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LG Studio Works 505E User manual

COLOR MONITORCOLOR MONITOR
SERVICE MANUALSERVICE MANUAL
Website:http://biz.LGservice.comWebsite:http://biz.LGservice.com
E-mail:http://www.LGEservice.com/techsup.htmlE-mail:http://www.LGEservice.com/techsup.html
CAUTIONCAUTION
BEFORE SERVICING THE UNIT,BEFORE SERVICING THE UNIT,
READ THREAD TH
E E
SAFETY PRECSAFETY PREC
AUTIONS IN THIS MANUAL.AUTIONS IN THIS MANUAL.
MM
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MODEL:MODEL:
StSt
udud
ioio
WW
oror
ks 5ks 5
0505
EE
(505EL-AP**M, AH**M, AL**M)(505EL-AP**M, AH**M, AL**M)
StSt
udud
ioio
WW
oror
ks 5ks 5
0505
GG
(505EL-AP**A, AL**A)(505EL-AP**A, AL**A)
CHASSIS NO. : CA-138CHASSIS NO. : CA-138
( (
))
****
Same model for ServiceSame model for Service
StSt
udiudi
oo
WoWo
rkrk
s 500s 500
EE
(505EL-AP**M, AH**M, AL**M)(505EL-AP**M, AH**M, AL**M)
StSt
udiudi
oo
WW
orkork
s 500s 500
GG
(505EL-AP**A, AL**A)(505EL-AP**A, AL**A)
1. PICTURE TUBE1. PICTURE TUBE
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((
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DefIection DefIection
Angle Angle
: :
90°90°
Neck Neck
Diameter Diameter
: :
29.29.
44
mmmm
DD
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t t
PP
ii
tt
cc
hh
: :
00
..
22
8 8
mm
mm
Face Face
Treatment Treatment
: :
AR-ASC AR-ASC
(Anti-Reflection (Anti-Reflection
andand
Anti-Static Coating)Anti-Static Coating)
AG(Anti-Glare)AG(Anti-Glare)
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2. SIGNAL2. SIGNAL
2-1. Horizontal & Vertical Sync2-1. Horizontal & Vertical Sync
1) Input Voltage Level1) Input Voltage Level
: Low= 0~1.2V, High= 2.: Low= 0~1.2V, High= 2.
5~5.5V5~5.5V
22
) S) S
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2-2. Video Input Signal2-2. Video Input Signal
11
) )
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: :
0 0
~ ~
00
..
7 7
VV
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--
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CC
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: :
0 0
VV
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CC
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: :
00
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44
66
7 7
VV
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cc
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CC
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11
55
, ,
00
: :
00
..
7 7
VV
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--
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2) 2)
InIn
pupu
t t
ImIm
pepe
dada
ncnc
ee
: :
7575
ΩΩ
33
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FoFo
rmrm
atat
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ReRe
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to to
thth
e e
TiTi
mimi
ng ng
ChCh
arar
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2-3. Signal Connector2-3. Signal Connector
15-pin D-Sub Connector (Attached Type)15-pin D-Sub Connector (Attached Type)
2-4. Scanning Frequency2-4. Scanning Frequency
HH
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: :
33
0 0
~ ~
55
4 4
kk
HH
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: :
55
0 0
~ ~
11
22
0 0
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zz
3. POWER SUPPLY3. POWER SUPPLY
3-1. Power Range3-1. Power Range
AC 100~240V (Free Voltage), 50/60Hz, 1.0A Max.AC 100~240V (Free Voltage), 50/60Hz, 1.0A Max.
3-2. Power Consumption3-2. Power Consumption
4. DISPLAY AREA4. DISPLAY AREA
4-14-1
. Ac. Ac
tivtiv
e Vide Vid
eo Aeo A
rearea
::
• 285 • 285
x x
215 mm 215 mm
(11.22" x8.46") - (11.22" x8.46") -
Max Image Max Image
SizeSize
• 270 x 200 m• 270 x 200 m
m (10.m (10.
63"63"
xx
7.87"7.87"
))
- Pre- Pre
set set
ImagImag
e Size Siz
ee
44
--
22
. D. D
ii
ss
pp
ll
aa
y Cy C
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: F: F
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l Cl C
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4-34-3
. Di. Di
splspl
ay ay
ResRes
oluolu
tiotio
nn
: 10: 10
24 x 24 x
768 768
/ 60/ 60
HzHz
(Non-Interlace)(Non-Interlace)
4-4-
4. 4.
VV
idid
eo eo
BaBa
ndnd
wiwi
dtdt
hh
: :
65 65
MM
HzHz
5. ENVIRONMENT5. ENVIRONMENT
5-1. Op5-1. Op
erating erating
TemperaTempera
ture: 1ture: 1
0°0°
C ~ 40°C ~ 40°
CC
(Ambient)(Ambient)
5-2. 5-2.
Relative Relative
Humidity Humidity
: :
10%~10%~
88
0%0%
(Non-condensing)(Non-condensing)
55
--
33
. .
AA
ll
tt
ii
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uu
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ee
: :
33
,,
00
00
0 0
mm
6. DIMENSIONS (with 6. DIMENSIONS (with
TILT/SWIVETILT/SWIVE
L)L)
Width Width
: :
356.0 356.0
mm mm
(14.01")(14.01")
Depth Depth
: :
33
6060
.0 mm (1.0 mm (1
3.103.10
")")
HH
ee
ii
gg
hh
tt
: :
33
77
11
..
