LG 70UK6570AUB User manual

P/NO : MFL70427814 (1808-REV01)
CHASSIS : UA83Q
MODEL : 70UK6570AUB
MODEL : 70UK6570PUB
MODEL : 70UK6190PUB
LED TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONFIDENTIAL
Any reproduction, duplication, distribution (including by way of email, facsimile or other electronic means),
publication, modification, copying or transmission of this Service Manual is STRICTLY PROHIBITED unless you
have obtained the prior written consent of the LG Electronics entity from which you received this Service Manual.
The material covered by this prohibition includes, without limitation, any text, graphics or logos in this Service
Manual.
Copyright © 2018 LG Electronics Inc. All rights reserved. Only training and service purposes.

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Only for training and service purposes.
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS ................................................................... 4
SPECIFICATION .......................................................................................6
SOFTWARE UPDATE ............................................................................. 9
BLOCK DIAGRAM ................................................................................. 10
EXPLODED VIEW .................................................................................. 22
DISASSEMBLY....................................................................................... 23
TROUBLE SHOOTING GUIDE ................................................ APPENDIX

- 3 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩand 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS

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Only for training and service purposes.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent poten-
tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electri-
cally shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

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Only for training and service purposes.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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Only for training and service purposes.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application range
This specification is applied to the LED TV used UA83Q
chassis.
2. Test condition
Each part is tested as below without special appointment.
(1) Temperature: 25 °C ± 5 °C, CST: 40 °C ± 2 °C
(2) Relative Humidity: 65 % ± 10 %
(3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
(5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
(1) Performance: LGE TV test method followed
(2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
4. General Specification
No Item Specication Remark
1 Market North America
2 Broadcasting system ATSC / NTSC-M, 64 & 256 QAM
3 Available Channel VHF : 02~13
UHF : 14~69
DTV : 02-69
CATV : 01~135
CADTV : 01~135
4 Receiving system Digital : ATSC, 64 & 256 QAM
Analog : NTSC-M
5 Video Input NTSC-M Rear (1EA)
6 Component Input Y/Cb/Cr, Y/ Pb/Pr Rear (1EA)
7 HDMI Input HDMI 1 PC / DTV format Side, Support 6Gbps
HDMI 2 PC / DTV format Side, Support 6Gbps, Support ARC
HDMI 3 PC / DTV format Rear, Support 6Gbps
HDMI 4 PC / DTV format Rear, Support 6Gbps
8 Audio Input Component / AV Audio / DVI Audio L/R Input ; Rear
Component and AV and DVI use same jack ;
9 SPDIF out(1EA) Optical Audio out Rear (1EA),
10 USB Input(3EA) EMF, DivX HD, For SVC (download) JPEG, MP3, DivX HD
Side(1EA), Rear(1EA)

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Only for training and service purposes.
5. External Input Support Format
5.1. Component (Y, PB, PR)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
HDMI-PC
1 640*350 31.46 70.09 25.17 EGA
2 720*400 31.46 70.08 28.32 DOS
3 640*480 31.46 59.94 25.17 VESA(VGA)
4 800*600 37.87 60.31 40 VESA(SVGA)
5 1024*768 48.36 60.00 65 VESA(XGA)
6 1360*768 47.71 60.01 84.75 VESA(WXGA)
7 1152*864 54.34 60.05 80 VESA
8 1280*1024 63.98 60.02 109.00 SXGA Support to HDMI-PC
9 1920*1080 67.5 60 158.40 WUXGA
(Reduced Blanking)
10 1920*1080 135 120 297 UDTV 1080P
11 3840*2160 54 24.00 297.00 UDTV 2160P
12 3840*2160 56.25 25.00 297.00 UDTV 2160P
13 3840*2160 67.5 30.00 297.00 UDTV 2160P
14 4096*2160 53.95 23.97 296.70 UDTV 2160P
15 4096*2160 54 24 297 UDTV 2160P
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
1 720*480i 15.73 59.94 13.50 SDTV, DVD 480I(525I)
2 720*480i 15.75 60.00 13.51 SDTV, DVD 480I(525I)
3 720*480p 31.47 59.94 27.00 SDTV 480P
4 720*480p 31.50 60.00 27.02 SDTV 480P
5 1280*720p 44.96 59.94 74.17 HDTV 720P
6 1280*720p 45.00 60.00 74.25 HDTV 720P
7 1920*1080i 33.72 59.94 74.17 HDTV 1080I
8 1920*1080i 33.75 60.00 74.25 HDTV 1080I
9 1920*1080p 67.43 59.94 148.5 HDTV 1080P
10 1920*1080p 67.50 60.00 148.5 HDTV 1080P
5.2. HDMI Input (PC/DTV)

