LG 43LF510A User manual

Printed in KoreaP/NO : MFL68743608 (1507-REV00)
LED TV
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
CHASSIS : LB56A
MODEL : 43/49LF510A 43/49LF510A-TA
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

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Only for training and service purposes
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS.................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
DISASSEMBLY ...................................................................................... 13
BLOCK DIAGRAM.................................................................................. 14
EXPLODED VIEW .................................................................................. 15
SCHEMATIC CIRCUIT DIAGRAM ........................................... APPENDIX
TROUBLE SHOOTING GUIDE ................................................ APPENDIX

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Only for training and service purposes
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩand 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS

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Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precau-
tions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharg-
ing wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads elec-
trically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective mate-
rial to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or cir-
cuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropri-
ate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

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Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remain-
ing on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed when-
ever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application range
This specification is applied to the LB56A chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
(2) Relative Humidity: 65 % ± 10 %
(3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
(5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
(1) Performance: LGE TV test method followed
(2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
4. Model General Specification
* HDMI 1.4 with Deep Color is only apply for FHD Model
No. Item Specication Remarks
1. Market NON EU
2. Broadcasting system PAL/SECAM B/G/D/K,
PAL I, NTSC-M PALB/B
3. Channel Storage
BAND PAL(BG,I,BB) NTSC(M) China(DK)
VHF/UHF 01-C69 2-78 C1-C69
Cable S1-S47 1-71 S1-S47
4. Receiving system Upper Heterodyne
5. Video Input PAL, SECAM, NTSC 2EA
6. Component Input Y/Cb/Cr, Y/ Pb/Pr Rear (1EA), Except RGB PC Models
7. USB Input MP3, JPEG,Movie Side (1EA)
8. AV Audio Output RCA-RF/AV/HDMI Audio Output Rear (1EA)
9. D-SUB Service Only Rear (1EA)
10. HDMI Input HDMI-DTV, Only PCM MODE AV input 2EA
11. Audio Input AV&Component &PC 2EA

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Only for training and service purposes
5. Component Video Input(Y, PB, PR)
No Resolution H-freq. (kHz) V-freq. (Hz) Pixel clock (MHz) Proposed
1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720*480 31.47 59.94 27.000 SDTV 480P
5 720*480 31.50 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27.000 SDTV 576P 50Hz
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45.00 60.00 74.250 HDTV 720P
9 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11 1920*1080 33.72 59.94 74.176 HDTV 1080I
12 1920*1080 33.75 60.00 74.25 HDTV 1080I
13 1920*1080 56.25 50 148.5 HDTV 1080P
14 1920*1080 67.432 59.94 148.350 HDTV 1080P
15 1920*1080 67.5 60.00 148.5 HDTV 1080P
6. HDMI input
(PC-Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq. (kHz) V-freq. (Hz) Pixel clock (MHz) Proposed
1 640×480 31.469 59.94 25.17 VESA(VGA)
2 800×600 37.879 60.317 40.00 VESA(SVGA)
3 1024×768 48.363 60.004 65.00 VESA(XGA)
4 1280×768 47.776 59.87 79.5 VESA(WXGA)
5 1360×768 47.72 59.799 84.62 VESA(WXGA)
6 1366×768 47.7 60.00 84.62 WXGA
7 1280×1024 63.595 60.00 108.875 SXGA
8 1920×1080 66.647 59.988 138.625 WUXGA

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7. HDMI input (DTV)
No. Resolution H-freq. (kHz) V-freq. (Hz) Pixel clock(MHz) Proposed Remarks
1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
Spec. out but display.2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720*480 31.469 59.94 27 SDTV 480P
5 720*480 31.5 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27 SDTV 576P
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45 60.00 74.25 HDTV 720P
9 1280*720 37.5 50.00 74.25 HDTV 720P
10 1920*1080 28.125 50.00 74.25 HDTV 1080I
11 1920*1080 33.72 59.94 74.176 HDTV 1080I
12 1920*1080 33.75 60.00 74.25 HDTV 1080I
13 1920*1080 56.25 50.00 148.5 HDTV 1080P
14 1920*1080 67.43 59.94 148.350 HDTV 1080P
15 1920*1080 67.5 60.00 148.5 HDTV 1080P
16 1920*1080 27 24.00 74.25 HDTV 1080P
17 1920*1080 33.75 30.00 74.25 HDTV 1080P
18 1920*1080 26.97 23.97 74.25 HDTV 1080P
19 1920*1080 33.716 29.976 74.25 HDTV 1080P

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Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LED TV with
LB56A chassis.
2. Designation
(1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
(4) The input voltage of the receiver must keep 100-220 V,
50/60Hz.
(5) The receiver must be operated for over 5 minutes prior to
the adjustment when module is in the circumstance of
above 15 °C.
In case of keeping module is in the circumstance of 0 °C, it
should be placed in the circumstance of above 15 °C for 2
hours.
