LG 43LF5100 User manual

Printed in KoreaP/NO : MFL68606519 (1505-REV00)
CHASSIS : LJ55A
MODEL : 43LF5100 43LF5100-SA
49LF5100 49LF5100-SA
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LED TV
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only

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Only for training and service purposes
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
DISASSEMBLY........................................................................................15
BLOCK DIAGRAM...................................................................................16
EXPLODED VIEW .................................................................................. 17
SCHEMATIC CIRCUIT DIAGRAM ............................................APPENDIX
TROUBLESHOOTING...............................................................APPENDIX

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Only for training and service purposes
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩand 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS

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Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent poten-
tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electri-
cally shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

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Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application range
This spec sheet is applied all of the LED TV with LJ55A
chassis
2. Test condition
Each part is tested as below without special notice.
1) Temperature : 25 ºC ± 5 ºC, CST : 40 ºC±5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
Standard input voltage (100~240V@ 50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC: CE, IEC
4. Electrical Specification
No Item Specication Measurement Result Remark
1 Receiving System 1) SBTVD / NTSC / PAL-M / PAL-N
2 Available Channel 1) VHF : 02~13
2) UHF : 14~69
3) CATV : 01~135
3 Input Voltage 1) AC 100 ~ 240V 50/60Hz
4 Market Central and South AMERICA
5 Aspect Ratio 16:9
6 Tuning System FS
7 Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
8 Storage Environment 1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %

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5. External Input Support Format
5.1. Component input(Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
1. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
2. 720*480 15.73 60 13.5135 SDTV ,DVD 480I
3. 720*480 31.47 59.94 27.0 SDTV 480P
4. 720*480 31.50 60 27.027 SDTV 480P
5. 1280*720 44.96 59.94 74.176 HDTV 720P
6. 1280*720 45.00 60.00 74.25 HDTV 720P
7. 1920*1080 28.12 50.00 74.250 HDTV 1080I
8. 1920*1080 33.72 59.94 74.176 HDTV 1080I
9. 1920*1080 33.75 60.00 74.25 HDTV 1080I
10. 1920*1080 26.97 23.976 74.176 HDTV 1080P
11. 1920*1080 27.00 24.000 74.25 HDTV 1080P
12. 1920*1080 33.71 29.97 74.176 HDTV 1080P
13. 1920*1080 33.75 30.000 74.25 HDTV 1080P
14. 1920*1080 56.25 50.00 148.50 HDTV 1080P
15. 1920*1080 67.43 59.939 148.352 HDTV 1080P
16. 1920*1080 67.50 60.00 148.50 HDTV 1080P
5.2. HDMI Input (PC/DTV)
*HDMI PC support only Rear HDMI Input
*If use DVI to HDMI cable for PC, you have to use external SPK for PC audio sound.
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
PC DDC
1640*350 31.46 70.09 25.17 EGA X
2 720*400 31.46 70.08 28.32 DOS O
3 640*480 31.46 59.94 25.17 VESA(VGA) O
4 800*600 37.87 60.31 40.00 VESA(SVGA) O
51024*768 48.36 60.00 65.00 VESA(XGA) O
61152*864 54.34 60.053 80.00 VESA O
71360*768 47.71 60.015 85.50 VESA (WXGA) O
81280*1024 (FHD Only) 63.98 60.02 108.00 VESA (SXGA) O
91920*1080 (FHD Only) 67.5 60 148.5 HDTV 1080P O
10 3840 x 2160 (UF67 ONLY) 67.5 30.00 297.00
11 3840 x 2160 (UF67 ONLY) 56.25 25.00 297.00
12 3840 x 2160 (UF67 ONLY) 54.0 24.00 297.00
13 4096 x 2160 (UF67 ONLY) 53.95 23.97 296.703
14 4096 x 2160 (UF67 ONLY) 54 24.00 297.00

