LG 49UB8200 User manual

Printed in KoreaP/NO : MFL68500704(1406-REV00)
CHASSIS : LA48V
MODEL : 49UB8200 49UB8200-UH
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LED TV
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only

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CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION .............................................................. 14
EXPLODED VIEW .................................................................................. 26
SCHEMATIC CIRCUIT DIAGRAM ..............................................................

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Only for training and service purposes
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩand 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS

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SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent poten-
tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electri-
cally shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application range
This spec sheet is applied to the LED TV used LA48V
2. Test condition
Each part is tested as below without special notice.
1) Temperature : 25 ºC ± 5 ºC(77±9ºF), CST : 40 ºC±5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
Standard input voltage (100~240V@ 50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : UL, CSA, CE, IEC specification
- EMC : FCC, ICES, CE, IEC specification
- Wireless : Wireless HD Specification (Option)

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4. General Specification
No Item Specication Remark
1 Market 1) North America
2 Receiving System ATSC / NTSC-M / 64 QAM / 256 QAM
3 Input Voltage AC 100 - 240V ~ 60Hz
4 Available Channel 1) VHF : 02~13
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
5) CADTV : 01~135
5 Input Voltage AC 100-240V ~50/60Hz
6 Screen Size 40 inch Wide(3840 × 2160)
47 inch Wide(3840 × 2160)
55 inch Wide(3840 × 2160)
60 inch Wide(3840 × 2160)
65 inch Wide(3840 × 2160)
40UB8000-UB
49UB8300-UG, 49UB8200-UH
55UB8300-UG, 55UB8200-UH
60UB8300-UG, 60UB8200-UH
65UB9200-UA
5 Aspect Ratio 16:9
6 Tuning System FS
7 LCD Module V400DK1-KS1
LC490EQE-XGF2
LC490EQE-XGM1
LC550EQE-PGF2
LC550EQE-PGM1
LC650EQF-FGM1
INX
LGD
LGD
LGD
LGD
LGD
LGD
LGD
40UB8000-UB,
49UB8300-UG,
49UB8200-UH,
55UB8300-UG,
55UB8200-UH,
60UB8300-UG,
60UB8200-UH,
65UB9200-UA
8 Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
9 Storage Environment 1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %

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5. External input format
5.1. 2D Mode
5.1.1. Component input(Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
1 720*480 15.73 60 13.514 SDTV ,DVD 480I
2 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
3 720*480 31.50 60 27.027 SDTV 480P
4 720*480 31.47 59.94 27.0 SDTV 480P
5 1280*720 45.00 60.00 74.25 HDTV 720P
6 1280*720 44.96 59.94 74.176 HDTV 720P
7 1920*1080 33.75 60.00 74.25 HDTV 1080I
8 1920*1080 33.72 59.94 74.176 HDTV 1080I
9 1920*1080 67.500 60 148.50 HDTV 1080P
5.1.2. HDMI Input (PC/DTV)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
HDMI-PC EGA
1 640*350 31.468 70.09 25.17 DOS Х
2 720*400 31.469 70.08 28.32 VESA(VGA) O
3 640*480 31.469 59.94 25.17 VESA(SVGA) O
4 800*600 37.879 60.317 40.00 VESA(XGA) O
5 1024*768 48.363 60.00 65.00 VESA O
6 1152*864 54.348 60.053 80.00 VESA (SXGA) O
7 1280*1024 63.981 60.020 108.00 VESA (WXGA) O
8 1360*768 47.712 60.015 85.50 VESA (WXGA) O
9 1920*1080 67.5 60 148.5
WUXGA(Reduced Blanking) O
10 3840*2160 54 24.00 297.00
UDTV 2160P O
11 3840*2160 56.25 25.00 297.00
UDTV 2160P O
12 3840*2160 67.5 30.00 297.00
UDTV 2160P O
14 4096*2160 53.95 23.98 297.00
UDTV 2160P O
15 4096*2160 54.00 24.00 297.00
UDTV 2160P O

