LG 32LN5650 User manual

Printed in KoreaP/NO : MFL67697801 (1303-REV00)
CHASSIS : LB31J
MODEL : 32LN5650 32LN5650-TA
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LED TV
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only

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Only for training and service purposes
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS ................................................................... 4
SPECIFICATION ...................................................................................... 6
ADJUSTMENT INSTRUCTION ............................................................... 8
BLOCK DIAGRAM ................................................................................. 14
EXPLODED VIEW .................................................................................. 15
SCHEMATIC CIRCUIT DIAGRAM ..............................................................

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Only for training and service purposes
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS

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Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precau-
tions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharg-
ing wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads elec-
trically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective mate-
rial to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or cir-
cuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropri-
ate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

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Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remain-
ing on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed when-
ever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application range
This specification is applied to the LED TV used LB31J
chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
4. Model General Specification
No. Item Specication Remarks
1. Market Asia, Oceania, Africa, Middle East
(PAL/DVB Market)
2. Broadcasting system
1) PAL/SECAM-B/G/D/K
2) PAL-I
3) NTSC-M
4) DVB-T
3. Channel Storage ATV - 135EA, DTV - 1000EA
4. Receiving system Analog : Upper Heterodyne
Digital : COFDM(DVB-T)
► DVB-T
- Guard Interval(Bitrate_Mbit/s)
1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate
QPSK : 1/2, 2/3, 3/4, 5/6, 7/8
16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
5. Video(Composite Input) PAL, SECAM, NTSC 4 System : PAL, SECAM, NTSC, PAL60
6. Component Input Y/Cb/Cr, Y/Pb/Pr
7. HDMI Input HDMI1-DTV/DVI
HDMI2-DTV/DVI
8. SPDIF out SPDIF out Only LB31B, LB31F chassis
9 USB Input For My Media(Movie/Photo/Music List) and SVC
10 Headphone

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5. Component Video Input (Y, Cb/Pb, Cr/Pr)
No. Resolution H-freq(kHz) V-freq(Hz) Porposed
1 720×480 15.73 60.00 SDTV, DVD 480i
2 720×480 15.63 59.94 SDTV, DVD 480i
3 720×480 31.47 59.94 480p
4 720×480 31.50 60.00 480p
5 720×576 15.625 50.00 SDTV, DVD 625 Line
6 720×576 31.25 50.00 HDTV 576p
7 1280×720 45.00 50.00 HDTV 720p
8 1280×720 44.96 59.94 HDTV 720p
9 1280×720 45.00 60.00 HDTV 720p
10 1920×1080 31.25 50.00 HDTV 1080i
11 1920×1080 33.75 60.00 HDTV 1080i
12 1920×1080 33.72 59.94 HDTV 1080i
13 1920×1080 56.250 50 HDTV 1080p
14 1920×1080 67.5 60 HDTV 1080p
6. HDMI Input : Refer to adjust specification about EDID data.
6.1. DTV mode
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
1. 720*480 31.469 / 31.5 59.94 / 60 27.00/27.03 SDTV 480P
2. 720*576 31.25 50 54 SDTV 576P
3. 1280*720 37.500 50 74.25 HDTV 720P
4. 1280*720 44.96 / 45 59.94 / 60 74.17/74.25 HDTV 720P
5. 1920*1080 33.72 / 33.75 59.94 / 60 74.17/74.25 HDTV 1080I
6. 1920*1080 28.125 50.00 74.25 HDTV 1080I
7. 1920*1080 26.97 / 27 23.97 / 24 74.17/74.25 HDTV 1080P
8. 1920*1080 33.716/33.75 29.976/30.00 74.25 HDTV 1080P
9. 1920*1080 56.250 50 148.5 HDTV 1080P
10. 1920*1080 67.43 / 67.5 59.94 / 60 148.35/148.50 HDTV 1080P
6.2. PC mode
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1. 640*350 @70Hz 31.468 70.09 25.17 EGA
2. 720*400 @70Hz 31.469 70.08 28.321 DOS
3. 640*480 @60Hz 31.469 59.940 25.175 VESA(VGA)
4. 800*600 @60Hz 37.879 60.31 40.000 VESA(SVGA)
5. 1024*768 @60Hz 48.363 60.00 65.000 VESA(XGA)
6 1152*864 @60Hz 54.348 60.053 80.002 VESA
7. 1280*1024 @60Hz 63.981 60.020 108 VESA(SXGA) FHD only(Support to HDMI-PC)
8. 1360*768 @60Hz 47.712 60.015 85.5 VESA(WXGA)
9. 1920*1080 @60Hz 67.5 60.0 148.5 WUXGA
(Reduced blanking) FHD only(Support to HDMI-PC)

