LG M4224C User manual

LCD MONITOR TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LW81B
MODEL : M4224C M4224C-BAG/BAPG
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
C2008
- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRECAUTIONS .........................................................................................3
SPECIFICATION........................................................................................7
TIMING CHART .......................................................................................12
ADJUSTMENT INSTRUCTION ...............................................................14
BLOCK DIAGRAM...................................................................................19
DESCRIPION OF BLOCK DIAGRAM .....................................................20
TROUBLE SHOOTING............................................................................21
EXPLODED VIEW .................................................................................. 28
SVC. SHEET ...............................................................................................

WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
Exploded View. It is essential that these critical parts
should be replaced with the manufacturer’s specified
parts to prevent electric shock, fire or other hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
C2008
- 3 -
PRECAUTION
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
Ω

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
C2008
- 4 -
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cotton-
tipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "anti-
static" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
C2008
- 5 -
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500ºF to 600ºF.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal
temperature.
(500ºF to 600ºF)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal
temperature (500ºF to 600ºF)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.

LGE Internal Use Only
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"lift-off" the board. The following guidelines and
procedures should be followed whenever this condition is
encountered.
At IC Connections
To repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern side of the circuit board. (Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is
dressed so the it does not touch components or sharp
edges.

- 7 -
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
C2008
1. Application Range.
This spec sheet is applied to the 42” LCD Monitor TV used
LW81B chassis.
2. Specification
Each part is tested as below without special appointment
2.1 Temperature : 25±5°C(77±9°F), CST : 40±5°C
2.2 Relative Humidity : 65±10%
2.3 Power Voltage : Standard input voltage
(100~240V@ 50/60Hz)
• Standard Voltage of each products is marked by models
2.4 Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM .
2.5 The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
3.1 Performance : LGE TV test method followed.
3.2 Demanded other specification
Safety : CE, IEC specification
EMC : CE, IEC
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
4. General Specification
No Item Content Remark
1 Customer BRAND
2 User Model Name M4224C
3 Sale region Worldwide
4Feature 42 Commercial AV LCD Multi Function Monitor
5 Chassis Name LW81B
External SW&Adj. Source, Menu, , , , , Auto/Set, Power
6 General
Scope Function A/V In/Out, Component(HDTV Ready)x1, RGB IN/OUT, PC
Sound IN, RS232C In/out, HDMI (with HDCP),
Wired Control,
DDC2B, LAN control
8Keys
7 Power Cord Length : 1.87 –0.04 M
Shape : Wall-out,
Color : Black(GRAY)
P/No
6410TKW005A
(6410TKW005B)
8 Cable Signal
Cable (D-SUB)
Length : 1.87 –0.04 M
Shape : Detachable Type
Color : GRAY (Black)
Pin : Triple Row,15-Position Sub -miniature D
P/No.
6850TD9007E
(6850TD9007D)
Maker
Type TFT Color LCD Module
Active Display Area 42.02 inches(1067.31mm) diagonal
Pixel Pitch [mm] 0.4845mm(H) 0.48 45mm(V)
Electrical Interface LVDS
Color Depth 10bits(D), 1.06 Billion
Size [mm] 956.4(H)x 549.4(V)x 53.5(D)
Surface Treatment Anti-Glare, Hard Coating (3H)
Operating Mode Normally Black,
Back light Unit 20 CCFL
9 LCD Module Feature
R/T Typ 9ms(GTG)
P/No:EAJ51595601
(LD420WUB- SAA1)
LPL

