MiTAC Master MP1-11TGS Series User manual

MP1-11TGS Series
User Manual
V1.1
Master Series Embedded System
Intel®Tiger Lake-UP3 Core-i/Celeron Processors
Performance, Versatile, and Rugged & Reliable

PREFACE
Copyright Notice
Copyright © 2016-2021 MiTAC Computing Technology Corporation (MiTAC Group). No part of this
document may be reproduced, copied, translated, or transmitted in any form or by any means,
electronic or mechanical, for any purpose, without the prior written permission of MiTAC Corp., Ltd.
All information and specification provided in this manual are for reference only and remain subject to
change without prior notice.
Disclaimer
We reserve the right to make changes, without notice, to any product, including circuits and/or
software described or contained in this manual in order to improve design and/or performance. We
assume no responsibility or liability for the use of the described product(s) conveys no license or title
under any patent, copyright, or masks work rights to these products, and make no representations or
warranties that these products are free from patent, copyright, or mask work right infringement,
unless otherwise specified. Applications that are described in this manual are for illustration purposes
only. We make no representation or guarantee that such application will be suitable for the specified
use without further testing or modification.
Declaration of Conformity
FCC
This equipment has been tested and found to comply with the limits for a
class "A" digital device, pursuant to part 15 of the FCC rules. These limits
are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This
equipment generates, uses, and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this
equipment in a residential area is likely to cause harmful interference in
which case the user will be required to correct the interference at him own
expense.
CE
This equipment is in conformity with the requirement of the following EU
legislations and harmonized standards. Product also complies with the
Council directions.

Safety Information
WARNING! / AVERTISSEMENT!
Always completely disconnect the power cord from your chassis
whenever you work with the hardware. Do not make connections
while the power is on. Sensitive electronic components can be
damaged by sudden power surges. Only experienced electronics
personnel should open the PC chassis.
CAUTION/ATTENTION
Always ground yourself to remove any static charge before touching
the CPU card. Modern electronic devices are very sensitive to static
electric charges. As a safety precaution, use a grounding wrist strap at
all times. Place all electronic components in a static-dissipative
surface or static-shielded bag when they are not in the chassis.
Safety Precautions
For your safety, please carefully read all the safety instructions before using the device. All cautions
and warnings on the equipment should be noted. Keep this user manual for future reference.
*Let service personnel to check the equipment in case any of the following problems appear:
The power cord or plug is damaged.
Liquid has penetrated into the equipment.
The equipment has been exposed to moisture.
The equipment does not work well or you cannot get it to work according to the user manual.
The equipment has been dropped and damaged.
The equipment has obvious signs of breakage on the surface.

Ordering Information
Model Number
CPU Model
Hot Swappable
2.5” HDD Tray
Xpansion
Module Support
AC Adaptor
MP1-11TGS-6305E
Celeron 6305E
Single Tray
Only support M.2
Dual LAN port
Xpansion
w/o AC Adaptor
MP1-11TGS-1115G4E
i3-1115G4E
MP1-11TGS-1145G7E
i5-1145G7E
MP1-11TGS-1185G7E
i7-1185G7E
MP1-11TGS-6305E-AC
Celeron 6305E
w/ 72W AC to DC
Adaptor
MP1-11TGS-1115G4E-AC
i3-1115G4E
MP1-11TGS-1145G7E-AC
i5-1145G7E
MP1-11TGS-1185G7E-AC
i7-1185G7E
MP1-11TGS-D-6305E
Celeron 6305E
Dual Tray
Support all
Xpansion models
w/o AC Adaptor
MP1-11TGS-D-1115G4E
i3-1115G4E
MP1-11TGS-D-1145G7E
i5-1145G7E
MP1-11TGS-D-1185G7E
i7-1185G7E
MP1-11TGS-D-6305E-AC
Celeron 6305E
w/ 120W AC to
DC Adaptor
MP1-11TGS-D-1115G4E-AC
i3-1115G4E
MP1-11TGS-D-1145G7E-AC
i5-1145G7E
MP1-11TGS-D-1185G7E-AC
i7-1185G7E

Packing List
Item
Description
Q’ty
1
MP1-11TGS or MP1-11TGS-D Embedded System
1
2
Quick Installation Guide (1 page)
1
3
Wall Mount Brackets (2 pcs in 1 set)
2
4
Screw Pack (For HDD and Wall Mount Bracket)
1
5
3-pin Terminal Block Power Connector (For DC Power Input)
1
6
2-pin Terminal Block Power Connector (For Remote Power Control)
1
7
4-pin Terminal Block Power Connector (For DC-out connector, only for
MP1-D)
1