0 0
mm
m m
((
11
44
..
66
11
""
))
7. WEIGHT (with TILT/SWIVEL)7. WEIGHT (with TILT/SWIVEL)
NN
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: :
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((
22
55
..
33
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: :
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CONTENTSCONTENTS
- 2- 2
--
SPECIFICASPECIFICA
TIONS TIONS
......................................................................................................
22
SAFETY SAFETY
PRECAUTIONS PRECAUTIONS
................................................................................
33
SERVICE PRECAUTIONSERVICE PRECAUTION
........................................ 4........................................ 4
WIRING DIAGRAM ................................................. .7WIRING DIAGRAM ................................................. .7
BLOCK DIAGRAM ................................................... 8BLOCK DIAGRAM ................................................... 8
DESCRIPTION OF BLOCK DIAGRAM.....................9DESCRIPTION OF BLOCK DIAGRAM.....................9
ADJUSTMENADJUSTMEN
T T
........................................................ ........................................................
99
TROUBLESHOOTTROUBLESHOOT
ING GUIDE ING GUIDE
.............................. 1.............................. 1
66
EXPLODED EXPLODED
VIEWVIEW
......................................................................................................
33
11
REPLACEMEREPLACEME
NT NT
PP
ARTS LIST ARTS LIST
..............................................................
33
22
SCHEMATIC DIAGRAM......................................... 37SCHEMATIC DIAGRAM......................................... 37
PRINTED CIRCUIT BOARD................................... 39PRINTED CIRCUIT BOARD................................... 39
SPECIFICATIONSSPECIFICATIONS
MODEMODE
MAXMAX
NORMAL (ON)NORMAL (ON)
STAND-BYSTAND-BY
SUSPENDSUSPEND
OFFOFF
POWER CONSUMPTIONPOWER CONSUMPTION
75 W75 W
63 W63 W
less than 15 Wless than 15 W
less than 15 Wless than 15 W
less less
than than
5 5
WW
LED COLORLED COLOR
GREENGREEN
GREENGREEN
FLASHFLASH
FLASHFLASH
SAFETY PRECAUTIONSSAFETY PRECAUTIONS
- 3- 3
--
SAFETY-RELATED COMPONENT WARNING!SAFETY-RELATED COMPONENT WARNING!
There are special components used in this color monitorThere are special components used in this color monitor
which are important for safety.which are important for safety.
These parts are markedThese parts are marked
on the schematic diagram and the replacementon the schematic diagram and the replacement
parts list.parts list.
It is essential that these critical parts should beIt is essential that these critical parts should be
replaced with the manufacturer's specified parts to preventreplaced with the manufacturer's specified parts to prevent
X-radiation, shock, fire, or other hazards. Do not modifyX-radiation, shock, fire, or other hazards. Do not modify
the original design without obtaining written permissionthe original design without obtaining written permission
from manufacturer or you will void the original parts andfrom manufacturer or you will void the original parts and
labor guarantee.labor guarantee.
CAUTION:CAUTION:
No modification of any circuit should beNo modification of any circuit should be
attempted.attempted.
Service work should be performed only afterService work should be performed only after
you are thoroughly familiar with all of theyou are thoroughly familiar with all of the
following safety checks and servicingfollowing safety checks and servicing
guidelines.guidelines.
SAFETY CHECKSAFETY CHECK
Care should be taken while servicing this color monitorCare should be taken while servicing this color monitor
because of the high voltage used in the deflection circuits.because of the high voltage used in the deflection circuits.
These voltages are exposed in such areas as theThese voltages are exposed in such areas as the
associated flyback and yoke circuits.associated flyback and yoke circuits.
FIRE & SHOCK HAZARDFIRE & SHOCK HAZARD
An isolation transformer must be inserted between theAn isolation transformer must be inserted between the
color monitor and AC power line before servicing thecolor monitor and AC power line before servicing the
chassis.chassis.
••
In serIn ser
vicinvicin
g, attg, att
entioentio
n musn mus
t be pt be p
aid to aid to
the orthe or
iginaigina
l leal lea
dd
dress specially in the high voltage circuit. If a shortdress specially in the high voltage circuit. If a short
circuit is found, replace all parts which have beencircuit is found, replace all parts which have been
overheated as a result of the short circuit.overheated as a result of the short circuit.
••
All tAll t
he prohe pro
tecttect
ive deive de
vicevice
s must bs must b
e reine rein
stalstal
led peled pe
r ther the
original design.original design.
••
SoldeSolde
ring ring
must must
be inbe in
spectspect
ed foed fo
r thr th
e cole col
d sold sol
der jder j
ointoint
s,s,
frayed leads, damaged insulation, solder splashes, orfrayed leads, damaged insulation, solder splashes, or
the sharp points. Be sure to remove all foreignthe sharp points. Be sure to remove all foreign
materials.materials.
IMPLOSION PROTECTIONIMPLOSION PROTECTION
All used display tubes are equipped with an integralAll used display tubes are equipped with an integral
implosion protection system, but care should be taken toimplosion protection system, but care should be taken to
avoid damage and scratching during installation. Use onlyavoid damage and scratching during installation. Use only
same type display tubes.same type display tubes.