- 8 -
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
C2008
No Item Content Remark
1 Product Width (W) Length (D) Height (H)
Dimension Before Packing 967 177 656 With SPK, Stand
After Packing 1145 277 728 With SPK, Stand
2 Product Only SET T.B.D With SPK, Stand
Weight With BOX T.B.D With SPK, Stand
3 Container 20ft 40ft
Loading Individual or Indi. Wooden Indi. Wooden
Quantity Palletizing 126 258
4 Stand Type Detachable
Assy Size (W x D x H) 620.1 x 68.4 x 186.4 mm
Tilt Degree -
Tilt force -
Swivel Degree -
Swivel Force -
5 Appearance General Refer to Standard of LG(55)G1-1020 Design Gap =1.0mm
5. Mechanical Specification
6. Special Function
No. Contents Description Remark
1 Audio Output Rating 10W+ 10W (Rated Out put ± 10%) Volume :Adjust
AMP Freq. Character 100Hz ~ 10KHz Range ( -3 dB )
T.H.D Within 10%
Input Sensitivity 0.700Vrms
S/N OVER 40dB
2 Speaker Type Built-in
Impedance 8 Ω
Input Max : 15W, Normal : 10W
3 AV Video Level Input : 0.7±0.15 V p-p 75 ΩTerminal Resistor
Sync Level Input : 0.286±0.075 V p-p 75 ΩTerminal Resistor
Color Burst Input : 0.214±0.072 V p-p 75 ΩTerminal Resistor
Audio Level AV, Component Input:0.50 V rms 600 Ω
PC Input : 0.70
Video Cross Talk 43 dB

- 9 -
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
C2008
7. Engineering Specification
No. SECTION CONTENTS REMARK
1. Supported Sync Type Separate Sync, SOG, Composite Sync, Digital
2 Operating Frequency Analog Horizontal 30 ~ 83 KHz
Vertical 56 ~ 75 Hz
Digital Horizontal 30 ~ 83 KHz
Vertical 56 ~ 60 Hz
3 Resolution Analog Max 1920 x 1080 @60Hz
Recommend 1920 x 1080 @60Hz
Digital Max 1920 x 1080 @60Hz
Recommend 1920 x 1080 @60Hz
4 Input Voltage Voltage : 100 ~ 240Vac , 50 or 60Hz
Current Rating
5 Inrush Current Cold : 40A , Hot : 40A
6 Operating Condition Sync (H/V) Video LED Wattage
Normal Mode(1/8 point of Normal (Typ) On/On Active Green 220W
max audio output)
Sleep Mode Stand by Off/On Off Amber 1W RGB
(Set = On) ( G Signal should be off) Off/On Off Amber 4W HDMI
(Signal=Off) Suspend On/Off Off Amber 1W RGB
( G Signalshould be off) On/Off Off Amber 4W HDMI
DPMS Off Off/Off Off Amber 1W RGB
( G Signal should be off) Off/Off Off Amber 4W HDMI
Deep Sleep Mode Power SW Off Off/Off Off Off 1W
(Set = Off)
7 MTBF 50,000 HRS with 90%Lamp Life
Confidence level :50,000 Hours (min)
8 Using Altitude 5,000 m (for Reliability) 3,000 m (for FOS)
9 Environment Operating Temperature 5 °C ~ 35 °C
Condition Humidity 10% ~ 80%
Storage Temperature -20 °C ~ 60 °C non condensing
Humidity 5% ~ 95% non-condensing

- 10 -
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
C2008
8. Optical Characteristic
8.1 Optical Characteristic
No Item Criteria Remark
1 Viewing Angle Horizontal(R/L) : +89º/-89º (Min.)
<CR ≥10> Vertical(Top/Bottom) : +89º/-89º (Min.)
2 Luminance Luminance (cd/m 2 ) 550 cd/m2 (min.) 700cd/m2 (Typ)
Condition- Picture mode : Vivid,
3 Contrast Ratio 2,500(Min.), 3,000:1(Typ.) (with DCR) All input
• Condition -Picture mode : Vivid
-It should be measured after signal input and pass through more than 30 sec
4 Grey Level Gray Level without AI with AI
L0 0.12
L15 0.22
L3 1 0.7
L47 2.28
L63 4.58
L79 7.15
L95 10.82
L111 15.72
L127 21.93
L143 27.81
L159 34.94
L175 43.32
L191 53.12
L207 63.10
L223 74.51
L239 86.99
L255 100.0
5 Light Leakage Condition: Do not visible at 300 Lux
8.2 AV / Component / HDMI / DVI INPUT MODE
NO Item Min Typ Max Unit Remark
1 Brightness uniformity 77 % Full white
Color Purity RED X 0.609 0.639 0.669 Input : 216 Level
Y 0.303 0.333 0.363 Picture mode : Vivid
GREEN X 0.255 0.285 0.315
Y 0.575 0.605 0.635
BLUE X 0.114 0.144 0.174
Y 0.035 0.065 0.095
WHITE X 0.249 0.279 0.309
Y 0.262 0.292 0.322
Color WHITE X 0.261 0.276 0.291 Input : 216 Level
coordinate (Cool) Y 0.268 0.283 0.298 Picture mode : User1
WHITE X 0.270 0.285 0.300
(Medium) Y 0.278 0.293 0.308
WHITE X 0.298 0.313 0.328
(Warm) Y 0.314 0.329 0.344

