LG 65LA9650 User manual

Printed in KoreaP/NO : MFL67687917(1309-REV00)
CHASSIS : LA34N
MODEL : 65LA9650 65LA9650-UA
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LED TV
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only

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CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 4
ADJUSTMENT INSTRUCTION .............................................................. 14
EXPLODED VIEW .................................................................................. 22
SCHEMATIC CIRCUIT DIAGRAM ..............................................................

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Only for training and service purposes
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩand 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS

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Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent poten-
tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electri-
cally shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

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Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application range
This spec sheet is applied LED TV with (LA34N) chassis
2. Test condition
Each part is tested as below without special notice.
1) Temperature : 25 ºC ± 5 ºC(77 ± 9 ºF) , CST : 40 ºC±5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
Market Input voltage Frequency Remark
USA 110~240V 50/60Hz Standard Voltage of each
product is marked by
models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM
5) The receiver must be operated for about 20 minutes prior to
the adjustment
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
Safety : UL, CSA, CE, IEC specification
EMC: FCC, ICES, CE, IEC specification
Wireless : Wireless HD Specification (Option)
4. General Specification
No Item Specication Remark
1 Market 1) North America
2 Broad casting System 1) ATSC / NTSC-M, 64 & 256 QAM (US)
3 Receiving System 1) ATSC / NTSC-M, 64 & 256 QAM(US)
4 Input Voltage AC 220 - 240V ~ 60Hz
5 Available Channel 1) VHF : 02~13
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
5) CADTV : 01~135
7 Aspect Ratio 16:9
8 Tuning System FS
9 LCD Module LC550EQK-FGK1
LC650EQK-FGK1
LC550EQD-FGF2
LC650EQD-FGF2
55LA9700-UA
65LA9700-UA
55LA9650-UA
65LA9650-UA
10 Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
11 Storage Environment 1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %

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Only for training and service purposes
5. External input format
5.1. 2D mode
5.1.1. Component input (Y, CB/PB, CR/PR)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
1. 720*480 15.73 60.00 13.5135 SDTV ,DVD 480I
2. 720*480 15.73 59.94 13.50 SDTV ,DVD 480I
3. 720*480 31.50 60.00 27.027 SDTV 480P
4. 720*480 31.47 59.94 27.00 SDTV 480P
5. 1280*720 45.00 60.00 74.25 HDTV 720P
6. 1280*720 44.96 59.94 74.176 HDTV 720P
7. 1920*1080 33.75 60.00 74.25 HDTV 1080I
8. 1920*1080 33.72 59.94 74.176 HDTV 1080I
9. 1920*1080 67.50 60.00 148.50 HDTV 1080P
10. 1920*1080 67.432 59.94 148.352 HDTV 1080P
11. 1920*1080 27.00 24.00 74.25 HDTV 1080P
12. 1920*1080 26.97 23.94 74.176 HDTV 1080P
13. 1920*1080 33.75 30.00 74.25 HDTV 1080P
14. 1920*1080 33.71 29.97 74.176 HDTV 1080P