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Only for training and service purposes
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
DTV
1640 * 480 31.46 59.94 25.125 SDTV 480P
2640 * 480 31.5 60.00 25.125 SDTV 480P
3720*480 31.47 59.94 27.000 SDTV 480I
4720*480 31.50 60.00 27.027 SDTV 480I
51280*720 37.50 50.00 74.25 HDTV 720P
61280*720 44.96 59.94 74.176 HDTV 720P
71280*720 45.00 60.00 74.25 HDTV 720P
81920*1080 28.12 50.00 74.25 HDTV 1080I
91920*1080 33.72 59.94 74.176 HDTV 1080I
10 1920*1080 33.75 60.00 74.25 HDTV 1080I
11 1920*1080 26.97 23.97 74.176 HDTV 1080P
12 1920*1080 27.00 24.00 74.25 HDTV 1080P
13 1920*1080 33.71 29.97 74.176 HDTV 1080P
14 1920*1080 33.75 30.00 74.25 HDTV 1080P
15 1920*1080 56.25 50.00 148.50 HDTV 1080P
16 1920*1080 67.43 59.94 148.352 HDTV 1080P
17 1920*1080 67.5 60.00 148.50 HDTV 1080P
18 3840 x 2160(UF67 ONLY) 53.95 23.98 UDTV 2160P
19 3840 x 2160(UF67 ONLY) 54 24.00 UDTV 2160P
20 3840 x 2160(UF67 ONLY) 56.25 25.00 UDTV 2160P
21 3840 x 2160(UF67 ONLY) 61.43 29.97 UDTV 2160P
22 3840 x 2160(UF67 ONLY) 67.5 30.00 UDTV 2160P
23 3840 x 2160(UF67 ONLY) 135 60.00 UDTV 2160P
24 3840 x 2160(UF67 ONLY) 135 59.94 UDTV 2160P
25 4096 x 2160(UF67 ONLY) 53.95 23.98 UDTV 2160P
26 4096 x 2160(UF67 ONLY) 54 24.00 UDTV 2160P
27 4096 x 2160(UF67 ONLY) 56.25 25.00 UDTV 2160P
28 4096 x 2160(UF67 ONLY) 61.43 29.97 UDTV 2160P
29 4096 x 2160(UF67 ONLY) 67.5 30.00 UDTV 2160P
30 4096 x 2160(UF67 ONLY) 135 60.00 UDTV 2160P
31 4096 x 2160(UF67 ONLY) 135 59.94 UDTV 2160P
* DTV Resolution #6 ~ #17 : Support dual play for 3D Models
※ HDMI Monitor Range Limits
Min Vertical Freq - 58 Hz
Max Vertical Freq - 62 Hz
Min Horiz. Freq - 30 kHz
Max Horiz. Freq - 83 kHz
Pixel Clock - 160 MHz

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Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application
This spec sheet is applied all of the TV with LJ55A chassis.
2. Designation
1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan whic al Unit: Product Specification Standard.
2) Power adjustment : Free Voltage.
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specification Standard.
5) Reserve after operation: Above 5 Minutes (Heat Run).
Temperature : at 25 ºC ±5 ºC
Relative humidity : 65 ± 10%
Input voltage : 100~220V, 50/60Hz
6) Adjustment equipments : Color Analyzer (CA-210 or
CA-110), SVC remote controller
7) Push The “IN STOP KEY” – For memory initialization.
3. Main PCB check process
* APC – After Manual-Insert, executing APC
* Boot file Download
1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
2) Set as below, and then click “Auto Detect” and check “OK”
message.
If “Error” is displayed, Check connection between
computer, jig, and set.
3) Click “Read” tab, and then load download file (XXXX.bin) by
clicking “Read”
4) Click “Connect” tab. If “Can’t ” is displayed, Check
connection between computer, jig, and set.
5) Click “Auto” tab and set as below.
6) Click “Run”.
7) After downloading, check “OK” message.
(1)
filexxx.bin
(2) (3)
Please Check the Speed
To use speed between
from 200KHz to 400KHz
(4)
(5)
(6)
(7)...........OK
filexxx.bin
Case1 : Software version up
1) After downloading S/W by USB , TV set will reboot
automatically
2) Push “In-stop” key
3) Push “Power on” key
4) Function inspection
5) After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1) When TV set is entering on the assembly line, Push
“In-stop” key at first.
2) Push “Power on” key for turning it on.
→If you push “Power on” key, TV set will recover channel
information by itself.
3).After function inspection, Push “In-stop” key.

