LG 24MP48HQ-P User manual

Printed in China
COLOR MONITOR
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS NO. : LM44A
MODEL:
24MP48HQ
Internal Use Only

- 2 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
CONTENTS
CONTENTS .............................................................................................. 2
PRECAUTION............................................................................................3
SERVICING PRECAUTIONS.....................................................................4
SPECIFICATIONS......................................................................................6
TIMING CHART .......................................................................................11
ADJUSTMENT .........................................................................................14
BLOCK DIAGRAM...................................................................................18
TROUBLE SHOOTING ............................................................................19
EXPLODED VIEW .................................................................................. 22
SVC. SHEET ...............................................................................................

- 3 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD monitor that
are important for safety. These parts are marked on the
schematic diagram and the Exploded View. It is essential
that these critical parts should be replaced with the
manufacturer’s specified parts to prevent electric shock, fire or
other hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the original parts
and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE WITH
BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged in four
corners.
• Do not press on the panel, edge of the frame strongly or electric
shock as this will result in damage to the screen.
• Do not scratch or press on the panel with any sharp objects,
such as pencil or pen as this may result in damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are grounded
through wrist band.
• Do not leave the module in high temperature and in areas of
high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within the
module.
• If the surface of panel become dirty, please wipe it off with a
softmaterial. (Cleaning with a dirty or rough cloth may damage
the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or LIPS
part, must disconnect the AC power because high voltage
appears at inverter circuit about 650Vrms.
• Handle with care wires or connectors of the inverter circuit. If
the wires are pressed cause short and may burn or take fire.
Leakage Current Hot Check Circuit
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
Ω
0.15uF

- 4 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or re-connecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) is opropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500ºF to 600ºF.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500ºF to 600ºF)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500ºF to 600ºF)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

- 5 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Copyright © 2010 LG Electronics. Inc. All right reserved. - 6 - LGE Internal Use Only
Only for training and service purposes
SPECIFICATIONS
1. General Specification
24MP48HQ/27MP48HQ(Novatek)
No Item Content Remark
1 Customer BRAND
2 User Model Name 24MP48HQ/27MP48HQ
3 Sale region Refer to Suffix standard
4 Feature 24”Wide LCD MONITOR/27” Wide LCD Monitor
5 Chassis Name LM44A
6
General
Scope
External SW
&Adj. MENU, READER, FUNC., AUTO, INPUT/Exit, Power
Function OSD,DDC2B,DDC2AB, HDCP, Control Lock,
Original Ratio / Wide, Black level, Smart Energy Saving
Screen Split, SUPER RESOLUTION+，Color Weakness,
Reader mode
7
Power Cord
Length : 1.5±0.05 M
Shape : Wall-out
Color : Black
Refer to Suffix
standard and
power cord table
8 Cable
Signal Cable
(D-SUB)
Length : 1.5m
Shape : Detachable Type
Color : Black
Pin : Triple Row, 15 Pin D-Sub
Refer to Suffix
standard
DVI
Length : 1.5m
Shape : Detachable Type
Color : Black
Pin : Triple Row, 18-Position DVI-D
Refer to Suffix
standard
Audio Length : ,Shape : ,Color: ,Pin Do not Support
TV Length : ,Shape : ,Color: ,Pin Do not Support
9 Power
24inch
Input: AC100~240V 50~60Hz, 1.1A Max; Output: DC 19V 1.3A
27inch
Input: AC100~240V 50~60Hz, 1.1A Max; Output: DC 19V 1.7A
Refer to Suffix
standard
10 Set Rating 24inch：19V，1.3A
27inch：19V，1.6A
11 Applying module list
P/No Specification
24MP48HQ
Open Cell: EAJ62570001
BLU: EBV61158006
Open Cell: LM238WF1-SJE1
BLU: LM23010045A
27MP48HQ:
Open Cell: EAJ63370101
BLU: EBV61138210
Open Cell: LM270WF5-SJN1
BLU: LM27030019D