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Only for training and service purposes.
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
DTV
1 640*480 31.46 59.94 25.12 SDTV 480P
2 640*480 31.5 60.00 25.12 SDTV 480P
3 720*480 15.73 59.94 13.50 SDTV, DVD
480I(525I)
Spec. out but display
4 720*480 15.75 60.00 13.51 SDTV, DVD
480I(525I)
5 720*576 15.62 50.00 13.50 SDTV, DVD
576I(625I) 50Hz
6 720*480 31.47 59.94 27 SDTV 480P
7 720*480 31.5 60.00 27.02 SDTV 480P
8 720*576 31.25 50.00 27 SDTV 576P
9 1280*720 44.96 59.94 74.17 HDTV 720P
10 1280*720 45 60.00 74.25 HDTV 720P
11 1280*720 37.5 50.00 74.25 HDTV 720P
12 1920*1080i 28.12 50.00 74.25 HDTV 1080I
13 1920*1080i 33.72 59.94 74.17 HDTV 1080I
14 1920*1080i 33.75 60.00 74.25 HDTV 1080I
15 1920*1080p 26.97 23.97 63.29 HDTV 1080P
16 1920*1080p 27.00 24.00 63.36 HDTV 1080P
17 1920*1080p 33.71 29.97 79.120 HDTV 1080P
18 1920*1080p 33.75 30.00 79.20 HDTV 1080P
19 1920*1080p 56.25 50.00 148.5 HDTV 1080P
20 1920*1080p 67.43 59.94 148.35 HDTV 1080P
21 1920*1080p 67.5 60.00 148.50 HDTV 1080P
22 1920*1080p 112.5 100 297.00 UDTV 1080P
23 1920*1080p 134.86 119.88 296.70 UDTV 1080P
24 1920*1080p 135.00 120 297 UDTV 1080P
25 3840*2160p 53.95 23.98 296.70 UDTV 2160P
26 3840*2160p 54 24.00 297.00 UDTV 2160P
27 3840*2160p 56.25 25.00 297.00 UDTV 2160P
28 3840*2160p 61.43 29.97 296.70 UDTV 2160P
29 3840*2160p 67.5 30.00 297.00 UDTV 2160P
30 3840*2160p 112.5 50.00 594 UDTV 2160P
31 3840*2160p 134.86 59.94 593.40 UDTV 2160P
32 3840*2160p 135 60.00 594 UDTV 2160P
33 4096*2160p 53.95 23.98 296.70 UDTV 2160P
34 4096*2160p 54 24.00 297 UDTV 2160P
35 4096*2160 56.25 25.00 297 UDTV 2160P
36 4096*2160 61.43 29.97 296.70 UDTV 2160P
37 4096*2160 67.5 30.00 297 UDTV 2160P
38 4096*2160 112.5 50.00 594 UDTV 2160P
39 4096*2160 134.86 59.94 593.40 UDTV 2160P
40 4096*2160 135 60.00 594 UDTV 2160P

- 9 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
SOFTWARE UPDATE
1. USB
(1) Insert the USB memory Stick to the USB port
(2) Automatically detect the SW Version and show the below
message
(3) Click [YES]: initiate the download and install of the update.
(4) Click [Check Now]: move to “About This TV” page for
update
(5) TV is updating
(6) After finished the update, below Pop-up appear
(7) Click [Yes] : TV will be DC OFF -> ON
(8) After TV turned on, Check the updated SW Version and
Tool Option
2. NSU
(This Function is needed to connect to the internet)
(1) Menu -> All Settings -> General -> About This TV
(2) Click [CHEK FOR UPDATES] : system check newest
version
(3) Click [DOWNLOAD AND INSTALL]
(4) TV is updating
(5) After finished the update, below Pop-up appear
(6) Turn OFF the TV and On. Check the updated SW Version
and Tool Option

