LG FLATRON User manual

COLOR MONITOR
SERVICE MANUAL
Website:http://biz.LGservice.com
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS NO. : LP69G
MODEL: M198WA (M198WA-BMH.A**MLP)
M228WA (M228WA-BMH.A**MLP)
*( ) **Same model for Service

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CONTENTS
CONTENTS .............................................................................................. 2
PRECAUTION ...........................................................................................3
SPECIFICATION ........................................................................................7
DISASSEMBLY ........................................................................................14
ADJUSTMENT ........................................................................................16
SERVICE OSD .........................................................................................22
TROUBLE SHOOTING ............................................................................23
BLOCK DIAGRAM...................................................................................29
EXPLODED VIEW ...................................................................................32
REPLACEMENT PARTS LIST ............................................................... 34
SVC. SHEET ...............................................................................................

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WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
replacement parts list. It is essential that these critical
parts should be replaced with the manufacturer’s
specified parts to prevent electric shock, fire or other
hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
PRECAUTION
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter

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SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cotton-
tipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "anti-
static" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)

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General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal
temperature.
(500 F to 600 F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal
temperature (500 F to 600 F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.

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Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"lift-off" the board. The following guidelines and
procedures should be followed whenever this condition is
encountered.
At IC Connections
To repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern side of the circuit board. (Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is
dressed so the it does not touch components or sharp
edges.

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1. Application range
This specification is applied to 19"/22" Wide Monitor TV
used LP69G chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Power Voltage : Standard input voltage (100~240V@,
50/60Hz)
*Standard Voltage of each products is marked by models.
(2) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
(3) The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
3.1 Performance : LGE test method followed
3.2 Demanded other specification
Safety : CE, IEC Specification
EMC : CE, IEC
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
4-1. General Specification
4.1.1 TV
4. General Specification(TV)
No Item Specification Remark
1 Video input applicable system NTSC, NTSC 4.43
2 Receivable Broadcasting System PAL N/M, NTSC M CHILE
3 RF Input Channel VHF : 2 ~ 13
UHF : 14 ~ 69 PAL N/M, NTSC
CATV : 1 ~ 125
4 Input Voltage AC 100-240V, 50Hz/60Hz
5 Market CHILE
6 Tuning System FS PAL N/M, NTSC
7 Operating Environment Temp : 10°C~ 35°C
Humidity : 20% ~ 80%
8 Storage Environment Temp : -10°C ~ 60°C non condensing
Humidity : 5%~90% non condensing
9 Display LCD Module

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No. Item Min Typ. Max Unit Remark
1. Type TFT Color LCD Module
2. Active Display area 410.4 (H) x 256.5 (V) mm
3. Outline dimension 427.2 (H) x 277.4 (V) x17.0 (D) mm Typ
4. Pixel pitch 0.285mm (H) x 0.285mm (V) x RGB mm
5. Color arrangement RGB vertical stripe
6. Color Depth 16.7M color
7. Electrical Interface LVDS
8. Surface Treatment Hard coating(3H) & Anti-glare(Haze 25)
9. Operating Mode Normally White
10. Back light Unit 4 CCFL (4 lamps)
11. R/T R.T : 1.3ms + R.T : 3.7ms Typ.
No. Item Specification Remark
1 Supported Sync. Type Separate Sync., Digital
2 Operating Frequency Analog Horizontal 28 ~ 83kHz
Vertical 56 ~ 75 Hz
Digital Horizontal 28 ~ 83kHz
Vertical 56 ~ 75 Hz
3 Resolution(M198WA) Analog Max. 1440 x 900 @ 75Hz
Recommend 1440 x 900 @ 60Hz
Digital Max. 1440 x 900 @ 60Hz
Recommend 1440 x 900 @ 60Hz
Resolution(M228WA) Analog Max. 1680 x 1050 @ 60Hz
Recommend 1680 x 1050 @ 60Hz
Digital Max. 1680 x 1050 @ 60Hz
Recommend 1680 x 1050 @ 60Hz
4 Input Voltage Voltage :100 - 240 Vac, 50 or 60Hz
5 Inrush Current Cold Start : 50 A Hot : 120 A
6 Operating Condition Sync (H/V) Video LED Wattage
Power S/W On On mode On/On Active Blue 60W Max.
On/On Active Blue 50W Typ.
Sleep mode Off/On Off Amber 1W
On/Off
Power S/W Off Off mode - Off Off 1W
7 MTBF 50,000 HRS with 90% Confidence level Lamp Life : 50,000 Hours(min)
8 Using Altitude 5,000 m (for Reliability) 3,000m(for FOS)
9 Operating Environment Temp : 10°C ~ 35°C
Humidity : 20% ~ 80%
10 Storage Environment Temp : -10°C ~ 60°C non condensing
Humidity : 5% ~ 90% non condensing
4.1.2 RGB/DVI
4-2. Module Specification(LPL LM190WX1-TLC1, P/N:EAJ36290801 (ZBD)) - M198WA