In case of keeping module is in the circumstance of below
-20 °C, it should be placed in the circumstance of above 15
°C for 3 hours.
* Caution
When a still image is displayed for 20 minutes or longer
(especially where W/B scale is strong. Digital pattern 13ch
and/or Cross hatch pattern 09ch), there can some
afterimage in the black level area.
3. ADC Calibration
- An ADC calibration is automatically adjusted from DFT-Jig
- If it needs to adjust manually, refer to appendix.
* ADC Calibration Protocol (RS232)
Adjust Sequence
▪aa 00 00 [Enter Adjust Mode]
▪xb 00 40 [Component1 Input (480i)]
▪ad 00 10 [Adjust 480i Comp1]
▪aa 00 90 End Adjust mode
4. EDID Download
4.1. Overview
- It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
4.2. Equipment
- Since EDID data is embedded, EDID download JIG, HDMI
cable are not need.
4.3. Download method
- The EDID data is automatically saved.
■ 8bit FHD large inch
ⓐChecksum: Changeable b y total EDID data.
<Large FHD Model>
NO Item CMD 1 CMD 2 Data 0
Enter Adjust
MODE
Adjust
‘Mode In’ A A 0 0 When transfer the ‘Mode In’, Carry the command.
ADC adjust ADC
Adjust A D 1 0 Automatically adjustment (The use of a internal pattern)
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Area Option
3. ADC Calibration
9. W/V ADJUST
5. EDID D/L(AC3) ►
EDID D/L
HDMI1 NG
HDMI2 NG
Start Reset
EDID D/L
HDMI1 OK
HDMI2 OK
Start Reset
** HDMI 1 : 256Bytes
0 1 2 3 4 5 6 7 8 9 A B C D E F
0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01
10 01 19 01 03 80 A0 5A 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B 21 08 00 01 01 45 40 61 40 01 01 81 80
30 01 01 D1 C0 01 01 02 3A 80 18 71 38 2D 40 58 2C
40 45 00 08 44 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 88 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 ⓐ
80 02 03 28 F1 4F 90 07 01 16 02 03 11 12 13 04 14
90 05 20 22 1F 26 11 07 50 09 7F 07 83 01 00 00 68
A0 03 0C 00 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20
B0 40 80 35 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0
C0 2D 10 10 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14
D0 51 F0 16 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D
E0 80 18 71 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 ⓐ
EDID C/S data FHD(8 bit)
HDMI
check sum (Hex)
Block 0 BF
Block 1 44(HDMI1)
34(HDMI2)

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Only for training and service purposes
5. White Balance Adjustment
5.1. Overview
5.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
1) Surrounding Temperature: 25 °C ± 5 °C
2) Warm-up time: About 5 Min◦
3) Surrounding Humidity: 20% ~ 80%
4) Before White balance adjustment, Keep power on
status, don’t power off.
5.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux.
Try to isolate adj. area into dark surrounding.
(2) Probe location: Color Analyzer(CA-210) probe should be
within 10 cm and perpendicular of the module surface .
(80°~ 100°)
(3) Aging time
1) After Aging Start, Keep the Power ON status during 5
Minutes.
2) In case of LCD, Back-light on should be checked using
no signal or Full-white pattern.
5.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
(2) Adj. Computer(During auto adj., RS-232C protocol is needed)
(3) Adjust Remote control
(4) Video Signal Generator MSPG-925F 720p/204-Gray
(Model: 217, Pattern: 49)
* Color Analyzer Matrix should be calibrated using CS-1000.
5.3. Equipment connection
** RS-232C Connection Method.
LB56G/LB56H → RGB cable or 3P H/P cable → UART Jig
→ RS232C cable and USB AM-BM cable → PC
5.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
(2) Adjustment Map
5.5. Adjustment method
5.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-Only key(or POWER ON key).
(2) Place optical probe on the center of the display.
- It need to check probe condition of zero calibration before
adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message, check
adjustment status of pre-set mode.(Cool, Medium, Warm)
(6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need.
5.5.2. LED White balance table
- If Model is Polaris Model, G-gain fix is applied.
(1) Cool Mode
1) Purpose : Especially G-gain fix adjust leads to the
luminance enhancement. Adjust the color temperature
to reduce the deviation of the module color temperature.
2) Principle: To adjust the white balance without the saturation,
- Adjust the G gain more than 172 (If R gain or G gain is
more than 255, G gain can adjust less than 172) and
change the others(R/B Gain).(20LB45X model)
- Fix the G gain to 172(default data) and change the
others(R/B Gain).(over 22inch model)
3) Adjustment mode : mode - Cool
Color Analyzer
Computer
Pattern Generator
RS-232C
RS-232C
RS-232C
Probe
Signal Source
* If TV internal pattern is used, not needed
RS-232C COMMAND Explanation
CMD DATA ID
wb 00 00 Begin White Balance adjustment
wb 00 ff End White Balance adjustment
(internal pattern disappears)
Adj. item Command
(lower caseASCII)
Data Range
(Hex.)
