Lg Studio works 505e User manual

COLOR MONITORCOLOR MONITOR

SERVICE MANUALSERVICE MANUAL

Website:http://biz.LGservice.comWebsite:http://biz.LGservice.com

E-mail:http://www.LGEservice.com/techsup.htmlE-mail:http://www.LGEservice.com/techsup.html

CAUTIONCAUTION

BEFORE SERVICING THE UNIT,BEFORE SERVICING THE UNIT,

READ THREAD TH

E E

SAFETY PRECSAFETY PREC

AUTIONS IN THIS MANUAL.AUTIONS IN THIS MANUAL.

MODEL:MODEL:

StSt

udud

ioio

oror

ks 5ks 5

0505

(505EL-AP**M, AH**M, AL**M)(505EL-AP**M, AH**M, AL**M)

StSt

udud

ioio

oror

ks 5ks 5

0505

(505EL-AP**A, AL**A)(505EL-AP**A, AL**A)

CHASSIS NO. : CA-138CHASSIS NO. : CA-138

( (

))

****

Same model for ServiceSame model for Service

StSt

udiudi

WoWo

rkrk

s 500s 500

(505EL-AP**M, AH**M, AL**M)(505EL-AP**M, AH**M, AL**M)

StSt

udiudi

orkork

s 500s 500

(505EL-AP**A, AL**A)(505EL-AP**A, AL**A)

1. PICTURE TUBE1. PICTURE TUBE

: :

5 5

h h

((

t t

e e

))

DefIection DefIection

Angle Angle

: :

90°90°

Neck Neck

Diameter Diameter

: :

29.29.

mmmm

t t

: :

8 8

Face Face

Treatment Treatment

: :

AR-ASC AR-ASC

(Anti-Reflection (Anti-Reflection

andand

Anti-Static Coating)Anti-Static Coating)

AG(Anti-Glare)AG(Anti-Glare)

w w

, ,

N N

R R

2. SIGNAL2. SIGNAL

2-1. Horizontal & Vertical Sync2-1. Horizontal & Vertical Sync

1) Input Voltage Level1) Input Voltage Level

: Low= 0~1.2V, High= 2.: Low= 0~1.2V, High= 2.

5~5.5V5~5.5V

) S) S

c Pc P

: P: P

e oe o

r Nr N

2-2. Video Input Signal2-2. Video Input Signal

) )

e e

: :

0 0

~ ~

7 7

) )

r r

, ,

: :

0 0

) )

r r

, ,

: :

7 7

) )

r r

, ,

: :

7 7

2) 2)

InIn

pupu

t t

ImIm

pepe

dada

ncnc

: :

7575

ΩΩ

) )

o o

: :

, ,

B B

4) 4)

SiSi

gngn

al al

FoFo

rmrm

atat

: :

ReRe

fefe

r r

to to

thth

e e

TiTi

mimi

ng ng

ChCh

arar

2-3. Signal Connector2-3. Signal Connector

15-pin D-Sub Connector (Attached Type)15-pin D-Sub Connector (Attached Type)

2-4. Scanning Frequency2-4. Scanning Frequency

: :

0 0

~ ~

4 4

: :

0 0

~ ~

0 0

3. POWER SUPPLY3. POWER SUPPLY

3-1. Power Range3-1. Power Range

AC 100~240V (Free Voltage), 50/60Hz, 1.0A Max.AC 100~240V (Free Voltage), 50/60Hz, 1.0A Max.

3-2. Power Consumption3-2. Power Consumption

4. DISPLAY AREA4. DISPLAY AREA

4-14-1

. Ac. Ac

tivtiv

e Vide Vid

eo Aeo A

rearea

• 285 • 285

x x

215 mm 215 mm

(11.22" x8.46") - (11.22" x8.46") -

Max Image Max Image

SizeSize

• 270 x 200 m• 270 x 200 m

m (10.m (10.