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HDMI-DTV
1 640 * 480 31.469 59.94 SDTV 480P
2 640 * 480 31.5 60 SDTV 480P
3 720*480 31.469 59.94 27.00 SDTV 480P
4 720*480 31.50 60 27.027 SDTV 480P
5 1280*720 45.00 60.00 74.25 HDTV 720P
6 1280*720 44.96 59.94 74.176 HDTV 720P
7 1920*1080 33.75 60.00 74.25 HDTV 1080I
8 1920*1080 33.72 59.94 74.176 HDTV 1080I
9 1920*1080 67.500 60 148.50 HDTV 1080P
10 1920*1080 67.432 59.939 148.352 HDTV 1080P
11 1920*1080 27.000 24.000 74.25 HDTV 1080P
12 1920*1080 26.97 23.976 74.176 HDTV 1080P
13 1920*1080 33.75 30.000 74.25 HDTV 1080P
14 1920*1080 33.71 29.97 74.176 HDTV 1080P
15 3840*2160 67.5 30.00 297.00 UDTV 2160P
16 3840*2160 61.43 29.97 296.703 UDTV 2160P
17 3840*2160 56.25 25.00 297.00 UDTV 2160P
18 3840*2160 54.0 24.00 297.00 UDTV 2160P
19 3840*2160 53.95 23.976 296.703 UDTV 2160P
20 3840*2160 135 59.94 593.41
UDTV 2160P(8 bit / YCbCr 4:2:0 Only)
21 3840*2160 135 60 594.00 UDTV 2160P(8 bit / YCbCr 4:2:0 Only)
22 4096*2160 53.95 23.976 296.703 UDTV 2160P
23 4096*2160 54 24 297 UDTV 2160P
24 4096*2160 56.25 25 297 UDTV 2160P
25 4096*2160 61.43 29.97 296.703 UDTV 2160P
26 4096*2160 67.5 30 297 UDTV 2160P
27 4096*2160 135 59.94 593.41
UDTV 2160P(8 bit / YCbCr 4:2:0 Only)
28 4096*2160 135 60 594.00 UDTV 2160P(8 bit / YCbCr 4:2:0 Only)

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No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock
(MHz)
VIC 3D input proposed
mode
Proposed
1 640*480 31.469 / 31.5 59.94/ 60 25.175/25.2 1 Top-and-Bottom
Side-by-side(half)
Side-by-side(full)
Secondary(SDTV 480P)
Secondary(SDTV 480P)
62.938 / 63 59.94/ 60 50.35/50.4 1 Frame packing
Line alternative
Secondary(SDTV 480P)
(SDTV 480P)
2 720*480 31.469 / 31.5 59.94 / 60 27.00/27.03 2,3 Top-and-Bottom
Side-by-side(half)
Side-by-side(full)
Secondary(SDTV 480P)
Secondary(SDTV 480P)
62.938 / 63 59.94 / 60 54/54.06 2,3 Frame packing
Line alternative
Secondary(SDTV 480P)
(SDTV 480P)
3 1280*720 44.96 / 45 59.94 / 60 74.18/74.25 4 Top-and-Bottom
Side-by-side(half)
Side-by-side(full)
Primary(HDTV 720P)
Primary(HDTV 720P)
89.91 / 90 59.94 / 60 148.35/148.5 4 Frame packing
Line alternative
Primary(HDTV 720P)
(HDTV 720P)
4 1920*1080 33.72 / 33.75 59.94 / 60 74.18/74.25 5 Top-and-Bottom
Side-by-side(half)
Side-by-side(full)
Secondary(HDTV 1080I)
Primary(HDTV 1080I)
67.432 / 67.5 59.94 / 60 148.35/148.5 5 Frame packing
Field alternative
Primary(HDTV 1080I)
(HDTV 1080I)
26.97 / 27 23.97 / 24 74.18/74.25 32 Top-and-Bottom
Side-by-side(half)
Side-by-side(full)
Primary(HDTV 1080P)
Primary(HDTV 1080P)
43.94 / 54 23.97 / 24 148.35/148.5 32 TFrame packing
Line alternative
Primary(HDTV 1080P)
(HDTV 1080P)
28.125 25 74.25 33 Top-and-Bottom
Side-by-side(half)
Side-by-side(full)
Secondary(HDTV 1080P)
Secondary(HDTV 1080P)
56.25 25 148.5 33 Frame packing
Line alternative
Secondary(HDTV 1080P)
(HDTV 1080P)
33.716 / 33.75 29.976 / 30.00 74.18/74.25 34 Top-and-Bottom
Side-by-side(half)
Side-by-side(full)
Primary(HDTV 1080P)
Secondary(HDTV 1080P)
67.432 / 67.5 29.976 / 30.00 148.35/148.5 34 Frame packing
Line alternative
Primary(HDTV 1080P)
(HDTV 1080P)
67.43 / 67.5 59.94 / 60 148.35/148.50 16 Top-and-Bottom
Side-by-side(half)
Primary(HDTV 1080P)
Secondary(HDTV 1080P)
5.2. 3D Mode
5.2.1. HDMI Input 1.4b (3D supported mode automatically)