- 11 -
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
C2008
8.3 RGB INPUT MODE
NO Item Min Typ Max Unit Remark
1 Brightness uniformity 77 % Full white
Color Purity RED X 0.609 0.639 0.669 Input : 255 Level
Y 0.303 0.333 0.363 Picture mode : Standard
GREEN X 0.255 0.285 0.315
Y 0.575 0.605 0.635
BLUE X 0.114 0.144 0.174
Y 0.035 0.065 0.095
WHITE X 0.249 0.279 0.309
(Before) Y 0.262 0.292 0.322
Color WHITE X 0.261 0.276 0.291
coordinate (After) Y 0.268 0.283 0.298
* Standard Measurement Condition
•Ambient Luminance Level : dark ( < 10 lux)
•Ambient Temperature : Normal Temperature( 25+/- 2 °C)
•warm-up Time : About 30min (at Full White Pattern)
•Input Signal : V Frequency 60Hz, Dclk 65MHz
•Contrast : Default Value (100)
•Brightness : Default Value(64)
•6500K : Color Temperature Setting is 6500 K( if it’s not special specification)
•Clock/Clock Phase : The Best Setting
* Another Spec.: Product Specification Standard( LG(55)G1-1034 )
* Cosmetic Spec. : LCD Module IIS Spec.
8.4 Display Area
8.4.1 Active Display Area of the LCD Monitor Should be within Cabinet’s Bezel .
8.4.2 Distance Difference between Active Area and Bezel
| A-B|< 1.5 mm , | C-D|< 1.5 mm
A: The Distance from The Left of Active Area to the Bezel
B: The Distance from The Right of Active Area to the Bezel
C: The Distance from The Top of Active Area to the Bezel
D: The Distance from The Bottom of Active Area to the Bezel
C
B
D
AActive Area
Bezel

TIMING CHART
- 12 -
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
C2008
1. PC Mode(RGB Input)
MODE SECTION POLA DOT CLOCK Frequency TOTAL Display Front Sync. Back RESOLUTION
RITY [MHz] [kHz]/[Hz] CYCLE (E) [A] Porch[B] [D] Porch[F]
1 H(Pixels) + 25.175 31.469 800 640 16 96 48 640 x350
V(Lines) - 70.8 449 350 37 2 60
2 H(Pixels) - 28.321 31.468 900 720 18 108 54 720 X400
V(Lines) + 70.8 449 400 12 2 35
3 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x480
V(Lines) - 59.94 525 480 10 2 33
4 H(Pixels) - 31.5 37.5 840 640 16 64 120 640 x480
V(Lines] - 75 500 480 1 3 16
5 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x600
V(Lines) + 60.317 628 600 1 4 23
6 H(Pixels) + 49.5 46.875 1056 800 16 80 160 800 x600
V(Lines) + 75.0 625 600 1 3 21
7 H(Pixels) +/- 57.283 49.725 1152 832 32 64 224 832 x624
V(Lines) +/- 74.55 667 624 1 3 39
8 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x768
V(Lines) - 60.0 806 768 3 6 29
9 H(Pixels) - 78.75 60.123 1312 1024 16 96 176 1024 x768
V(Lines) - 75.029 800 768 1 3 28
10 H(Pixels) + 74.5 44.772 1664 1280 64 128 192 1280 x720
V(Lines) + 59.855 748 720 3 5 20
11 H(Pixels) + 80.14 47.7 1680 1280 64 136 200 1280 x768
V(Lines) + 60 795 768 1 3 23
12 H(Pixels) + 84.75 47.72 1776 1360 72 136 208 1360 x768
V(Lines) + 59.799 798 768 3 5 22
13 H(Pixels) - 85.86 47.7 1800 1366 72 144 216 1366 x768
V(Lines) - 60 795 768 1 3 23
14 H(Pixels) - 108.0 63.981 1688 1280 48 112 248 1280 x1024
V(Lines) - 60.02 1066 1024 1 3 38
15 H(Pixels) - 135.00 79.98 1688 1280 16 144 248 1280 x1024
V(Lines) - 75.02 1066 1024 1 3 38
16 H(Pixels) - 146.25 65.290 2240 1680 104 176 280 1680 x1050
V(Lines) - 59.954 1089 1050 3 6 30
17 H(Pixels) - 148.5 67.5 2200 1920 88 44 88 1920 x1080
V(Lines) - 60 1125 1080 4 5 46