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4-3. Optical characteristic specifications
4.3.1 Optical Characteristic - M198WA
No. Item Specification Remark
Min Typ Max
1 Viewing Angle R/L 75/75 88/88
<CR≥10> U/D 70/70 85/85
2 Luminance RGB-PC 250 300 PSM:Dynamic, CSM: 6500K
Luminance Full White (100IRE)
(cd/m2) AV/TV 200 250 PSM:Dynamic, CSM:Cool
Component Full White (100IRE)
White Luminance Uniformity 75
3 Contrast Ratio CR RGB-PC/ At DFC Mode
AV/TV/ 500 850 Typ. 3000:1, Min. 2400:1
Component
4 CIE Color Coordinates WHITE Wx 0.313
Wy 0.329 In RGB-PC input
RED Rx 0.639
Ry 0.342 PSM : Dynamic
GREEN Gx 0.297 CSM : 6500K
Gy 0.615 White
BLUE Bx 0.146 (100 IRE)
By 0.068
WHITE Wx 0.285
Wy 0.293 In AV/Component/TV input
RED Rx 0.639
Ry 0.342 PSM : Dynamic
GREEN Gx 0.297 CSM : Cool
Gy 0.615 White
BLUE Bx 0.146 (85 IRE)
By 0.068
Typ.
+0.03
Typ.
+0.015
Typ.
-0.03
Typ.
-0.015
No. Item Min Typ. Max Unit Remark
1. Type TFT Color LCD Module
2. Active Display area 473.76 (H) x 296.1 (V) mm
3. Outline dimension 493.7 (H) x 320.1 (V) x16.5 (D) mm Typ
4. Pixel pitch 0.282mm (H) x 0.282mm (V) x RGB mm
5. Color arrangement RGB vertical stripe
6. Color Depth 16.7M color
7. Electrical Interface LVDS
8. Surface Treatment Hard coating(3H) & Anti-glare(Haze 25)
9. Operating Mode Normally White
10. Back light Unit 4 CCFL (4 lamps)
11. R/T R.T : 1.3ms + R.T : 3.7ms Typ.
4-2. Module Specification(LPL LM220WE1-TLA1, P/N:EAJ33945801 (ZBD)) - M228WA