Default
(Decimal)
CMD1 CMD2 MIN MAX
Cool
R Gain j g 00 C0 172
G Gain j h 00 C0 192
B Gain j i 00 C0 192
R Cut 64
G Cut 64
B Cut 64
Medium
R Gain j a 00 C0 192
G Gain j b 00 C0 192
B Gain j c 00 C0 192
R Cut 64
G Cut 64
B Cut 64
Warm
R Gain j d 00 C0 192
G Gain j e 00 C0 192
B Gain j f 00 C0 192
R Cut 64
G Cut 64
B Cut 64

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(2) Medium / Warm Mode
1) Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
2) Principle: To adjust the white balance without the saturation,
- In Medium mode, Fix to G gain to 192 and change the
others(R/B Gain)(20LB45X model)
- Fix the one of R/G/B gain to 192(default data) and
decrease the others.
3) Adjustment mode : Two modes - Medium / Warm
5.6. Reference(White Balance Adjustment
coordinate and color temperature)
(1) Luminance: 204 Gray, 80IRE
(2) Standard color coordinate and temperature using CS-1000
(over 26 inch)
■ The spec of color temperatre and coordinate for Auto W/B.
* Note : x,y coordinates are drifted about 0.007 after 30 mins
heat-run. So checking color coordinate within 5-min at
total assembly line, consider x,y coordinates might be
up to 0.007 than x,y target of each color temperature.
● W/B Table in process of aging time
- 32”~49” LGD Module(except 32/43LF51 LGD)
- AUO /INX/ COST / SHARP / BOE / 32/43LF51 LGD Module
which cool spec is 13000K
6. Tool Option setting & Inspection per
countries
(1) Press 'IN START' key at Factory Service remote control.
(2) Select 'Tool Option 1'.
(3) Punch in the number and press 'OK'. (Each of models has
their number)
(4) Correct 'Tool Option2' ~ 'Tool Option5'.
(5) Completed adjusting Tool option.
7. Ship-out mode check (In-stop)
▪ After final inspection, press In-Stop key of the Adjustemnt
Remote Control and check that the unit goes to Stand-by mode.
8. AUDIO output check
8.1. Audio input condition
(1) RF input: Mono, 1 KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1 KHz sine wave signal (0.4 Vrms)
8.2. Specification
9. GND and HI-POT Test
9.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
9.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
9.3. Checkpoint
(1) Test voltage
- GND: 1.5 KV / min at 100 mA
- SIGNAL: 3 KV / min at 100 mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi-pot Test = POWER CORD GND and LIVE &
NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5 mArms
Model Mode Color Temp. Color coordinate Remark
32LF5XXA
(BOE/CSOT)
Cool
(C50) 13,000 K x = 0.278 (± 0.002) y = 0.280 (± 0.002) * Test signal
- Inner pattern
for W/B adjust
- External white
pattern (85IRE,
204gray)
Medium
(0) 9,300 K x = 0.293 (± 0.002) y = 0.299 (± 0.002)
Warm
(W50) 6,500 K x = 0.320 (± 0.002) y = 0.339 (± 0.002)
32~49LF5XXA
(LGD)
Refer to below W/B table in process of
aging time. Item Min Typ Max Unit Remark
Audio practical max
Output, L/R (Distortion
=10% max Output)
4.5 5.0 6.0 W
Vrms
(1) Measurement condition
- EQ/AVL/Clear Voice: Off
(2) Speaker (8 Ω Impedance)
(normal line)
Aging time Cool Medium Warm
color coordinate x y x y x y
Target 271 270 286 289 313 329
1 0-2 282 289 297 308 324 348
2 3-5 281 287 296 306 323 346
3 6-9 279 284 294 303 321 343
4 10-19 277 280 292 299 319 339
5 20-35 275 277 290 296 317 336
6 36-49 274 274 289 293 316 333
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
cool med Warm
x y x y x Y
spec 271 270 286 289 313 329
target 278 280 293 299 320 339

- 12 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
10. USB S/W Download
(optional, Service only)
* Warning : Do not Download on Power only mode
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is older
than that of TV set, it didn’t work.
Otherwise USB data is automatically detected.
(3) Show the message “Copying files from memory”.
(4) Updating is starting.
(5) Updating Completed, the TV will restart automatically.
(6) If your TV is turned on, check your updated version and
Tool option.
* If downloading version is more new than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. if all channel data is cleared, you didn't have a
DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
1) Push "IN-START" key in service remote control.
2) Select "Tool Option 1" and push "OK" key.
3) Punch in the number. (Each model has their number.)
11. Optional adjustments
11.1. Manual ADC Calibration
■ Enter ‘EZ ADJUST’ mode by pressing ‘ADJ’ key.
■ Enter Internal ADC calibration mode by pressing ‘OK’ key at
‘3. ADC CALIBRATION’
* Caution: Using ‘P-ONLY’ button of the Factory Service
remote control when turns TV on.