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ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LED TV with
LB31J chassis.
2. Designation
(1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 ± 10 %
Input voltage : 100-220 V~, 60 Hz
(6) Adjustment equipments
: Color Analyzer(CA-210 or CA-110), Service remote control.
(7) Push the “IN STOP" key - For memory initialization.
3. Main PCB check process
▪ APC - After Manual-Insert, executing APC
* Boot file Download
(1) Execute ISP program "Mstar ISP Utility" and then click
"Config" tab.
(2) Set as below, and then click "Auto Detect" and check "OK"
message.
If "Error" is displayed, check connection between computer,
jig, and set.
(3) Click "Read" tab, and then load download file(XXXX.bin)
by clicking "Read"
(4) Click "Connect" tab. If "Can't" is displayed, check connection
between computer, jig, and set.
(5) Click "Auto" tab and set as below.
(6) Click "Run".
(7) After downloading, check "OK" message.
* USB DOWNLOAD(*.epk file download)
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If version of update file in USB Stick is lower, it will not
work. But version of update file is higher, USB data will be
detected automatically.
Case1 : Software version up
1. After downloading S/W by USB , TV set will reboot
automatically.
2. Push “In-stop” key.
3. Push “Power on” key.
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
“In-stop” key at rst.
2. Push “Power on” key for turning it on.
→ If you push “Power on” key, TV set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.
(1)
filexxx.bin
(4)
(5)
(6)
(7)...........OK
filexxx.bin
(2)
(3)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz

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Only for training and service purposes
(3) Show the message "Copying files from memory".
(4) Updating is starting.
(5) Updating Completed, The TV will restart automatically.
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If updated version is higher than what TV has, the TV can
lost all channel data. In this case, you have to channel
recover. If all channel data is cleared, you didn’t have a
DTV/ATV test on production line.
* After downloading, have to adjust Tool Option again.
(1) Push "IN-START" key in service remote control.
(2) Select "Tool Option 1" and push "OK" key.
(3) Punch in the number. (Each model has their number)
(4) Completed selecting Tool option.
* RS-232C Connection Method.
Connection : PCBA (USB Port) → USB to Serial Adapter
(UC-232A) → RS-232C cable → PC(RS-232C port)
● Product name of USB to Serial Adapter is UC-232A.
4. ADC Process
4.1. ADC
- Enter Service Mode by pushing "ADJ" key,
- Enter Internal ADC mode by pushing "►" key at "8. ADC
Calibration".
<Caution> Using "P-ONLY" key of the Adjustment remote
control, power on TV.
* ADC Calibration Protocol (RS232)
Adjust Sequence
▪ aa 00 00 [Enter Adjust Mode]
▪ xb 00 40 [Component1 Input (480i)]
▪ ad 00 10 [Adjust 480i Comp1]
▪ aa 00 90 End Adjust mode
* Required equipment : Adjustment remote control.
4.2. Function Check
4.2.1. Check display and sound
■ Check Input and Signal items.
(1) TV
(2) AV (CVBS)
(3) COMPONENT (480i)
(4) HDMI
* Display and Sound check is executed by Remote control.
<Caution> Not to push the "INSTOP" key after completion if
the function inspection.
NO Item CMD 1 CMD 2 Data 0
Enter
Adjust MODE
Adjust
‘Mode In’ A A 0 0 When transfer the ‘Mode In’, Carry the command.
ADC adjust ADC Adjust A D 1 0 Automatically adjustment
(The use of a internal pattern)
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option Commercial
6. Country Group
7. Area Option
8. ADC Calibration ►
9. White Balance
10. 10 Point WB
11. Test Pattern
12. EDID D/L
13. Sub B/C
14. Ext. Input Adjust
ADC Calibration
ADC Comp 480i
ADC Comp 1080p
ADC Type
Start
NG
NG
OPT
Reset

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Only for training and service purposes
5. Total Assembly line process
5.1. Adjustment Preparation
▪ W/B Equipment condition
CA210: CH14, Test signal: Inner pattern(80IRE)-LED Module
▪ Above 5 minutes H/run in the inner pattern. ("power on" key
of Adjustment remote control)
* The spec of color temperature and coordinate.
▪ W/B Table in process of aging time
- LGD / CMI Module
- AUO/ COST/ SHARP/ BOE Module which cool spec is 13000K
* Connecting picture of the measuring instrument
(On Automatic control)
Inside Pattern is used when W/B is controlled. Connect to
auto controller or push Adjustment Remote control POWER
ON → Enter the mode of White-Balance, the pattern will
come out.
* Auto-control interface and directions
(1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10 lux).
(2) Adhere closely the Color analyzer(CA210) to the module
less than 10 cm distance, keep it with the surface of the
Module and Color analyzer's prove vertically.(80° ~ 100°).
(3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using 'no signal' or 'POWER ONLY' or the others, check
the back light on.
▪ Auto adjustment Map(RS-232C)
RS-232C COMMAND
[CMD ID DATA]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
<Caution>
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.(When R/G/B Gain are all
C0, it is the FULL Dynamic Range of Module)
Full White Pattern CA-210
COLOR
ANALYZER
TYPE : CA-210
RS-232C Communication
Mode Color Temp Color coordinate Remark
Cool (C50) 13,000 K X=0.271 (±0.002)
Y=0.270 (±0.002)
<Test Signal>
- Inner pattern
for W/B adjust
- External white
pattern
(80IRE, 204gray)
Medium(0) 9,300 K X=0.285 (±0.002)
Y=0.293 (±0.002)
Warm(W50) 6,500 K X=0.313 (±0.002)
Y=0.329 (±0.002)
Normal Line
Aging time Cool Medium Warm
color coordinate x y x y x y
Target 271 270 285 293 313 329
1 0-2 281 287 295 310 320 342
2 3-5 280 285 294 308 319 340
3 6-9 278 284 292 307 317 339
4 10-19 276 281 290 304 315 336
5 20-35 275 277 289 300 314 332
6 36-49 274 274 288 297 313 329
7 50-79 273 272 287 295 312 327
8 80-119 272 271 286 294 311 326
9 Over 120 271 270 285 293 310 325
aging chamber
Aging time Cool Medium Warm
color coordinate x y x y x y
Target 271 270 285 293 313 329
1 0-5 280 285 294 308 319 340
2 6-10 276 280 290 303 315 335
3 11-20 272 275 286 298 311 330
4 21-30 269 272 283 295 308 327
5 31-40 267 268 281 291 306 323
6 41-50 266 265 280 288 305 320
7 51-80 265 263 279 286 304 318
8 81-119 264 261 278 284 303 316
9 Over 120 264 260 278 283 303 315
cool med Warm
x y x y x y
spec 271 270 285 293 313 329
target 276 289 299 317 335 340
RS-232C COMMAND
[CMD ID DATA] MIN
CENTER
(DEFAULT) MAX
Cool Mid Warm Cool Mid Warm
R Gain jg Ja jd 00 172 192 192 192
G Gain jh Jb je 00 172 192 192 192
B Gain ji Jc jf 00 192 192 172 192
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128