- 10 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
BLOCK DIAGRAM
1. Main IC
Main IC
eMMC (4GB)
CI Slot
USB1 (2.0)
OCP USB2 (2.0)
HDMI3
HDMI2(ARC)
HDMI1
Air/
Cable
TUNER
(T2/C/A)
TUNER
(S,S2)
DVB-S
LNB
T2/C/S/S2 H-NIM tuner
IF (+/-)
P_TS_OUT
P_TS_IN
Sub MICOM
X_TAL
32.768KHz
I2C 1
IR / KEY
LOGO LIGHT(Ready)
WIFI/BT Combo
USB_WIFI
X_TAL
24MHz
Sub Assy LAN
ETHERNET
SPDIF
AV/COMP CVBS/YPbPr
SPDIF OUT
H/PAMP
RS-232 MAX323
MAIN Audio AMP
I2S Out
I2C 4
Vx1 51P (8 lane) Vx1 / EPI/ CEDS
FCIC SPI/ I2C 6
EPI
PMIC
Level
shifter
M0
M1
IF_S
IF
GST/MCLK/GCLK/EO/I2C 6NVRAM (256Kb)
I2C 4
I2C 2
EPI block
IQ (+/-), IP(+/-)
HDMI4
TS
DDR3 2133 X 32
(256MB X 2EA)
DDR3 2133 X 32
(512MB X 2EA)
EPI 60P (65”:8 lane, 55”↓:6lane), CEDS 68P
Area OPT

- 11 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
2. EPI / CEDS
CEDS 6lane 68Pin / EPI 6Lane 60Pin
BOE Panel
3840x2160@60p
1.5Gbps
[ PAD_MOD_TX_P02/ N02 ~ P09/ N09] CEDS 6lane 68Pin / EPI 6Lane 60Pin
LGD Panel
3840x2160@60p
3Gbps(55” ↓ )
/2Gbps(65” )
PMIC
&
Level Shifter
RT6950(LGD)
SW50212(BOE)
CLK(x10)
VGL1
VST
GIP_RST
LS_VGL
VGH_EVEN
VGH_ODD
HVDD
EPI 3Lane 60P ( 55” ↓ )
EPI 4Lane 60P ( 65” )
EPI 3Lane 60P ( 55” ↓ )
EPI 4Lane 60P ( 65” )
GMA
(1, 5, 9, 10, 13, 24,18)
[PAD_MOD_TX_P12(LVA3- )]
P
M
I
C
PMIC_RESET
LOCKOUT12
GST, E/ O, MCLK, GLCK
[ PAD_I2S_IN_WS(TCON1)(GPIO)]
[PAD_I2S_IN_SD(TCON2)(GPIO)]
[PAD_SPDIF_IN(TCON3)(GPIO)]
[PAD_GPIO16(TCON4)(GPIO)]
Sub PMIC
(RT5093)
VDD
VCOM1
VCOMLFB
VCOMRFB
VCOM2
[ PAD_MOD_TX_P02/ N02 ~ P09/ N09]
GAMMA
(RT6508)
BOE Only
GMA
(2, 3, 4, 7, 8,
11, 12, 15, 16, 17)
[ PAD_GPIO30SCK4]
[PAD_GPIO31SDA4]
68pin
60pin
68pin
60pin
LDO
(TJ4320) VTERM
[ PAD_GPIO17_PM(PM_SPI_CK2]
[PAD_GPIO18_PM(PM_SPI_DI2)]
[PAD_GPIO19_PM(PM_SPI_DO2)]
[PAD_GPIO10_PM(PM_SPI_CZ2)]
Main IC