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4.3.1 Optical Characteristic - M228WA
No. Item Specification Remark
Min Typ Max
1 Viewing Angle R/L 70/70 80/80
<CR≥10> U/D 60/70 75/85
2 Luminance RGB-PC 250 300 PSM:Dynamic, CSM: 6500K
Luminance Full White (100IRE)
(cd/m2) AV/TV 200 250 PSM:Dynamic, CSM:Cool
Component Full White (100IRE)
White Luminance Uniformity 75
3 Contrast Ratio CR RGB-PC/ At DFC Mode
AV/TV/ 500 800 Typ. 3000:1, Min. 2400:1
Component
4 CIE Color Coordinates WHITE Wx 0.313
Wy 0.329 In RGB-PC input
RED Rx 0.635
Ry 0.342 PSM : Dynamic
GREEN Gx 0.292 CSM : 6500K
Gy 0.611 White
BLUE Bx 0.147 (100 IRE)
By 0.070
WHITE Wx 0.285
Wy 0.293 In AV/Component/TV input
RED Rx 0.635
Ry 0.342 PSM : Dynamic
GREEN Gx 0.292 CSM : Cool
Gy 0.611 White
BLUE Bx 0.147 (85 IRE)
By 0.070
Typ.
+0.03
Typ.
+0.015
Typ.
-0.03
Typ.
-0.015
4-4. Model Specification
No Item Specification Remark
1. Market CHILE
2. Broadcasting system PAL N/M, NTSC M
3 RF Input Channel VHF : 2 ~ 13
UHF : 14 ~ 69 NTSC
CATV : 1 ~ 125
4. CVBS Input (1EA) PAL N/M, NTSC 3 System(Rear) :PAL50/60, NTSC
5. S-Video Input (1EA) PAL N/M, NTSC 3 System(Rear) :PAL50/60, NTSC
6. Component Input (1EA) Y/ Pb/Pr 480i/480p/576i/576p/720p/1080i
7. RGB Input (1EA) RGB-PC Max 1440 * 900@75Hz-M198WA
Max 1680 * 1050@60Hz-M228WA
RGB-DTV 480p, 576p, 720p, 1080i
8. DVI Input (1EA) DVI-PC Max 1440 * 900@60Hz-M198WA
Max 1680 * 1050@60Hz-M228WA
DVI-DTV 480p, 576p, 720p, 1080i
9. Audio Input (3 EA) CVBS, PC Audio, Component L/R Input

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6. RGB Input (PC)-M198WA
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz)
1 720*400 31.468 70.08 28.321
2 640*480 31.469 59.94 25.175
3 640*480 37.5 75 31.5
4 800*600 37.879 60.317 40.0
5 800*600 46.875 75.0 49.5
6 1024*768 48.363 60.0 65.0
7 1024*768 60.123 75.029 78.75
8 1152*864 67.500 75.000 108.0
9 1280*1024 63.981 60.02 108.0
10 1280*1024 79.976 75.035 135.0
11 1440*900 55.5 59.90 88.750
12 1440*900 55.935 59.887 106.50
13 1440*900 70.635 74.984 136.75
5. Component Video Input (Y, PB, PR)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
1. 720*480 15.73 59.94 13.500 480i
2. 720*480 15.75 60.00 13.514 480i
3. 720*576 15.625 50.00 13.500 576i
4. 720*480 31.47 59.94 27.000 480P
5. 720*480 31.50 60.00 27.027 480P
6. 720*576 31.25 50.00 27.000 576P
7. 1280*720 44.96 59.94 74.176 720P
8. 1280*720 45.00 60.00 74.250 720P
9. 1280*720 37.50 50.00 74.25 720P
10. 1920*1080 33.72 59.94 74.176 1080i
11. 1920*1080 33.75 60.00 74.250 1080i
12. 1920*1080 28.125 50.00 74.250 1080i
*M228WA
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz)
1 720*400 31.468 70.08 28.321
2 640*480 31.469 59.94 25.175
3 640*480 37.5 75 31.5
4 800*600 37.879 60.317 40.0
5 800*600 46.875 75.0 49.5
6 1024*768 48.363 60.0 65.0
7 1024*768 60.123 75.029 78.75
8 1152*864 67.500 75.000 108.0
9 1280*1024 63.981 60.02 108.0
10 1280*1024 79.976 75.035 135.0
11 1680*1050 64.674 59.883 119.0
12 1680*1050 65.290 59.954 146.25