Copyright © 2010 LG Electronics. Inc. All right reserved. - 7 - LGE Internal Use Only
Only for training and service purposes
2. Mechanical specification
27MP48HQ / 27MP48HQ-W
No Item Content Remark
1 Product
Dimension
Width (W) Length (D) Height (H)
Before Packing 634.0mm
634.0mm
211.9mm
71.3mm 479.7mm 381.0mm With stand
Without stand
After Packing 703 mm 446 mm 125 mm
2 Product
Weight
Only SET 3.9 kg With stand
3.6kg Without stand
With BOX 5.4kg
3
Container
Loading
Quantity
Individual or
Palletizing
20ft 40ft / 40ft HC
W/Wide
(NON EU)
Indi. Pallet Indi. Pallet
680 510 1445
/ 1615
1173
/ 1311
4 Stand
Assy
Type Base detachable
Size (W x D x H) 231.8 X 212.3 X 148.3
Tilt Degree -3(+2/-1) ~ 20(+5/-0) degree
Tilt force 0.9 ~ 1.3 kgf
Folding Degree None
5 Appearance General Refer to Standard of LG(56)G2-1011
Tilt force
Folding Degree None
6 Appearance General Refer to Standard of LG(56)G2-1011
*Gap spec : IA-BI≤1mm; IA-CI≤1mm; IB-CI≤1mm

Copyright © 2010 LG Electronics. Inc. All right reserved. - 8-LGE Internal Use Only
Only for training and service purposes
3. Optical Character
24MP48HQ
No Item Criteria Remark
1 Viewing Angle
<CR≥10>
Horizontal(R/L) : 178º (Typ.)
Vertical(Top/Bottom) : 178º (Typ.)
2 Luminance Max Luminance 200(min), 230(Typ.)
(Full white pattern, 0.7V) Custom
6500K Luminance 170(min)
(Full white pattern, 0.7V) Warm
8000K Luminance 150 (min)
(Full white pattern, 0.7V) Medium
9300K Luminance 130(min)
(Full white pattern, 0.7V) Cool
Luminance
Uniformity 75%(min),
3 Contrast Ratio 600(MIN), 1000(TYP), DFC->5,000,000:1(Typ.)
4 Response Time
Gray to Gray: 14ms(Average),
-. Low : 9 ms ~ 11 ms
-. Middle : 7 ms ~ 9 ms
-. High : 5.5 ms ~ 6.5 ms
5 Paper mode
Reader1 X: 0.3650 ± 0.030, Y: 0.3605 ± 0.030
Reader2 X: 0.3530 ± 0.030, Y: 0.3670 ± 0.030
5 CIE C6lor
Coordinate
s
Minimum Normal Maximum
White
(Custom)
WXTyp-0.03 0.313 Typ+0.03
Custom
(Module spec)
WY0.329
Red WXTyp-0.03 0.652 Typ+0.03
WY0.338
Green WXTyp-0.03 0.320 Typ+0.03
WY0.610
Blue WXTyp-0.03 0.150 Typ+0.03
WY0.063
White
(6500K)
WXTyp-0.015 0.313 Typ+0.015 Warm
(Adjustment)
WY0.329
White
(8000K)
WXTyp-0.015 0.295 Typ+0.015 Medium
(Not adjusted)
WY0.305
White
(9300K)
WXTyp-0.015 0.283 Typ+0.015 Cool
(Adjustment)
WY0.298

- 9-
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
If we select 1024x768@75Hz , our set
1 Supported Sync. Type Separate Sync., Digital
2 Operating Frequency
Analog/
Digital
Horizontal 30  83kHz 20MP48A&24/27MP4
8HQ
Vertical 56  75 Hz
HDMI
Horizontal 30  83kHz
24/27MP48HQ
Vertical 56Hz ~ 75Hz
3 Resolution
Analog/
Digital
Max 1440*900@60Hz 20MP48A
Recommend 1440*900@60Hz
Analog/
Digital
Max. 1920×1080 @ 60Hz
24/27MP48HQ
Recommend 1920×1080 @ 60Hz
HDMI Max. 1920×1080 @ 60Hz 24/27MP48HQ
Recommend 1920×1080 @ 60Hz
4 Input Voltage Voltage :100 – 240 Vac
5 Inrush Current Cold Start : 50 A Hot : 120 A
6
Operating Condition Sync
(H/V) Video LED Wattage
On Mode
On/On Active white
24MP48HQ:25W(Typ) Test condition
1.1920x1080@60Hz
2. burst pattern
3. 100~240V
4. After aging 30min
20MP48A:17W(Typ)
27MP48HQ:28W(Typ)
On/On Active white
24MP48HQ:29W(Max)
20MP48A:21W(Max)
27MP48HQ:32W(Max)
Sleep Mode
(D-SUB , DVI, HDMI)
Off/On
On/Off
Off/Off
Off
white
Blinki
ng
≤0.3W
측정방법) 제어판 Æ
전원 옵션에서 디스
플레이 끄기와 PC를
절전모드로 하기 두
가지 설정이 있는데,
PC를절전모드로 하
기만 선택하고 측정
해야 함.
Off Mode
(Power switch off) - - Off ≤0.3 W(Typ.)
Smart Energy
Saving Low/high
/off On white
24MP48HQ/27MP48HQ
Low:10%~20%,2W/H
High:20%~30%,4W/H
20MP48A
Low:10%~20%,1W/H
High:20%~30%,3W/H
-Test Condition
(1)
EPA6.0
24MP48HQ<22W/H
20MP48A<15W/H
27MP48HQ<25W/H
margin >7%
Worst :margin>0
Adjust the center l
uminance to 200 c
d/㎡
4. Engineering Specification