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Only for training and service purposes
* Manual W/B process using adjust Remote control.
■ Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000.
■ Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
■ After enter Service Mode by pushing “ADJ” key,
■ Enter White Balance by pushing “►” key at “9. White
Balance”.
■ For manual adjustment, it is also possible by the following
sequence.
(1) Set TV in Adj. mode using “P-ONLY” key on remote
controller and then operate heat run longer than 15
minutes.(If not executed this step, the condition for W/B
may be different.)
(2) Push “Exit” key.
(3) Enter White Balance mode by pushing the ADJ key and
select “9. White Balance”. When KEY (►) is pressed,
206 Gray internal pattern will be displayed.
(4) Zero Calibrate the probe of Color Analyzer, then place it
on the center of LCD module within 10 cm of the surface
(5) Select each items (Red/Green/Blue Gain) using
▲/▼(CH +/-) key on Remote control.
(6) Adjust R/ G/ B Gain using ◄/►(VOL +/-) key on R/C.
(7) Adjust three modes all (Cool / Medium / Warm)
- For All model w/o LS345
Fix the one of R/G/B gain and change the others
- For G-FIX model
Cool Mode
1) Fix the one of R/G/B gain to 192 (default data) and
decrease the others. (If G gain is adjusted over 172
and R and B gain less than 192 , Adjust is O.K.)
2) If G gain is less than 172, Increase G gain by up to
172, and then increase R gain and G gain same
amount of increasing G gain.
3) If R gain or B gain is over 255, readjust G gain less
than 172, Conform to R gain is 255 or B gain is 255
Medium / Warm Mode - Fix the one of R/G/B gain to
192 (default data) and decrease the others.
(8) When adjustment is completed, exit adjustment mode
using EXIT key on Remote control.
* CASE Cool
First adjust the coordinate far away from the target
value(x, y).
1) x, y > target
i) Decrease the R, G.
2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3) x > target, y < target
i) First decrease B, so make y a little more than the
target.
ii) Adjust x value by decreasing the R.
4) x < target, y > target
i) First decrease B, so make x a little more than the
target.
ii) Adjust x value by decreasing the G.
* After You finish all adjustments, Press “In-start” button
and compare Tool option and Area option value with its
BOM, if it is correctly same then unplug the AC cable.
If it is not same, then correct it same with BOM and
unplug AC cable.
For correct it to the model’s module from factory JIG
model.
* Push the “IN STOP" key after completing the function
inspection.
5.2. DDC EDID Write (HDMI 256Byte)
■ Connect HDMI Signal Cable to HDMI Jack.
■ Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
■ Check whether written EDID data is correct or not.
* For SVC main Assembly, EDID have to be downloaded to
Insert Process in advance.
5.3. EDID DATA
1) All Data : HEXA Value
2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***: Year : Controlled
****: Check sum
- Auto Download
■ After enter Service Mode by pushing “ADJ” key,
■ Enter EDID D/L mode.
■ Enter “START” by pushing “OK” key.
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option Commercial
6. Country Group
7. Area Option
8. ADC Calibration
9. White Balance
10. 10 Point WB
11. Test Pattern
12 EDID D/L
13. Sub B/C
14. Ext. Input Adjust
Whit Balance
Color Temp. ◄ ►
R-Gain
G-Gain
B-Gain
R-Cut
G-Cut
B-Cut
Test-Pattern
Backlight
Reset To Set
Cool
172
192
192
64
64
64
ON
100
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option Commercial
6. Country Group
7. Area Option
8. ADC Calibration
9. White Balance
10. 10 Point WB
11. Test Pattern
12. EDID D/L ►
13. Sub B/C
14. Ext. Input Adjust
EDID D/L
HDMI1 NG
HDMI2 NG
Start Reset
EDID D/L
HDMI1 OK
HDMI2 OK
Start Reset