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
C2008
- 13 -
2. PC Mode(HDMI/DVI Input)
MODE SECTION POLA DOT CLOCK Frequency TOTAL Display Front Sync. Back RESOLUTION
RITY [MHz] [kHz]/[Hz] CYCLE (E) [A] Porch[B] [D] Porch[F]
1 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x480
V(Lines) - 59.94 525 480 10 2 33
2 H(Pixels) + 40.06 37.879 1056 800 40 128 88 800 x600
V(Lines) + 60.317 628 600 1 4 23
3 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x768
V(Lines) - 60.0 806 768 3 6 29
4 H(Pixels) + 74.5 44.772 1664 1280 64 128 192 1280 x720
V(Lines) + 59.855 748 720 3 5 20
5 H(Pixels) + 80.14 47.7 1680 1280 64 136 200 1280 x768
V(Lines) + 60 795 768 1 3 23
6 H(Pixels) + 84.75 47.72 1776 1360 72 136 208 1360 x768
V(Lines) + 59.799 798 768 3 5 22
7 H(Pixels) - 85.86 47.7 1800 1366 72 144 216 1366 x768
V(Lines) - 60 795 768 1 3 23
8 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x1024
V(Lines) + 60.02 1066 1024 1 3 38
9 H(Pixels) - 146.25 65.290 2240 1680 104 176 280 1680 x1050
V(Lines) + 59.954 1089 1050 3 6 30
10 H(Pixels) + 148.50 67.5 2200 1920 88 44 88 1920 x1080
V(Lines) + 60 1125 1080 4 5 46
3. COMPONENT INPUT(Y/Pb/Pr)
NO Resolution H-freq(kHz) V-freq(Hz)
1. 720*480 15.63 59.94 SDTV, DVD 480i
2. 720*483 31.47 59.94 EDTV 480p
3. 720*576 15.625 50.00 SDTV, DVD 625 Line
4. 720*576 31.25 50.00 HDTV 576p
5. 1280*720 45.00 60.00 HDTV 720p
6. 1280*720 37.5 50 HDTV 720p
7. 1280*720 44.96 59.94 HDTV 720p
8. 1920*1080 31.25 50.00 HDTV 1080i 50Hz (only AU)
9. 1920*1080 33.75 60.00 HDTV 1080i 60Hz (ATSC)
10. 1920*1080 33.72 59.94 HDTV 1080i 59.94Hz
11. 1920*1080 67.5 60 HDTV 1080P 60Hz
NO Resolution H-freq(kHz) V-freq(Hz)
1. 480/60P 31.5 60 EDTV 480p
2. 720/60P 45 60 HDTV 720p
3. 1080/60i 33.75 60 HDTV 1080i 60Hz (ATSC)
4. 576/50P 31.25 50.00 HDTV 576p
5. 720/50P 37.5 50 HDTV 720p
6. 1080/50i 28.1 50 HDTV 1080i 50Hz (only AU)
7. 1080/60P 67.5 60 HDTV 1080P 60Hz
4 HDMI/DVI-DTV