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Only for training and service purposes
* USB DOWNLOAD(*.epk file download)
1) Put the USB Stick to the USB socket.
2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low,
it didn't work. But your downloaded version is High, USB
data is automatically detecting
3) Show the message "Copying files from memory"
4) Updating is staring.
5) After updating is complete, The TV will restart automatically.
6) If TV turns on, check your updated version and Tool option.
(refer to the next page about tool option)
* If downloading version is higher than your TV have, TV
can lost all channel data. In this case, you have to
channel recover. If all channel data is cleared, you didn't
have a DTV/ATV test on production line.
* After downloading, have to adjust Tool
Option again.
1) Push "IN-START" key in service remote controller.
2) Select "Tool Option 1" and Push "OK" button.
3) Punch in the number. (Each model has their number.)
4) Completed selecting Tool option.
Model Module BLU
Type
Tool
option1
Tool
option2
Tool
option3
Tool
option4
Tool
option5
Tool
option6
32LF510B-
SB/D LGD POLA 551 41899 4044 36384 9218
273
43LF5100-
SA LGD POLA 556 33707 4044 36384 9218
273
49LF5100-
SA LGD POLA 558 33707 4044 36384 9218
273
* RS-232C Connection Method
Connection : PCBA (USB Port) -> USB to Serial Adapter
(UC-232A) -> RS-232C cable -> PC(RS-232C port)
▪ Product name of USB to Serial Adapter is UC-232A.
※Caution: LJ55H chassis support only UC-232A driver. (only
use this one. )

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Only for training and service purposes
4. Total Assembly line process
4.1. Adjustment Preparation
■ W/B Equipment condition
CA210 : CH14, Test signal : Inner pattern (80IRE) – in case of
LED back light
■ Above 5 minutes H/run in the inner pattern. (“power on” key of
adjust remote control)
► The spec of color temperature and coordinate
Model Mode Color Temp Color coordinate Remark
All
Cool (C50) 13,000k x = 0.271 (±0.002)
y = 0.270 (±0.002) ※Test signal
- Inner pattern for W/B adjust
- External white pattern
(80IRE, 204gray)
Medium (0) 9,300k x = 0.286 (±0.002)
y = 0.289 (±0.002)
Warm (W50) 6,500k x = 0.313 (±0.002)
y = 0.329 (±0.002)
► CA210 : CH 14, Test signal : Inner pattern (80IRE)
- Standard color coordinate and temperature using CA-1000 (by
H/R time)
▪ L15 LGD, INX Module
March to December & Global
Normal line
H/R Time(Min)
Cool Medium Warm
x y x x y x
271 270 286 289 313 329
1 0-2 282 289 297 308 324 348
2 3-5 281 287 296 306 323 346
3 6-9 279 284 294 303 321 343
4 10-19 277 280 292 299 319 339
5 20-35 275 277 290 296 317 336
6 36-49 274 274 289 293 316 333
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
▪ Aging chamber line
H/R Time(Min)
Cool Medium Warm
x y x x y x
271 270 285 293 313 329
1 0-5 280 285 294 308 319 340
2 6-10 276 280 290 303 315 335
3 11-20 272 275 286 298 311 330
4 21-30 269 272 283 295 308 327
5 31-40 267 268 281 291 306 323
6 41-50 266 265 280 288 305 320
7 51-80 265 263 279 286 304 318
8 81-119 264 261 278 284 303 316
9 Over 120 264 260 278 283 303 315
▪ Gumi Winter table(
January to February - Gumi production of prospective models all
models except Cinema Screen
Normal line
H/R Time(Min)
Cool Medium Warm
x y x x y x
271 270 286 289 313 329
1 0-2 286 295 301 314 328 354
2 3-5 284 290 299 309 326 349
3 6-9 282 287 297 306 324 346
4 10-19 279 283 294 302 321 342
5 20-35 276 278 291 297 318 337
6 36-49 274 275 289 294 316 334
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
▪ INX, AUO, Sharp, CSOT (13000K Cool the SPEC)
cool med warm
x y x y x y
spec 271 270 286 289 313 329
target 278 280 293 299 320 339
※Connecting picture of the measuring instrument
(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER-ON -> Enter
the mode of White-Balance, the pattern will come out.
●Auto-control interface and directions
1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10ux).
2) Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80~100°).
3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check
the back light on.