X-RADIATIONX-RADIATION
The only potential source of X-radiation is the picture tube.The only potential source of X-radiation is the picture tube.
However, when the high voltage circuitry is operatingHowever, when the high voltage circuitry is operating
properly there is no possibility of an X-radiation problem.properly there is no possibility of an X-radiation problem.
The basic precaution which must be exercised is keep theThe basic precaution which must be exercised is keep the
high voltage at the factory recommended level; the normalhigh voltage at the factory recommended level; the normal
high voltage is about 2high voltage is about 2
44
..
55
kV. The following steps describekV. The following steps describe
how to measure the high voltage and how to prevent X-how to measure the high voltage and how to prevent X-
radiation.radiation.
Note :Note :
It is important to use an accurate high voltageIt is important to use an accurate high voltage
meter calibrated periodically.meter calibrated periodically.
• •
To measurTo measur
e the e the
high volhigh vol
tage, tage,
use a use a
high ihigh i
mpedancempedance
high voltage meter, connect (–) to chassis and (+) tohigh voltage meter, connect (–) to chassis and (+) to
the CDT anode cap.the CDT anode cap.
• •
Set the Set the
brightness control brightness control
to maximum to maximum
point at point at
fullfull
white pattern.white pattern.
• •
Measure the Measure the
high voltaghigh voltag
e. The e. The
high voltage high voltage
metermeter
should be indicated at the factory recommended level.should be indicated at the factory recommended level.
• •
If the If the
meter indicatmeter indicat
ion exceeds ion exceeds
the maximum the maximum
level,level,
immediate service is required to prevent the possibilityimmediate service is required to prevent the possibility
of premature component failure.of premature component failure.
••
To prTo pr
event event
X-raX-ra
diatidiati
on poson pos
sibilsibil
ity, ity,
it is it is
essentessent
ial tial t
o useo use
the specified picture tube.the specified picture tube.
Leakage Current Hot Check CircuitLeakage Current Hot Check Circuit
CAUTION:CAUTION:
Please use only a plastic screwdriver to protect yourselfPlease use only a plastic screwdriver to protect yourself
from shock hazard during service from shock hazard during service
operation.operation.
1.5 Kohm/10W1.5 Kohm/10W
To Instrument'sTo Instrument's
exposedexposed
METALLIC PARTSMETALLIC PARTS
Good Earth GroundGood Earth Ground
such as WATER PIPE,such as WATER PIPE,
CONDUIT etc.CONDUIT etc.
AC Volt-meterAC Volt-meter
- 4
-
SERVICING PRECAUTIONS
CAUTION:
Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the
SAFETY PRECAUTIONS
on page 3 of this
publication.
NOTE:
If unforeseen circumstances create
conflict
between the following servicing precautions and any of
the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b.
Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c.
Connecting a te
st substitute i
n parallel wit
h an
electrolytic capacitor in the receiver.
CAUTION:
A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d.
Discharging the picture tube anode.
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5.
Unless specified ot
herwise in this
service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cotton-
tipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION:
This is a
flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not
required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
9.
Use with this receiver only the test fixtures specified in
this service manual.
CAUTION:
Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called
Electrostatically Sensitive (ES)
Devices.
Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1.
Immediately before
handling any
semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4.
Use only an
anti-static type solder
removal device.
Some solder removal devices not classified as "anti-
static" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION:
Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting
of your foot
from a
carpeted floor
can
generate static electricity sufficient to damage an ES
device.)
- 5
-
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
tem
per
atu
re wi
thi
n the r
ang
e or 50
0
F to 60
0
F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3.
Keep the soldering iron tip clean and well ti
nned.
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use
freon-propelled spray-on cleaners.
5.
Use the following unsoldering techni
que
a. Allow the soldering iron tip to reach normal
temperature.
(
5
0
0
F
t
o
6
0
0
F
)
b.
Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION:
Work quickly to avoid overheating the
circuitboard printed foil.
6.
Use the following soldering techniq
ue.
a. Allow the soldering iron tip to reach a normal
te
mp
er
at
ur
e (5
00
F to
60
0
F)
b.
First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c.
Quick
ly move t
he solde
ring ir
on tip to t
he junct
ion of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION:
Work quickly to avoid overheating the
circuit board printed foil.
d.
Clos
ely in
spect
the so
lder a
rea an
d remo
ve any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.
Replacement
1.
Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3.
Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2.
Remove the heat
sink mounting
screw (if
so equipped).
3.
Carefully remove the transistor from the heat sink of the
circuit board.
4.
Insert new transistor in the circuit board.
5.
Solde
r each tra
nsist
or lead, an
d clip off exc
ess lead.
6. Replace heat sink.
Diode
Removal/Replaceme
nt
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5.
Insp
ect (on t
he circ
uit boa
rd copp
er side
) the sold
er
joints
of
the
two
"original"
leads.
If
they
are
not
shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each
fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION:
Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.
- 6
-
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"lift-off" the board. The following guidelines and
procedures should be followed whenever this condition is
encountered.
At IC Connections
To repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern side of the circuit board. (Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected
copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION:
Be sure the insulated jumper wire is
dressed so the it does not touch components or sharp
edges.
