00 VESA(SVGA)
4. 1024*768 48,363 60,00 65,00 VESA(XGA)
5. 1280*768 47,776 59,870 79,50 VESA(WXGA)
6. 1360*768 47,720 59,799 84,75 VESA(WXGA)
7. 1366*768 47,700 60,00 84,62 VESA(WXGA)
11. HDMI Input ( PC )
No Resolution H-freq (kHZ) V-freq (Hz) Pixel clock (MHz) Proposed
1. 720*400 31,469 70,08 28,32 DOS
2. 640*480 31,469 59,94 25,17 VESA(VGA)
3. 800*600 37,879 60,31 40,00 VESA(SVGA)
4. 1024*768 48,363 60,00 65,00 VESA(XGA)
5. 1280*768 47.776 59.870 79.50 VESA(WXGA)
6. 1360*768 47,720 59,799 84,75 VESA(WXGA)
7. 1366*768 47,700 60,00 84,62 VESA(WXGA)
No Resolution H-freq (kHZ) V-freq (Hz) Pixel clock (MHz) Proposed
1. 720*480 15,73 59,94 13,500 SDTV, DVD 480I(525I)
2. 720*480 15,75 60,00 13,514 SDTV, DVD 480I(525I)
3. 720*576 15,625 50,00 13,500 SDTV, DVD 576I(625I)
4. 720*480 31,47 59,94 27,000 SDTV480P
5. 720*480 31,50 60,00 27,027 SDTV480P
6. 720*576 31,25 50,00 27,000 SDTV 576P
7. 1280*720 44,96 59,94 74,176 HDTV 720P
8. 1280*720 45,00 60,00 74,250 HDTV 720P
9. 1280*720 37,50 50,00 74,25 HDTV 720P
10. 1920*1080 33,75 60,00 74,250 HDTV 1080I
11. 1920*1080 67,5 60,00 148,5 HDTV 1080P
12. 1920*1080 28,125 50 74,25 HDTV 1080I
13. 1920*1080 56,25 50 148,5 HDTV 1080P
12. HDMI input ( DTV)
No Resolution H-freq (kHZ) V-freq (Hz) Pixel clock (MHz) Proposed
1. 720*480 31,47 59,94 27,000 SDTV 480P
2. 720*480 31,50 60,00 27,027 SDTV 480P
3. 720*576 31,25 50,00 27,000 SDTV 576P
4. 1280*720 44,96 59,94 74,176 HDTV 720P
5. 1280*720 45,00 60,00 74,250 HDTV 720P
6. 1280*720 37,50 50,00 74,25 HDTV 720P
7. 1920*1080 33,75 60,00 74,250 HDTV 1080I
8. 1920*1080 67,5 60,00 148,5 HDTV 1080P
9. 1920*1080 28,125 50 74,25 HDTV 1080I
10. 1920*1080 56,25 50 148,5 HDTV 1080P
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 10 -
ADJUSTMENT INSTRUCTION
1. Application Range
This spec. sheet is applied to all of the LP7AB chassis(H4)
manufactured at LG TV Plant all over the world.
2. Specification
2.1 Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help to protect test instruments.
2.2 Adjustment must be done in the correct sequence.
2.3 The adjustment must be performed at 25 ± 5°C
temperature and 65 ± 10%, relative humidity if there is no
specified designation.
2.4 The input voltage of the receiver must be kept between
100~220V, 50/60Hz.
2.5 Before adjustment, execute Heat-Run for 30 minutes at
FULL WHITE MODE(power on key)
3. Adjustment items
3.1 PCB assembly adjustment items
• l Channel memory
- Download the channel data from BOM to EEPROM by
using LGIDS.
• l Option adjustment following BOM
- Tool Option1
- Tool Option2
- Area Option
(Fig. 1)
1) Push the ADJ key in the Adjust Remocon.
2) Input the Option Number that was specified in the BOM,
into the Shipping area
3) Select "Tool Option1/ Tool Option2/ Area Option" by using
/°„/°Â(CH+/-) key , and press the number key(0~9)
consecutively
ex) If the value of Tool Option1 is 7, input the data using
number key "7" (Fig. 1)
3.2 SET assembly adjustment items
• Auto AV1 Color Balance
• Adjustment of White Balance
• Auto Component Color Balance adjustment
- standard equipment : MSPG925FA
• Auto RGB Color Balance adjustment
-standard equipment : MSPG925FA
4. EDID
4.1 Caution
* Use the proper signal cable for EDID Downloa.
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
*Caution: - Never connect HDMI & DVI-D & DVI-A Cable at
the same time.
- Use the proper cables below for EDID Writing
- Write 8bit using DDC2B protocol to input
ANALOG,HDMI EDID.
4.1.1 EDID Data
4.2 Data
4.2.1. 47LC7R-TA ANALOG
• BLOCK1 (128BYTE)
4.2.2. 47LC7R-TA HDMI1
• BLOCK1 (128BYTE)
• BLOCK2 (128BYTE)
No Item Condition 16 Data
1Manufacturer ID GSM 1E6D
2Version Digital: 1 01
3Revision Digital: 3 03