-10 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
7
MTBF 30,000 HRS with 90%
Confidence level
Lamp Life : 30,000 Hours(Min)
8
Using Altitude 5,000 m (for Reliability) 3,000m(for FOS)
Environm
ent
Condition
Operatin-
g
Temperature 0 °C ~ 40 °C
Humidity ≤80%
Storage Temperature -20 °C ~ 60 °C
Humidity ≤85%
OSD
MENU
MENU
(Monitor
block)
Brightness 0 ~ 100
Contrast 0 ~ 100
Ratio Wide, Orihinal
Reader Reader1.Reader2 ,Off
Picture Mode Custom Text, Photo Cinema, Game,
Color Weakness On,Off
Picture Adjust
Super Resolution +
Sharpness 5
Gamma
17 Language:
English, Germanic,
French, Spanish,
Italian, Swedish,
Finnish, Portuguese
Brazilian Portuguese,
Polish, Russian,
Greek, Chinese,
Japanese, Korean,
Ukrainian
Hindi
Color Temp
Red
Green
Six Color
Reset
Display
Horizontal
Vertical
Clock
Phase
Power LED On, Off
Language ▶ENGLISH
Factory reset Reset, Cancel
Automatic
standby Off / 4H / 6H / 8H
Depend on
BOM suffix
(Country)
Notice :
APD: Auto Power Down, OSD 菜单中对应“Automatic standby”
-Apply standard: EU region HDMI model
Model spec 中OSD 描述部分

- 11-
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
(1) Standard Measurement Condition
• Ambient Luminance Level : dark ( < 10 lux)
• Ambient Temperature : Normal Temperature(10ºC ~ 25ºC)
• warm-up Time : More than 30 min (at Full White Pattern)
• Input Signal : VESA 1920 X 1080 @ 60 Hz
• Contrast : 70 (But, the contrast is 100 when we check response time)
• Brightness : Max. 100
• Color Temp : CUSTOM
• Clock/Clock Phase : The Best Setting
(2) Another Spec.: Product Specification Standard( LG(55)G1-1034 )
(3) Cosmetic Spec. : LCD Module IIS Spec.
C
5.1 Display Area Activearea
A
1) Active Display Area of the LCD Monitor Should be within Cabinet’s Bezel.
2) Distance Difference between Active Area and Bezel A A B
| A-B|<1.0 mm , | C-D|<1.0 mm
A: The Distance from The Left of Active Area to the Bezel
Bezel
B: The Distance from The Right of Active Area to the Bezel
C: The Distance from The Top of Active Area to the Bezel
D: The Distance from The Bottom of Active Area to the Bezel D
5. Applying module Character
24MP48HQ
No Item Content Remark
1 LCD Module
Feature
Maker LGD
Type TFT
Active Display Area 23.8inches(60.4cm) diagonal
Pixel Pitch [mm] 0.2745 mm x 0.2745 mm
Electrical Interface 2ch-LVDS
Color Depth 6-bit with A-FRC, 16.7M colors
Size (Outline) [mm] 535.84(H) x 307.5(V) x 1.3(D) mm (Typ.)
Surface Treatment Hard coating(3H), Anti-glare treatment of
the front polarizer
Operating Mode Transmissive mode, normally Black
Back light Unit White LED
R/T Typical 14ms
Max. 25ms
2
CIE Color
Coordinates
(색좌표)
Minimum Normal Maximum
White WXTyp-0.03 0.283 Typ+0.03 Cool
(9300K)
WY0.298
White
WXTyp-0.03 0.301 Typ+0.03 Medium
(8000K)
WY0.310
WXTyp-0.03 0.313 Typ+0.03 Warm
(6500K)
WY0.329
Red RX
Typ-0.03
0.652
Typ+0.03 Warm
(6500K)
RY0.338
Green GX0.320
GY0.610
Blue
BX0.150
BY0.063
Max. 25ms