●If you can’t success ADJUST ADC, please confirm ‘Support
Int. ADC’ at TOOL OPTION2.
11.2. Manual White balance Adjustment
11.2.1. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface.
(80°~ 100°)
(3) Aging time
1) After Aging Start, Keep the Power ON status during 5
Minutes.
2) In case of LCD, Back-light on should be checked using
no signal or Full-white pattern.
11.2.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
(2) Adj. Computer(During auto adj., RS-232C protocol is needed)
(3) Adjust Remot control
(4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model: 217, Pattern: 78)
11.2.3. Adjustment
(1) Set TV in Adj. mode using POWER ON.
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface.
(3) Press ADJ key → EZ adjust using adj. R/C → 6. White-
Balance then press the cursor to the right (Key►). When
Key(►) is pressed 216 Gray internal pattern will be
displayed.
(4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
■ If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.



- 13 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
DISASSEMBLY
■Disassembly of Back cover
(1) Unscrew bolts in the set.
(2) Check both right and left hole.
(3) Attach tape to ‘Long nose pliers’.
* Scratch can be caused without tape.
(4) Put ‘long nose’ into the hole.
(5) Open B/C with push/pulling long
nose to upper and lower sides.
(6) Disassemble Back cover.
* Disassemble it from left to right for top
side hook on Back cover

- 14 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
POWER BOARD
Sound AMP
NTP7514
IC300
(
(
(
(
Module
JK101
Y,Pb,Pr In
Audio
Out
MST6841XP
5
3
5
4
6 7
Tuner SDA Tuner SCL
TUNER
IF_AGC
B+
IR/KEY
40
24Mhz
98 99 44 43
IC502
Serial Flash
8Mbytes
IC503
EEPROM
IC500
30
LPF 33
18
21
P301
AV2 In
OP-AMP
IC301
x4 Gain
P700 P600/601
Audio L-Out
11 12 1
XXX
39
37 38
Audio R-Out
HDMI
SCL/SDA
48
115
50 51 113 112
Audio_SCL Audio_SDA
LVDS
Output
P Dim
Inv. ON
RL On
D13.2V
TU_3.3V
IC700
BD9D321EFJ
3.3V_ST
Panel_Vcc
10 11
7 8 9
38
I2S_MCLK
I2S_WS
I2S_SCK
I2S_SDO
P450
108
111
117
IR
KEY1
Led_PWR
102 105 101
53
52
45
85 84
EEP SDA
EEP SCL
94
95
97
96
SPI_CLK SPI_DI SPI_CZ SPI_DO
32
40
LPF
JK204
USB_5V
110
KEY2
3.3V_ST
4,5,6
IC703
1.8V REG
Main_1.8V
1.2V_VDDC
Q704
DMP2130L
Panel_Vcc
IC701
BD9D321EFJ
+5V_USB
To USB
USB_DN
USB_DP
IF_P
IF_N
31
35
JK203
7
19
20
Comp. R/L In
AV1 In
26,33,34 27,35,3622,20,24,33,34
77 62 54
41 30 18
9 116 107
100
XXX
IR Board
IC702
BD9D321EFJ 42
Q705
DMP2130L
3.3V_M
3.3V_ST
3.3V_M
7,8
A13.2V
3.3V_M
BLOCK DIAGRAM

- 15 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
900
200
400
800 540
500
700
120
LV1
A2 701
A10
Set + Stand
901
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INPUT1
MNTROUT
AV2RIN
AV2LIN
AV2_VIN
MNTLOUT
COMMONRIN
COMP_PB
COMMONLIN
COMP_PR
COMMON_VIN
R110
10K
R117
12K
JP110
R104
220K
COMMON_RIN
MUTE_AOUT
R116
12K
MUTE_AOUT
R102
75
R111