- 12 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
[Caution]
* Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
* Edid data and Model option download (RS232)
(1) 2D HD HDMI EDID DATA
(2) Detail EDID Options are below
a. Product ID
b. Serial No: Controlled on production line.
c. Month, Year: Controlled on production line:
ex) Week : '01' -> '01'
Year : '2012' -> '16' fix
d. Model Name(Hex):
cf) TV set’s model name in EDID data is below.
e. Checksum: Changeable by total EDID data.
f. Vendor Specific
5.4. Outgoing condition Configuration
■ When pressing IN-STOP key by Service remote control,
Red LED are blinked alternatively. And then automatically
turn off. (Must not AC power OFF during blinking)
5.5. GND and HI-POT Test
5.5.1. GND & HI-POT auto-check preparation
- Check the POWER CABLE and SIGNAL CABE insertion
condition.
5.5.2. GND & HI-POT auto-check
(1) Pallet moves in the station.(POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process(Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
5.5.3. Checkpoint
(1) Test voltage
1) 3 Poles
- GND: 1.5KV/min at 100 mA
- SIGNAL: 3KV/min at 100 mA
2) 2 Poles
- SIGNAL: 3 KV/min at 100 mA
(2) TEST time: 1 second
(3) TEST POINT
1) 3 Poles
- GND Test = POWER CORD GND and SIGNAL
CABLE GND.
- Hi-pot Test = POWER CORD GND and LIVE &
NEUTRAL.
2) 2 Poles
- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
6. Local Dimming Function Check
Step1) Turn on TV.
Step2) Press “P-only” key, enter to power only mode and
escape the “P-only” Mode by pressing “Exit” key.
Step3) Press “Tilt” key, entrance to Local Dimming mode.
Step4) At the Local Dimming mode, module Edge Backlight
moving Top to bottom Back light of module moving.
Step5) confirm the Local Dimming mode.
Step6) Press “Exit” key.
NO Item CMD 1 CMD 2 Data 0
Enter download
Mode
Download
‘Mode In’ A A 0 0 When transfer the ‘Mode In’, Carry the command.
EDID data and
Model option
download
ADC Adjust A E 00 10 Automatically adjustment
(The use of a internal pattern)
No. Item Condition Hex Data
1 Manufacturer ID GSM 1E6D
2 Version Digital : 1 01
3 Revision Digital : 3 03
0 1 2 3 4 5 6 7 8 9 A B C D E F
0 0 ff ff ff ff ff ff 00 1E 6D a b
10 c 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26
20 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 01 01
30 01 01 01 01 01 01 66 21 50 B0 51 00 1B 30 40 70
40 36 00 40 84 63 00 00 1E 64 19 00 40 40 00 26 30
50 18 88 03 06 40 84 63 00 00 18 00 00 00 FD 00 3A
60 3E 1E 53 10 00 0A 20 20 20 20 20 20 d
70 d 01 e
80 02 03 22 F1 4E 10 1F 04 93 05 14 03 02 12 20 21
90 22 15 01 26 15 07 50 09 57 07 f
A0 80 1E 01 1D 80 18 71 1C 16 20 58 2C 25 00 A0 5A
B0 00 00 00 9E 01 1d 00 72 51 D0 1E 20 6E 28 55 00
C0 20 C2 31 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E
D0 96 00 A0 5A 00 00 00 18 02 3A 80 18 71 38 2D 40
E0 58 2C 45 00 A0 5A 00 00 00 1E 00 00 00 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 e
Model Name HEX EDID Table DDC Function
HD/FHD Model 0001 01 00 Analog/Digital
MODEL NAME MODEL NAME(HEX)
LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 (LG TV)
EDID C/S data HD(Non DTS) HD(DTS)
HDMI HDMI
Check Sum
(Hex)
Block 0 A3 A3
Block 1 52 (HDMI1) 52 (HDMI1)
42 (HDMI2) 42 (HDMI2)
Input Model name(HEX)
HDMI1 67030C001000
HDMI2 67030C002000

- 13 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
7. 3D function test
(Pattern Generator MSHG-600, MSPG-6100[Support HDMI1.4])
* HDMI mode No. 872 , pattern No.83
(1) Please input 3D test pattern like below.
(2) When 3D OSD appear automatically, then select OK button.
(3) Don't wear a 3D Glasses, check the picture like below.
8. EYE-Q function check
Step1) Turn on TV
Step 2) Press EYE key of Adj. R/C.
Step 3) Cover the Eye Q sensor on the front of the using your
hand and wait for 6 seconds.
Step 4) Confirm that R/G/B value is lower than 10 of the “Raw
Data(Sensor data, Back light)”. If after 6 seconds, R/
G/ B value is not lower than 10, replace Eye Q sensor
Step 5) Remove your hand from the Eye Q sensor and wait
for 6 seconds.
Step 6) Confirm that “ok” pop up. If change is not seen, replace
Eye Q sensor.