Copyright © 2010 LG Electronics. Inc. All right reserved. - 12-LGE Internal Use Only
Only for training and service purposes
6. EDID
6.1
No Item Content 16진Data
1 Manufacturer ID GSM 1E 6D
2 Product ID (Analog)
(HDMI)
23222（5AB6）
23234（5AB8）
3 Year 2013
4 Version 1 01
5 Revision Analog : 3
HDMI : 3 03
6 Serial Number * *
7 Week ** **
8 Model Name LG IPS FULL HD --
9 Check Sum **** ****
10 Special Item Need to Input Serial Number
** Protocol : DDC 2AB
3.2.1 Data ( 128 Bytes ) Æ24MP47HQ/27MP47HQ
3.2.1.1 EDID Ver. 1.3 FOR ANALOG ( 128Byte)
3.1.2.2 EDID Ver. 1.3 FOR HDMI (256Byte)

- 13-
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
TIMING CHART
Applied Model : 24MP47HQ/27MP47HQ
Signal(Video & Sync)
A
B
C
D E F
V i deo
S y n c
H/V Timing
MODE CLASSIF
ICATION
Polar
ity
DOT
CLOCK
[MHz]
Frequency
[kHz]/
[Hz]
Total
Period
(E)
Display
(A)
Front
Porch
(D)
Sync.
(C)
Back
Porch
(B)
Resolut
ion
1 H(Pixels) - 28.321 31.468 900 720 18 108 54 720 X
400
V(Lines) + 70.08 449 400 12 2 35
2 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x
480
V(Lines) - 59.94 525 480 10 2 33
3 H(Pixels) - 31.5 37.5 840 640 16 64 120 640 x
480
V(Lines) - 75 500 480 1 3 16
4 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x
600
V(Lines) + 60.317 628 600 1 4 23
5 H(Pixels) + 49.5 46.875 1056 800 16 80 160 800 x
600
V(Lines) + 75.0 625 600 1 3 21
6 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x
768
V(Lines) - 60.0 806 768 3 6 29
7 H(Pixels) + 78.75 60.023 1312 1024 16 96 176 1024 x
768
V(Lines) + 75.029 800 768 1 3 28
8 H(Pixels) + 108.0 67.500 1600 1152 64 128 256 1152 x
864
V(Lines) + 75.000 900 864 1 3 32
9 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x
1024
V(Lines) + 60.02 1066 1024 1 3 38
10 H(Pixels) + 135.0 79.976 1688 1280 16 144 248 1280 x
1024
V(Lines) + 75.035 1066 1024 1 3 38
11
H(Pixels) -
146.25
65.290 2240 1680 104 176 280 1680 x
1050
V(Lines) + 59.954 1089 1050 3 6 30
12
H(Pixels) +
148.50
67.50 2200 1920 88 44 148 1920 x
1080
V(Lines) + 60 1125 1080 4 5 36
D-SUB/DVI DTV Mode is not supported (interlace mode)
HDMI support timing:mode 2,4,6,9,11,12

- 14-
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
HDMI Video input
Factory support
mode
(Preset Mode)
Horizontal
frequency
(KHz)
Vertical
frequency
(Hz)
HDMI
1 480P 31.5 60 O
2 576P 31.25 50 O
3 720P 37.5 50 O
4 720P 45 60 O
5 1080P 56.25 50 O
6 1080P 67.5 60 O
(Recommend Mode)