63"63"

7.87"7.87"

))

- Pre- Pre

set set

ImagImag

e Size Siz

. D. D

y Cy C

: F: F

l Cl C

4-34-3

. Di. Di

splspl

ay ay

ResRes

oluolu

tiotio

: 10: 10

24 x 24 x

768 768

/ 60/ 60

HzHz

(Non-Interlace)(Non-Interlace)

4-4-

4. 4.

idid

eo eo

BaBa

ndnd

wiwi

dtdt

: :

65 65

HzHz

5. ENVIRONMENT5. ENVIRONMENT

5-1. Op5-1. Op

erating erating

TemperaTempera

ture: 1ture: 1

0°0°

C ~ 40°C ~ 40°

(Ambient)(Ambient)

5-2. 5-2.

Relative Relative

Humidity Humidity

: :

10%~10%~

0%0%

(Non-condensing)(Non-condensing)

. .

: :

0 0

6. DIMENSIONS (with 6. DIMENSIONS (with

TILT/SWIVETILT/SWIVE

L)L)

Width Width

: :

356.0 356.0

mm mm

(14.01")(14.01")

Depth Depth

: :

6060

.0 mm (1.0 mm (1

3.103.10

")")

: :

0 0

m m

((

))

7. WEIGHT (with TILT/SWIVEL)7. WEIGHT (with TILT/SWIVEL)

t t

: :

5 5

g g

((

6 6

))

s s

: :

7 7

g g

((

1 1

))

CONTENTSCONTENTS

- 2- 2

SPECIFICASPECIFICA

TIONS TIONS

......................................................................................................

SAFETY SAFETY

PRECAUTIONS PRECAUTIONS

................................................................................

SERVICE PRECAUTIONSERVICE PRECAUTION

........................................ 4........................................ 4

WIRING DIAGRAM ................................................. .7WIRING DIAGRAM ................................................. .7

BLOCK DIAGRAM ................................................... 8BLOCK DIAGRAM ................................................... 8

DESCRIPTION OF BLOCK DIAGRAM.....................9DESCRIPTION OF BLOCK DIAGRAM.....................9

ADJUSTMENADJUSTMEN

T T

........................................................ ........................................................

TROUBLESHOOTTROUBLESHOOT

ING GUIDE ING GUIDE

.............................. 1.............................. 1

EXPLODED EXPLODED

VIEWVIEW

......................................................................................................

33

REPLACEMEREPLACEME

NT NT

ARTS LIST ARTS LIST

..............................................................

SCHEMATIC DIAGRAM......................................... 37SCHEMATIC DIAGRAM......................................... 37

PRINTED CIRCUIT BOARD................................... 39PRINTED CIRCUIT BOARD................................... 39

SPECIFICATIONSSPECIFICATIONS

MODEMODE

MAXMAX

NORMAL (ON)NORMAL (ON)

STAND-BYSTAND-BY

SUSPENDSUSPEND

OFFOFF

POWER CONSUMPTIONPOWER CONSUMPTION

75 W75 W

63 W63 W

less than 15 Wless than 15 W

less less

than than

5 5

LED COLORLED COLOR

GREENGREEN

FLASHFLASH

SAFETY PRECAUTIONSSAFETY PRECAUTIONS

- 3- 3

SAFETY-RELATED COMPONENT WARNING!SAFETY-RELATED COMPONENT WARNING!

There are special components used in this color monitorThere are special components used in this color monitor

which are important for safety.which are important for safety.

These parts are markedThese parts are marked

on the schematic diagram and the replacementon the schematic diagram and the replacement

parts list.parts list.

It is essential that these critical parts should beIt is essential that these critical parts should be

replaced with the manufacturer's specified parts to preventreplaced with the manufacturer's specified parts to prevent

X-radiation, shock, fire, or other hazards. Do not modifyX-radiation, shock, fire, or other hazards. Do not modify

the original design without obtaining written permissionthe original design without obtaining written permission

from manufacturer or you will void the original parts andfrom manufacturer or you will void the original parts and

labor guarantee.labor guarantee.

CAUTION:CAUTION:

No modification of any circuit should beNo modification of any circuit should be

attempted.attempted.

Service work should be performed only afterService work should be performed only after

you are thoroughly familiar with all of theyou are thoroughly familiar with all of the

following safety checks and servicingfollowing safety checks and servicing

guidelines.guidelines.