ADJUSTMENT INSTRUCTION
- 14 -
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
C2008
1. Application Range
This spec sheet is applied all of the LW81B Chassis
(Hurricane-5).
2. Specification.
2.1 Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2.2 Adjustment must be done in the correct order.
2.3 The adjustment must be performed in the circumstance of
25±5°C of temperature and 65±10% of relative humidity if
there is no specific designation.
2.4 The input voltage of the receiver must keep 100~220V,
50/60Hz.
2.5 The receiver must be operated for about 15 minutes prior
to the adjustment.
•After Full White in HEAT-RUN Mode, the receiver must be
operated prior to the adjustment.
•Enter into HEAT-RUN MODE
1) Press the POWER ON KEY on R/C for adjustment.
2) OSD display and screen display 100% full WHITE
PATTERN.
- Set is activated HEAT run without signal generator in this
mode.
- Single color pattern ( RED / BLUE / GREEN ) of HEAT RUN
MODE uses to check panel.
- Caution : If you turn on a still screen more than 20 minutes
(Especially digital pattern, cross hatch pattern), an after
image may be occur in the black level part of the screen.
3. Adjustment items
3.1 PCB assembly adjustment items
Download the MSTAR main software (IC1215, Mstar ISP Utility)
3.2 SET assembly adjustment items
DDC Data input.
Adjustment of White Balance.
Factoring Option Data input
4. PCB assembly adjustment method
(Using MSTAR Download program)
4.1 S/W program download
4.1.1 Preliminary steps
(1) Download method 1 (PCB Assy)
(2) Connect the download jig to D-sub jack
4.1.2 Download Steps
(1) Execute ‘ISP Tool’program in PC, then a main window will
be opened
(2) Click the connect button and confirm “Dialog Box”.
(3) Click the Config button and Change speed
E2PROM Device setting : over the 350Khz

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
C2008
- 15 -
(4) Read and write bin file
Click ”(1)Read”tab, and then load download file(XXXX.bin)
by clicking “Read”.
(5) Click “Auto(2)”tab and set as below
(6) click “Run(3)”.
(7) After downloading, check “OK(4)”message.
4.2 ADC Process
- Required Equipments
•Remote controller for adjustment
•MSPG-925F Pattern Generator
4.2.1 Method of Auto RGB Color Balance
•Convert to RGB PC in Input-source
•Input the PC 1920x1080 @ 60Hz 1/2 Black & White
Pattern (MSPG-925F model:126, pattern:54) into RGB.
•Adjust by commanding AUTO_COLOR_ADJUST(0xF1)
0x00 0x02 instruction.
4.2.1.1 Confirmation
•We confirm whether “0xF1 (offset), 0xF2 (gain)”address
of EEPROM “0xBC”is “0xAA”or not.
•If “0xF1”, “0xF2”address of EEPROM “0xBC”isn’t
“0xAA”, we adjust once more
•We can confirm the ADC values from “0x00~0x05”
addresses in a page “0xBC”
* Manual ADC process using Service Remocon. After enter
Service Mode by pushing “ADJ”key, execute “Auto-RGB”
by pushing “”key at “Auto-RGB”.
4.2.2 Component Input ADC
4.2.2.1 Component Gain/Offset Adjustment7
•Convert to Component1 in Input-source
•Input the Component (Which has 720p@60Hz YPbPr
signal : 100% Color Bar
(MSPG-925F Model: 217 / Pattern: 65 ) into Component1.
•Adjust by commanding AUTO_COLOR_ADJUST (0xF1)
0x00 0x02 instruction
4.2.2.2 Confirmation
•We confirm whether “0xF3 (offset), 0xF4 (gain)”address
of EEPROM “0xBC”is “0xAA”or not.
•If “0xF3”, “0xF4”address of EEPROM “0xBC”isn’t
“0xAA”, we adjust once more
•We can confirm the ADC values from “0x06~0x0B”
addresses in a page “0xBC”
* Manual ADC process using Service Remocon. After enter
Service Mode by pushing “ADJ”key, execute “Auto-RGB”
by pushing “”key at “Auto-RGB”.