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5.1.2. HDMI Input 1 (PC/DTV)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
HDMI-PC
1 640*350 31.468 70.09 25.17 EGA Х
2 720*400 31.469 70.08 28.32 DOS O
3 640*480 31.469 59.94 25.17 VESA(VGA) O
4 800*600 37.879 60.31 40.00 VESA(SVGA) O
5 1024*768 48.363 60.00 65.00 VESA(XGA) O
6 1152*864 54.348 60.053 80.00 VESA O
7 1280*1024 63.981 60.020 108.00 VESA (SXGA) O
8 1360*768 47.712 60.015 85.50 VESA (WXGA) O
9 1920*1080 67.5 60 148.5 WUXGA(Reduced Blanking) O
10 3840*2160 67.5 30.00 297.00 UD
11 3840*2160 56.25 25.00 297.00 UD
12 3840*2160 54.0 24.00 297.00 UD
HDMI-DTV
1 720*480 31.47 60 27.027 SDTV 480P
2 720*480 31.47 59.94 27.00 SDTV 480P
3 1280*720 45.00 60.00 74.25 HDTV 720P
4 1280*720 44.96 59.94 74.176 HDTV 720P
5 1920*1080 33.75 60.00 74.25 HDTV 1080I
6 1920*1080 33.72 59.94 74.176 HDTV 1080I
7 1920*1080 67.500 60 148.50 HDTV 1080P
8 1920*1080 67.432 59.939 148.352 HDTV 1080P
9 1920*1080 27.000 24.000 74.25 HDTV 1080P
10 1920*1080 26.97 23.976 74.176 HDTV 1080P
11 1920*1080 33.75 30.000 74.25 HDTV 1080P
12 1920*1080 33.71 29.97 74.176 HDTV 1080P
13 3840*2160 67.5 30.00 297.00 UDTV 2160P
14 3840*2160 56.25 25.00 297.00 UDTV 2160P
15 3840*2160 54.0 24.00 297.00 UDTV 2160P

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5.2. 3D Mode
5.2.1. HDMI Input 1.4b (3D supported mode automatically)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) VIC 3D input
proposed mode Proposed
1 640*480 31.469 / 31.5 59.94/ 60 25.125/25.2 1 Top-and-Bottom
Side-by-side(half)
Secondary(SDTV 480P)
Secondary(SDTV 480P)
31.469 / 31.5 59.94/ 60 50.35/50.4 1 Side-by-side(Full) (SDTV 480P)
62.938/63 59.94/ 60 50.35/50.4 1 Frame packing
Line alternative
Secondary(SDTV 480P)
(SDTV 480P)
2 720*480 31.469 / 31.5 59.94 / 60 27.00/27.03 2,3 Top-and-Bottom
Side-by-side(half)
Secondary(SDTV 480P)
Secondary(SDTV 480P)
31.469 / 31.5 59.94 / 60 54/54.06 2,3 Side-by-side(Full) (SDTV 480P)
62.938/63 59.94 / 60 54/54.06 2,3 Frame packing
Line alternative
Secondary(SDTV 480P)
(SDTV 480P)
3 720*576 31.25 50 27 17,18 Top-and-Bottom
Side-by-side(half)
Secondary(SDTV 576P)
Secondary(SDTV 576P)
31.25 50 54 17,18 Side-by-side(Full) (SDTV 576P)
62.5 50 54 17,18 Frame packing
Line alternative
Secondary(SDTV 576P)
(SDTV 576P)
4 720*576 15.625 50 27 21 Frame packing
Field alternative
Side-by-side(Full)
Top-and-Bottom
Side-by-side(half)
Secondary(SDTV 576I)
(SDTV 576I
(SDTV 576I
Secondary(SDTV 576I)
Secondary(SDTV 576I)
5 1280*720 37.500 50 74.25 19 Top-and-Bottom
Side-by-side(half)
Primary(HDTV 720P)
Primary(HDTV 720P)
37.500 50 148.5 19 Side-by-side(Full) (HDTV 720P)
44.96 / 45 59.94 / 60 74.17/74.25 4 Top-and-Bottom
Side-by-side(half)
Primary(HDTV 720P)
Primary(HDTV 720P)
44.96 / 45 59.94 / 60 148.35/148.5 4 Side-by-side(Full) (HDTV 720P)
75 50 148.5 19 Frame packing
Line alternative
Primary(HDTV 720P)
(HDTV 720P)
89.91/90 59.94 / 60 148.35/148.5 4 Frame packing
Line alternative
Primary(HDTV 720P)
(HDTV 720P)
6 1920*1080 28.125 50.00 74.25 20 Top-and-Bottom
Side-by-side(half)
Secondary(HDTV 1080I)
Primary(HDTV 1080I)
28.125 50.00 148.5 20 Side-by-side(Full) (HDTV 1080I)
33.72 / 33.75 59.94 / 60 74.17/74.25 5 Top-and-Bottom
Side-by-side(half)
Secondary(HDTV 1080I)
Primary(HDTV 1080I)
33.72 / 33.75 59.94 / 60 148.35/148.5 5 Side-by-side(Full) (HDTV 1080I)
56.25 50.00 148.5 20 Frame packing
Field alternative
Primary(HDTV 1080I)
(HDTV 1080I)
67.432/67.50 59.94 / 60 148.35/148.5 5 Frame packing
Field alternative
Primary(HDTV 1080I)
(HDTV 1080I)