- 12 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
● Auto adjustment Map(RS-232C)
RS-232C COMMAND
[ CMD ID DATA ]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
RS-232C COMMAND
[CMD ID DATA] MIN
CENTER
(DEFAULT) MAX
Cool Mid Warm Cool Mid Warm
R Gain jg Ja jd 00 172 192 192 192
G Gain jh Jb je 00 172 192 192 192
B Gain ji Jc jf 00 192 192 172 192
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128
*Manual W/B process using adjusts Remote control.(TBD)
■ Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
■ Operate the zero-calibration of the CA100+ or CA-210, then
stick sensor to the module when adjusting.
■ After enter Service Mode by pushing “ADJ” key,
■Enter White Balance by pushing “►” key at “8. White Balance”.
■ For manual adjustment, it is also possible by the following
sequence.
1) Set TV in Adj. mode using POWER ON
2) Zero Calibrate the probe of Color Analyzer, then place it on the
center of LCD module within 10cm of the surface
3) Press ADJ key -> EZ adjust using adj. R/C -> 8. White-Balance
then press the cursor to the right (KEY►). When KEY(►) is
pressed 206 Gray internal pattern will be displayed.
4) Adjust Cool modes
(i). Fix the one of R/G/B gain to 192 (default data) and
decrease the others
(If G gain is adjusted over 172 and R and B gain less than
192, increase G gain to 192 and increase R gain and B gain
same amount of increasing G gain.)
(ii). If G gain is less than 172,
Increase G gain by up to 172, and then increase R gain and
G gain same amount of increasing G gain.
(iii). If R gain or B gain is over 255,
Readjust G gain less than 172, Conform to R gain is 255 or
B gain is 255
5) Adjust two modes (Medium / Warm) Fix the one of R/G/B gain
to 192 (default data) and decrease the others.
6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
▪ If internal pattern is not available, use RF input. In EZ Adj. menu
8. White Balance, you can select one of 2 Test-pattern: ON,
OFF. Default is inner (ON). By selecting OFF, you can adjust
using RF signal in 206 Gray pattern.
※CASE Cool
First adjust the coordinate far away from the target value(x, y).
1) x, y > target
i) Decrease the R, G.
2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3) x > target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
How to adjust
1) If G gain is adjusted over 172 and R gain and B gain less
than 192 , Adjust is O.K.
2) If G gain is less than 172 , increase G gain by up to 172, and
then increase R gain and B gain same amount of increasing
G gain.
3) If R gain or B gain is over 255 , Readjust G gain less than
172, Conform to R gain is 255 or B gain is 255
※CASE Medium / Warm
First adjust the coordinate far away from the target value(x, y).
1) x, y > target
i) Decrease the R, G.
2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3) x > target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
▪ After You finish all adjustments, Press “In-start” button and
compare Tool option and Area option value with its BOM, if it is
correctly same then unplug the AC cable. If it is not same, then
correct it same with BOM and unplug AC cable. For correct it to
the model’s module from factory JIG model.
▪ Push the “IN STOP KEY” after completing the function
inspection.