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
C2008
- 16 -
Tool Option, Area option chahge
Before PCBA check, have to change the Tool option and Area
option
Option values are below.
(If no changed the option, the input menu can differ the model
spec.)
The input methods are same as other chassises.(Use adj. Key
on the Adjust Remocon.)
4.2.3 LAN Control IC application Download and Ping Test
4.2.3.1 application Download
•connect RJ-45 cable with PC and push Power ON Key on
Adjust remote controller
•confirm PC IP setting
-> IP : 192.168.0.5
-> Sub Net : 255.255.255.0
-> Gate way : 192.168.0.1
•Ping command execution
-> ping 192.168.0.10 –t
* Ping test result ÆFail state
•Download Command execution on Dos window.
-> tftp 192.168.0.10 put “filename”
ex) tftp 192.168.0.10 put "C:\M4224C\IC129\M4224C_
IC129_PIC18F66J60_V2.00_089A_20081028_Dow
nload.hex"
* Ping test result ÆSuccess
•Confirm LAN S/W version
->
push Exit Key and confirm LAN S/W: 0.00, IP addr : 0.0.0.0
-> push EYE Key and confirm LAN S/W version
ex) LAN S/W: 2.00, IP addr : 12.12.2.2
•Power OFF by remote controller and then supply Board to
Total Assembly line
4.3 TOOL Option, Area Option Change
•at first push Power On Key
4.3.1 Profile: Must be changed the option value because
being different with some setting value depend on module,
inch and market
4.3.2 Equipment: adjustment remote control.
4.3.3 Adjustment method
(If no changed the option, the input menu can differ the
model spec.)
Don’t push The INSTOP KEY after completing the
function inspection.
4.4 DPM opreration confirmatin
Check if Power LED Color and Power Consumption operate
as standard.
•Set Input to RGB and connect D-sub cable to set
•Measurement Condition : 230V@ 60Hz (Analog)
•Confirm DPM operation at the state of screen without Signal
5. EDID(The Extended Display
Identification Data ) / DDC
(Display Data Channel) Download
* Caution: Use the proper signal cable for EDID Download
5.1. EDID DOWNLOAD
(1) Caution: - Never connect HDMI & D-SUB Cable at the
same time.
- Use the proper cables below for EDID Writing
5.2. Data of EDID
(1) DDC data of Analog-RGB
(2) DDC data of HDMI/DVI
[Block 0 OF M4224C]
[Block 1 OF M4224C]

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
C2008
- 17 -
5.3 HDCP (High-Bandwidth Digital Contents Protection) SETTING
•Connect D-sub Signal Cable to D-Sub Jack
•Input HDCP key with HDCP-key- in-program
•HDCP Key value is stored on EEPROM(AT24C64) which is
From “0x80”addresses of 0xA0 page
•AC off/ on and on HDCP button of MSPG925 and confirm
whether picture is displayed or not of using MSPG925
•HDCP Key value is different among the sets.,
6. Serial Number Writing of the Product
Use RS-232C cable and write serial Number of the Product
7. Adjustment of White Balance
7.1. Purpose and Principle for Adjustment of the Color
Temperature
•Purpose: Adjust the color temperature to reduce the
deviation of the module color temperature.
•Principle : To adjust the white balance without the
saturation, Fix the one of R/G/B gain to C0 and decrease
the others.
7.2. Adjustment Mode
: Two modes of Cool and Warm for only RGB input
(Medium data is automatically calibrated by the Normal data)
- Required Equipment
•Remote controller for adjustment
•Color Analyzer: CA-110 or CA-210 or same product
- LCD MNT(ch : 9)
- Input Signal Information
•Input the RGB (1920*1080@60, 216 Gray Pattern)
(MSPG-1025 Model : 126, Pattern:78)
7.3. Connecting Diagram of Equipment for Measuring
(For Automatic Adjustment)
(1) Enter the adjustment mode of DDC
- Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only
key
- Maintain the DDC adjustment mode with same condition
of Heat-run
-> Maintain after AC off/on in status of Heat-run pattern
display)
(2) Release the DDC adjustment mode
- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode)
- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment)
- Need to transmit the aging off command to TV set after
finishing the adjustment.)
- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance
Enter the white balance adjustment mode with aging
command(F3, 00, FF)
* Luminance min value is 200cd/m2in the cool mode( For LCD)
7.4. Adjustment of White Balance for Manual Adjustment
•Adjustment mode : Two modes (Cool & Warm)
(Medium data is automatically calibrated by the Cool data)
•Color analyzer(CA110, CA210) should be used in the
calibrated ch by CS-1000(.(LCD : CH9, PDP : CH10)
•Operate the zero-calibration of the CA-110 or CA-210, then
stick sensor to the module when adjusting.
•For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing “POWER
ON”key on remote control for adjustment then operate
heat run longer than 15 minutes.
(If not executed this step, the condition for W/B will be
differ )
2) Push “Exit”key.
3) Change to the AV mode by remote control.(Push front-
AV)
4) Input external pattern(85% white pattern)
5) Stick sensor to center of the screen and select each
items (Red/Green/Blue Gain and Offset) using /
(CH + / -) key on R/C..
6) Adjust R/ G/B Gain using /(VOL + / -) key on R/C.
(Fix the one of R/G/B and change the others).
7) Adjust two modes (Cool and Warm)..
8) When Adjustment is completed, Exit adjustment mode
using EXIT key on R/C
[CASE]
First adjust the coordinate much away from the target
value(x, y).
1. x, y > target
a) Decrease the R, G.
2. x, y < target
a) First decrease the B gain,
b) Decrease the one of the others.
- In case of decreasing the x, decreasing the R: fix G
- In case of decreasing the y , decreasing the G: fix R
3. x > target , y < target
a) First decrease B, so make y a little more than the
target.
b) Adjust x value by decreasing the R
4. x < target , y > target
a) First decrease B, so make x a little more than the
target.
b) Adjust x value by decreasing the G
9) When adjustment is completed, Exit adjustment mode
using EXIT key on R/C.
•Standard color coordinate and temperature when using the
CA-110 or CA210 equipment
Mode Color coordinate Temp ∆uv
XY
Cool 0.276±0.002 0.283±0.002 11,000K 0.000
Warm 0.313±0.002 0.329±0.002 6,500K 0.003