WIRING DIAGRAM
- 7 -
P501(option)
P301
P302
G2
P702
 P701
T1
P402
P902
S
+
S
Signal
Cable
AC
Socket
F
B
T
BLOCK DIAGRAM
-
8
-
P
o
w
e
r
I
n
p
u
t
1
0
0
~
2
4
0
V
A
C
(
5
0
/
6
0
H
z
)
L
i
n
e
F
i
l
t
e
r
D
e
g
a
u
s
s
i
n
g
C
i
r
c
u
i
t
[
O
S
D
C
o
n
t
r
o
l
]
S
M
P
S
C
o
n
t
r
o
l
(
I
C
9
0
1
)
1
3
V
E
2
P
R
O
M
(
I
C
4
0
2
)
5
V
H
-
S
y
n
c
V
-
S
y
n
c
I
2
C
D
A
T
A
(
S
D
A
)
I
2
C
C
L
O
C
K
(
S
C
L
)
V
I
D
E
O
P
r
e
-
A
M
P
/
O
S
D
(
I
C
3
0
2
)
V
i
d
e
o
S
i
g
n
a
l
R
G
B
V
I
D
E
O
M
a
i
n
A
M
P
(
I
C
3
0
3
)
C
U
T
O
F
F
C
i
r
c
u
i
t
(
I
C
3
0
4
)
8
0
V
M
I
C
O
M
&
H
/
V
S
y
n
c
P
r
o
c
e
s
s
o
r
(
I
C
4
0
1
)
S
A
A
4
8
4
9
V
-
O
u
t
(
I
C
6
0
1
)
T
D
A
4
8
6
7
J
H
-
O
u
t
(
Q
7
0
6
)
H
-
L
i
n
e
a
r
i
t
y
C
o
r
r
e
c
t
i
o
n
X
-
R
A
Y
P
r
o
t
e
c
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i
o
n
C
i
r
c
u
i
t
B
r
i
g
h
t
n
e
s
s
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o
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l
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1
6
0
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4
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1
3
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/
D
F
e
e
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a
c
k
1
3
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L
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S
D
A
H
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S
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n
c
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-
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y
n
c
P
W
M
C
o
n
t
r
o
l
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i
g
n
a
l
1
3
V
5
0
V
D
Y
C
D
T
H
e
a
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(
6
.
3
V
)
I
2
C
Screen
H
.
V
R
/
G
/
B
B
i
a
s
H
-
D
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i
v
e
B
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i
v
e
B
+
D
P
M
C
o
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6
.
3
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V
V
o
l
t
a
g
e
f
e
e
d
b
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n
g
C
o
i
l
Dynamic Fo
c
us
Static Focus
5
0
V
8
0
V
5
V
G
2
G
1
A
u
t
o
B
e
a
m
L
i
m
i
t
D
C
/
D
C
C
o
n
v
e
r
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e
r
F
B
T
(
T
7
0
1
)
R
e
g
u
l
a
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i
o
n
C
i
r
c
u
i
t
1
3
V
S
M
P
S
(
T
9
0
1
)
5
V
B
R
I
G
H
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N
E
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S
C
O
N
T
R
A
S
T
M
O
I
R
E
D
E
G
A
U
S
S
I
N
G
H
/
V
P
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I
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V
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I
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B
A
L
A
N
C
E
P
A
R
A
L
L
E
L
O
G
R
A
M
R
E
C
A
L
L
/
R
E
S
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DESCRIPTION OF BLOCK DIAGRAM
-
9
-
1. SMPS(Switching Mode Power Supply)
When you turn on the power switch, the operating
procedure is as follows
:
1) The AC line voltage is rectified by the bridge diode
D900.
2) The control IC(IC901)
starts switching and generates
switch pulse in the primary turn of the SMPS
transformer(T901)
3) The switching pulses of the primary turns are induced
to the secondary turns of the transformer by the turn
ratio. This pulses are rectified by each diode(D971,
D961(D962),D951,D942,D941)
4) Each rectified DC voltage(80V, 50V, 13V, 6.3V
and 5V)
2. Over Voltage Protection Circuit
When the input
of IC901 Vin
(pin 4) is m
ore than
22V, all the secondary voltages of the SMPS
transformer (T901) down to low value
3. Display Power Management Circuit(DPM)
1)
STAND-BY
& SUS
PEND Mode
When no input of horizontal or vertical sync Q951,
Q941 are turned off and Q952,Q942 are turned o
ff.
Then input power consumption is below 5
watts.
2) OFF Mode
When no input of horizontal and vertical sync Q951,
Q941 are turned off and Q952, Q942 are
turned off.
Then input power consumption is below 5
watts.
6. X-RAY Protection Circuit
When the high Voltage reaches to 29kV in an abnormal
case, the high voltage
detector circuit, R818,D721,C739-1
R416, C409 start operation to
shut down high voltage
circuit.
4. Microprocessor Control & Horizontal and
Vertical Sync Processor Circuit
The operating procedure is as follows ;
1)
There is Horizon
tal & Vertical proces
s function in
Microprocessor.(IC401)
2)
Microprocessor (IC
401) discriminat
es the operating
mode from the sync polarity a
nd resolution.
3) After microprocessor reads these adjusted mode data
stored at EEPROM, it controls operating mode data
through IIC
4) Users can control screen condition by the OSD Select,
Up, Down, Left, Right, Exit.