ADJUSTMENT
- 15-
Copyright©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
1. Coverage
Apply to 54.61 cm (21.5inch) Wide monitor made in Monitor Factory
Gumi Korea) or made in accordance with the standard of Gumi
Factory process.
2. Appointment
2.1 Adjustment must be done as fixed sequence, and adjustment
sequence can be modified after agreement withthe responsible
R&D engineer considering mass-production condition.
2.2 Power : AC 100 - 240 Voltage (Free)
2.3
Input signal:
2.3.1 RGB Input: As Product Standard (Signal ROM : LB800K
Ver1.6)
2.3.2 RJ-45 input : As Product Standard (Ethernet connection
through network from Host PC)
* PC spec for MK(Minikey) Loader (TBD): CPU - Dual core 2.0
GHzD, Memory - 2 GByteD
*PC spec for Host PC (TBD): CPU - Dual core 2.0 GHzD,
Memory - 2 GByteD
2.4 Warm-up Time: Over than 30 minutes
2.5 Adjustment equipment : White balance equipment (CA-110),
Display adjust equipment, VG-813(or VG819), Oscilloscope,
PC (More than 486 computer ) & White balance adjust
program.
3. Adjustment
3.1 Overview
Use factory automation equipment and adjust automatic
movement. But, do via passivity adjust in erroroccurrence.
3.2 Adjustment order
(refer to the Adjustment standard and adjustment command table)
3.2.1 Board Assembly Line
3.2.1.1 15pin D-sub (RGB)
· Connect input signal to 15pin D-sub.
· Check the firmware version & model name. And write the
firmware code to the serial Flash ROM by ISP.
· Ready for adjustment : check whether adjustment command
works normally or not and the operating state of each mode.
· Check the display state of gray color when 256 gray scale
patterns is embodied.
· Read by EEPROM Read Command to check whether initial
value is correct or not.
3.2.1.2 MK( Minikey ) Loading
· Open MK Loader Tool on MK Loader PC.
( * MK Loader PC should be connected Internet)
· Connect input signal to RJ-45 input with LAN cable connected
network devices such as routers.
· Turn on the Monitor set.
· Click the box when the °∞empty port °∞box is changed to “write
mini-key” in MK Loader Tool.
3.2.1.2 RJ-45 input
· Connect input signal to RJ-45 input with LAN cable connected
network devices such as routers.
· Check USB 1.1 Port (Keyboard/ Mouse) : @RJ-45 input
· Check USB 2.0 Port (USB Memory Stick 2port) : @RJ-45 input
· Check Audio (Ear-phone out/ Mic in/ Speaker) : @RJ-45 input,
PC audio volume : MAX
* LAN cable
* Router
* PC: vSpace S/W for N+ ( Ver 4.5.xx.xx ) --- Caution: Ver
4.4.xx.xx for N1742L family
3.2.2 Total Assembly Line
· Ready : Heat-run during5 minutes in the state with signal
· Connect input signal to D-sub.
· Default value before adjustment : Contrast “70” , Brightness
‘100(Max)”
3.2.3 Adjustment of Horizontal/Verticality screen
position, Clock and Clock Phase at each Mode.
· There is no special factory mode adjustment. Writing initial value
of EEPROM in Board Assembly line is adjusting Preset Mode
and Reset mode. (EEPROM is initialized when AC Power is
ON first.)
· If the change of FOS data is needed after M.P, it is possible by
writing Mode Data with EEPROM write command or modifying
the Mode Data in MICOM itself.
3.2.4 Color coordinates adjustment and Luminance
adjustment.
3.2.4.1 Color coordinates adjustment
· Monitor Contrast / Brightness
- Contrast : 70
- Brightness : 100(Max)
· CA-110: Set “channel 9”
· Signal Generator : At cut-off and drive --> 16 step pattern for
ADC (Program No.: 31)
- Output Voltage : 700 mVp-p
- Output Mode : Mode 12 (SXGA 60 Hz)mode Setting.
3.2.4.2.Adjustment : Board Assembly Line
· Select RGB mode
· Input 16 step pattern for ADC (Program No.31 (Mode 12,Pattern
11)). (Video level : 700 mVp-p)
· Adjust by commanding AUTO_COLOR_ADJUST
· Confirm “Success” message in Screen or Check the data of
0xFE, 0xFF address of EEPROM(0XA6) is 0xAA after waiting 5
seconds.
· If there is “FAULT” message or the data of 0xFE, 0XFF address
of EEPROM(0xA6) is not 0xAA, do adjust again.
· If all Adjustment is completed, the values of 6500K, User Color
and 9300K are saved automatically.
· Select RGB mode
· Input 16 step pattern for ADC (Program No.31 (Mode 12,Pattern
11)). (Video level : 700mVp-p)
· Adjust by commanding AUTO_COLOR_ADJUST
· Confirm “Success” message in Screen or Check the data of
0xFE,0xFF address of EEPROM(0xA6) is 0xAA after waiting 5
seconds.
3.2.4.3. Confirm at Total Assembly Line: adjustment
· Check the data of 0xFE, 0xFF address of EEPROM(0xA6) is
0xAA.
· If the data of 0XFE, FF address of EEPROM(0xA6) is not
0xAA, do adjust again by 3.2.4.2.