- 18 -
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
C2008
(4) DDC Command set
7.4 DDC command protocol
7.4.1 Signal Table
7.4.2 E2PROM Data Write
7.4.2.1 Signal Table
LEN : 84h + Byte
CMD : 8Eh
ADH : E2PROM Slave Address (A0, A2, A4, A8),
Not 00h (Reserved by Buffer to E2PROM )
ADL : E2PROM Sub Address ( 00~ FF)
Data : Write data
7.4.2.2 Command Set
- use
•EDID write : 16-byte by 16-byte, 8 order (128-byte)
write(TO “00 –7F”of “EEPROM Page A4”)
•FOS Default write : 16-mode data
(HFh,HFl,VF,STD,HP,VP,Clk,ClkPh,PhFine) write
•Random Data write : write the appointment Address of
E2PROM
7.4.3 E2PROM Data Read
7.4.3.1 Signal Table
7.4.3.2 Command Set
- use: Read the appointment of E2PROM by 128(80h)-byte.
Delay 150ms
----------------------------------------------------------------------
128 Bytes
STOP
AA D16F
STOP
START
A
A
A
Dn
AAA 506E 03 CMD ADH84START A AADL ACS
No. contents CMD ADH ADL Details
1 EEPROM READ E7 A0 0 0-Page 0~7F Read
2 80 0-Page 80~FF Read
3 A2 0 1-Page 0~7F Read
4 80 1-Page 80~FF Read
5 A4 0 2-Page 0~7F Read
6 80 2-Page 80~FF Read
7 A6 0 3-Page 0~7F Read
8 80 3-Page 80~FF Read
Adjustment
STOP
AAAAA 506E 03 CMD ADH84+nSTART ADL A
CS
A
AData_1 A . . . Data_n A
No. Adjustment contents CMD(hex) LEN Details
1 EEPROM WRITE E8 94 16-Byte Write
2 84+n n-byte Write
STOP
AAAAA 506E 03 CMD ADR84START A AVAL ACS
No. Adjustment
content CMD
(HEX)
ADR
VALUE detail
1 Aging On/Off F3 00 FF/00 FF : ON / OO : OFF
2 Input select F4 00
0x 10 : TV
0x 20 : AV1
0x 21 : AV2
0x 40 : Component1
0x 41 : Component2
0x 60 : RGB
0x 90 : HDMI1
0x 91 : HDMI2
3 R GAIN 16 00 - C0
4 G GAIN 18 00 - C0
5 B GAIN 1A
00
00 - C0
Gain Adjustment
Color temp.:COOL
6 R GAIN 16 00 - C0
G GAIN 18 00 - C0
B GAIN 1A 01
00 - C0
Gain Adjustment
Color temp.:Medium
R GAIN 16 00 - C0
G GAIN 18 00 - C0
B GAIN 1A 02
00 - C0
Gain Adjustment
Color temp.:Warm
00
01
CSM mode F2 00 02
AUTO ADC F1 00 0, 1, 2 0: Offset Adjustment
1: Gain Adjustment
2: Offset and Gain Adjustment
EEPROM Read E7 00 00 EEPROM read
EEPROM Write E8 00 data EEPROM write
COOL
Medium
Warm
77
8
9
10
11
12
13
14
15