- 12 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
3. Vx1
I2C_ A6
Vx1 8Lane 51P
2
2
C
A
2
C
H n
Panel
3840x2160@60p
H
LOCKAn
I
2
C
A
6
6
6
DATA_FORMAT_0/ 1
[ PAD_GPIO23]
[ PAD_MOD_TX_P00~ 07]
[PAD_GPIO31SDA4]
[PAD_GPIO24]
AGP_CTL
A
G
P
C
T
L
VX1_MSE
BIT [2:3] DISPLAY TYPE TYPE Data lane RGB/M+ COMMENT
[Level 0 : Level 0] LCD_UHD VBY1 N/A RGB/M+ V16_V17_V18 [Level 0 : Level 1]
[Level 0 : Level 2]
[Level 0 : Level 3]
[Level 1 : Level 0] LCD_UHD LGD_EPI_3G V18 6lane RGB
[Level 1 : Level 1] LCD_UHD LGD_EPI_3G V18 6lane M+ [Level 1 : Level 2] LCD_UHD LGD_EPI_3G V17 6lane M+ [Level 1 : Level 3]
[Level 2 : Level 0] LCD_UHD BOE_CEDS_1.5
G V18 12lane RGB
[Level 2 : Level 1] LCD_UHD BOE_CEDS_1.5
G 17Y_18Y 12lane RGBW
[Level 2 : Level 2]
[Level 2 : Level 3]
[Level 3 : Level 0] LCD_UHD LGD_EPI_3G V18 8lane RGB V18 8lane :
LGD 65UK75
65UK63
[Level 3 : Level 1] LCD_UHD LGD_EPI_3G V18 8lane M+
[Level 3 : Level 2] LCD_UHD LGD_EPI_3G
Q- SAC V18 6lane RGB Q- SAC :
LGD 49inch
Only
[Level 3 : Level 3] LCD_UHD LGD_EPI_3G
Q- SAC V18 6lane M+
[ PAD_MOD_TX_P12(LVA3- )]
[PAD_MOD_TX_N12(LVA3+)]
[PAD_GPIO30SCK4]
[PAD_GPIO19]
[PAD_GPIO20]
Main IC
Main IC
IC
Main IC Main IC
Main IC
Main IC
Main IC
Main IC Main IC
Main IC
Main IC

- 13 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
4. Tuner
18Y Tuner
Main
[ B1_+3.3V_RF] 3
[ +3.3V_DEMOD_TU] 11
[B3_+1.2V_DEMOD] 13
[IF[ P] ] 8
[IF[ N] ] 7
[IF_AGC] 5
[TU_SIF] 6
[CVBS] 4
[ERROR] 14
[MCLK] 15
[SYNC] 16
[VALID] 17
AC5 [ PAD_TS2_CLK]
AD4 [ PAD_TS2_SYNC]
AC4 [ PAD_TS2_VLD]
EWBS_TU
FE_DEMOD1_TS_CLK
FE_DEMOD1_TS_SYNC
FE_DEMOD1_TS_VAL
D[ 0- 7] 18- 25 FE_DEMOD1_TS_DATA [ 0- 7] [ GPIO_27~ 34_TP0_D0~ D7]
[ RESET1_DEMOD] 10
/ TU_RESET1_TU AH4 [ PAD_GPIO13]
[LNB_TX1] 12
[LNB] 26
I2C_SCL_2
I2C_SDA_2
+3.3V_NORMAL
IF_P_TU
IF_N_TU
TU_SIF_TU
TU_CVBS_TU
IF_AGC_TU
AL11 [ PAD_IP_T]
AM10 [ PAD_IM_T]
AM11 [ PAD_IFAGC_T]
AL12 / AM12 [ SIF_P/ N]
Y2 [ PADA_CVBS0]
+ D_Demod_Core
LNB1
IC7001
LNB1_OUT
1.2K Ω
5 [ SCL]
6[ SDA]
8[ TONECTRL]
2[ LNB]
33 Ω
33 ΩAG10 [ PAD_TGPIO2SCK1]
AH10 [ PAD_TGPIO3SDA1]
AM8 [ PAD_IP_S]
AL8 [ PAD_IM_S]
AK10 [ PAD_QP_S]
AL9 [ PAD_QM_S]
AK8 [ PAD_IFAGC_S]
AH9 [ PAD_GPIO26 (DISEQC_OUT)]
IF_S_IP_MAIN
IF_S_IN_MAIN
IF_S_QP_MAIN
IF_S_QN_MAIN
[I[ P] ] 59
[I[ N] ] 60
[Q[ P] ] 62
[Q[ N] ] 61
[SAT_AGC] 58
EXT_Demod
Option
IF_S_AGC_MIAN
[SCL_RF] 1
[SDA_RF] 2
0 Ω
Main Ball No : 27*27 _package
+3.3V_NORMAL
3.5V_ST
LNB1_TX
(Phillippine only)
(Phillippine only)
Ready- Not user
Ready- Not user
IC