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No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock
(MHz)
Proposed 3D input proposed mode
1. 720*480 31.5 60 27.03 SDTV 480P 2D to 3D, Side by Side(Half), Top & Bottom,
Checker Board, Frame Sequential,
Row Interleaving, Column Interleaving
2. 1280*720 45.00 60.00 74.25 HDTV 720P
3. 1920*1080 33.75 60.00 74.25 HDTV 1080I 2D to 3D, Side by Side(Half), Top & Bottom
4. 1920*1080 27.00 24.00 74.25 HDTV 1080P 2D to 3D, Side by Side(Half), Top & Bottom,
Checker Board, Row Interleaving,
Column Interleaving
5. 1920*1080 28.12 25 74.25 HDTV 1080P
6. 1920*1080 33.75 30.00 74.25 HDTV 1080P
7. 1920*1080 67.50 60.00 148.5 HDTV 1080P 2D to 3D, Side by Side(Half), Top & Bottom,
Checker Board, Single Frame Sequential,
Row Interleaving, Column Interleaving
8. 3840*2160 53.95 23.976 296.703 HDTV 2160P
9. 3840*2160 54 24.00 297.00 HDTV 2160P
10. 3840*2160 56.25 25.00 297.00 HDTV 2160P
11. 3840*2160 61.43 29.970 296.703 HDTV 2160P
12. 3840*2160 67.5 30.00 297.00 HDTV 2160P
13. 4096*2160 53.95 23.976 296.703 HDTV 2160P
14. 4096*2160 54 24.00 297.00 HDTV 2160P
15. 4096*2160 56.25 25.00 297.00 HDTV 2160P
16. 4096*2160 61.43 29.970 296.703 HDTV 2160P
17. 4096*2160 67.5 30.00 297.00 HDTV 2160P
18. 3840*2160 135 60 594 HDTV 2160P 2D to 3D, Top & Bottom(half),
Side by Side(half), Port3 Only
19. 4096*2160 135 60 594 HDTV 2160P 2D to 3D, Top & Bottom(half),
Side by Side(half), Port3 Only
5.2.2. HDMI 1.4/2.0(3D Supported mode manaually)
5.2.3. HDMI-PC Input (3D) (3D Supported Mode Manually)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock
(MHz)
Proposed 3D input proposed mode
1. 1024*768 48.36 60 65 HDTV 768P 2D to 3D,
Side by Side(half), Top & Bottom
2. 1920*1080 67.500 60 148.50 HDTV 1080P 2D to 3D,
Side by Side(half), Top & Bottom,
Checker Board, Single Frame Sequential,
Row Interleaving, Column Interleaving
3. 3840*2160 54 24.00 296.703 HDTV 2160P 2D to 3D,
Top & Bottom, Side by Side(half),
56.25 25.00 297
67.5 30.00 296.703
4. 4096*2160 54 24.00 297.00 HDTV 2160P 2D to 3D,
Side by Side(half), Top & Bottom
5. Others - - - 2D to 3D,
Side by Side(half), Top & Bottom

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5.2.4. RF Input(3D supported mode manually)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode
1 DTV 74.25 HD/SD 2D to 3D, Side by Side, Top & Bottom
2 ATV 74.25 SD 2D to 3D, Side by Side, Top & Bottom
5.2.5. RF Input (3D supported mode automatically)
No. Signal 3D input proposed mode
1 Frame Compatible Side by Side(Half), Top & Bottom
5.2.6. USB, DLNA (Movie) Input (3D supported mode manually)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode
1 Under 704x480 - - - 2D to 3D
2 Over 704x480
interlaced
- - - 2D to 3D, Side by Side(Half), Top & Bottom
3 Over 704x480
progressive
- 60 - 2D to 3D, Side by Side(Half), Top & Bottom,
Checker Board, Row Interleaving, Column Interleaving,
Frame Sequential
4 Over 704x480
progressive
- others - 2D to 3D, Side by Side(Half), Top & Bottom,
Checker Board, Row Interleaving, Column Interleaving
5 Over 2160P - 24/25/30 - 2D to 3D, Side by Side(Half), Top & Bottom, USB Only
5.2.7. USB, DLNA (Photo) Input (3D supported mode manually)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode
1 Under 320x240 - - - 2D to 3D
2 Over 320x240 - - - 2D to 3D, Side by Side(Half), Top & Bottom
5.2.8. USB, DNLA Input (3D supported mode automatically) – not used
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode
1 1080P 33.75 30 - Side by Side(Half), Top & Bottom, Checker Board,
MPO(Photo)
2 2160p 67.5 30 297 MPO(Photo), JPS(Photo)