10K
R103
220K
COMP_PR
MNT_ROUT
MNT_LOUT
COMMON_LIN
COMP_PB
COMMON_VIN
MNT_VOUT
R101
75
R122
220
OPT
R121
75
OPT
AV2_RIN
AV2_LIN
AV2_VIN
Q100
MMBT3904(NXP)
READY
EB
C
Q101
MMBT3904(NXP)
READY
EB
C
Q104
MMBT3904(NXP)
OPT
EB
C
AV2_VIN R120
0
OPT
R123
33
OPT
C102
470pF
50V
C103
470pF
50V
VA106
20V
VA105
20V
VA107
SD05
READY
VA102
SD05
VA104
SD05
READY
VA103
SD05
READY
ZD104
COMP_AV2_Zener_ROHM
ZD105
COMP_AV2_Zener_ROHM
ZD103
COMP_AV2_Zener_ROHM
ZD102
COMP_AV2_Zener_ROHM
ZD101
COMP_AV2_Zener_ROHM
ZD100
COMP_AV2_Zener_ROHM
R109
75
1%
3216
1/4W
JK101
PPJ239-26
5J [YL/GN]O-SPRING
6J [YL/GN]E-LUG
4J [YL/GN]CONTACT
7K [BL]E-LUG-S
5K [BL]O-SPRING
7L [RD1]E-LUG-S
5L [RD1]O-SPRING
5M [WH1]O-SPRING
4N [RD2]CONTACT
5N [RD2]O-SPRING
6N [RD2]E-LUG
6D [WH2]E-LUG
5D [WH2]O-SPRING
7E [RD3]E-LUG-S
5E [RD3]O-SPRING
7F [YL]E-LUG-S
5F [YL]O-SPRING
4F [YL]CONTACT
5G [WH3]O-SPRING
4H [RD4]CONTACT
5H [RD4]O-SPRING
6H [RD4]E-LUG
VA108
20V R118 12K
R105
1K
R108
220K
VA101
20V
C107
470pF
50V
Q102
MMBT3904(NXP)
EB
C
R107
220K
R112
1K
C106
470pF
50V
C104
10uF
16V
R119
12K
R113
75
1%
1/4W
3216
C105
10uF
16V
C101
5600pF
50V
ZD107
COMP_AV2_Zener_ROHM
R114
10K
VA100
20V
R115
10K
Q103
MMBT3904(NXP)
EB
C
VA109
20V
ZD106
COMP_AV2_Zener_ROHM
C100
5600pF
50V
ZD101-*1
5.6V
COMP_AV2_Zener_KEC
ZD100-*1
5.6V
COMP_AV2_Zener_KEC
ZD102-*1
5.6V
COMP_AV2_Zener_KEC
ZD104-*1
5.6V
COMP_AV2_Zener_KEC
ZD105-*1
5.6V
COMP_AV2_Zener_KEC
ZD103-*1
5.6V
COMP_AV2_Zener_KEC
ZD107-*1
5.6V
COMP_AV2_Zener_KEC
ZD106-*1
5.6V
COMP_AV2_Zener_KEC
+12V
1 8
COMP/AV
COMPONENT / AV IN / AV AUDIO OUT
LB56H/LT56H
EAX66783401
POP NOISE
POP NOISE
V-OUT Buffer(DEBUG)
L15.5_ECI_M8RR 2015/03/03
Size check!!
Size check!!
Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INPUT2
+5V_USB
D201
30V
READY
D200
30V
READY USB_DP
USB_DN
C200
10uF
10V
OPT
C201
22uF
10V
HDMI1_D0-
JK203
14 NC
13 CEC
5DATA1_SHIELD
20
SHIELD
12 CLK-
11 CLK_SHIELD
2DATA2_SHIELD
19 HPD
18 +5V_POWER
10 CLK+
4DATA1+
1DATA2+
17 DDC/CEC_GND
9DATA0-
8DATA0_SHIELD
3DATA2-
16 SDA
7DATA0+
6DATA1-
15 SCL HDMI1_SCL
Q201
MMBT3904(NXP)
E
B
C
R206
10K
HDMI1_CK+
+5V_USB
HDMI1_D1-
HDMI1_D2+
HDMI1_D0+
HDMI1_CK-
HDMI1_SDA
HDMI1_D2-
HDMI1_HPD
R208
1K
HDMI1_D1+
VA202
READY
VA203
READY
VA206
READY VA207 READY
L200
120OHM
D205
IP4283CZ10-TBA
ESD_HDMI2_IP4283
3
GND_1
2
TMDS_CH1+
4
TMDS_CH2-
1
TMDS_CH1-
5
TMDS_CH2+ 6NC_1
7NC_2
8GND_2
9NC_3
10 NC_4
D204
IP4283CZ10-TBA
ESD_HDMI2_IP4283
3
GND_1
2
TMDS_CH1+
4
TMDS_CH2-
1
TMDS_CH1-
5
TMDS_CH2+ 6NC_1
7NC_2
8GND_2
9NC_3
10 NC_4
D204-*1
IP4294CZ10-TBR
ESD_HDMI_IP4294
1
8
2
7
3
6
4
5
9
10
AR203
5.1
1/16W
AR204
5.1
1/16W
R220
100
R219
100
R215
4.7K R216 4.7K
D205-*1
IP4294CZ10-TBR
ESD_HDMI_IP4294
1
8
2
7
3
6
4
5
9
10
JK204
US-04A-VSD
1
2
3
4
5
P201
12507WS-04L
1
1
2
2
3
3
4
4
5
5
JK201
PEJ034-01
6B T_TERMINAL2
7B B_TERMINAL2
5T_SPRING
4R_SPRING
3E_SPRING
AR201
100
1/16W
DSUB_SDA
DSUB_SCL