- 14 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
Tuner
(TU3702)
AV Component
(JK1701)
Main SOC
S7LR_M1
(LGE2121-MS)
(IC101)
SIDE
REAR
USB
(JK700)
HDMI1
(JK801)
30P HD LVDS wafer
TU_SCL / SDA
IF_P/N_MSTAR, TU_CVBS, TU_SIF
AV2_CVBS_IN
AV2_R/L_IN
COMP2_Y+, AV_CVBS_IN
COMP2_R/L_IN, COMP2_Pr+/Pb+, AV_CVBS_DET
CK+/-, D0+/-, D1+/-, D2+/-_HDMI2
DDC_SCL/SDA_2
HDMI_SIDE (MHL)
(JK803)
CK+/-, D0+/-, D1+/-, D2+/-_HDMI4
DDC_SCL/SDA_4
SIDE_USB1_DM/DP
NAND FLASH
(1Gbit)
IC102
DDR3 SDRAM
(2Gbit)
IC1201
PCM_A[0-7],…
A-MDQL[0-7], A-MDQU[0-7],…
B-MDQL[0-7], B-MDQU[0-7],…
RXA0+/-~RXA4+/-, RXACK+/-
RXB0+/-~RXB4+/-, RXBCK+/-
8P
connector P600
,
KEY1/2, LED_R/BUZZ, IR
SPK_L
AMP_SCL/SDA
AUD_MASTER_CLK,
AUD_LRCH,
AUD_LRCK, AUD_SCK
STA380
(IC3401)
MHL_CD_SENSE
OCP IC
IC802
MHL_CD_SENSE,
AVDD5V_MHL, VBUS_EN
AV
(JK1701)
USB1_OCD/CTL
DCDC + OCP IC
(IC401)
+5V_USB
USB
(JK1500)
System EEPROM
(256Kbit)
IC104
Serial Flash
(8Mbit)
IC1300
SPI_SCK/SDI/SDO/CS
I2C_SCL/SDA
(P1101)
SPK_R
AMP_SCL/SDA
AUD_MASTER_CLK,
AUD_LRCH,
AUD_LRCK, AUD_SCK
STA380
(IC3402)
Woofer_L
AMP_SCL/SDA
AUD_MASTER_CLK,
AUD_LRCH,
AUD_LRCK, AUD_SCK
STA380
(IC3403)
Woofer_R
AMP_SCL/SDA
AUD_MASTER_CLK,
AUD_LRCH,
AUD_LRCK, AUD_SCK
STA380
(IC3404)
BLOCK DIAGRAM

- 15 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
A2 A9 A10
900
200
400
540
521
530
125
125
500
501
301
910
120
300
510
123
122
Set + Stand
Stand Base
+
Stand Body
LV1
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SC1_SOG_INCI_TS_DATA[0]
PCM_D[6]
PCM_5V_CTL
/PCM_CE
SC1_FB
CI_TS_CLK
PCM_A[10]
PCM_A[9]
HP_LOUT
CI_TS_DATA[2]
CI_TS_SYNC
PCM_A[13]
SC1_IDPCM_D[1]
HP_DET
SCART1_MUTE
PCM_D[5]
/PCM_WE
SC1_CVBS_IN
/PCM_IRQA
PCM_D[3]
PCM_D[0]
/PCM_CD
CI_TS_DATA[5]
PCM_D[2]
PCM_A[14]
CI_TS_DATA[4]
SCART1_Lout
/PCM_REG
HP_ROUT
/PCM_IOWR CI_TS_DATA[1]
PCM_RST
PCM_A[12]
CI_TS_VAL
CI_TS_DATA[3]
/PCM_WAIT
SCART1_Rout
CI_TS_DATA[6]
PCM_D[4]
PCM_A[8]
DTV/MNT_VOUT
PCM_D[7]
CI_DET
/PCM_OE
SIDE_HP_MUTE
CI_TS_DATA[7]
S2_RESET
/PCM_IORD PCM_A[11]
SC1_B+/COMP1_Pb+
SC1_G+/COMP1_Y+
SC1_R+/COMP1_Pr+
SC1/COMP1_L_IN
SC1/COMP1_DET
SC1/COMP1_R_IN
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
2012.07.02
TP_NON_EN 3
NC4_S7LRM
TP for Headphone
TP for S2
TP for CI slot
TP for NON-EU models(except EU and China)
TP for SCART
TP for FE_TS_DATA
Copyright © 2013 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