SAFETY CHECKSAFETY CHECK

Care should be taken while servicing this color monitorCare should be taken while servicing this color monitor

because of the high voltage used in the deflection circuits.because of the high voltage used in the deflection circuits.

These voltages are exposed in such areas as theThese voltages are exposed in such areas as the

associated flyback and yoke circuits.associated flyback and yoke circuits.

FIRE & SHOCK HAZARDFIRE & SHOCK HAZARD

An isolation transformer must be inserted between theAn isolation transformer must be inserted between the

color monitor and AC power line before servicing thecolor monitor and AC power line before servicing the

chassis.chassis.

••

In serIn ser

vicinvicin

g, attg, att

entioentio

n musn mus

t be pt be p

aid to aid to

the orthe or

iginaigina

l leal lea

dress specially in the high voltage circuit. If a shortdress specially in the high voltage circuit. If a short

circuit is found, replace all parts which have beencircuit is found, replace all parts which have been

overheated as a result of the short circuit.overheated as a result of the short circuit.

••

All tAll t

he prohe pro

tecttect

ive deive de

vicevice

s must bs must b

e reine rein

stalstal

led peled pe

r ther the

original design.original design.

••

SoldeSolde

ring ring

must must

be inbe in

spectspect

ed foed fo

r thr th

e cole col

d sold sol

der jder j

ointoint

s,s,

frayed leads, damaged insulation, solder splashes, orfrayed leads, damaged insulation, solder splashes, or

the sharp points. Be sure to remove all foreignthe sharp points. Be sure to remove all foreign

materials.materials.

IMPLOSION PROTECTIONIMPLOSION PROTECTION

All used display tubes are equipped with an integralAll used display tubes are equipped with an integral

implosion protection system, but care should be taken toimplosion protection system, but care should be taken to

avoid damage and scratching during installation. Use onlyavoid damage and scratching during installation. Use only

same type display tubes.same type display tubes.

X-RADIATIONX-RADIATION

The only potential source of X-radiation is the picture tube.The only potential source of X-radiation is the picture tube.

However, when the high voltage circuitry is operatingHowever, when the high voltage circuitry is operating

properly there is no possibility of an X-radiation problem.properly there is no possibility of an X-radiation problem.

The basic precaution which must be exercised is keep theThe basic precaution which must be exercised is keep the

high voltage at the factory recommended level; the normalhigh voltage at the factory recommended level; the normal

high voltage is about 2high voltage is about 2

kV. The following steps describekV. The following steps describe

how to measure the high voltage and how to prevent X-how to measure the high voltage and how to prevent X-

radiation.radiation.

Note :Note :

It is important to use an accurate high voltageIt is important to use an accurate high voltage

meter calibrated periodically.meter calibrated periodically.

• •

To measurTo measur

e the e the

high volhigh vol

tage, tage,

use a use a

high ihigh i

mpedancempedance

high voltage meter, connect (–) to chassis and (+) tohigh voltage meter, connect (–) to chassis and (+) to

the CDT anode cap.the CDT anode cap.

• •

Set the Set the

brightness control brightness control

to maximum to maximum

point at point at

fullfull

white pattern.white pattern.

• •

Measure the Measure the

high voltaghigh voltag

e. The e. The

high voltage high voltage

metermeter

should be indicated at the factory recommended level.should be indicated at the factory recommended level.

• •

If the If the

meter indicatmeter indicat

ion exceeds ion exceeds

the maximum the maximum

level,level,

immediate service is required to prevent the possibilityimmediate service is required to prevent the possibility

of premature component failure.of premature component failure.

••

To prTo pr

event event

X-raX-ra

diatidiati

on poson pos

sibilsibil

ity, ity,

it is it is

essentessent

ial tial t

o useo use

the specified picture tube.the specified picture tube.

Leakage Current Hot Check CircuitLeakage Current Hot Check Circuit

CAUTION:CAUTION:

Please use only a plastic screwdriver to protect yourselfPlease use only a plastic screwdriver to protect yourself

from shock hazard during service from shock hazard during service

operation.operation.