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8. DVI input (PC)-M198WA
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz)
1 720*400 31.468 70.08 28.321
2 640*480 31.469 59.94 25.175
3 640*480 37.5 75 31.5
4 800*600 37.879 60.317 40.0
5 800*600 46.875 75.0 49.5
6 1024*768 48.363 60.0 65.0
7 1024*768 60.123 75.029 78.75
8 1152*864 67.500 75.000 108.0
9 1280*1024 63.981 60.02 108.0
10 1280*1024 79.976 75.035 135.0
11 1440*900 55.5 59.90 88.750
12 1440*900 55.935 59.887 106.50
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
1. 720*480 31.47 59.94 27.000 480P
2. 720*480 31.50 60.00 27.027 480P
3. 720*576 31.25 50.00 27.000 576P
4. 1280*720 37.5 50.00 74.250 720P
5. 1280*720 44.96 59.94 74.176 720P
6. 1280*720 45.00 60.00 74.250 720P
7. 1920*1080 33.72 59.94 74.176 1080i
8. 1920*1080 33.75 60.00 74.250 1080i
9. 1920*1080 28.125 50.00 74.250 1080i
7. RGB input ( DTV )
* M228WA
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz)
1 720*400 31.468 70.08 28.321
2 640*480 31.469 59.94 25.175
3 640*480 37.5 75 31.5
4 800*600 37.879 60.317 40.0
5 800*600 46.875 75.0 49.5
6 1024*768 48.363 60.0 65.0
7 1024*768 60.123 75.029 78.75
8 1152*864 67.500 75.000 108.0
9 1280*1024 63.981 60.02 108.0
10 1280*1024 79.976 75.035 135.0
11 1680*1050 64.674 59.883 119.0
12 1680*1050 65.290 59.954 146.25

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9. DVI input (DTV)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
1. 720*480 31.47 59.94 27.000 480P
2. 720*480 31.50 60.00 27.027 480P
3. 720*576 31.25 50.00 27.000 576P
4. 1280*720 37.5 50.00 74.250 720P
5. 1280*720 44.96 59.94 74.176 720P
6. 1280*720 45.00 60.00 74.250 720P
7. 1920*1080 33.72 59.94 74.176 1080i
8. 1920*1080 33.75 60.00 74.250 1080i
9. 1920*1080 28.125 50.00 74.250 1080i

DISASSEMBLY
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1. Push down slightly to disassembly it.
2. After push the cable management like above fig.(Downward),
Disassembly the Cable management with pulling it upward.
3. Disassembly Cable Holder.
Disassembly Stand base.
Remove base body Like a picture. Push 2 letches Like a picture.
Push the button.
Hold the stand base.
# 1
# 4
# 2
# 5
# 3
# 6

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# 7
# 9
# 8
# 10
Pull base body to separate from set during pressing 2 letches.
Remove the screws.
# 11
Pull the connector.
Disassembly back cover.
1. Remove the screws.
2. Disassembly Hinge Cover.

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ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to 19"/ 20"/ 22" LCD
Monitor TV which is manufactured in TV (or Monitor) Factory
or is produced on the basis of this data.
2. Specification
1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2) Power Adjustment : Free Voltage
3) Magnetic Field Condition : Nil.
4) Input signal Unit : Product Specification Standard
5) Reserve after operation : Above 30 Minutes
6) Adjustment equipments : Color Analyzer(CA-210 or CA-
110), Pattern Generator (MSPG-925L or Equivalent), DDC
Adjustment Jig equipment, SVC remote controller
3. Main PCB check process
* APC - After Manual-Insult, executing APC
3.1. Download
1) Execute ISP program “Mstar ISP Utility”and then click
“Config”tab.
2) Set as below, and then click “Auto Detect”and check
“OK”message.
If display “Error”, Check connect computer, jig, and set.
3) Click “Connect”tab.
If display “Can’t ”, Check connect computer, jig, and set.
4) Click “Read”tab, and then load download
file(XXXX.bin) by clicking “Read”.
5) Click “Auto”tab and set as below
6) click “Run”.
7) After downloading, check “OK”message.
3.2. ADC Process
* If a scaler IC changed for PCB repairing, it is need to do
ADC process at all times.
(1) PC input ADC
1) Auto RGB Gain/Offset Adjustment
- Convert to PC in Input-source
- Signal equipment displays
Output Voltage : 700 mVp-p
Impress Resolution XGA (1024 x 768 @ 60Hz)
Model : 60 in Pattern Generator
Pattern : 29 in Pattern Generator (MSPG-925
SERISE)
[gray pattern that left & right is black and center is
white signal (Refer below picture)].
- Adjust by commanding AUTO_COLOR _ADJUST
(0xF1) 0x00 0x02 instruction.
2) Confirmation
- We confirm whether “0x8B,0x8C”address of
EEPROM “0xB4”is “0xAA”or not.
- If “0x8B,0x8C”address of EEPROM “0xB4”isn’t
“0xAA”, we adjust once more.
- We can confirm the ADC values from “0x00~0x05”
addresses in a page “0xB4”
* Manual ADC process using Service Remocon. After
enter Service Mode by pushing “INSTART”key,
execute “Auto-RGB”by pushing “”key at “Auto-
RGB”.
(2) COMPONENT input ADC
1) Component Gain/Offset Adjustment
- Convert to Component in Input-source
- Signal equipment displays
Impress Resolution 480P
MODEL : 212 in Pattern Generator
(480p Mode, Y : 100%, Pb/Pr : 75%)
PATTERN : 08 in Pattern Generator
(MSPG-925 SERISE)
<Adjustment pattern (PC)>