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Only for training and service purposes
5.2.9. Component Input(3D supported mode manually)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 1280*720 45.00 60.00 74.25 HDTV 720P 2D to 3D,
Side by Side(Half),
Top & Bottom
2 1280*720 44.96 59.94 74.176 HDTV 720P
3 1920*1080 33.75 60.00 74.25 HDTV 1080I
5 1920*1080 33.72 59.94 74.176 HDTV 1080I
5 1920*1080 27.00 24.00 74.25 HDTV 1080P
6 1920*1080 26.97 23.976 74.176 HDTV 1080P
7 1920*1080 28.12 25 74.25 HDTV 1080P
8 1920*1080 33.75 30.00 74.25 HDTV 1080P
9 1920*1080 33.71 29.97 74.176 HDTV 1080P
10 1920*1080 67.50 60.00 148.5 HDTV 1080P
11 1920*1080 67.432 59.94 148.352 HDTV 1080P
5.2.10. Miracast, Widi (3D supported mode manually)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode
1 1024X768p - 30 / 60 - 2D to 3D, Side by Side(Half), Top & Bottom
2 1280x720p - 30 / 60 -
3 1920X1080p 30 / 60
4 Others - 2D to 3D
**Remark: 3D Input mode
No. Side by Side Top & Bottom Checkerboard Single Frame
Sequential
Frame
Packing
2D to 3D Line Interleav-
ing
Column
Interleaving
1

- 14 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application Range
This spec. sheet applies to LA48V Chassis applied LED TV all
models manufactured in TV factory
2. Specification.
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15ºC
▪ In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
▪ In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above 15°C
for 3 hours
* Caution) When still image is displayed for a period of 20
minutes or longer (especially where W/B scale is
strong. Digital pattern 13ch and/or Cross hatch
pattern 09ch), there can some afterimage in the
black level area.
3. Adjustment items
3.1. PCB assembly adjustment items
1) MAC Address, ESN Key and Wide-vine Key D/L
2) LAN Test( Ping-Test )
3) Main S/W program download : Using USB Memory stick
4) Input Tool - Option
5) Download EDID
6) ADC Calibration – RGB & Component
7) Check SW Version
3.2. SET assembly adjustment items
1) Input Area option.
2) Adjustment of White Balance : Auto
3) Adjustment of White Balance : Manual
4) Intelligent Sensor Inspection Guide
5) LAN Inspection Guide
6) Widevine Key Inspection Guide
7) Model name & Serial number D/L
8) Wi-Fi MAC Address Check
9) Local Dimming Inspection Guide
10) Preset CH information
11) GND and Internal Pressure check
12) Motion Remote controller Inspection
13) 3D Function test
14) Outgoing Condition Configuration
15) Sound spec
16) Factoring Option Data input.
4. PCB assembly adjustment method
4.1. ADC Calibration : component using internal pattern
- An ADC calibration is needed to fine the optimum black level
and gain in Analog-to-Digital device
.
4.1.1. Adj. method
- Using RS-232C, adjust items listed in “4.1.2”
4.1.2. Adj. protocol
Protocol Command Set ACK
Enter adj. mode aa 00 00 a 00 OK00x
Source change xb 00 40 b 00 OK04x (Adjust 480i, 1080p Comp1 )
Begin adj. ad 00 10 OKx (Case of Success)
NGx (Case of Fail)
Read adj. data ad 00 20 000000000000000000000000007c007b-
006dx
Conrm adj. ad 00 99 NG 01 00x (Fail)
OK 01 01x (Success)
End adj. ad 00 90 a 00 OK90x
4.1.3. Adj. Order (TBD)
▪ aa 00 00 [Enter adj. mode]
▪ xb 00 04 [Change input source to Component1(480i&1080p)]
▪ ad 00 10 [Adjust 480i&1080p Comp1]
▪ aa 00 90 [End adj.]
4.2. 4.2.MAC Address, ESN Key and Wide-
vine Key Download
4.2.1. Equipment & Condition
1) Play file: keydownload.exe
2) Key Write: Com 1,2,3,4 and 115200 (Baudrate)
3) Barcode: Com 1,2,3,4 and 9600 (Baudrate)