5) The horizontal and vertical sync processor IC (IC401)
has a sync detector, a saw-tooth generator, and drive
function, And outputs horizontal and vertical drive
signal to control screen
distortions
5. D/D Converter Circuit.
To obtain constant high voltage, this circuit
supplies
controlled DC voltage for FBT
and horizontal deflection
circuit according to the horizontal sync
frequency.
7. Horizontal S-correction Circuit.
This circuit corrects the horizontal linearity for each
horizontal sync frequency.
8. Horizontal drive and Output Circuit.
This circuit is a
horizontal deflection amplifier for raster
scan.
9. ABL Circuit
This circuit limits the beam-current for the r
eliability of
CDT
10. Vertical Output Circuit
This circuit takes the vertical ramp wave from the
TDA4867J (IC601) and perform the vertical de
flection
by supplying the saw-
tooth wave current to the vertical
deflection yoke.
11. Blanking and Brightness Control Circuit.
Blanking circuit eliminates the retrace line by
supplying a negative pulse wave to the G1 of the CDT.
Brightness control circuit is used for control of the
screen brightness by changing the DC level G1.
13. OSD (On Screen Display) Circuit.
This circuit displays information of the monitor`s status
on the screen.
12. Image Rotation (Tilt) Circuit.
This circuit corrects the tilt of the screen by
supplying the image rotation signal to the tilt coil
which is attached near the deflection yoke of the
CDT
DESCRIPTION OF BLOCK DIAGRAM
-
10
-
15. Video Pre-Amp Circuit.
This circuit amplifies the analog video signal from
0~0.7 V to 0~4 V. It is operated by taking the clamp,
R,G,B drive and contrast signal from the MICOM
(IC401)
16. Video Output Amp Circuit.
This circuit amplifies the video signal which comes
from the video pre-amp circuit and amplified it to
applied the CDT cathode
14. Video Processor Circuit.
Video processor circuit consists of the video drive
output block. The video drive IC(IC302) receives the
video signal from PC. The gain of each channel is
controlled by MICOM through IIC.
The cut-off circuit compensate different voltage of
each channel between the cathode and the G1 of the
CDT
1. Preparation for Service Adjustment
GENERAL INFORMATION
All adjustment are thoroughly checked and corrected
when the monitor leaves the factory, but sometimes
several adjustments may be required.
Adjustment should be following procedure and after
warming up for a minimum of 30 minutes.
•
Alignment appliances and tools.
- IBM compatible PC.
- Programmable Signal Generator.
(eg. VG-819
made by Astr
odesign
Co.)
- EPROM or EEPROM with saved each mode data.
- Alignment Adaptor and Software.
- Digital Voltmeter.
- White Balance Meter.
- Luminance Meter.
- High-voltage Meter.
AUTOMATIC AND MANUAL DEGAUSSING
The degaussing coil is mounted around the CDT so that
automatic degaussing when turn on the monitor. But a
monitor is moved or faced in a different direction, become
poor color purity cause of CDT magnetized, then press
DEGAUSSING on the OSD menu.
ADJUSTMENT PROCEDURE & METHOD
-
Install the cable f
or adjustment such as
Figure 1and run
the alignment program on the DOS for IBM
compatible PC.
-
Set external Brightness and Contrast volume to max
position.
1. Adjustment for B
+
Voltage.
1)
Displ
ay cro
ss hatc
h patt
ern at M
ode 4.
2)
Check D961
cathode voltage within
50V ±
1V
.
2. Adjustment for High-Voltage.
1)
Display cross hatch patt
ern at Mode 4.
2) Enter the SVC SUB menu as the following instruction.
3) Adjust H/Voltage to 2
4
.
5
kV
±
0.1 kV by adjust 1-P value.
2. Adjustment by Service Hot key
How to enter SVC HOT KEY
1. Press Menu and OSD window will appear.
2.
While
OSD
window
is
displayed,
is
seen
on
the
left bottom of OSD window.
3.
Pres
s
+
pow
er
swi
tch
simu
ltan
eous
ly and the
screen will immediately refresh.
4.
Press
Menu
and
make
sure
that
is
changed
to
1
2.
5. Follow the menu on the left of OSD window to find 12
and OSD will change as shown in the figure.
6. Select Degauss in the above figure and then press
Select
and
to
enter
the
screen
of
the
SUB
menu.
(Back Raster for Pattern)
FOS SPEC
1
.
S
i
z
e
H :
27
0
4
m
m
V : 2
0
0
4
m
m
Scanning frequency : All Mode (Mode 1~4)
Display image : Cross hatch
pattern
2. Centering
Scanning frequency : All Mode (Mode 1~4)
Display image : Crosshatch pattern
Horizontal : 10 Row
Vertical : 8 Row
H
:
L
-
R
4
m
m
,
V
:
U
-
D
4
m
m
3
.
T
i
l
t
Scanning frequency : All Mode (Mode 1~4)
Display image : Crosshatch pattern
Horizontal : 10 Row
Vertical : 8 Row
T
i
l
t
:
E
-
F
2
.
0
m
m
-
11
-
ADJUSTMENT
U
D
L
R
E
F
- 1
2
-
4.
Di
st
or
ti
on
Scanning frequency : All Mode (Mode 1~4)
Display image : Crosshatch pattern
Horizontal : 10 Row
Vertical : 8 Row
A
-
B
2
.
0
m
m
,
C
-
D
2
.
0
m
m
E
-
F
2
.
0
m
m
,
G
-
H
2
.
0
m
m
5.