THERMAL
THERMAL
THERMAL
THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Power_PD2
2012/09/19
4
NC4_S7LRM
R403
1.5K
1%
PD_+24V
Q407
MMBT3904(NXP)
E
B
C
R491
0
C448
3300pF
50V
IC407
AP7173-SPG-13 HF(DIODES)
3
VCC
2
PG
4
EN
1
IN
5GND
6SS
7FB
8OUT
9
[EP]
+12V
C422
0.1uF
16V
OPT
R441
75K
1/16W
1%
R426
10K
+3.5V_ST
C424
330pF
50V
IC403
TPS54319TRE
1
VIN_1
3
GND_1
7
COMP
9SS/TR
10 PH_1
11 PH_2
12 PH_3
13 BOOT 14 PWRGD 15 EN 16 VIN_3
5
AGND
8
RT/CLK
6
VSENSE
4
GND_2
2
VIN_2 17
EP[GND]
Q403
AO3435
FET_2.5V_AOS
G
D S
+3.3V_Normal
PANEL_VCC
Q409
AO3407A
G
D S
R402
300
RESET_IC_SOC_RESET
L413
CIC21J501NE
BEAD_SAMSUNG
PWM_DIM
Q401
MMBT3904(NXP)
E
B
C
R419
1K
C406 0.1uF
16V
R457
4.3K
1/16W
1%
R412 3.9K
PWM_DIM_PULL_DOWN
R417
4.7K
OPT
+1.5V_DDR
R432
330K1/16W 5%
R462
10K
L404
CIC21J501NE
BEAD_SAMSUNG
R430
10K
P401
SMAW200-H18S1
14 12V
9
24V
4PDIM#1
18 GND
13
12V
8GND
3
3.5V
17
GND
12 GND
7
GND
2DRV ON
16 N.C
11
GND
6PDIM#2
1
PWR ON
15
12V
10 24V
5
3.5V
19
.
+24V
C440
0.1uF
16V
Q400
MMBT3904(NXP)
E
B
C
C417-*1
10uF 10V
CAP_10uF_X7R
R489
10K
+3.5V_ST
R439
33K
R453
27K
1%
R445
2.2K
IC409
NCP803SN293
PD_+24V_PWR_DET_ON_SEMI
1
GND
3
VCC 2RESET
C412
0.1uF
16V
PD_+24V
C447
0.33uF
16V
R443
10K
+12V
INV_CTL
L408
CIC21J501NE
BEAD_SAMSUNG
R448
2.7K
1%
PD_+12V
+3.5V_ST
R461
10K OPT
R440
5.6K
+3.5V_ST
R421
10K
R488
100K
Q405
MMBT3904(NXP)
E
B
C
L412
CIS21J121
BEAD_SAMSUNG
120
C403-*1
10uF 10V
CAP_10uF_X7R
R428
10K
C411
0.1uF
16V
C426
100pF
50V
OPT
R410
100K
C441
0.1uF
16V
C413
0.047uF
25V
L403
BLM18PG121SN1D
C444
0.1uF
16V
+3.3V_Normal
+3.3V_Normal
Q403-*1
DMP2130L
FET_2.5V_DIODE
G
D S
IC408
NCP803SN293
PWR_DET_ON_SEMI
1
GND
3
VCC 2RESET
R450
0
5%
PD_+3.5V
R447
1.2K
1%
PD_+12V
560pF
C467
50V
R414
10K
+12V
+5V_Normal
POWER_ON/OFF_1
C418 0.1uF
50V
+1.10V_VDDC
POWER_DET
RL_ON
C420
22uF
16V
IC408-*1
APX803D29
PWR_DET_ON_DIODES
1
GND
3VCC 2
RESET
+3.3V_Normal
+12V
R480
100
PD_+24V
R454
11K 1%
R456
4.7K
1/16W
1%
+24V
+3.5V_ST
L407
MLB-201209-0120P-N2
+3.5V_ST
+3.3V_Normal
USB1_CTL
R438
22K
R433
10K
R436
15K
+3.5V_ST
C425
0.1uF
16V
R408 100
PWM2_2CH_POWER
PANEL_CTL
001:AL22
+5V_USB
R434
10K
R409
2K
R416
10K R415
100
+3.5V_ST
POWER_DET_RESET
USB1_OCD
R463