- 13 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.2. DPM operation confirmation
(Only Apply for MNT Model)
Check if Power LED Color and Power Consumption operate
as standard.
■ Set Input to RGB and connect D-sub cable to set
■ Measurement Condition: (100~240V@ 50/60Hz)
■ Confirm DPM operation at the state of screen without Signal
4.3. EDID DATA
1) All Data : HEXA Value
2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***:Year : Controlled
****:Check sum
- Auto Download
■ After enter Service Mode by pushing “ADJ” key,
■ Enter EDID D/L mode.
■ Enter “START” by pushing “OK” key.
※Edid data and Model option download (RS232C)
NO Item CMD 1 CMD 2 Data 0
Enter
download
MODE
Download
‘Mode In’ A A 0 0
When transfer
the ‘Mode In’,
Carry the com-
mand
Edid data
and Model
option
download
Download A E 00 10
Automatically
download
(The use of a
internal Data)
●EDID DATA
1) HD 2D EDID Data
Before S/W version
CheckSum
(0xFF)
Physical Address
(0x1E)
Remark
HDMI 1 74 / 5B 10 LF51 has Only
HDMI1
HDMI 2 74 / 4B 20
- HDMI1/2 (128)
- HDMI1 (256)
- HDMI2 (256)
2) FHD 2D EDID Data (S/W 1.01.20)
CheckSum
(0xFF)
Physical Address
(0x1E)
Remark
HDMI 1 40 / 25 10
HDMI 2 40 / 15 20
- HDMI1/2 (128)
- HDMI1 (256)
- HDMI2 (256)

- 14 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.4. Outgoing condition Configuration
■ When pressing IN-STOP key by SVC remocon, Red LED
are blinked alternatively. And then automatically turn off.
(Must not AC power OFF during blinking)
4.5. GND & Hi-pot test
4.5.1. GND & HI-POT auto-check preparation
1) Check the POWER CABLE and SIGNAL CABE insertion
condition
4.5.2. GND & HI-POT auto-check
1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
2) Connect the AV JACK Tester.
3) Controller (GWS103-4) on.
4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
4.5.3. Checkpoint
1) Test voltage
①3 Poles
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
②2 Poles
- SIGNAL: 3KV/min at 100mA
2) TEST time: 1 second
3) TEST POINT
①3 Poles
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi-pot Test = POWER CORD GND and LIVE &
NEUTRAL.
②2 Poles
- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL.
4) LEAKAGE CURRENT: At 0.5mArms

- 15 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
DISASSEMBLY

- 16 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
BLOCK DIAGRAM
Main SOC
M1A-LGE2136
(IC101, DDR3 256MB)
(P1801)
30P HD LVDS wafer
51P FHD LVDS wafer
(P1800)
CK+/-, D0+/ -, D1+/ -, D2+/ - _HDMI2
DDC_SCL/SDA_2, HDMI_CEC
Serial Flash
SPI_SCK/SDI/SDO/CS
System EEPROM
I2C_SCL/SDA
RXA0+/-~RXA4+/-,
RXACK+/-
RXB0+/- ~RXB4+/-,
RXBCK+/
-
SPK_R
SPK_L
AMP_SCL/SDA
AUD_MASTER_CLK,
AUD_LRCH,
AUD_LRCK, AUD_SCK
NTP7515
Connector
HDMI1
F- SCART
USB DM/DP
USB1_OCP/CTL
SN1406035RGER
+5V_USB
NAND FLASH
IC102 (1Gbit)
H27U1G8F2CTR-BC
PCM_A[0:7]
T4LCX244FTBuffer
TS_DATA[0:7] PCM_DATA[0:7]
EPHY_TP/TN/RP/RN
LAN
Only UK
PCM_A[8:14]
X- tal
24M
HZ
SC1/AV2_CVBS_IN, SC1_R+/G+/B+
DTV/MNT_OUT, DTV/MNT_L/R_OUT
TU_SCL / SDA
Tuner
F/NIM
DEMOD_SCL/SDA
IF_N/P
IF_AGC
FE_TS_DATA[0:7]
LNB_TX
LNB_OUT, DEMOD_RESET
CI SLOT
OCP
REAR
SIDE
Jog KEY, LED_R, IR

- 17 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
900
200
400
800 540
500
700
120
LV1
A2 701
A10
Set + Stand
901

THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
POWER
150112
4
L15.5_ECI_M1A
Q403
MMBT3904(NXP)
TR_NXP
E
B
C
PANEL_VCC
R442
10K
Q404
MMBT3904(NXP)
TR_NXP
E
B
C
R441
10K
+3.5V_ST
R448
2.2K
R444
10K
+12V
L410
BLM18PG121SN1D
POWER_ON/OFF_1
+3.3V_Normal
C429
0.1uF
16V
PANEL_CTL
C425
0.1uF
25V
OPT R451
5.6K R452 5.6K
C430
22uF
10V
C428
2.2uF
10V
ZD402
5V
TVS_SEMTECH
L408
UBW2012-121F
120OHM
L409
BLM18PG121SN1D
+3.3V_Normal
L411
CB2012PK501T
10uF
C426
10V
+1.5V_DDR
10uF
C431
10V
ZD403
2.5V
BRAZIL_ESD
R447
22K
R449
1K
1/16W
1%
R450
200
1/16W
1%
IC404
AZ1117EH-ADJTRG1
ADJ/GND
OUTIN
R453
0
Q405
SSM3J332R
S
G
D
Q406
SSM3J332R
FET_TOSHIBA
S
G
D
C423
22uF
16V
C432
1uF
16V
C403
4700pF
50V
OPT
+5V_Normal
+5V_USB
USB1_CTL
USB1_OCD
R422
15K
C418
47pF
50V
+5V_Normal
ZD401
2.5V
+1.10V_VDDC
C408
2200pF
50V
OPT
C417
3300pF
50V
C405
10uF
25V
C421
0.047uF
25V
L404
CB2012PK501T
C409
2200pF
50V
OPT
C416
22pF
50V
C411
82pF
50V
OPT
C424
22uF
16V
+12V
R403
10K
C419 22pF
50V
C412
10uF
6.3V
C406
10uF
25V
C410
0.047uF
25V
+3.3V_Normal
C420
3300pF
50V
R408
100K
C407
1uF
10V
R409
91K
+5V_Normal
ZD402-*1
TVS_KEC
Q403-*1
2N3904S
TR_KEC
E
B
C
Q404-*1
2N3904S
TR_KEC
E
B
C
R418
20K
R414
10K
C413
22uF
10V
C414
22uF
10V
ZD407
5.1v
OPT
R445
33K
R446
120K
Q406-*1
AO3435
FET_AOS
G
D S
C427
0.22uF
25V
R411
4.7K
1%
R413
5.1K
1%
SN1406035RGER
IC400
1
SS2
3
EN2
7
SW_OUT
9
VIN2
10
PGND2
11
LX2
12
BST2
13 COMP2
14 FB2
15 RSET
16 AGND
17 FB1
18 COMP1
19 BST1 20 LX1 21 PGND1 22 VIN1 23 V7V 24 SS1
5
SW_EN
8
SW_IN
6
NFAULT
4
ROSC/SYNC
2
EN1 25
[EP]
R417
39K
1%
R416
5.1K
1%
R472
3.3K
USB1_CTL_Pull_Down
R473
30K
OPT
+19V
+19V
R479
20K
R475
68
+3.5V_ST
IC402
MP2315GJ
3
SW
2
IN
4
GND
1
AAM
5BST
6EN/SYNC
7VCC
8FB
C470
10uF
25V
C475
0.1uF
50V
C474
0.1uF
25V
C472
0.1uF
25V
C473
10uF
25V
C480
10uF
16V
C479
0.1uF
25V
C483
0.1uF
25V
JK400
KJA-DC-1-0032
11
22
44
C482
10uF
10V
C481
10uF
16V
C485
0.1uF
25V D470
5V
C477
0.47uF
16V
OPT
C478
0.1uF
25V
C484
10uF
10V
POWER_ON/OFF_1
IC403
MP2315GJ
3
SW
2
IN
4
GND
1
AAM
5BST
6EN/SYNC
7VCC
8FB
R477
68
C471
68uF
35V
R478
100K
ZD405
15V
OPT
C476
0.1uF
50V
BOOST_EN
C486
10uF
16V
C487
22uF
10V
RL_ON
+3.5V_ST
R490
10K
OPT
R489
10K
OPT
R476
47K
OPT
R480
10K
R443
4.7K
+3.5V_ST
C400
0.1uF
16V
R410
10K
POWER_DET
D471
20V
Surge Protection
R485
56K
R486
2K
1%
R487
1.2K
1%
R488
1K
1%
R481
56K
R482
11K
1%
R483
3.3K
1%
R484
1K
1%
R470
100K
C488
68uF
35V
OPT
C489
22uF
10V
ZD408
5V
OPT
C490
1uF
10V
OPT
R415
100
1%
+12V
C491
470pF
50V
R491
5.1
Q407
SSM3J332R
OPT
S
G
D
R492
120K
OPT
C492
10uF
25V
OPT
L471-*1
4.7uH
CYNTEC
L405-*1
4.7uH
CYNTEC
L406-*1
4.7uH
CYNTEC
L470-*1
10uH
CYNTEC
R471
39K
1/16W
1%
R493
120K
OPT
L471
4.7uH
TDK
L405
4.7uH
TDK
L406
4.7uH
TDK
L470
10uH
TDK
+12V to PANEL_VCC
+3.5V_ST to +3.3V_Normal
+3.5V_Normal to +1.5V_DDR
FROM ADAPTOR 19V
POWER
R2
R1
1.3A
Vout=1.25*(1+R2/R1)+Iadj*R2
+19V to +3.5V_STANDBY
Vout=0.6(R1/R2)+0.6
+5V_Normal & +1.10V_VDDC
R2
R1
Vout=0.6(R1/R2)+0.6
R1
R2
Check the pull down
when AC Power On with HDD
3A
2013.08.07
5.6B->5V
READY->APPLY
To improve CST Issue
2013.12.21 by GH.Song
20130528 cJ.LIM
19V TO PANEL VCC(12V) DCDC CONVERTER
20130528 cJ.LIM
3A
NEW
NEW
X5R => X7R
3.5V_ST POWER_DET
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