Optional Xpansion Modules and Accessories
Model Number
Description
MS-48CDN-DT10
Expansion Module with 4 x RS232 / 422 / 485, 8-bit Isolated DIDO
(4 x DI, 4 x DO)
MS-04LAN-R10
Expansion Module with 4 x Intel i210-IT Giga LAN, RJ45 Port
MS-04LAN-M10
Expansion Module with 4 x Intel i210-IT Giga LAN, M12 Port
MS-04POE-R10
Expansion Module with 4 x PoE+, Intel i210-IT Giga LAN, RJ45
Port
MS-04POE-M10
Expansion Module with 4 x PoE+, Intel i210-IT Giga LAN, M12
Port
M2-02LAN-R10
Expansion Module with 2 x Intel i210-IT Giga LAN, RJ45 Port
MS-01IGN-S10
Vehicle Power Ignition Card, 12V/24V and Power ON/OFF Timing
Selectable

MS-26CAD-T10
Expansion module with 2 x CANBus 2.0B and 6-bit Isolated DIDO
(3 x DI, 3 x DO)
MB-01DINVESA
Din-rail + VESA 75x75mm holes Combo Mounting kit
MPE-072W24-3TUE
AC/DC 24V/3A, 72W 3PIN Terminal Block Power Adaptor with
EU+US power cords
MPE-120W24-3TUE
AC/DC 24V/5A, 120W 3PIN Terminal Block Power Adaptor with
EU+US power cords
MPE-220W24-3TUE
AC/DC 24V/9.2A, 220W 3PIN Terminal Block PowerAdaptor with
EU+US power cords

CONTENTS
PREFACE 1
CHAPTER 1: INTRODUCTION ..............................................................................................................10
1.1 Overview ..............................................................................................................................10
1.2 Product Features ..................................................................................................................10
1.3 Hardware Specification ........................................................................................................11
1.4 Mechanical Specification .....................................................................................................15
1.5 System I/O Placement..........................................................................................................16
CHAPTER 2: DIP SWITCH SETTING AND PIN DEFINITION...................................................................20
2.1 Jumper and Internal Connector Overall Placement.............................................................20
2.2 Jumper Setting .....................................................................................................................22
2.3 Internal Connector Pin Definition ........................................................................................24
2.4 External Connector Pin Definition........................................................................................27
2.5 Xpansion Module MS-48CDN-DT10.....................................................................................30
2.6 Xpansion Module MS-04LAN-M10 ......................................................................................34
2.7 Xpansion Module MS-01IGN-S10.........................................................................................35
CHAPTER 3: SYSTEM SETUP................................................................................................................37
CHAPTER 4: BIOS SETUP.....................................................................................................................40
4.1 Main Page.............................................................................................................................40
4.2 Advanced Page .....................................................................................................................42
4.3 Evnet logs .............................................................................................................................58
4.4 Security Page........................................................................................................................61
4.5 Boot Page .............................................................................................................................69
4.6 Save & Exit Page ...................................................................................................................73

INTRODUCTION
This chapter provides the MP1-11TGS Embedded
System product overview, including features,
hardware and mechanical specifications.
1

CHAPTER 1: INTRODUCTION
This chapter provides the MP1-11TGS Embedded System product overview, including features,
hardware, mechanical specifications, and I/O placement.
1.1 Overview
MiTAC’s MP1-11TGS embedded system is the next generation embedded system with Intel® 11st
Gen. (10nm+ manufacturing process) Tiger Lake-UP3 processor which integrates Iris Xe
outstanding graphic engine. The excellent graphic performance, performance processor, OCP/OVP
power protection, and expandable design provide the solution for every complicated task and
most types of application.
1.2 Product Features
MP1-11TGS Embedded System offers the following features:
11st Generation Intel® Tiger Lake-UP3 Core™ i7 / i5 / i3 / Celeron Processors
Integrated Intel® Iris Xe Graphic Engine
Quadruple Display with HDMI and DisplayPort Interface
Fan-less chassis and Expandable module design
Support COM/DIO/LAN/PoE via Xpansion Modules (Only for MP1-D model)
Support Power Ignition for Vehicle Application via Xpansion Module (Only for MP1-D
model)
8-24V Wide Power Voltage for MP1-11TGS; 12-36V Wide Power Voltage for
MP1-11TGS-D
15W TDP: -40 ~ 70°C
28W TDP: -40 ~ 60°C
*with 0.7m/s Air Flow (w/ Extended Temp. SSD/mSATA/RAM)