Di
sp
la S
iz
e dr
if
t
4
m
m
:
2
5
S
t
a
n
d
a
r
d
, 1
0
3
5
0.5mm : 180V ~ 264V
6.
Li
ne
ar
it
y
Form
ula
:
(Max
-
Min)
/
Max
x
100(%
)
Criteria
: H
- 10%
Max. (Upp
er 40kHz)
14% Max. (Less 40kHz)
V - 8% Max.
7.
Re
gu
la
ti
on
Luminance 2mm
Dynamic(lode) 2mm
Scanning frequency : All Mode (Mode 1~4)
8.
Tr
ap
ez
oi
d
9.
Pi
n B
al
an
ce
10.Parallelogram
1
1
.
Adjustment of
white ba
lance (Ad
justment of
chromaticity diagram)
*(Adjustment of white balance must be made after
entering Hot Key Mode and DEGAUSS.)
CONDITIONS
Signal:
54
kHz / 85 Hz
Display
image:
Back
raster
(Color
0,0)
Contrast: Maximum
Brightness: Maximum
Color temperature: 9300K
11-1. Adjustment of cut off (Adjustment of back raster)
11-1(a). Before adjustment, press Menu and Degauss
to remove.
=> Enter hot key mode.
Adjust Brightness and Contrast to Max in OSD
window.
(1)
Adjust cut
off (back
raster) f
irst.
Enter DEGAUSS in
the Menu and modify the following data.
Modify RCUT to Min ,
Modify GCUT To Min ,
Adjust to BCUT Data = 127 (7F (h)) ,
Adjust to SBRT Data = 205 ( CD (h)).
(2)Turn FBT screen volume on "CRT COLOR
ANALYZER CA-100" equipment to adjust
Br
ig
ht
ne
ss
t
o
0.
4
0.
05
FL
.
(3)
Adjust RCUT, GCUT, and
SBRT to set chr
omaticity
diagram at :
x
:
0
.
2
8
3
0
.
0
0
5
y
:
0
.
2
9
8
0
.
0
0
5
Y
:
0
.
4
0
0
.
0
5
F
L
* If color values would not be matched desirable values,
repeat sequence 1 and 2 after readjusting
“
GREEN
CUTOFF
”
control a little different.
U
D
D
U
U-D
<
4mm
L
1
R
1
2.0mm
L1
R
1
L
1
R1
Y1
Y2
Y3
Y4
X1 X2 X3 X4
4mm
A
B
D
C
E
G
F
H
11-2. Adjustment of White Balance
After finishing adjustment of cut off (back raster),
approve "Color(15.0) Full white pattern".
Adjust BDRV Data = 80, SCON=127.
Adjust RDRV and GDRV to set chromaticity diagram at :
x
:
0
.
2
8
3
0
.
0
0
5
y
:
0
.
2
9
8
0
.
0
0
5
Approve "Window pattern (70x70mm)" to adjust
S-
CO
N t
o Y
:
50
1F
L.
Approve "Color (15.0) Full white pattern" again and
ad
jus
t A
BL
Dat
a t
o Y
: 3
2
1F
L
12. Focus Adjustment
CONDITIONS
Scanning frequency
:
All Mode (Mode
1~4)
Dis
pla
y
ima
ge:
Ò
HÓ
cha
ract
er
patt
ern
Brightness:
Cut
off
point
Contrast: Maximum
PROCEDURE
1. Adjust the Focus VR on the FBT to display the
sharpest image possible.
2. Use Locktite to seal the Focus VR in position.
13. Color Purity Adjustment
Color purity is the absence of undesired color.
Conspicuous mislanding (unexpected color in a uniform
field) within the display area shall not be visible at a
distance of 50 cm from the CRT surface.
CONDITIONS
Orientation: Monitor facing east
Scanning
Frequency:
1024
x
768@85Hz(69kHz/85Hz)
Display
image:
White
flat
field
Luminance:
Cut
off
point
at
the
center
of
the
display area
Note: Color purity adjustments should only be
attempted by qualified personnel.
PROCEDURE
For trained and experienced service technicians only.
Use the following procedure to correct minor color
purity problems:
1. Make sure the display is not affected by external
magnetic fields.
2. Very carefully break the glue seal between the 2-pole
purity convergence magnets (PCM), the band and
the spacer.
3. Make sure the spacing between the PCM assembly
and
the
CRT
stem
is
29
mm
1
mm.
4. Display a green pattern over the entire display area.
5. Adjust the purity magnet rings on the PCM assembly
to display a pure green pattern.
(Optimum
setting:
x
=
0.295
0.015,
y
=
0.594
0.015)
6. Repeat steps 4 and 5 using a red pattern and then
again, using a blue pattern.
Table 4-6. Color Purity Tolerances
(For
9300K
color
adjustment:
x
=
0.283
0.02,
y
=
0.298
0.02)
7
.
When you
have the
PCMs properly
adjusted,
carefully glue them together to prevent their
movement during shipping.
- 1
3
-
R
e
d
:
x
=
0
.
6
2
0
0
.
0
1
5
y
=
0
.
3
3
4
0
.
0
1
5
G
r
e
e
n
:
x
=
0
.
6
2
0
0
.
0
1
5
y
=
0
.
3
3
4
0
.
0
1
5
B
l
u
e
:
x
=
0
.
6
2
0
0
.