THERMAL
THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LED_DRIVER
150112L15.5_ECI_M1A
5
R530
100K
OPT
R521
100
C512
33uF
100V
49inch
R525
270K
1/8W
1%
R502
1K
1%
49inch
R545
220K 1%
R551
0.1
R503
10K
1/16W
49inch
BOOST_EN
R543
1.5K
1%
R517
680
1/8W
1%
49inch
R542
39K
1%
R546
1.5K 1%
R512 0.1
1W
49inch
R540
100
C501
10uF
25V
R548
30K 1%
R515
100K
1/8W
49inch
R544
3.3
1/16W
L500
33uH
49inch
R539
100
L501
33uH
R522
120K
32_43inch
C529
0.1uF
25V
C508
0.1uF
50V
49inch
+19V
C523
220pF
100V
C525 1uF
25V
C522
1000pF
50V
C514
1uF
50V
49inch
C507
1uF
25V
49inch
R523
3K
INV_CTL
C526
220pF
100V
+3.3V_Normal
R514 0.1
1W
49inch
R550
100
PWM_DIM
IC501
DT1641AS
3
NC_1
2
OVP
4
PGND_1
1
EN
6
PDIM
5
PGND_2
7
RISET
8
LS8
9
LS7
10
LS6
11
LS5
12
NC_2 13 LGND
14 LS4
15 LS3
16 LS2
17 LS1
18 RT
19 COMP
20 RSS
21 NDRV
22 CS
23 VREF
24 VIN
25
[EP]GND
R535
100
R534
10K
C504
470pF
50V
49inch
R536
100
BLU_CURRENT_CTL
C527
220pF
100V
IC500
TPS40210DGQR
49inch
3
DIS/EN
2
SS
4
COMP
1
RC
5
FB 6GND
7ISNS
8GDRV
9BP
10 VDD
11
[EP] R549
100
C502
0.1uF
50V
OPT
R519
10K
OPT
R537
100
R510
3.9K
1%
49inch
C515
1uF
50V
49inch
R516
100K
1/8W
49inch
R547
100
R500
1K
49inch
R531
100K
1%
C513
33uF
100V
49inch
R528
1K
1% +19V
ZD500
33V
R541
100
C503
0.033uF
50V
49inch
D502
UF3D(SUZHOU GRANDE)
49inch
R501
18K
1%
49inch
C505
100pF
50V
49inch
C518
100pF
50V
R520
10K
C521
1000pF
50V
R538
100
R524
100K
C500
47uF
25V
C509
330pF
50V
49inch
R507
3.9K
1%
49inch
C511
33uF
100V
49inch
C528
4700pF
50V
TR501
MMBT3904(NXP)
E
B
C
C506
0.22uF
16V
49inch
C524
220pF
100V
C530
220pF
100V
49inch C531
220pF
100V
49inch
C532
220pF
100V
OPT
P500
SMAW200-04
1
2
3
4
C520
1uF
100V
49inch
R532
15K
1%
32inch
R533
3.6K
1%
32inch
R529
30K
1%
32inch
R529-*1
13K
1%
43inch
R532-*1
12K