- 17 -
<Adjustment pattern (COMPONENT)>
- Adjust by commanding AUTO_COLOR_ADJUST
(0xF1) 0x00 0x02 instruction.
2) Confirmation
- We confirm whether “0x8D,0x8E”address of
EEPROM “0xB4”is “0xAA”or not.
- If “0x8D,0x8E”address of EEPROM “0xB4”isn’t
“0xAA”, we adjust once more.
- We can confirm the ADC values from “0x00~0x05”
addresses in a page “0xB4”.
3.3. Function Check
(1) Check display and sound
- Check Input and Signal items. ( cf. work instructions)
1) TV
2) AV (CVBS/ S-Video)
3) COMPONENT (480P)
4) RGB (PC : 1024 x 768 @ 60hz)
5) DVI
6) PC Audio In and H/P Out
* Display and Sound check is executed by Remote
controller.
4. Total Assembly line process
4.1. Adjustment Preparation
(1) Above 30 minutes H/run in RF no signal
(2) 15 Pin D-Sub Jack is connected to the signal of Pattern
Generator.
4.2. Confirm color coordinate of RGB
* Check White Balance
- Set Input to RGB.
- Input signal : (1024 x 768 @ 60Hz), Full white 255/255
gray level (100 IRE, Model : 60, Pattern : 4
at MSPG925L)
- Set CSM : 6500k
- Confirm whether x = 0.313±0.03, y = 0.329±0.03 or not.
- Confirm whether luminance over 200cd/m2
- Set CSM : 9300k
- Confirm whether x = 0.283±0.03, y = 0.298±0.03 or not.
* Check sRGB
- Set Input to RGB.
- Input signal : (1024 x 768 @ 60Hz)
Full white 255/255 gray level (100 IRE, Model : 60,
Pattern : 4 at MSPG925L)
- Set CSM : sRGB
- Confirm whether x = 0.313±0.03, y = 0.329±0.03 or not.
- Confirm whether luminance = 180±50 cd/m2
4.3. Confirm color coordinate of AV
(1) Set Input to AV
(2) Input signal : CVBS, NTSC @ 60Hz
Full white 216/255 gray level (85 IRE, Model : 202,
Pattern : 78 at MSPG925L)
(3) Set PSM : Dynamic / CSM : Cool
(4) Confirm whether x = 0.285±0.03, y = 0.293±0.03 or
not.
4.4. Confirm color coordinate of component
(1) Set Input to COMPONENT.
(2) Input signal : 480P
Full white 216/255 gray level (85 IRE Model : 212,
Pattern : 78 at MSPG925L)
(3) Set PSM : Dynamic / CSM : Cool
(4) Confirm whether x = 0.285±0.03, y = 0.293±0.03 or
not.
4.5. Confirm Auto adjustment operation.
(1) Input 1 Dot on/off & Rectangle Pattern at Model 60
(1024 x 768@60Hz).
(2) Confirm adjustment operation by changing Clock,
Phase, H/V Position.
(3) Check Clock, Phase by pressing AUTO Key after
varying the Clock & the Phase
4.6. Other quality
- Confirm that each items satisfy under standard
condition that was written product spec.
(1) AV
1) Select input AV (S-video) and whether picture is
displayed or not
2) Select input AV (CVBS) and whether picture is
displayed or not.
(2) TV
- Select input TV and check below item
* In Gumi Factory
04 - Stero Sound check
63 - Dual Sound check
(3) RGB
*M198WA
- Select input RGB model 112(1440*900@60hz), 64 Gray
Scale pattern and whether picture is displayed or not
*M208WA / M228WA
- Select input RGB model 122(1680*1050@60hz), 64Gray
Scale pattern and whether picture is display or not
(4) COMPONENT
- Select input COMPONENT and whether picture is
displayed or not.