- 16-
Copyright©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
3.2.4.4. Confirm PRESET 6500K Color coordinates and Adjust
PRESET 9300K Color coordinates .
· Set as Aging mode ON, by commanding AGING_ON/OFF
command code.
· Select Module that is being used in present production by
commanding MODULE SELECT. ( It is not needed so far.
However, it will be needed to apply other modules)
· Send SYSTEM RESET command to set Module data.
· Input Full White Pattern (Video level : 700 mVp-p)
· Set as 9300K by commanding COLOR_MODE_CHANGE
Command code.
· Check to meet x = 0.283 ± 0.03, y=0.298 ± 0.03, and confirm.
· Only if it does not meet, adjust as below steps.
· Adjust to meet x = 0.283 ± 0.01, y=0.298 ± 0.01 in 5 minutes. and
confirm.
· Save 9300K Color by commanding COLOR SAVE Command
code.
· Set as 6500K by commanding COLOR_MODE_CHANGE
Command code.
· Check to meet x = 0.313 ± 0.03, y=0.329 ± 0.03, and confirm.
· Only if it does not meet, adjust as below steps.
· Adjust to meet x = 0.313 ± 0.01, y =0.329 ± 0.01, and confirm.
· Save 6500K Color by commanding COLOR SAVE Command
code.
· Set as sRGB by commanding COLOR_MODE_CHANGE
Command code.
· Adjust to meet Y = 150 ± 50, and confirm.
· Save sRGB Color by commanding COLOR SAVE Command
code.
3.2.4.5. Confirm User color coordinates .
· Confirm Whether User color is saved same as 6500K.
· After confirming Color coordinates, Must return to 6500K
3.2.5 Confirm Operation state.
3.2.5.1 Operation mode : Confirm whether each appointed mode
operate correctly or not.
3.2.5.2 Confirmation of Adjustment condition and operation :
Confirm whether it meet Auto/Manual equipment Adjustment
standard or not.
· Confirm Analog screen state : Confirm screen state at below
mode. Appointment mode (RGB input):
640*480 @60Hz (Mode 1),
800*600@75Hz(Mode 5),
1024*768@60Hz(Mode 8),
1280*1024@60Hz(Mode 12),
1680*1050@60Hz(Mode 11)
1920*1080@60HZ(Mode 12)
SMPTE pattern(Check 0%,5%,95%,100%)
–Mode can be added.
3.2.5.3. Confirm Auto adjustment operation.
· Input Analog 1 Dot on/off & Rectangle Pattern at Mode
12(1280x1024@60 Hz)
· Confirm adjustment operation by changing Clock, Phase, H/V
Position.
· Check Clock, Phase by pressing AUTO Key.
· Confirm first set of new lot by periods
3.2.5.4 Other quality
· Confirm that each items satisfy under standard condition that was
written product spec.
· Confirm Applying Module & MICOM Setting --> Confirm with
Service OSD
- Confirm at Service OSD by “Menu + Power key” on .(from
Power off)
- Confirm first set of new lot by periods, and confirm periodically
when there is Process change or Adjustment setting change.
3.2.5.5. OSD & Adjustment device Confirmation : Confirm
operation mentioned as product spec.
· Vary Brightness and Contrast and confirm the variation of
Luminance and display status.
· Operate the f-engine function and confirm variation of Luminance.
· Make sure to do FACTORY RESET after confirmation of OSD
function.
3.2.5.6. Confirm the display state by inputting 8 color Bar Pattern &
256 Gray Scale pattern.
3.2.5.7. DPM operation confirmation : Check if Power LED Color
and Power Consumption operates as standard.
· Measurement Condition : 230 V@ 50 Hz (Analog)
· Confirm DPM operation at the state of screen without Video
Signal.
3.2.5.8. RJ-45 input
· Connect input signal to RJ-45 input with LAN cable connected
network devices such as routers.
· Check USB 1.1 Port (Keyboard/ Mouse) : @RJ-45 input
· Check USB 2.0 Port (USB Memory Stick 2port) : @RJ-45 input
· Check Audio (Ear-phone out/Mic in/Speaker) : @RJ-45 input, PC
audio volume : MAX
* LAN cable
* Router
* PC: vSpace S/W for N+ ( Ver 4.5.xx.xx ) --- Caution: Ver
4.4.xx.xx for N1742L family
3.2.5.9. DDC EDID Write
( Set as Aging mode ON, by commanding AGING_ON/OFF
command code. )
1) SUFFIX: xxxxxPN
· Connect analog Signal Cable to D-sub wafer.
· Write EDID DATA to EEPROM(24C08) by using DDC2AB
protocol.
· Check whether written EDID data is correct or not.
(refer to Product spec).
--> After writing EDID, send Elapsed Time Clear command.
(Elapsed time should not be displayed, after EDID writing)
: Confirm periodically (in the first set of new lot, process change)
whether module name and aging time disappeared on the self-
diagnostics OSD with signal cable disconnected.
--> If Elapsed Time Clear command isn°Øt executed, module
name, aging time and TCO word appear on the self-diagnostics
OSD.(Module name and aging time should not appear after
writing EDID)
--> Make sure to do FACTORY RESET at the final process.
3.2.5.10. Shipping condition
· Contrast : 70
· Power Switch : Off
· Brightness : “100(Max)”
· Color Select : Preset ( 6500K )
· Language Select : Refer to product spec.
· OSD Position : Match Position with Key position
· Power indicator : ON
· Flatron f-engine : Normal