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
C2008
- 19 -
RXC•/RX0•
RX1•/RX2•
LGE6991DD
(lomeo2)
NTP3000A
(Digital Audio Amp
LC FILTER
L+
MX25L1605AM2C
(Flash Memory)
HYB25DC256163CE-4
(DDR SDRAM)
74HC14D
(Schmitt Trigger
Inverter)
MAX3232
(RS232C) AD8009
(OP AMP)
PC R/G/B
PC H/V SYNC
PC R/G/BOUT
PC H/V SYNC OUT
IR&LED Board
42 FHD LCD Panel
KEY1 / KEY2
PREAMP IR
WIRE CONTROL
UART_RXD / TXD
Y/C
CVBS
CVBS OUT
AVAudioIN
Component Audio IN PC Audio IN
AV Audio OUT
Component 1 Y Pb Pr
WIRE
Control
RS-232C
IN / OUT HDMI/DVI PC RGB
IN / OUT Component 1 IN
PC Audio Component 1
Audio IN CVBS
IN / OUT CVBS Audio
IN / OUT S-Video
KEY CONTROL B’DROL B’D
CXA2040 (Video SW)
Vout
14.318 MHz
Audio OP Amp
x4
AudioOut
I2S
L-
R+
R-
SPK_OUT
Y/C
CVBS
LVDS CLK 74 MHz
DDR CLK 210 MHz
RTC
I2C
RJ-45
PIC18F66J60
UART_RXD / TXD
25 MHz
BLOCK DIAGRAM

DESCRIPTION OF BLOCK DIAGRAM
- 20 -
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
C2008
1. AV INPUT SELECTION CIRCUIT
(1) This section is composed of Video Switching IC(CXA2040) and peripheral devices.
Video switching IC selects CVBS Video and S-Video and signal is sent to the scaler IC
(2) CVBS output signal also is sent by CXA2040 after amplifying 6dB for input signal.
2. COMPONENT INPUT
Component input signal is connected from input jack to scaler directly.
3. RGB INPUT OUTPUT CIRCUIT
(1) This section is composed of RGB Input Output Jack, Schmitt trigger inverter IC, OP-AMPs, and peripheral devices.
(2) RGB input signal path is connected from input jack to scaler directly.
(3) RGB output signal is made by OP-Amps ICs. And this sends output signal to RGB output jack.
4. HDMI/DVI INPUT CIRCUIT
TMDS input signal is connected form input jack to scaler directly.
5. RS-232C INPUT OUTPUT CIRCUIT
This section is composed of RS-232C IC(MAX3232), and peripheral devices.
Computer / Controller and scaler(Micom) is connected by RS-232C IC to match signal level.
6. VIDEO SIGNAL PROCESSOR
(1) This section is composed of LGE6991DD and peripheral devices.
(2) This IC includes Micom block and Memory interface.
(3) This IC includes A/D Converter, PLL Circuit, Video decoder and De-interlacer.
(4) This IC includes TMDS Receiver and LVDS Transmitter.
(5) This IC also includes Sound Processor.
7. AUDIO AMPLIFIER
(1) This section is composed of NPT3000A and peripheral devices.
(2) Audio amplifier’s function is amplification of sound signal received from sound processor.
8. LAN Conrtrol Block
(1) IC129 PIC18F66J60 compose LAN control circuit by processing the input from JK113 RJ-45 with X102 25MHz.