1.5 Kohm/10W1.5 Kohm/10W

To Instrument'sTo Instrument's

exposedexposed

METALLIC PARTSMETALLIC PARTS

Good Earth GroundGood Earth Ground

such as WATER PIPE,such as WATER PIPE,

CONDUIT etc.CONDUIT etc.

AC Volt-meterAC Volt-meter

- 4

SERVICING PRECAUTIONS

CAUTION:

Before servicing receivers covered by this

service manual and its supplements and addenda, read

and follow the

SAFETY PRECAUTIONS

on page 3 of this

publication.

NOTE:

If unforeseen circumstances create

conflict

between the following servicing precautions and any of

the

safety precautions on page 3 of this publication, always

follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC

power source before;

a. Removing or reinstalling any component, circuit

board module or any other receiver assembly.

Disconnecting or reconnecting any receiver electrical

plug or other electrical connection.

Connecting a te

st substitute i

n parallel wit

h an

electrolytic capacitor in the receiver.

CAUTION:

A wrong part substitution or incorrect

polarity installation of electrolytic capacitors may

result in an explosion hazard.

Discharging the picture tube anode.

2. Test high voltage only by measuring it with an

appropriate high voltage meter or other voltage

measuring device (DVM, FETVOM, etc) equipped with

a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first

connecting one end of an insulated clip lead to the

degaussing or kine aquadag grounding system shield

at the point where the picture tube socket ground lead

is connected, and then (b) touch the other end of the

insulated clip lead to the picture tube anode button,

using an insulating handle to avoid personal contact

with high voltage.

4. Do not spray chemicals on or near this receiver or any

of its assemblies.

Unless specified ot

herwise in this

service manual,

clean electrical contacts only by applying the following

mixture to the contacts with a pipe cleaner, cotton-

tipped stick or comparable non-abrasive applicator;

10% (by volume) Acetone and 90% (by volume)

isopropyl alcohol (90%-99% strength)

CAUTION:

This is a

flammable mixture.

Unless specified otherwise in this service manual,

lubrication of contacts in not

required.

6. Do not defeat any plug/socket B+ voltage interlocks

with which receivers covered by this service manual

might be equipped.

7. Do not apply AC power to this instrument and/or any of

its electrical assemblies unless all solid-state device

heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the

receiver chassis ground before connecting the test

receiver positive lead.

Always remove the test receiver ground lead last.

Use with this receiver only the test fixtures specified in

this service manual.

CAUTION:

Do not connect the test fixture ground strap

to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be

damaged easily by static electricity. Such components

commonly are called

Electrostatically Sensitive (ES)

Devices.

Examples of typical ES devices are integrated

circuits and some field-effect transistors and

semiconductor "chip" components. The following

techniques should be used to help reduce the incidence of

component damage caused by static by static electricity.

Immediately before

handling any

semiconductor

component or semiconductor-equipped assembly, drain

off any electrostatic charge on your body by touching a

known earth ground. Alternatively, obtain and wear a

commercially available discharging wrist strap device,

which should be removed to prevent potential shock

reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with

ES devices, place the assembly on a conductive

surface such as aluminum foil, to prevent electrostatic

charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or

unsolder ES devices.

Use only an

anti-static type solder

removal device.

Some solder removal devices not classified as "anti-

static" can generate electrical charges sufficient to

damage ES devices.

5. Do not use freon-propelled chemicals. These can

generate electrical charges sufficient to damage ES

devices.

6. Do not remove a replacement ES device from its

protective package until immediately before you are

ready to install it. (Most replacement ES devices are

packaged with leads electrically shorted together by

conductive foam, aluminum foil or comparable

conductive material).

7. Immediately before removing the protective material

from the leads of a replacement ES device, touch the

protective material to the chassis or circuit assembly

into which the device will be installed.

CAUTION:

Be sure no power is applied to the chassis

or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged

replacement ES devices. (Otherwise harmless motion

such as the brushing together of your clothes fabric or

the lifting

of your foot

from a

carpeted floor

can

generate static electricity sufficient to damage an ES

device.)

- 5

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and

appropriate tip size and shape that will maintain tip

tem

per

atu

re wi

thi

n the r

ang

e or 50

F to 60

2. Use an appropriate gauge of RMA resin-core solder

composed of 60 parts tin/40 parts lead.