(5) DVI
*M198WA
- Select input DVI model 112(1440*900@60hz), 64 Gray
Scale pattern and whether picture is displayed or not
*M208WA / M228WA
- Select input DVI model 122(1680*1050@60hz), 64Gray
pattern and whether picture is displayed or not.
4.7. DPM operation confirmation
- Check if Power LED Color and Power Consumption operate
as standard.
(1) Set Input to RGB and connect D-sub cable to set.
(2) Measurement Condition : 230V@ 50Hz (Analog)
(3) Confirm DPM operation at the state of screen without
Signal
4.8 DDC EDID Write
1) Connect D-sub Signal Cable to D-Sub Jack.
2) Connect HDMI Signal Cable to DVI Jack.
3) Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
4) Check whether written EDID data is correct or not. (refer
to Product spec).
(1) M198WA EDID DATA
1) ANALOG DATA 128Byte
2) DIGITAL DATA 256Byte
(2) M208WA EDID DATA
1) ANALOG DATA 128Byte
2) DIGITAL DATA 256Byte
(3) M228WA EDID DATA
1) ANALOG DATA 128Byte
2) DIGITAL DATA 256Byte
4.9. HDCP SETTING
(High-Bandwidth Digital Contents Protection)
1) Connect D-sub Signal Cable to D-Sub Jack.
2) Input HDCP key with HDCP-key- in-program.
3) HDCP Key value is stored on EEPROM(AT24C64)
which is E00~F20 addresses of 0xBC~0xBE page.
4) AC off/ on and on HDCP button of MSPG925 and
confirm whether picture is displayed or not of using
MSPG925.
5) HDCP Key value is different among the sets.
4.10. Outgoing condition Configuration
1) After all function test., press IN-STOP Key by SVC
Remote controller. And Make Ship Condition.
2) When pressing IN-STOP key by SVC remocon, Green
and red LED are blinked alternatively. And then
Automatically turn off. (Must not AC power OFF during
blinking)
- 18 -
ADH ADL LEN
BC 00 128
BC 80 128
BE 00 33

- 19 -
4.11. Internal pressure
- Confirm whether is nomal or not when between power
board's ac block and GND is impacked on 1.5kV(dc) or
2.2kV(dc) for one second.
4.12 Option data setting (SVC OSD setting)
(1) Tool Option
*M198WA-BMH- Tool Option 7809
*M208WA/M228WA-BMH Tool Option 7810
* Area Option (M198WA/M208WA/M228WA-BMH) Change by suffix
: Area Option : South America - S.Am
No. Item Condition Remark
1 2HR-OFF 1 0 : 2 Hour off option -OFF
1 : 2 Hour off option -ON
2 FACTORY-MODE 0 0 : EEPROM Write Protection On
1 : EEPROM Write Protection Off
3 CHANNEL-MUTE 1
RAM Delay
1 Clock Phase 7
2 DQS0 Phase 2
3 DQS1 Phase 2
4 DQS2 Phase 2
5 DQS3 Phase 2
Power Off History
1 Last Power 0
2 Remocon 0
3 Key 0
4 Sleep Timer 0
5 RS232 0
6 Off Timer 0
7 Auto Off 0
8 2Hour Off 0
9 Reset 0
ETC
1 DFC Control 1
2 Exit Key 0
3 PWM DIM 255
4 Dimming Ctl. 255
5 DEBUG ON 0
6 UART ON 3
7 AGC TAKEOVER 16
8 AGC EData 0
9 AGC BData 0
10 VID Lev 96
11 SOG Level 4
M198WA-BTH REMARK
Resolution 1 WXGA+
Module 0
TV 1
VIDEO 1
COMPONENT 1
PC-RGB 1
DVI 1
HDMI 0
M208WA-BMH / M228WA-BMH REMARK
Resolution 2 WSXGA
Module 0
TV 1
VIDEO 1
COMPONENT 1
PC-RGB 1
DVI 1
HDMI 0