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No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) VIC 3D input
proposed mode Proposed
7 1920*1080 26.97 / 27 23.97 / 24 74.17/74.25 32 Top-and-Bottom
Side-by-side(half)
Primary(HDTV 1080P)
Primary(HDTV 1080P)
26.97 / 27 23.97 / 24 148.35/148.5 32 Side-by-side(Full) (HDTV 1080P)
28.12 25 74.25 33 Top-and-Bottom
Side-by-side(half)
Secondary(HDTV 1080P)
Secondary(HDTV 1080P)
28.12 25 148.5 33 Side-by-side(Full) (HDTV 1080P)
33.716 / 33.75 29.976 / 30.00 74.18/74.25 34 Top-and-Bottom
Side-by-side(half)
Primary(HDTV 1080P)
Secondary(HDTV 1080P)
33.716 / 33.75 29.976 / 30.00 148.35/148.5 34 Side-by-side(Full) (HDTV 1080P)
43.94/54 23.97 / 24 148.35/148.5 32 Frame packing
Line alternative
Primary(HDTV 1080P)
(HDTV 1080P)
56.25 25 148.5 33 Frame packing
Line alternative
Secondary(HDTV 1080P)
(HDTV 1080P)
67.432 / 67.5 29.976 / 30.00 148.35/148.5 34 Frame packing
Line alternative
Primary(HDTV 1080P)
(HDTV 1080P)
56.250 50 148.5 31 Top-and-Bottom
Side-by-side(half)
Primary(HDTV 1080P)
Secondary(HDTV 1080P)
67.43 / 67.5 59.94 / 60 148.35/148.50 16 Top-and-Bottom
Side-by-side(half)
Primary(HDTV 1080P)
Secondary(HDTV 1080P)
5.2.2. HDMI Input(1.3)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode
1 720*480 31.5 60 27.03 SDTV 480P 2D to 3D, Side by Side(Half),
Top & Bottom, Checker Board,
Frame Sequential, Row Interleaving,
Column Interleaving
2 720*576 31.25 50 27 SDTV 576P
3 1280*720 45.00 60.00 74.25 HDTV 720P
37.500 50 74.25 HDTV 720P
4 1920*1080 33.75 60.00 74.25 HDTV 1080I 2D to 3D, Side by Side(Half),
Top & Bottom
28.125 50.00 74.25 HDTV 1080I
5 1920*1080 27.00 24.00 74.25 HDTV 1080P 2D to 3D, Side by Side(Half),
Top & Bottom, Checker Board,
Row Interleaving, Column Interleaving
28.12 25 74.25 HDTV 1080P
33.75 30.00 74.25 HDTV 1080P
67.50 60.00 148.5 HDTV 1080P 2D to 3D, Side by Side(Half),
Top & Bottom,
Checker Board, Single Frame Sequential,
Row Interleaving, Column Interleaving
56.250 50 148.5 HDTV 1080P
6 3840*2160 53.95 23.976 297.00 HDTV 2160P 2D to 3D,
Top & Bottom(half), Side by Side(half),
54 24.00 296.703
56.25 25.00 297.00
61.43 29.970 297.00
67.5 30.00 296.703