Keep the soldering iron tip clean and well ti

nned.

4. Thoroughly clean the surfaces to be soldered. Use a

mall wire-bristle (0.5 inch, or 1.25cm) brush with a

metal handle.

Do not use

freon-propelled spray-on cleaners.

Use the following unsoldering techni

que

a. Allow the soldering iron tip to reach normal

temperature.

(

)

Heat the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static,

suction-type solder removal device or with solder

braid.

CAUTION:

Work quickly to avoid overheating the

circuitboard printed foil.

Use the following soldering techniq

ue.

a. Allow the soldering iron tip to reach a normal

e (5

F to

First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

Quick

ly move t

he solde

ring ir

on tip to t

he junct

ion of

the component lead and the printed circuit foil, and

hold it there only until the solder flows onto and

around both the component lead and the foil.

CAUTION:

Work quickly to avoid overheating the

circuit board printed foil.

Clos

ely in

spect

the so

lder a

rea an

d remo

ve any

excess or splashed solder with a small wire-bristle

brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong)

through which the IC leads are inserted and then bent flat

against the circuit foil. When holes are the slotted type,

the following technique should be used to remove and

replace the IC. When working with boards using the

familiar round hole, use the standard technique as

outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation

by gently prying up on the lead with the soldering iron

tip as the solder melts.

2. Draw away the melted solder with an anti-static

suction-type solder removal device (or with solder

braid) before removing the IC.

Replacement

Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad

and solder it.

3. Clean the soldered areas with a small wire-bristle

brush. (It is not necessary to reapply acrylic coating to

the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1. Remove the defective transistor by clipping its leads as

close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads

remaining on the circuit board.

Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the

corresponding leads extending from the circuit board

and crimp the "U" with long nose pliers to insure metal

to metal contact then solder each connection.

Power Output, Transistor Device

Removal/Replacement

1. Heat and remove all solder from around the transistor

leads.

Remove the heat

sink mounting

screw (if

so equipped).

Carefully remove the transistor from the heat sink of the

circuit board.

Insert new transistor in the circuit board.

Solde

r each tra

nsist

or lead, an

d clip off exc

ess lead.

6. Replace heat sink.

Diode

Removal/Replaceme

1. Remove defective diode by clipping its leads as close

as possible to diode body.

2. Bend the two remaining leads perpendicular y to the

circuit board.

3. Observing diode polarity, wrap each lead of the new

diode around the corresponding lead on the circuit

board.

4. Securely crimp each connection and solder it.

Insp

ect (on t

he circ

uit boa

rd copp

er side

) the sold

joints

the

two

"original"

leads.

they

are

not

shiny,

reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1. Clip each

fuse or resistor lead at top of the circuit board

hollow stake.

2. Securely crimp the leads of replacement component

around notch at stake top.

3. Solder the connections.

CAUTION:

Maintain original spacing between the

replaced component and adjacent components and the

circuit board to prevent excessive component

temperatures.

- 6

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed

circuit board will weaken the adhesive that bonds the foil

to the circuit board causing the foil to separate from or

"lift-off" the board. The following guidelines and

procedures should be followed whenever this condition is

encountered.

At IC Connections

To repair a defective copper pattern at IC connections use

the following procedure to install a jumper wire on the

copper pattern side of the circuit board. (Use this

technique only on IC connections).

1. Carefully remove the damaged copper pattern with a

sharp knife. (Remove only as much copper as

absolutely necessary).

2. carefully scratch away the solder resist and acrylic

coating (if used) from the end of the remaining copper

pattern.

3. Bend a small "U" in one end of a small gauge jumper

wire and carefully crimp it around the IC pin. Solder the

IC connection.

4. Route the jumper wire along the path of the out-away

copper pattern and let it overlap the previously scraped

end of the good copper pattern. Solder the overlapped

area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper

pattern at connections other than IC Pins. This technique

involves the installation of a jumper wire on the

component side of the circuit board.

1. Remove the defective copper pattern with a sharp

knife.