0
1
5
y
=
0
.
3
3
4
0
.
0
1
5
- 1
4
-
3.
Adjustment
Using
Service
software
Program
(Adjustment Program)
1. Adjustment for Factory Mode (Preset Mode).
1)
Displ
ay cr
oss ha
tch p
atter
n at
Mode
All.
2)
Run alignment
program f
or
505EL
 on the IBM
compatible PC.
3
)
E
E
P
R
O
M
→
ALL CLEAR
→
Y(Yes) command.
<Caution>
Do not run this procedure unless the
EEPROM is changed. All data
in EEPROM (mode
data and color data) will be erased.
4) COMMAND
→
PRESET START
→
Y(Yes)
command.
5)
DIST.
ADJ.
→
FOS. ADJ command.
6)
Adjust H-POSITI
ON as arrow
keys to center of
the
screen.
7)
Adjust
H-SIZE
as arr
ow keys
to
270
± 2mm.
8)
Adjus
t V-PO
SITIO
N as arr
ow keys t
o cente
r of th
e
screen.
9)
Adjust V-
SIZE as
arrow keys
to 2
0
0 ± 2mm.
10)
Adjust TRAPEZOID as arr
ow keys to be the best
condition.
11)
Adjust SIDE PINCUSH
ON as arrow keys to be the
best condition.
12) Adjust TILT to be the best condition
(Optional)
.
13) Display cross hatch pattern at Mode 4.
14) DIST. ADJ.
→
BALANCE
DATA
command.
15) Adjust balance of Pin-Balance as arrow keys to be
the best condition.
16) Adjust parallelogram as arrow keys to be the best
condition.
17) Save of the Mode.
18) Save of the System.
19) Display from Mode 4 and repeat above
from number
6) to 16).
20) COMMAND
→
PRESET EXIT
→
Y (Yes) command.
2. Adjustment for White Balance and
Luminance.
1)
Set t
he Whi
te Bal
ance Met
er.
2)
Press the DEGAUSSING on
the OSD menu for
demagnetization of the CDT.
3)
Display color
0,0 patter
n at
Mode 4.
4
)
C O
M M
A N
D
→
PRESET START
→
Y(Yes)
command.
5)
Set Bightness
and Contrast
to max
position.
6) COLOR ADJ.
→
LUMINANCE command of the
alignment program.
7) COLOR ADJ.
→
BIAS ADJ. command of the
alignment program.
8)
Check whether blue colo
r or not at R-
BIAS and G-
BIAS to min position, Sub-Brightness to 205
(CD(h))position, B-Bias to 127(7F(h))position. If it's not
blue color, the monitor must repair.
9)
Adjust Screen control
on the FBT to 0.4 ±
0.05FL
of the raster luminance.
10) Adjust R-BIAS and G-BIAS command to x=0.283 ±
0.006 and y=0.298 ± 0.006 on the White Balance
Meter with PC arrow keys.
11)
Display color 15,0 Full White(70x70mm) at mode
4.
12) DRIVE ADJ command.
13) Set B-DRIVE to
8
0(5
0
(h)) at DRIVE of the alignment
program.
14)
Adjust
R-DRIVE and G-DRIVE co
mmand to white
balance x=0.283 ± 0.003 and y=0.298 ± 0.003 on
the White Balance Meter with PC arrow keys.
15)
Adjust SUB-CONTRAST command to 50±1FL of
the
raster luminance.
15)
Display color 15,0 full white patt
en at Mode 4.
16) COLOR ADJ.
→
LUMINANCE
→
ABL command.
17) Adjust ABL to 32 ± 1FL of the luminance.
18)
Exit fr
om the pro
gram.
4. EDI
D Data Edi
t
Using Service software Program
4.1 Read and Modify EDID Data
1) Connector the monitor and adjust device as Figure1
2) Display color 15,0 cross hatch pattern at Mode 4.
3) Use EDIT – MODEL SEL. command to select the right model info file.
4) Use EDIT –
EDID INFO command and return to read the
EDID Data.
5) Modify the EDID Data if needed and using F10 to save the change and exit.
4.2 Write EDID Data.
1) Display color 15,0 cross hatch pattern at Mode 4.
2) Use EEPROM -- Write
EDID command and confirm
“EDID Write OK!!” message of monitor.
3) Exit from the alignment program.
4) Power switch OFF/ON for EDID
data save.