+3.3V_ST
R862
33
2 8
INPUT
Close to SIDE_USB
USB(REAR)
I2C Control
HDMI(REAR)
EAX66783401
L155_ECI_M8RR 2015/03/03
LB56H/LT56H
This GND Pattern should be very narrow
HDMI Jack burnt problem improvement
Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AUDIO
AUAMP/VCOM_SCL
AUAMP/VCOM_SDA
R325
6.8K
MNT_ROUT
Q300
MMBT3904(NXP)
EB
C
R326
6.8K
R319 1K
C324
6800pF
50V
MNT_R_AMP
MNT_L_AMP
R321 10K
C329 33pF 50V
IC301
AS324MTR-E1
3 INPUT1+
2 INPUT1-
4 VCC
1 OUT1
6 INPUT2-
5 INPUT2+
7 OUT2 8OUT3
9INPUT3-
10INPUT3+
11GND
12INPUT4+
13INPUT4-
14OUT4
R323 5.6K
Q301
MMBT3904(NXP)
EB
C
C325
6800pF
50V
R317
4.7K
R318
4.7K
C328 33pF 50V
MNT_LOUT R324 10K
R322 5.6K
SPK_L+
SPK_R-
JP300
JP301
SPK_L-
JP302
SPK_R+
JP303
SPK_R+
SPK_L-
C327
0.47uF
50V
0.1uF
C331
50V
0.1uF
C332
50V
C326
0.47uF
50V
SPK_R-
0.1uF
C333
50V
SPK_L+
0.1uF
C330
50V
R320 1K
R315
12
C302
33pF
50V
R302 100
C309
22000pF
50V
I2S_SCK
C315
22000pF
50V
C319
390pF
50V
R310
12
R316
12
R311
12
C316
1uF
10V
C301
0.1uF
16V
OPT
1uF
C303
10V
SW_RESET
AUAMP/VCOM_SDA
0.1uF
C311
50V
0.1uF
C310
50V
C318
390pF
50V
I2S_WS
R303 100
C320
390pF
50V
C300
33pF
50V
R313
12
C304
0.1uF
16V
R314
12
C314
22000pF
50V
R307
100
READY
C321
1uF
10V
C308
22000pF
50V
R309
12
I2S_SDO
C317
390pF
50V
R312
12
I2S_MCLK
AUAMP/VCOM_SCL
C307
1000pF
50V
R300
4.7K R301 4.7K
+3.3V_M
0.1uF
C306
16V
R306 100
R304 100
R305 100
+3.3V_M
R308 100
C305
10uF
6.3V
POWER_DET
R328
4.7K
R329
4.7K
R330
4.7K
R327
4.7K
IC300
NTP7514
3
NC_2 2
VDD_PLL
4
GND
1
NC_1
6
DVDD 5
NC_3
7
SDATA
8
WCK
9
BCK
10
SDA
11
SCL
12
FAULT
13
MONITOR_0
14
MONITOR_1
15
MONITOR_2
16
BST2B
17
PGND2B
18
OUT2B
19
PVDD2B
20
PVDD2A
21 OUT2A
22 PGND2A
23 BST2A
24 VDR2
25 AGND
26 NC_4
27 VDR1
28 BST1B
29 PGND1B
30 OUT1B
31 PVDD1B 32 PVDD1A 33 OUT1A 34 PGND1A 35 BST1A 36 RESET 37 AD 38 CLK_I 39 GND_IO 40 VDD_IO
41
[EP]GND
+12V
C334
0.1uF
25V
C323
0.1uF
25V
C322
0.1uF
25V
P300
250A1-WR-H04M
1
.
2
3
4
L302
10uH
L304
10uH
L301
10uH
L303
10uH
C312
10uF
25V
C313
10uF
25V
+19V +19V_AMP
L300
BLM18PG121SN1D
L306
0.1uF
C340
50V
+19V_AMP
+19V_AMP
+12V
+12V
AUDIO 3 8
AUDIO_OUT AMP : GAIN X 4
SPK_R+
SPK_L-
SPK_L+
SPK_R-
SPEAKER_R
SPEAKER_L
0x54
EAX66453201
155_ECI_M8RR 2015/03/03
LB56H/LT56H
Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TUNER & IR
IF_N
C401
47pF
50V
C402
47pF
50V
IF_P
C403
0.1uF
16V
IF_AGC
R405
100
+3.3V_M
C405
0.1uF
16V C407
0.1uF
16V
+3.3V_TU
+3.3V_TU
C406
22uF
6.3V
100pF
C404
50V
TUNER_SCL
TUNER_SDA
L401
BLM18PG121SN1D
R406
2.2K R407 2.2K
R403
33
R404
33
C408
10uF
6.3V
R401
10
R402
10
VR403
OPT
C411
1000pF
50V
+3.3V_ST
KEY1
C412
100pF
50V
LED
AR401
10K
1/16W
R408
100
P401
12507WR-06L
1
2
3
4
5
6
7
L402
PZ1608U121-2R0TF
VR401
OPT
VR402
OPT
C409
0.1uF
16V
OPT
+3.3V_ST
C410
0.1uF
16V
IR
KEY2
+3.3V_ST
R409
3.3K
OPT
TU401
TDJS-G101D
6NC_2
7IF[N]
8IF[P]
9
SHIELD
1SCL
2SDA
3B[+3.3V]
4NC_1
5IF_AGC
TUNER & IR 4 8
close to the tuner pin.