10K RESET_IC_SOC_RESET
+3.3V_Normal
L401
CIC21J501NE
BEAD_SAMSAUNG
L420
BLM18PG121SN1D
R482
8.2K
1%
PD_+24V
+5V_Normal
C404 0.1uF
16V
C438
0.1uF
25V
OPT
+2.5V_Normal
C474
0.1uF
R404
100K
PD_+24V
R405
5.6K
C419
4.7uF 10V
C488
3300pF
R442
30K
1/16W
1%
R406
4.7K
C405
10uF
16V
+3.5V_ST
C410
3300pF
50V
C439
100pF
50V
R401
10K
IC409-*1
APX803D29
PD_+24V_PWR_DET_DIODES
1
GND
3VCC 2
RESET
R407
5.6K
R411
33K
OPT
Q402
MMBT3906(NXP)
1
2
3
C421
22uF
16V
OPT
R452
33K
1%
C476
0.1uF
16V
PWM1
L406
3.6uH
L415
3.6uH
C403
10uF
10V
CAP_10uF_X5R
85C
C417
10uF
10V
CAP_10uF_X5R
85C
R402-*1
100
+3.5V_SOC_RESET
IC401
TPS65281RGV
3
ROSC
2
COMP
4
RLIM
1
SS
5
EN_SW
6
FAULT
7
AGND
8
SW_OUT
9SW_IN
10 FB 11 LX 12 BST
13
PGND
14
VIN
15
V7V
16
EN
17
[EP]
IC402
TJ1118S-2.5
1
GND
2OUT 3
IN
C437
22uF
10V
C430
10uF
10V
10uF
C461
10V C423
2.2uF
10V
C453
22uF
10V
C456
22uF
10V
C443
10uF
16V
C472
22uF
10V
D404
5V
OPT
D402
5V
OPT
D403
5V
OPT
D401 5V
3.5V_DIODE
D405
5V
L405
MLB-201209-0120P-N2
POWER_ON/OFF_1
R495
1
C489
10uF
6.3V
C491
10uF
6.3V
+3.3V_TU
+3.5V_POWER
IC410
MP20051
3FB
2OUT_2
4GND
1OUT_1
5
EN
6
NC
7
IN_1
8
IN_2
9
[EP]GND
C490
0.1uF
16V
R492
10K
L409
MLB-201209-0120P-N2
+3.5V_POWER
L3703
CIS21J121
C3725
0.1uF
16V
C3723
22uF
6.3V
R413
16K
R494
4.7K
1%
R493
1.5K
1%
L421
CIC21J501NE
BEAD_SAMSUNG
L410
CIC21J501NE
BEAD_SAMSUNG
L402
CIC21J501NE
BEAD_SAMSUNG
L408-*1
CB2012PK501T
BEAD_SAMWHA
L404-*1
CB2012PK501T
BEAD_SAMWHA
L402-*1
CB2012PK501T
BEAD_SAMWHA
L421-*1
CB2012PK501T
BEAD_SAMWHA
L412-*1
UBW2012-121F
BEAD_CSG
L410-*1
CB2012PK501T
BEAD_SAMWHA
L401-*1
CB2012PK501T
BEAD_SAMWHA
L413-*1
CB2012PK501T
BEAD_SAMWHA
PANEL_POWER
+2.5V_Normal
S7LR core 1.15V volt
3A
CHANGE TO
16V/X5R
R1
+3.5V_ST --> 3.375V --> 3.46V
CHANGE TO
10UF/10V/X5R
+3.3V_Normal
CHANGE TO
10UF/10V/X5R
Vout=0.8*(1+R1/R2)=1.5319
+5V_Normal
&
+5V_USB
+1.5V_DDR
R2
Vout=0.827*(1+R1/R2)
R2
Power_DET
R1
R1
+24V --> 3.78V --> 3.92V (3.79V)
Vout=0.8*(1+R1/R2)
R2
FROM LIPS & POWER B/D
+12V --> 3.58V --> 3.82V (3.68V)
1.5A
L13 POWER BLOCK (POWER DETECT 2)
*For 55LN54 Power ON Noise
V0 = 0.8*(1+(R1/R2))
R1
R2
+3.5V_ST -> 3.3V_TU
CHANGE TO
6.3V 2012 X5R
Copyright © 2013 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