 00
01 02
03
04 05
06
07 08
09 0A
0B 0C
0D 0E
0F
00
|
00 FF
FF FF
FF FF
FF
00 1E
6D 91
3B
*01
00
00
00
10
|
**01
0E 01 03 78 1C 15
B0 EA 60 59
A4 54 46 9B 24
20
|
10 48
4C BF
E8 00
31
59 45
59
01 01
01 01
01 01
30
|
01 01
01 01
01 01
64
19 00
40
41
00
26 30
18 88
40
|
36 00
0E C8
10 00
00
18 F9
15
20
F8
30 58
1F 20
50
|
20
40
13
00
0E
C8
10
00
00
1E
00
00
00
FD
00
32
60
|
78
1E
36
07
00
0A
20
20
20
20
20
20
00
00
00
FC
70
|
00
35
30
35
47
0A
20
20
20
20
20
20
20
20
00
***
00 01
02 03
04 05
06
07 08
09 0A
0B 0C
0D 0E
0F
00
|
00 FF
FF FF
FF FF
FF
00 1E
6D 66
3B
*01
00
00
00
10
|
**01
0E 01 03 78 1C 15
B0 EA 60 59
A4 54 46 9B 24
20
|
10 48
4C BF
E8 00
31
59 45
59
01 01
01 01
01 01
30
|
01 01
01 01
01 01
64
19 00
40
41
00
26 30
18 88
40
|
36 00
0E C8
10 00
00
18 F9
15
20
F8
30 58
1F 20
50
|
20
40
13
00
0E
C8
10
00
00
1E
00
00
00
FD
00
32
60
|
78
1E
36
07
00
0A
20
20
20
20
20
20
00
00
00
FC
70
|
00
35
30
30
47
0A
20
20
20
20
20
20
20
20
00
***
------------------------------------------------------------------
Figure 1. Cable
Connection
Figure 1. Cable
Connection
2
2
0
IB
M
Compatib
le P
C
PAR ALL
EL P
ORT
Power inlet (required)
Power LED
ST
Switc
h
Power Se
lect Swit
ch
(110V/220V)
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n
t
r
o
l
L
i
n
e
N
o
t
u
s
e
d
R
S
2
3
2
C
P
A
R
A
L
L
E
L
V
-
S
Y
N
C
P
O
W
E
R
S
T
V
G
S
M
O
N
I
T
O
R
E
V-S
ync On/Off
Switch
(S
wit
ch must be ON.)
F
A
B
C
E
F
A
B
C
15
10
5
5
6
9
1
1
1
14
13
25
6
5V
5V
5V
4.7K
4.7K
4.7K
74LS0 6
74LS0 6
O
F
F
O
N
OFF
ON
11
VIDEO
SIGNAL
GEN ERA TOR
1
2
CHECK
D900 BRIDGE DIODE?
CHECK
C908(+) VOLTAGE
145VDC at 110V input
310VDC at 220V input
IC901, Q901
CHECK
D971, D961, D951, D904
D941, D942, D906 ?
CHECK
FUSE OK?(F901)
- 1
6
-
TROUBLESHOOTING GUIDE
1. NO POWER
NO POWER
(POWER INDICATOR OFF)
NO
NO
NO
NO
TROUBLE IN
Q951, Q952, Q941, Q942,
TROUBLE
IN FUSE (F901)
SMPS Switch (ON, OFF)
Waveforms
TROUBLE IN
BRIDGE DIODE (D900)
TROUBLE IN
IC901, Q901
TROUBLE IN
D971, D961, D951, D904
D941, D942, D906
YES
YES
YES
YES
Q
9
0
1
,
D
r
a
i
n
I
C
9
0
1
,
#
6
2
1
26
2. NO CHARACTER
NO CHARACTER
NO
NO
NO
NO
TROUBLE IN
CDT SOCKET
TROUBLE IN
P301, SIGNAL CABLE,
PC SIGNAL
TROUBLE IN
IC302, P301
TROUBLE IN
IC303
TROUBLE IN
IC304
YES
YES
YES
YES
-
17
-
CHECK
IC302 PIN 5,6,7
CHECK
IC302 PIN 1, 24, 23, 19, 20, 21
PIN 18 (5V) ?
CHECK
IC303 PIN 1, 2, 3
PIN8 (8V),
PIN 4 (80V) ?
CHECK
R, G, B CATHODE
VOLTAGE?
IC302, #5, 6, 7
IC302,
#23
IC302,
#19,
20,
21
IC302,
#1
IC302,
#24
CDT, RK, GK, BK
Waveforms
28
27
30
31
2
6
2
7
2
8
2
9
3
0
3
1
29
CHECK
SCREEN CONTROL
KNOB OF FBT
CHECK
VOLTAGE AT
D961 CATHODE (50V)
D971 CATHODE (80V)
D951 CATHODE (13V)
D941 CATHODE
(6.3V)?
CHECK
IC401 (MICOM) PIN 16
5V (HIGH), IC401 PIN 18
PIN20, PIN21
CHECK
POWER INDICATOR
GREEN or FLASH ?
-
18
-
3. NO RASTER
FLASH
NO
NO
NO
TROUBLE IN
IC401 (MICOM),
TROUBLE IN
P302 SIGNAL CABLE
ROTATE SCREEN CONTROL
KNOB TO CLOCKWISE
or COUNTER CLOCKWIES
TROUBLE IN PRIMARY
CIRCUIT OF T901
TROUBLE IN
CDT SOCKET, BOARD
GREEN
YES
YES
YES
NO VIDEO
(POWER INDICATOR
GREEN or FLASH)
IC401,
#18
IC401,
#20
IC401,
#21
14
7
5
5
1
4
7
Waveforms
CHECK
IC601 P
IN 7
(45V)?
CHECK
IC401 PIN 33, 34
(SAWTOOTH WAVE)?
CHECK
IC601 Pin 3 (13V) ?
-
19
-
4. NO VERTICAL DEFLECTION
NO V-DEFLECTION
(ONE HORIZONTAL LINE)
NO
NO
NO
TROUBLE IN
IC601, V-CIRCUIT
TROUBLE IN
T901 13V Line
Waveforms
TROUBLE IN
T701 40V line
TROUBLE IN
IC401
YES
YES
YES
IC401,
#33
IC401,
#34
9
8
8
9

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