- 20 -
5. Adjustment Command
5.1. Adjustment Commands(LENGTH=84)
5.2 EEPROM DATA READ
(1) Signal Table
(2) Command Set
* Purpose : To read the appointment Address of
E2PROM by 128(80h)-byte
5.3. E2PROM Data Write
(1) Signal Table
LEN : 84h+Bytes
CMD : 8Eh
ADH : E2PROM Slave Address(A0,A2,A4,A6,A8), Not
00h(Reserved by BufferToEEPROM)
ADL : E2PROM Sub Address(00~FF)
Data : Write data
(2) Command Set
* Purpose
1) EDID write : 16-byte by 16-byte, 8 order (128-byte)
write(TO “00 –7F”of “EEPROM Page A4”).
2) FOS Default write : 16-mode data (HFh, HFl, VF, STD,
HP, VP, Clk, ClkPh, PhFine) write.
3) Random Data write : write the appointment Address of
E2PROM.
5.4. VRAM Read
1) Send CMD(70h) to read Video RAM value from MICOM
And save its value to 128-Bytes Buffer(Common Buffer
for the use of EDID)
2) Delay 500ms ( Time to Wait and Read Video RAM from
MICOM)
3) Be transmitted the contents of MICOM’s 128-bytes
Buffer to PC. (128th Data is the CheckSum of 127-bytes
data : That’s OK if the value of adding 128-bytes Data is
Zero)
FACTORY ON E0 00 00 Factory mode on
FACTORY OFF E2 00 00 Factory mode off
EEPROM ALL INIT. E4 00 00 EEPROM All clear
EEPROM Read E7 00 00 EEPROM Read
EEPROM Write E8 00 data EEPROM Write by some
values
COLOR SAVE
(R/G/B cutoff, Drive, EB 00 00 Color Save
Contrast, Bright)
H POSITION 20 00 00 –100 They have different range
V POSITION 30 00 00 –100 each mode, FOS Adjustment
CLOCK 90 00 00 –100
PHASE 92 00 00 –100
R DRIVE 16 00 00 –FF Drive adjustment
G DRIVE 18 00 00 –FF
B DRIVE 1A 00 00 –FF
R CUTOFF 80 00 00 –7F Offset adjustment
G CUTOFF 82 00 00 –7F
B CUTOFF 84 00 00 –7F
BRIGHT 10 00 00 –3F Bright adjustment
CONTRAST 12 00 00 - 64 Luminance adjustment
AUTO_COLOR_ F1 00 02 Auto COLOR Adjustment
ADJUST
CHANGE_COLOR F2 00 0,1,2,3 0: COOL
_TEMP 1: NORMAL
2: WARM
3: USER
FACTORY_DEFAULT F3 00 00 Factory mode off
& II_SW is “1”
& Input change to “TV”
AUTO_INPUT F4 00 0,1,2,4 0 : TV
CHANGE 1 : AV1
2 : AV2
3 : Component
4 : RGB
5 : DVI
ADR VAL Description
CMD
(hex)
Adjustment Contents
128 Bytes
Delay 100ms
EEPROM READ E7 A0 0 0-Page 0~7F Read
80 0-Page 80~FF Read
A2 0 1-Page 0~7F Read
80 1-Page 80~FF Read
A4 0 2-Page 0~7F Read
80 2-Page 80~FF Read
A6 0 3-Page 0~7F Read
80 3-Page 80~FF Read
Adjustment contents CMD(hex) ADH(hex) ADL(hex) Details
EEPROM WRITE E8 94 16-Byte Write
84+n n-byte Write
Adjustment contents CMD(hex) ADH(hex) Details