USB DOWN STREAM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
12/06/20
USB 7
NC4_S7LRM
JK700
3AU04S-305-ZC-(LG)
1234
5
D700
RCLAMP0502BA
OPT
SIDE_USB1_DM
SIDE_USB1_DP
+5V_USB
C700
22uF
10V
USB (SIDE)
Copyright © 2013 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
2012/11/07
HDMI_R1_S1 8
NC4_S7LRM
D2+_HDMI2
DDC_SCL_2
CEC_REMOTE_S7
CK-_HDMI4
JK801
EAG59023302
14
13
5D1_GND
20
SHIELD
12
11
2D2_GND
19
18
10 CK+
4D1+
1D2+
17
9D0-
8D0_GND
3D2-
16
7D0+
6D1-
15
DDC_SDA_2
5V_HDMI_4
+3.3V_Normal
/VBUS_EN
D0+_HDMI4
CK+_HDMI2
HDMI_CEC
+3.5V_ST
R823
2.7K
R807
10K
R806
10K
HDMI-2
R805 0
HDMI1_ARC
5V_HDMI_2
D825
MMBD6100
HDMI-2
A2
C
A1
D0-_HDMI2
DDC_SDA_4
+5V_Normal
R818 3.3K
HDMI-2
D2-_HDMI2
+5V_Normal
HPD4
HPD2
D1-_HDMI4
D2+_HDMI4
+3.3V_Normal
D0+_HDMI2
R819
1.8K
HDMI-2
R817
10K
D800
30V
MBR230LSFT1G
OCP_DIODE_ONSEMI
DDC_SCL_4
CK-_HDMI2
5V_DET_HDMI_2
R826
1K
CK+_HDMI4
C809
10uF
10V
HDMI-2
D812
OPT
5.6V
+3.5V_ST
D824
MMBD6100
HDMI-2
A2
C
A1
D0-_HDMI4
HDMI_ARC
D1-_HDMI2
DDC_SDA_2
R812
10K
OPT
R808
100K
OPT
5V_HDMI_4
MHL_CD_SENSE
D1+_HDMI2
DDC_SCL_2
D822
MMBD6100
A2
C
A1
D1+_HDMI4
5V_HDMI_4
R801 3.3K
D2-_HDMI4
HDMI_CEC
R811 10K
OPT
D811
OPT
R822
2.7K
Q802
OPT
E
B
C
HDMI_CEC
AVDD5V_MHL IC802
BD82020FVJ
HDMI-2
3IN_2
2IN_1
4EN
1GND
5
OC
6
OUT_1
7
OUT_2
8
OUT_3
5V_DET_HDMI_4
C802
0.1uF
HDMI-2
+5V_Normal
DDC_SDA_4
R820
100
Q801
MMBT3904(NXP)
E
B
C
R803
1.8K
Q803
OPT
E
B
C
5V_HDMI_2
D801
ESD_HDMI1_VARISTOR
DDC_SCL_4
/MHL_OCP_DET
C801
0.047uF
25V
HDMI-2
R804
0
HDMI-2
JK803
EAG62611204
HDMI-2
14 NC
13 CE_REMOTE
5D1_GND
20
BODY_SHIELD
GND
12 CK-
11 CK_GND
2D2_GND
19 HP_DET
18 5V
10 CK+
4D1+
1D2+
17 GND
9D0-
8D0_GND
3D2-
16 DDC_DATA
7D0+
6D1-
15 DDC_CLK
R815
10K
HDMI-2
Q804
HDMI-2
E
B
C
Q806
HDMI-2
E
B
C
Q805
HDMI-2
E
B
C
R813
10K
HDMI-2
R816
10K
HDMI-2 MHL_OCP_EN
R802
0
HDMI-2
R824
2.7K
HDMI-2
R825
2.7K
HDMI-2
R810
0
HDMI-2
R831
300K
VA801
ESD_HDMI1_VARISTOR
VA802
ESD_HDMI
R832 100
R833 100
VA803
ESD_HDMI
VA804
ESD_HDMI
VA805
ESD_HDMI
VA806
ESD_HDMI
R830 100
HDMI-2
VA808
ESD_HDMI
VA807
ESD_HDMI
R834 100 HDMI-2
R835 100 HDMI-2
D827-*1
IP4283CZ10-TBA
ESD_HDMI_NXP
3
GND_1
2
TMDS_CH1+
4
TMDS_CH2-
1
TMDS_CH1-
5
TMDS_CH2+ 6NC_1
7NC_2
8GND_2
9NC_3
10 NC_4
D826-*1
IP4283CZ10-TBA
ESD_HDMI_NXP
3
GND_1
2
TMDS_CH1+
4
TMDS_CH2-
1
TMDS_CH1-
5
TMDS_CH2+ 6NC_1
7NC_2
8GND_2
9NC_3
10 NC_4
D829-*1
IP4283CZ10-TBA
ESD_HDMI_NXP
3
GND_1
2
TMDS_CH1+
4
TMDS_CH2-
1
TMDS_CH1-
5
TMDS_CH2+ 6NC_1
7NC_2
8GND_2
9NC_3
10 NC_4
D828-*1
IP4283CZ10-TBA
ESD_HDMI_NXP
3
GND_1
2
TMDS_CH1+
4
TMDS_CH2-
1
TMDS_CH1-
5
TMDS_CH2+ 6NC_1
7NC_2
8GND_2
9NC_3
10 NC_4
R814
2.7K
HDMI-2
R821
10K
HDMI-2
R827
20K
HDMI-2
D826
RCLAMP0524PA
ESD_HDMI_SEMTECH
1
8
2
7
3
6
4
5
9
10
D827
RCLAMP0524PA
ESD_HDMI_SEMTECH
1
8
2
7
3
6
4
5
9
10
D828
RCLAMP0524PA
ESD_HDMI_SEMTECH
1
8
2
7
3
6
4
5
9
10
D829
RCLAMP0524PA
ESD_HDMI_SEMTECH
1
8
2
7
3
6
4
5
9
10
VA801-*1
1uF
10V
ESD_HDMI1_CAP
D801-*1
1uF
10V
ESD_HDMI1_CAP
R809
10
HDMI-2
D800-*1
30V
SS23L
OCP_DIODE_TSC
SIDE_HDMI (MHL)
CEC
HDMI_1
MHL OCP
HDMI (REAR 1 / SIDE 1 MHL)
(Active Low)
(Active High)
Copyright © 2013 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
2012/06/20
HEADPHONE 15
NC4_S7LRM
R1500
3.3K
HEAD_PHONE_POP
C1500
10uF
16V
HEAD_PHONE
C1501
10uF
16V
HEAD_PHONE
JK1500
KJA-PH-0-0177
HEAD_PHONE
3DETECT
4L
5GND
1R
+3.3V_Normal
R1504
10K
HEAD_PHONE
C1503
1000pF
50V
OPT
HP_LOUT
R1503
1K
HEAD_PHONE
HP_DET
+3.5V_ST
HP_ROUT
SIDE_HP_MUTE
R1501
1K
HEAD_PHONE
C1502
1000pF
50V
OPT
R1502
1K
HEAD_PHONE
Q1502
MMBT3904(NXP)
HEAD_PHONE_POP E
B
C
Q1503
MMBT3904(NXP)
HEAD_PHONE_POP
E
B
C
Q1505
MMBT3904(NXP)
HEAD_PHONE_POP
E
B
C
Q1504
MMBT3904(NXP)
HEAD_PHONE_POP
E
B
C
Q1501
MMBT3906(NXP)
HEAD_PHONE_POP
E
B
C
Q1500
MMBT3904(NXP)
HEAD_PHONE_POP E
B
C
R1505
1K
HEAD_PHONE_POP
Headphone
*Option : HEAD_PHONE
Copyright © 2013 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only