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5.2.3. RF Input(3D supported mode manually)
No Resolution Proposed 3D input proposed mode
1 HD (DTV) 1080I
720P
2D to 3D
Side by Side(Half)
Top & Bottom
2 SD (DTV) 576P
576I
3 SD (ATV : CVBS / SCART)
5.2.4. RF Input (3D supported mode automatically)
No Resolution 3D input proposed mode
1 Frame Compatible Side by Side(Half),
Top & Bottom
5.2.5. USB, DLNA (Movie) Input (3D supported mode manually)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Remark
1. Under 704x480 2D to 3D
2. Over 704x480 interlaced 2D to 3D, Side by Side(Half), Top & Bottom
3. Over 704x480 progressive 50 / 60 2D to 3D, Side by Side(Half),
Top & Bottom, Checker Board,
Row Interleaving, Column Interleaving, Frame
Sequential
4. Over 704x480 progressive others 2D to 3D, Side by Side(Half),
Top & Bottom, Checker Board,
Row Interleaving, Column Interleaving
5.2.6. USB, DLNA (Photo) Input (3D supported mode manually)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Remark
1. Under 320x240 2D to 3D
2. Over 320x240 2D to 3D, Side by Side(Half), Top & Bottom
* USB, DNLA Input (3D supported mode automatically)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Remark
1. 1080P 33.75 30 Side by Side(Half), Top & Bottom, Checker
Board, MPO(Photo), JPS(Photo)

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5.2.7. HDMI-PC Input(3D supported mode manually)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
3D input proposed mode
1 1024*768 31.5 60 27.03 SDTV 480P 2D to 3D,
Side by Side(half), Top & Bottom
2 1360*768 31.25 50 27 SDTV 576P 2D to 3D,
Side by Side(half), 7Top & Bottom
3 1920*1080 45.00 60.00 74.25 HDTV 720P 2D to 3D,
Side by Side(half), Top & Bottom,
Checker Board, Single Frame Sequential,
Row Interleaving, Column Interleaving
4 3840*2160 54 24.00 296.703 HDTV 2160P 2D to 3D,
Top & Bottom(half), Side by Side(half),
56.25 25.00 297
67.5 30.00 296.703
5 Others 27.00 24.00 74.25 640*350
720*400
640*480
800*600
1152*864
2D to 3D,
Side by Side(half), Top & Bottom
5.2.8. Component Input(3D supported mode manually)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 1280*720 45.00 60.00 74.25 HDTV 720P 2D to 3D, Side by Side(Half),
Top & Bottom
2 1280*720 37.500 50 74.25 HDTV 720P
3 1920*1080 33.75 60.00 74.25 HDTV 1080I
4 1920*1080 28.125 50.00 74.25 HDTV 1080I
5 1920*1080 27.00 24.00 74.25 HDTV 1080P
6 1920*1080 28.12 25 74.25 HDTV 1080P
7 1920*1080 33.75 30.00 74.25 HDTV 1080P
8 1920*1080 67.50 60.00 148.5 HDTV 1080P
9 1920*1080 56.250 50 148.5 HDTV 1080P
10 Others - - - SDTV

- 13 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
5.2.9. Miracast, Widi (3D supported mode manually)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Remark
1 1024X768p 30 / 60 2D to 3D, Side by Side(Half),
Top & Bottom
2 1280x720p 30 / 60
3 1920X1080p 30 / 60
4 Others 2D to 3D
●REMARK: 3D INPUT MODE
No. Side by Side Top & Bottom Checkerboard Single Frame
Sequential
Frame Packing 2D to 3D
1