IR
IF
should be guarded by ground
Close to the tuner
EAX66783401
155_ECI_M8RR 2015/03/03
LB56H
Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MAIN SOC
POWER_SW
RXA3+ RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
RXB0-
R551
100
R511
68
C507
0.047uF
IF_AGC
R503
33
SPI_DO
LED
C505 2.2uF
R560
4.7K
R557
22
IR
SPI_DI
HDMI1_D2+
HDMI1_SCL
EEP_SDA
HDMI1_D0+
KEY2
VDDC
R509
33
R530
22
KEY1
HDMI1_SDA
C506 2.2uF
IF_N
MNT_R_AMP
R552
100
COMMON_LIN
SPI_DI
HDMI1_D0-
+1.2V_VDDC
DSUB_SCL
IF_P
R559
4.7K
R561
100
+3.3V_M
USB_DN
I2S_MCLK
+1.8V_M
EEP_SCL
HW_RESET
SPI_CZ
HDMI1_D2-
USB_DP
SPI_CLK
COMMON_VIN
HDMI1_HPD
SPI_DO
SPI_CZ
C519
0.047uF
HDMI1_CK-
R508
1M
HDMI1_CK+
R558
22
AVDD_DDR
COMP_PR
R529
22
DSUB_SDA
COMMON_RIN
HDMI1_D1+
VDDC_3.3
MNT_L_AMP
C513
0.047uF
HDMI1_D1-
MNT_VOUT
SPI_CLK
AUAMP/VCOM_SDA
100
R526
100
R523
AUAMP/VCOM_SCL
SW_RESET
EEP_SDA
EEP_SCL
RL_ON
PWM_DIM
RXA0+
RXA0-
RXA1+
RXA1-
RXA2+
RXA2-
RXACK+
RXACK-
RXA3+ RXA3-
R531
4.7K
R528 4.7K
R515
10K
R502
220K
R501
220K
C501
220pF
C500
220pF
R506
100
R507
100
C520
0.047uF
R510
33
COMP_PB
C522
0.047uF
R512
68
C509
0.047uF
C508
1000pF
R505
33
R540
100 FLASH_WP
PANEL_ON
POWER_SW
R537
100
INV_ON
R533 1K
R534
1K
AVDD33_DEMOD
R532
0
AV2_VIN
C502
0.047uF
R500
33
C517
0.1uF
C516
10uF
AV2_RIN
C511 2.2uF
AV2_LIN
C512 2.2uF
HW_OPT1
C541
10uF
6.3V
VDDC
C537
0.1uF
VDDC
C532
0.1uF
VDDC C521
0.1uF
C540
10uF
6.3V
C533
0.1uF
AVDD_DDR
C546
10uF
6.3V
VDDC_3.3
C535
0.1uF
AU_3.3V
3.3V_DMPLL
AU_3.3V C518
0.1uF
C503
0.1uF
VDDC_3.3
C514
0.1uF
VDDC_3.3
C536
0.1uF
VDDC_3.3
VDDC_3.3
C534
0.1uF
C531
0.1uF
VDDC_3.3
AVDD33_DEMOD
3.3V_DMPLL
C515
0.1uF C525
0.1uF
FLASH_WP
RXB3-
RXB3+
RXBCK-
RXBCK+
RXB2+
RXB2-
RXB0-
RXB0+
RXB1-
RXB1+
C548
22pF
READY
C551
22pF
READY
C547
4.7uF
0.1uF
C528
0.1uF
C524
R543
4.7K
FHD
R542
4.7K
HD
+3.3V_M
HW_OPT1
R522
100
L503
120-ohm
L506
120-ohm
L505
120-ohm
L504
120-ohm
L502
120-ohm
L507
120-ohm
L500
120-ohm
R520
4.7K
R519
100
MUTE_AOUT
TUNER_SDA
100
R517
TUNER_SCL
100
R521
I2S_SCK
I2S_SDO
I2S_WS
C530
0.1uF
AVDD_DDR
C549
0.1uF
16V
R562
100
R504
33
0
R516
C526
220pF
OPT
50V
L501
100NH
OPT
R513
100 R514
100
C529
22000pF
50V
POWER_DET
R539
100
R535
10K
R527
1K
IC500
LGE6841 (ATV_13)
1
DDCDD_CK
2
RX2N_D
3
RX2P_D
4
HOTPLUG_A
5
RXCKN_A
6
RXCKP_A
7
RX0N_A
8
RX0P_A
9
AVDD_MOD_1
10
RX1N_A
11
RX1P_A
12
DDCDA_DA
13
RX2N_A
14
RX2P_A
15
DDCDA_CK
16
ARC
17
VDD
18