- 17-
Copyright©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
4.Standard of Auto/Manual equipment adjustment

- 18-
Copyright©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
*Note 1 (Test condition):
- mode12(1920x1080 @60Hz),
- Burst pattern
- 100V ~ 240Vac
- Analog & Digital & HDMI
- After aging 30min
5. Pattern for Adjustment
Pattern 0 : FULL BLACK (State of without video signal )
Pattern 1 : FULL WHITE (Don’t display other Character except for White Pattern)
Pattern 3 : FULL WHITE
Pattern 4 : Cross hatch pattern (Horizontal 10Line, Vertcial 8Line) & Rectangle Pattern
Pattern 5 : 1 Dot on, 1 Dot off & Rectangle Pattern
Pattern 6 : Vertical Sync only input (Use signal cable of which Pin #5 is GND)
Pattern 7 : Horizontal Sync only input (Use signal cable of which Pin #5 is GND)
Pattern 8 : State of without Vertical/Horizontal Sync and Video Signal. (Use signal cable of which Pin #5 is GND)
Pattern 9 : 8 Color Bar Pattern + 16 Gray Level Pattern
Pattern 10 : SMPTE Pattern
Pattern 11 : 16 Gray Step Pattern (700mV)
)

BLOCK DIAGRAM (Main)
- 19-
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
BlockDiagram(HW)
NT68771
(Novatek)
RGB
R/G/B/H/V
4M SERIAL
Flash
LED PANEL
(IPS,FHD)
LVDS
RGB IIC
V_LED
F/B
SPI
Data/
CLK Key1/Key2
LED
(WHITE)
19V
From Adapter
6 Keys : MENU/Reader
/Function/AUTO/INPUT(EXIT)/Power
19-to-5V DC/DC
LED B/L
T-Con 5V
System 3.3V
Core 1.2V
2CH, LDO

TROUBLESHOOTING GUIDE
- 20 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
1. NO POWER
`
No power issue
Check JK100 PIN 1
Is IC102
PIN2(19V),PIN3(5V)
CHECK ADAPTER
CHECK IC102
Is IC 201
PIN1(3.3V)
PIN3(1.2V). CHECK 201
Is IC100 PIN45,PIN46
PULSE CHECK CRYSTAL X100
YES YES YES
NO
NO
NO
NO
CHECK IC100
IC102‐#1 IC102‐#2 IC201 X100