- 15 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.2.2. Download process (14Y ULTRA HD TV + MAC
+ WIDEVINE + ESN)
1) Execute “keydownload.exe” on PC
2) Select the download items.
3) Mode check : Online only
4) Check the test process
- DETECT -> MAC_WRITE -> ESN_WRITE (only Colombia/
Panama) ->WIDEVINE_WRITE
5) Play: START
6) Check of result: Ready, Test, OK or NG
4.2.3. Inspection : InINSTART menu, check these keys
4.3. PING Test(LAN Operating Test)
4.3.1. Check PCBA
1) Connect LAN to PCBA& Power On.(Default IP can be set to
automatic setting. When power ON, IP can be Automatically
be achieved from the router)
2) Push ADJ key on Adjust remote-controller.
3) Enter “13. ACAP PING TEST” & check Network.
4.3.2. Check Set(Manufacturer)
1) Connect TV-Set & PC with Cross LAN cable.(PC IP :
12.12.2.3)
2) Execute “PINT Test program”, Check setting data of
program. (TV-Set IP : 12.12.2.2)
3) Push Power Only key on Adjust remote-controlle.
4) Click “RUN”, Check “OK” or “NG”
4.4. Main S/W program download
4.4.1. Using the Memory Stick
** USB DOWNLOAD : Service Mode
1) Insert the USB memory Stick to the USB port
2) Automatically detect the SW Version.
-> S/W download process is executed automatically.
3) Show the message “Copy the file from the Memory”
4) After Finished the Download, Automatically DC Off -> On
5) If the TV IS Turn On, Check the updated SW Version and
Tool Option.

- 16 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.5. EDID D/L method
Recommend that don’t connect HDMI and RGB(D-SUB) cable
when downloading the EDID.
If not possible, recommend that connect the MSPG equipment.
There are two methods of downloading the edid data
It is a VESA regulation. A PC or a MNT will display an optimal
resolution through information
Sharing without any necessity of user input. It is a realization
of “Plug and Play”
4.5.1. 1st Method
EDID data’s are automatically downloaded when adjusting the
Tool Options.
Automatically downloaded when pushing the enter key in the
EDID D/L menu.
It takes about 2seconds
4.5.2. 2st Method
=> Caution : Must be checked that the tool option is right or
not. If tool option is wrong, HDMI edid data could
not be downloaded well.
1) Press the ADJ key
2) Move to the 13. EDID D/L and Press the right direction
key(►)
3) Press the right direction key(►) at Start.
4) After about a few seconds, appear “Waiting..” => “OK”, then
complete.
4.5.3. RS-232C command Method
1) Command : AE 00 10
=> Caution : Don’t connect HDMI and RGB(D-SUB) cable
when downloading the EDID. If the cables are
connected, Downloading of edid could be failed.
4.5.4. EDID DATA
▪ Reference
- HDMI1 ~ HDMI3
- In the data of EDID, bellows may be different by Input mode
ⓐProduct ID
ⓑSerial No: Controlled on production line.
ⓒMonth, Year: Controlled on production line:
ex) Monthly : ‘01’ -> ‘01’
Year : ‘2014’ -> ‘18
ⓓModel Name(Hex): LGTV
ⓔChecksum(LG TV): Changeable by total EDID data.
ⓕ Vendor Specific(HDMI)
4.5.4.1. EDID
#DTS HDMI1 (C/S: F7 82)
EDID Block 0, Bytes 0-127
EDID Block 1, Bytes 128-255
#DTS HDMI2 (C/S: E7 72)
EDID Block 0, Bytes 0-12
EDID Block 1, Bytes 128-255

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Only for training and service purposes
#DTS HDMI3 (C/S: A1 81)
EDID Block 0, Bytes 0-127
EDID Block 1, Bytes 128-255
# DTS HDMI4 (C/S: E7 52)
EDID Block 0, Bytes 0-127
EDID Block 1, Bytes 128-255
# AC3 HDMI1 (C/S: E7 8B)
EDID Block 0, Bytes 0-127
EDID Block 1, Bytes 128-255
# AC3 HDMI2 (C/S: E7 7B)
EDID Block 0, Bytes 0-127
EDID Block 1, Bytes 128-255