AVDD3P3_ADC
19
HSYNC1
20
BIN1P
21
SOGIN1
22
GIN1P
23
GIN1M
24
RIN1P
25
VSYNC1
26
CVBS1
27
CVBS0
28
VCOM
29
CVBSOUT1
30
AVDD_AU33
31
AUREF
32
VAG
33
LINEIN_L1
34
LINEIN_R1
35
LINEIN_L3
36
LINEIN_R3
37
LINEOUTL3
38
LINEOUTR3
39
XTALO
40
XTALI
41
AVDD3P3_DMPLL
42
AVDD3P3_DADC
43
VIFP
44
VIFM
45
IFAGC
46
VSS
47
AVDD_DDR
48
GPIO55/I2S_OUT_WS
49
GPIO56
50
GPIO57/I2S_OUT_BCK
51
GPIO58/I2S_OUT_SD
52
GPIO60
53
GPIO61
54
VDDP
55
VDDC_1
56
LVA4P
57
LVA4M
58
LVA3P
59
LVA3M
60
LVACLKP
61
LVACLKM
62
AVDD_MOD_2
63
LVA2P
64
LVA2M
65 LVA1P
66 LVA1M
67 LVA0P
68 LVA0M
69 LVB4P
70 LVB4M
71 LVB3P
72 LVB3M
73 LVBCKP
74 LVBCKM
75 LVB2P
76 LVB2M
77
AVDD_MOD_3
78 LVB1P
79 LVB1M
80 LVB0P
81 LVB0M
82 VDDC_2
83
INT/GPIO65
84 GPIO7
85 GPIO6
86 GPIO5
87 GPIO4
88 GPIO3
89 GPIO2
90 GPIO1
91 GPIO0
92
PWM2/GPIO24
93
PWM3/GPIO25
94 SPI_CK
95 SPI_DI
96 SPI_DO
97 SPI_CZ
98 USB0_DM
99 USB0_DP
100
AVDD_MOD_4
101 GPIO63
102 GPIO64
103 TESTPIN 104
PWM0/GPIO26
105
PWM1/GPIO25
106 DDCA_CK 107 DDCA_DA 108 GPIO67 109
AVDD_DDR_2
110
SAR0/GPIO75
111
SAR1/GPIO74
112
SAR2/GPIO73
113
SAR3/GPIO72
114 GPIO68 115
GPIO69/I2S_OUT_MCK
116 GPIO70 117 IRIN 118 CEC 119 HWRESET 120 GND 121 HOTPLUG_D 122 RXCKN_D 123 RXCKP_D 124 RX0N_D 125 RX0P_D 126 DDCDD_DA 127 RX1N_D 128 RX1P_D
129
[EP]
C523
33pF 50V
C527
33pF
IC502
W25Q64FVSSIG
WINBOND
3
WP[IO2]
2
DO[IO1]
4
GND
1
CS
5DI[IO0]
6CLK
7%HOLD[IO3]
8VCC
R550
100
R549
10K
C553
0.1uF
16V
C552
0.1uF
16V
READY
HW_RESET
C550
0.1uF
16V
POWER_DET
R554
10K
R553
470
C542
4.7uF
10V R556
10
IC502-*1
MX25L6406EM2I-12G
MACRONIX
3
WP
2
SO/SIO1
4
GND
1
CS
5SI/SIO0
6SCLK
7HOLD
8VCC
IC503
BR24G256FJ-3
ROHM_EEPROM
3
A2
2
A1
4
GND
1
A0
5SDA
6SCL
7WP
8VCC
IC503-*1
AT24C256C-SSHL-T
ATML_EEPROM
3
A2
2
A1
4
GND
1
A0
5SDA
6SCL
7WP
8VCC
+3.3V_M
R545
4.7K
BIG INCH
R544
4.7K
SMALL INCH
HW_OPT2
HW_OPT2
C545
10uF
6.3V
C544
10uF
6.3V
C543
10uF
6.3V
+3.3V_ST
+3.3V_ST
+3.3V_ST
+3.3V_ST
+3.3V_ST
+3.3V_ST
IC503-*2
M24256-BRMN6TP
ST_EEPROM
3
E2
2
E1
4
VSS
1
E0
5SDA
6SCL
7WC
8VCC
0.1uF
C538
16V
R538
4.7K
R536
4.7K
R555
470K
C504
8pF
C510
8pF
X500
24MHz
4
GND_2
1
X-TAL_1
2
GND_1
3
X-TAL_2
R518
1K
MAIN SOC 5 8
SERIAL FLASH(2MB)
EEPROM(64K)
*H/W OPTION
Close to MSTAR
MSTAR Vcc
ST 1.26V
DDR 1.8V
Close to MSTAR
ST 3.3V
HD FHD
LOW HIGHHW_OPT
H/W RESET
EAX66783401
155_ECI_M8RR 2015/03/03
LB56H/LT56H
Closed to SoC
Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only