Remove at least 1/4 inch of copper, to ensure that a

hazardous condition will not exist if the jumper wire

opens.

2. Trace along the copper pattern from both sides of the

pattern break and locate the nearest component that is

directly connected to the affected

copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead

of the nearest component on one side of the pattern

break to the lead of the nearest component on the

other side.

Carefully crimp and solder the connections.

CAUTION:

Be sure the insulated jumper wire is

dressed so the it does not touch components or sharp

edges.

WIRING DIAGRAM

- 7 -

P501(option)

P301

P302

P702

 P701

P402

P902

Signal

Cable

Socket

F

B

T

BLOCK DIAGRAM

-

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o

w

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Dynamic Fo

Static Focus

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E

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V

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D

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L

E

V

E

L

O

S

D

C

O

N

T

R

O

L

O

C

K

DESCRIPTION OF BLOCK DIAGRAM

-

1. SMPS(Switching Mode Power Supply)

When you turn on the power switch, the operating

procedure is as follows

1) The AC line voltage is rectified by the bridge diode

D900.

2) The control IC(IC901)

starts switching and generates

switch pulse in the primary turn of the SMPS

transformer(T901)

3) The switching pulses of the primary turns are induced

to the secondary turns of the transformer by the turn

ratio. This pulses are rectified by each diode(D971,

D961(D962),D951,D942,D941)

4) Each rectified DC voltage(80V, 50V, 13V, 6.3V

and 5V)

2. Over Voltage Protection Circuit

When the input

of IC901 Vin

(pin 4) is m

ore than

22V, all the secondary voltages of the SMPS

transformer (T901) down to low value

3. Display Power Management Circuit(DPM)

STAND-BY

& SUS

PEND Mode

When no input of horizontal or vertical sync Q951,

Q941 are turned off and Q952,Q942 are turned o

ff.

Then input power consumption is below 5

watts.

2) OFF Mode

When no input of horizontal and vertical sync Q951,

Q941 are turned off and Q952, Q942 are

turned off.

Then input power consumption is below 5

watts.

6. X-RAY Protection Circuit

When the high Voltage reaches to 29kV in an abnormal

case, the high voltage

detector circuit, R818,D721,C739-1

R416, C409 start operation to

shut down high voltage

circuit.

4. Microprocessor Control & Horizontal and

Vertical Sync Processor Circuit

The operating procedure is as follows ;

There is Horizon

tal & Vertical proces

s function in

Microprocessor.(IC401)

Microprocessor (IC

401) discriminat

es the operating

mode from the sync polarity a

nd resolution.

3) After microprocessor reads these adjusted mode data

stored at EEPROM, it controls operating mode data

through IIC

4) Users can control screen condition by the OSD Select,

Up, Down, Left, Right, Exit.

5) The horizontal and vertical sync processor IC (IC401)

has a sync detector, a saw-tooth generator, and drive

function, And outputs horizontal and vertical drive

signal to control screen

distortions

5. D/D Converter Circuit.

To obtain constant high voltage, this circuit

supplies

controlled DC voltage for FBT

and horizontal deflection

circuit according to the horizontal sync

frequency.

7. Horizontal S-correction Circuit.

This circuit corrects the horizontal linearity for each

horizontal sync frequency.

8. Horizontal drive and Output Circuit.

This circuit is a

horizontal deflection amplifier for raster

scan.

9. ABL Circuit

This circuit limits the beam-current for the r

eliability of

CDT

10. Vertical Output Circuit

This circuit takes the vertical ramp wave from the

TDA4867J (IC601) and perform the vertical de

flection

by supplying the saw-

tooth wave current to the vertical

deflection yoke.

11. Blanking and Brightness Control Circuit.

Blanking circuit eliminates the retrace line by

supplying a negative pulse wave to the G1 of the CDT.

Brightness control circuit is used for control of the

screen brightness by changing the DC level G1.

13. OSD (On Screen Display) Circuit.

This circuit displays information of the monitor`s status

on the screen.

12. Image Rotation (Tilt) Circuit.

This circuit corrects the tilt of the screen by

supplying the image rotation signal to the tilt coil

which is attached near the deflection yoke of the

CDT

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