- 14 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application
This spec. sheet applies to LA34N Chassis applied LED TV all
models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15 ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
※Caution
When still image is displayed for a period of 20 minutes or
longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area
3. Adjustment items
3.1. Main PCBA Adjustments
(1) ADC adjustment: Component 480i, 1080p
(2) EDID downloads for HDMI
※Remark
- Above adjustment items can be also performed in Final
Assembly if needed. Adjustment items in both PCBA and
final assembly tages can be checked by using the INSTART
Menu -> 1.ADJUST CHECK
3.2. Final assembly adjustment
(1) White Balance adjustment
(2) RS-232C functionality check
(3) Factory Option setting per destination
(4) Shipment mode setting (In-Stop)
(5) GND and HI-POT test
3.3. Appendix
(1)Tool option menu, USB Download (S/W Update, Option and
Service only)
(2) Manual adjustment for ADC calibration and White balance.
(3) Shipment conditions, Channel pre-set
4. MAIN PCBA Adjustments
4.1. ADC Calibration
- An ADC calibration is not necessary because MAIN SoC
(LGExxxx) is already calibrated from IC Maker
- If it needs to adjust manually, refer to appendix.
4.2. MAC Address, ESN Key and Widevine
Key download
4.2.1. Equipment & Condition
1) Play file: keydownload.exe
4.2.2. Communication Port connection
1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)
2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)
4.2.3. Download process
1) Select the download items.
2) Mode check: Online Only
3) Check the test process
- US, Canada models: DETECT -> MAC_WRITE ->
WIDEVINE_WRITE
- Korea, Mexico models: DETECT -> MAC_WRITE ->
WIDEVINE_WRITE
4) Play : START
5) Check of result: Ready, Test, OK or NG
6) Printer out (MAC Address Label)
4.2.4. Communication Port connection
1) Connect: PCBA Jig -> RS-232C Port == PC -> RS-232C
Port
4.2.5. Download
1) US, Canada models (13Y LCD TV + MAC + Widevine +
ESN Key + DTCP Key + HDCP1.4 and HDCP2.0)
4.2.6. Inspection
- In INSTART menu, check these keys.

- 15 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.3. LAN port Inspection (Ping Test)
4.3.1. Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test Program.
- IP number: 12.12.2.2
4.3.2. LAN PORT inspection (PING TEST)
1) Play the LAN Port Test Program.
2) Connect each other LAN Port Jack.
3) Play Test (F9) button and confirm OK Message.
4) Remove LAN CABLE
4.4. EDID Download
4.4.1 Overview
▪ It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
4.4.2 Equipment
▪ Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
▪ Adjust remocon
4.4.3 Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.
5) If Download is failure, Re-try downloads.
※Caution) When EDID Download, must remove RGB/HDMI
Cable.
4.4.4. EDID DATA(PCM)
▪ HDMI1 (C/S:E8 95)
EDID Block 0, Bytes 0-127
EDID Block 1, Bytes 128-255
▪ HDMI2 (C/S:E8 85)
EDID Block 0, Bytes 0-127
EDID Block 1, Bytes 128-255
▪ HDMI3 (C/S:E8 75)
EDID Block 0, Bytes 0-127
EDID Block 1, Bytes 128-255

- 16 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.5. Camera Port Inspection
(1) Objective : To check PCBA’s CAMERA Port.
(2) How-it-works
i) Connect the PCBA like below Picture.
ii) Send specific RS-232C Command for displaying Camera
Preview.
* CAMERA need to be status of Slide up.
(3) RS-232C Command
RS-232C COMMAND Explanation
CMD DATA ID
Ai 00 23 Camera Function Start.
Ai 00 24 Camera Function End.
5. Final Assembly Adjustment
5.1. White Balance Adjustment
5.1.1. Overview
5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 °C
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
- Before White balance adjustment, Keep power on status,
don’t power off
5.1.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
signal or Full-white pattern.
5.1.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
(3) Adjust Remocon
(4) Video Signal Generator MSPG-925F 720p/204-Gray
(Model: 217, Pattern: 49)
※Color Analyzer Matrix should be calibrated using CS-1000
5.1.3. Equipment connection
5.1.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
RS-232C COMMAND Explanation
CMD DATA ID
Wb 00 00 Begin White Balance adj.
Wb 00 ff End White Balance adj.
(internal pattern disappears )
(2) Adjustment Map
Adj. item Command
(lower caseASCII)
Data Range
(Hex.)
CMD1 CMD2 MIN MAX
Cool R Gain j g 00 C0
G Gain j h 00 C0
B Gain j i 00 C0
Medium R Gain j a 00 C0
G Gain j b 00 C0
B Gain j c 00 C0
Warm R Gain j d 00 C0
G Gain j e 00 C0
B Gain j f 00 C0
Color Analyzer
Computer
Pattern Generator
※
Signal Source
Probe
RS-232C
RS-232C
RS-232C
※If TV internal pattern is used, not needed