- 14 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
5. Video / Audio IN/OUT
HDMI_ARC
ST_GPIO_23_H0_ARC[AD8]
[AL12] PAD_SIFP
I2C_SDA_0_AMP1 / I2C_SCL_0_AMP1
AUD_SCK
AMP_RESET_N
AUDA_OUTR
AUDA_OUTL
H/P Jack
SIDE_HP_MUTE
[M3]PAD_EARPHONE_OUTR
[M2]PAD_EARPHONE_OUTL
TU_SIF_TU
H/P AMP
(IC6300)
LPF
[E10]PAD_GPIO7_PM
SPDIF_OUT
HP_LOUT_JACK
HP_ROUT_JACK
LPF
LPF
Main
IC
Tuner
AUD_LRCH
AUD_LRCK
AMP_MUTE
SPK_R+ / R-
SPK_L+ / L-
MAIN AMP
(IC5800)
MICOM
SPK L
SPK R
22
26
[38] CLK_I
[8] WCK
[7] SDATA
[10,11]
[36]
[12]
[30, 33]
[18, 21]
AV/COMP
HDMI2
SPDIF
HP_DET
[AL15]PAD_GPIO21
[
Y3]PADA_CVBS_OUT1
SIF_P
SIF_N
[AM12] PAD_SIFM
DTV/MNT_V_OUT
COMP1_Y/CVBS
[V2]PADA_GIN1P / [Y1] PADA_CVBS1
AV1_CVBS_DET
[
D3]PAD_I2S_OUT_SD2(GPIO
)
COMP1_Pb / COMP1_Pr / COMP1_DET
[W2]PADA_RIN1P / [v3]PADA_BIN1P / [C1] PAD_I2S_OUT_SD1
COMP1/AV1/DVI_L_IN
COMP1/AV1/DVI_R_IN
[
L2]PAD_LINEIN_L0
[
L1]PAD_LINEIN_R0
[
E5]PAD_SPDIF_OUT
[E2]PAD_I2S_OUT_WS
[D1]PAD_I2S_OUT_SD
[D2]PAD_I2S_OUT_BCK
[F2]PAD_DDCR_DA / [F3]PAD_DDCR_CK
5

- 15 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
Main IC
HDMI2.0_1_HPD
TMDS1 - D0/D1/D2/CLK
DDC_SCL1 / DDC_SDA1
MICOM
(IC3000)
HDMI2.0_1_5V_DET
HDMI2.0_2_HPD
TMDS2 - D0/D1/D2/CLK
DDC_SCL2 / DDC_SDA2
HDMI2.0_2_5V_DET
HDMI2.0_3_HPD
TMDS3 - D0/D1/D2/CLK
DDC_SCL3 / DDC_SDA3
HDMI2.0_3_5V_DET
HDMI2.0_4_HPD
TMDS4 - D0/D1/D2/CLK
DDC_SCL4 / DDC_SDA4
HDMI2.0_4_5V_DET
HDMI2 with ARC
HDMI1
HDMI3 HDMI4
HDMI_CEC
HDMI_ARC
HDMI_CEC
HDMI_CEC
6. HDMI2.0

- 16 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
RS232C
(IC7200)
WIFI_DM / DP
SOC_RX / TX
USB2.0_2_DM / DP
USB3
DEBUG_RX / TX
Main
USB2
USB2.0_3_DM / DP
MICOM
(IC3000)
Wafer
(P200)
Wafer
(P4000)
DEBUG UART
Wafer
(P201)
5
7 9
10 15 16 19 20
SOC_RX / TX
DCDC OCP
(IC4501)
+5V_USB3
+5V_USB3
WOL/WIFI_POWER_ON
COMBO_RESET
BT_WAKEUP_DEVICE
BT_WAKEUP_HOST
IR
LED_R
KEY2
KEY1
DCDC OCP
(IC4700)
DOUT1
RIN1
PHONE JACK
US Only
IC
7. USB / WIFI / M-REMOTE / UART(Debug)