1%
43inch
R533-*1
10K
1%
43inch
R522-*1
150K
49inch
R529-*2
8.2K
1%
49inch
R532-*2
27K
1%
49inch
C510
1uF
25V
C533
33uF
C520-*1
0
1/4W
5%
32_43inch
D504
100V
BR210
32_43inch
D503
MBRD10U100CT
49inch
A1
C
A2
C534
33uF
R578
0
32_43inch
R579
0
49inch
R580
0
32_43inch
R518 47K
49inch
C535
4.7uF
50V
C536
4.7uF
50V
C539
4.7uF
50V
C519
1uF
100V
43_49inch
C519-*1
4.7uF
50V
32inch
R506 47
49inch
R508 47
49inch
R511 47
49inch
R513 47
49inch
R558 47
49inch
Q500
AOD478
49inch
S
D
G
C537
4.7uF
50V
32_43inch_AJ_KR_CO
C538
4.7uF
50V
32_43inch_AJ_KR_CO
R509
3.3
49inch
C541
1uF
100V
49inch
C540
1uF
100V
49inch
C517
0.1uF
OPT
C516
0.1uF
OPT
R555
0
32_43inch_AJ_KR_CO
R554
0
R553
0
EU_BR
L503
UBW2012-121F
OPT
L504
UBW2012-121F
OPT
L505
CIS21J121
32_43inch
R581 1K
49inch
R504
180K
49inch R505
180K
49inch
Q502
SMN630LD
49inch
G
D
S
C537-*1
10uF
35V
49inch
C538-*1
10uF
35V
49inch
L502
33uH
43_49inch
L506
CIS21J121
32inch
L507
49inch
L508
49inch
D505
1N4148W-G
OPT R582
2.2
OPT R583
10K
OPT
R533-*2 3.3K
1/16W
1%
49inch
Q502-*1
AOD2922
32_43inch
G
D
S
121211
1K -> 3.9K
220p -> 330p
TOTAL LED DRIVER BLOCK
VOUT#2
VOUT = VREF*(1+48.8K/680)
= 0.7 *(1+48.8K/680)
= 50.5V
VOUT#1=50.5V
REDUCE RIPPLE CURRENT
REDUCE INDUCTOR TEMP ISSUE
To Improve EMI Issue
FIRST BOOST UP
To Improve EMI Issue
EXCEPT C500 C501
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
150112
USB_S1 7
L15.5_ECI_M1A
D700
RCLAMP0502BA
OPT
SIDE_USB1_DM
SIDE_USB1_DP
C700
22uF
10V
USB_HDD_CAP1_22uF
ZD700
5V
OPT
SD05
C701
5pF
50V
OPT C702
5pF
50V
OPT
C703
22uF
10V
USB_HDD_CAP2_22uF
+5V_USB
C700-*1
10uF
10V
USB_HDD_CAP1_10uF C703-*1
10uF
10V
USB_HDD_CAP2_10uF
R700
2.2
R701
2.2
JK700
US-04A-VSD
1
2
3
4
5
C704
22uF
10V
OPT
USB
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only