- 17 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
5.1.5. Adjustment method
5.1.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
(2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
(6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need
5.1.5.2. LED White balance table
(1) Cool Mode
- Purpose : Especially G-gain fix adjust leads to the
luminance enhancement. Adjust the color temperature to
reduce the deviation of the module color temperature.
- Principle : To adjust the white balance without the
saturation, Adjust the G gain more than 172 ( If R gain or G
gain is more than 255 , G gain can adjust less than 172 )
and change the others ( R/B Gain ).
- Adjustment mode : mode – Cool
(2) Medium / Warm Mode
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the
saturation, Fix the one of R/G/B gain to 192 (default data)
and decrease the others.
- Adjustment mode : Two modes – Medium / Warm
5.1.6. Reference (White Balance Adj. coordinate and
color temperature)
(1) Luminance: 204 Gray, 80IRE
(2) Standard color coordinate and temperature using CS-1000
(over 26 inch)
5.1.7. Reference (White Balance Adj. coordinate and
color temperature)
▪ Luminance: 204 Gray
▪ Standard color coordinate and temperature using CS-1000
(over 26 inch)
Mode Coordinate Temp △uv
X Y
Cool 0.271 0.270 13,000K 0.0000
Medium 0.285 0.293 9,300K 0.0000
Warm 0.313 0.329 6,500K 0.0000
▪ Standard color coordinate and temperature using
CA-210(CH-14)
Mode Coordinate Temp △uv
X Y
Cool 0.271±0.002 0.270±0.002 13,000K 0.0000
Medium 0.285±0.002 0.293±0.002 9,300K 0.0000
Warm 0.313±0.002 0.329±0.002 6,500K 0.0000
▪ Standard color coordinate and temperature using
CA-210(CH-14) – by aging time

- 18 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
5.1.8. ALEF LED White balance table
ALEF LED module change color coordinate because of aging
time
Apply under the color coordinate table, for compensated aging
time
-Gumi producing model use only(Gumi PV)
Model : (Normal line) LA96xx, LA97- Not confirmed
GP4 Aging time
(Min)
Cool Medium Warm
X Y X Y X Y
271 270 285 293 313 329
1 0-2 281 287 295 310 320 342
2 3-5 280 285 294 308 319 340
3 6-9 278 284 292 307 317 339
4 10-19 276 281 290 304 315 336
5 20-35 275 277 289 300 314 332
6 36-49 274 274 288 297 313 329
7 50-79 273 272 287 295 312 327
8 80-119 272 271 286 294 311 326
9 Over 120 271 270 285 293 310 325
- Pyeongtaek producing model use only (Pyeongtaek PV)
Model(Aging chamber) LA96xx, LA97xx
GP4 Aging time
(Min)
Cool Medium Warm
X Y X Y X Y
271 270 285 293 313 329
1 0-5 280 283 295 302 320 327
2 6-10 276 278 291 297 316 322
3 11-20 271 272 286 291 311 316
4 21-30 267 268 282 287 307 312
5 31-40 265 263 280 282 305 307
6 41-50 262 260 277 279 302 304
7 51-80 260 258 275 277 300 302
8 81-119 259 256 274 275 299 300
9 Over 120 259 255 274 274 299 299
5.1.9. V-COM Adjust
– ONLY FOR GP2 2010year model. GP3 LW Series[2011year]
spec out!
5.2. Tool Option setting & Inspection per
countries
5.2.1. Overview
(1) Tool option selection is only done for models in Non-USA
North America due to rating
(2) Applied model: LA34N Chassis applied to CANADA and
MEXICO
5.2.2. Country Group selection
(1) Press ADJ key on the Adj. R/C, and then select Country
Group Menu
(2) Depending on destination, select US, then on the lower
Country option, select US, CA, MX.
Selection is done using +, - KEY
5.2.3. Tool Option inspection
▪ Press Adj. key on the Adj. R/C, then select Tool option
Model Tool 1 Tool 2 Tool 3 Tool 4 Tool 5 Tool 6 Tool 7
55LA9700-UA 33207 21265 29326 61837 47258 1354 48171
65LA9700-UA 34227 21265 29326 61837 47258 1354 48171
55LA9650-UA 33383 21009 29325 61837 47254 1354 46123
65LA9650-UA 34403 21009 29325 61387 47254 1354 46123
※Tool option can be reconstructed by Software
5.3. Local Dimming Inspection
(1) Press ‘TILT” key of the Adj. R/C and check moving
patterns. The black bar patterns moves from top to bottom.
If a local dimming function does not work, a whole screen
shows full white.
<Local dimming All model >