- 17 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
I2C_SDA6
EPI PMIC
P7100
Vx1 51P
I2C_SCL6
1.8k Ω
I2C_SDA_1
I2C_SCL_1
Main IC
1.8k Ω
+3.3V_NOR
1.8k Ω
1.8k Ω
+3.3V_ST
MICOM
I2C_SDA4
I2C_SCL4
NVRAM
AMP
I2C_SDA2
I2C_SCL2
LNB
Tuner
1.8 k Ω
1.8 k Ω
+3.3V_NOR
1.8k Ω
1.8k Ω
+3.3V_NOR
33 Ω
33 Ω
TCON_I2C_EN
33 Ω
33 Ω
100Ω
33 Ω
EPI / CEDS only
Vx1 only
8. I2C Map

- 18 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
WOL/ETH_POWER_ON
USB_CTL2
Main IC
MICOM
USB1 OCP USB1
INSTANT_BOOT
/USB_ODC2 USB_CTL3
USB2 OCP USB2
/USB_ODC3
SOC_RESET
BIT0~6
HW option
ADC 1~5
PCM_RESET
PCMCIA OCP
PCM_5V_CTL
DATA_FORMAT_1
Panel
DATA_FORMAT_0
VX1_MSE
AGP_CTRL
HTPDAn/MCKL_A
LOCKAn
PMIC
PWM_DIM2
POWER
PWM_DIM
L/D_CLK
L/D_DO
L/D_VSYNC
TCON_I2C_EN/GCLK_A
VID_CPU
CPU DCDC
VID_CPU2
VID_CORE
CORE DCDC
/TU_RESET1
Tuner
AMP_RESET_N
Audio AMP1
COMP1_DET
Component/AV Jack
HP_DET
H/P Jack
AV1_CVBS_DET
9. GPIO

- 19 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
IC100
RS232C
Debug port
P200
SOC_RX/TX
MICOM DEBUG 4P
P3000
MICOM_DEBUG
AMP
IC5800
AMP_MUTE
MODEL1_OPT_0/1/2/ 3
GND
+13V TO PANEL_VCC PANEL_CTL
HDMI 1 / 2 / 3 /4
JK3101/JK3102/JK3103/JK3104
HDMI_CEC
RESET IC
IC1300
POWER_DET
POWER WAFER
P1001
INV_CTL
MODE_SELECT_PWM1
RL_ON
I2C_SCL_1_MICOM / I2C_SDA_1_MICOM
WOL/ETH_POWER_ON
SOC_RESET
INSTANT_BOOT
OPT0 NON LOGO LCD/LOGO LCD
NON LOGO OLED/LOGO OLED
OPT1 TV-NON EPI/BOX/TV EPI/BOX
OTP2 RESERVED
OPT3 M16/RTK/H15
MICOM_RESET
MICOM X- TAL
X3001
32.768KHz
51P VX1 Wafer
AM_MODE_DET_OLED
IR / KEY/WIFI/BT
P4000
EDID_WP
3D&L_DIM_EN
3.5V_ST- 1.5V DCDC
IC2303
POWER_ON/OFF2_3 13V- 3.3V NORMAL
IC2300
13V- 1V DCDC
IC2302
POWER_ON/OFF2_4
POWER_ON/OFF1 13V- 5V NORMAL DCDC
IC2500
WIFI_EN
T_CON_SYS_POWER_OFF_OLED
IR
EYE_SCL / EYE_SDA
WOL/WIFI_POWER_ON
BT_WAKEUP_DEVICE
COMBO_RESET
BT_WAKEUP_HOST
KEY1 / KEY2
LED_R
GND
+3.5V WIFI
RETENTION_DISABLE
GND
10k Ω
SYSTEM_DEBUG
Main IC
10. GPIO(MICOM – ABOV)

- 20 - Copyright © LG Electronics Inc. All rights reserved.
Only for training and service purposes.
LDODCDC
D13.2V
3.5V ST
4A
IC2305
MICOM
IR Ass’y
RS-232
WiFi Module
FET
FET(Q4101)
+AVDD_NODIE
L302
1.5V DDR
3A
IC2302
SoC(DDR)
CPU_1V0
3A
IC2309
SoC(VDDC_CPU)
FET(Q1101)
Panel_VCCL7601/2L1100
+AVDD33_AU33
L322
+AVDD_DMPLL
L333
CORE_1V0
12A
IC2310
SoC(VDDC)
LNBL7100
11. Power