- 18 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
# AC3 HDMI3 (C/S: A1 8A)
EDID Block 0, Bytes 0-127
EDID Block 1, Bytes 128-255
# AC3 HDMI4 (C/S: E7 5B)
EDID Block 0, Bytes 0-127
EDID Block 1, Bytes 128-255
# PCM HDMI1 (C/S: F7 FD)
EDID Block 0, Bytes 0-127
EDID Block 1, Bytes 128-255
# PCM HDMI1(C/S: E7 ED)

- 19 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
# PCM HDMI3 (C/S: A1 FC)
EDID Block 0, Bytes 0-127
EDID Block 1, Bytes 128-255
# PCM HDMI4 (C/S: E7 CD)
* Checksum (HDMI 1/2/3/4)
Input DTS FFh AC3 FFh PCM FFh
HDMI1 E7 82 E7 8B E7 FD
HDMI2 E7 72 E7 7B E7 ED
HDMI3 A1 81 A1 8A A1 FC
HDMI4 E7 52 E7 5B E7 CD
4.6. Camera Port Inspection
(1) Objective : To check how it connects between Camera and
PCBA normally, and their Function
(2) Test Method : This Inspection is available only Power-Only
Status.
i) Push Camera Up
ii) Camera’s Preview picture appears on TV Set
iii) Push Camera Down
(3) RS-232C Command
RS-232C COMMAND Explanation
CMD DATA ID
Ai 00 23 Camera Function Start.
Ai 00 24 Camera Function End.
5. SET assembly adjustment method
5.1. Input Area-Option
(1) Profile : Must be changed the Area option value because
being different of each Country’s Language and
signal Condition.
(2) Equipment : adjustment remote control.
(3) Adjustment method
- The input methods are same as other chassis.(Use
IN-START Key on the Adjust Remocon.)
Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value.
5.2. Adjustment of White Balance
▪ In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
▪ In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above 15°C
for 3 hours.
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192 (default data) and
decrease the others.
- Adjustment mode : Three modes – Cool / Medium / Warm

- 20 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
* Required Equipment
▪ Remote controller for adjustment
▪ Color Analyzer : CA100+ or CA-210 or same product (should
be used in the calibrated ch by CS-1000)
- LCD TV : CH-9
- PDP TV : CH-10
- White LED TV : CH-14
- ALEF : CH-18
- RGB LED(MNT) : CH-16
▪ Auto W/B adjustment instrument(only for Auto adjustment)
5.2.1. Adjustment of White Balance :
(For Automatic Adjustment)
Connecting diagram of equipment for measuring (For
Automatic Adjustment)
1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment.
3) Connect RS-232C Cable
4) Select mode in ADJ Program and begin a adjustment.
5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need
(1) RS-232C Command used during auto-adj.
RS-232C COMMAND Explanation
CMD DATA ID
wb 00 00 Begin White Balance adj.
wb 00 10 Gain adj.(internal white pattern)
wb 00 1f Gain adj. completed
wb 00 20 Offset adj.(internal white pattern)
wb 00 2f Offset adj. completed
wb 00 Ff End White Balance adj.
(internal pattern disappears )
5.2.2. Adjustment of White Balance
(For Automatic Adjustment)
5.2.2.1. Adj. condition and cautionary items
1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface (90+/-
2.5°)
3) Aging time
A. After Aging Start, Keep the Power ON status during 5
Minutes.
B. In case of LCD, Back-light on should be checked using
no signal or Full-white pattern.
5.2.2.2. Equipment
1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model: 217, Pattern: 78)
5.2.2.3. Adjustment
1) Set TV in Adj. mode using POWER ON
2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface.
3) Press ADJ key -> EZ adjust using adj. R/C > 6. White-
Balance then press the cursor to the right (KEY►). When
KEY(►) is pressed 216 Gray internal pattern will be
displayed.
4) One of R Gain / G Gain / B Gain should be fixed at 192, and
the rest will be lowered to meet the desired value.
5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.
** R-fix adjustment
Adjust modes (Cool), Fix the R gain to 210 (default data) and
change the others (G/B Gain ).
- Adjust the R gain more than 210 ( If G gain or B gain is less
than 0 , R gain can adjust more than 210 ) and change the
others ( G/B Gain ). Adjust two modes(Medium / Warm), Fix
the one of R/G/B gain to 192 (default data) and decrease the
others.