- 19 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
5.4. Magic Motion remote controller Check
5.4.1. Test equipment
▪ RF-remote controller for check, IR-KEY-CODE remote
controller.
▪ Check AA battery before test. A recommendation is that a
tester change battery every lots.
5.4.2. Test
(1) Make pairing with TV set by pressing “Start key(Wheel
key)” on RCU.
(2) Check a cursor on screen by pressing ‘Wheel key” of RCU
(3) Stop paring with TV set by pressing “Back+ Home” key of
RCU
5.4.3. Applied models
Chassis Model Name Magic RF receiver
LA34N 55/65LA9700-UA Built-in
55/65LA9650-UA
5.5. Wi-Fi MAC Address Check
5.5.1. Using RS232 Command
Command Set ACK
Transmission [A][l][][Set ID][][20][Cr] [O][K][x] or [N][G]
5.5.2. Check the menu on in-start
5.6. 3D pattern test (Only for 3D models)
5.6.1. Test equipment
(1) Pattern Generator MSHG-600 or MSPG-6100 (HDMI 1.4
support)
(2) Pattern: HDMI mode (model No. 872, pattern No. 83)
5.6.2. Test method
(1) Input 3D test signal as Fig.1.
(2) Press ‘OK” key as a 3D input OSD is shown.
(3) Check pattern as Fig2 without 3D glasses. (3D mode
without 3D glasses)
Fig.2 Fig.3
<OK in 3D mode without 3D glasses> <NG in 3D mode without 3D glasses>

- 20 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
5.7. HDMI ARC Function Inspection
5.7.1. Test equipment
- Optic Receiver Speaker
- MSHG-600 (SW: 1220 ↑)
- HDMI Cable (for 1.4 version)
5.7.2. Test method
(1) Insert the HDMI Cable to the HDMI ARC port from the
master equipment (HDMI1)
(2) Check the sound from the TV Set
(3) Check the Sound from the Speaker or using AV & Optic
TEST program (It’s connected to MSHG-600)
* Remark: Inspect in Power Only Mode and check SW version
in a master equipment
5.8. Camera Function Inspection
(1) Objective : To check how it connects between Camera and
PCBA normally, and their Function
(2) Test Method : This Inspection is available only Power-Only
Status.
- Slide Camera Up.
- Camera’s Preview picture apeears on TV Set.
- Slide Camera Down.
5.9. Ship-out mode check (In-stop)
▪ After final inspection, press In-Stop key of the Adj. R/C and
check that the unit goes to Stand-by mode
6. AUDIO output check
6.1. Audio input condition
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
(3) RGB PC: 1KHz sine wave signal (0.7Vrms)
6.2. Specification
No Item Min Typ Max Unit Remark
1 Audio
practical
max Output,
L/R
(Distor-
tion=10%
max Output)
9.0
8.5
10.0
8.9
12.0
9.9
W
Vrms
(1) Measurement
condition
- EQ/AVL/Clear
Voice: Off
(2) Speaker (8Ω
Impedance)
<Slide Up Status> <Slide Down Status>