1.3 Hardware Specification
SYSTEM
CPU
11st Gen Tiger Lake-UP3 Intel®Core™ i ULV Processor
Celeron 6305E (Dual Core, 4MB Cache, up to 1.80 GHz)
i3-1115G4E (Dual Core, 6MB Cache, up to 3.90 GHz)
i5-1145G7E (Quad Core, 8MB Cache, up to 4.10 GHz)
i7-1185G7E (Quad Core, 12MB Cache, up to 4.40 GHz)
System Memory
DDR4 3200 MHz / 1 x 260-pin SO-DIMM / Max. 32GB (Non-ECC)
Graphics
Intel®Iris Xe Graphics
Display Interface
HDMI, DisplayPort
Storage Slot
MP1-11TGS
1 x Hot Swappable 2.5 HDD / SSD (Maximum 9.5mm height)
1 x M.2 B Key 2280/2260/2242 Slot
MP1-11TGS-D
2 x Hot Swappable 2.5 HDD / SSD (Maximum 9.5mm height)
1 x M.2 B Key 2280/2260/2242 Slot
1 x mSATA Slot
Ethernet
Intel® I225-LM 2.5GbE LAN + Intel®I219-LM Giga LAN
(Additional 2 x Intel® I210-IT Giga LAN for Options)
Audio
Realtek®ALC256
I/O Chipset
Nuvoton NCT6126D
TPM
Nuvoton NPCT750AABYX TPM2.0
Expansion Slot
MP1-11TGS
Wireless: M.2 2230 E key (PCIe, USB)
Storage/LTE/5G Slot: M.2 2280/2260/2242/3042/3052 B Key
(USB2.0/*PCIex1/SATAIII)
*Not support M.2 M Key NVMe SSD
**5G card support is by BOM option. Please check with sales about the M.2 B Key 3052 5G card spec if
you have any request
MP1-11TGS-D
2 x Xpansion slot (PoE/LAN/COM/DIO/IGN/CANBus Options)
Mini PCIe Full size (USB2.0 / SATAIII / PCIex1)
Wireless: M.2 2230 E key (PCIe, USB)
Storage/LTE/5G Slot: M.2 2280/2260/2242/3042/3052 B Key
(USB2.0/*PCIex1/SATAIII)
*Not support M.2 M Key NVMe SSD
**5G card support is by BOM option. Please check with sales about the M.2 B Key 3052 5G card spec if
you have any request

Indicator
Power LED, HDD LED
FRONT I/O
MP1-11TGS
3 x RS232
1 x RS232 / 422 / 485
1 x Audio Combo Jack (Mic-in and Line-out)
1 x Hot Swappable 2.5” SSD/HDD slot (Maximum 9.5mm height)
2 x USB 2.0
2 x SMAAntenna (Optional for WiFi/LTE function)
MP1-11TGS-D
3 x RS232
1 x RS232 / 422 / 485
1 x Audio Combo Jack (Mic-in and Line-out)
2 x Hot Swappable 2.5” SSD/HDD slot (Maximum 9.5mm height)
2 x USB 2.0
2 x SMAAntenna (Optional for WiFi/LTE function)
REAR I/O
MP1-11TGS
2 x DisplayPort 1.2
2 x HDMI 1.4
2 x RJ-45
4 x USB 3.1 Gen 2 (10 Gbps)
1 x 3-pin Terminal Block Power Input
1 x 2-pin Terminal Block Remote Power on / off
2 x SMAAntenna (Optional for WiFi/LTE function)
MP1-11TGS-D
2 x DisplayPort 1.2
2 x HDMI 1.4
2 x RJ-45
4 x USB 3.1 Gen 2 (10 Gbps)
1 x 3-pin Terminal Block Power Input
1 x 2-pin Terminal Block Remote Power on / off
1 x 4-pin Terminal Block Power Output (12V / 5V)
4 x SMAAntenna (Optional for WiFi/LTE function)
Watchdog Timer
1~255 Steps by Software Program
POWER REQUIREMENT
Power Input
MP1-11TGS
8~24V Wide Range DC Input w/ Terminal Block Connectivity
*Power Ignition Xpansion module is only optional in MP1-11TGS-D model.
MP1-11TGS-D
12~36V Wide Range DC-in Input w/ 3-pin Terminal Block Connectivity
*Optional Xpansion Module for Power Ignition

MECHANICAL
Thermal Design
Fanless
Mounting
Wall Mount / Side Mount
75 mm x 75 mm VESA Holes & Din Rail Mount Combo Kit (Optional)
Dimension
a. MP1-11TGS: 8.3” x 5.9” x 2.5” (210 x 150 x 63 mm)
b. MP1-11TGS-D: 8.3” x 5.9” x 4” (210 x 150 x 103 mm)
Material
Top cover: Aluminum Alloy , Bezel and chassis: Steel
ENVIRONMENTAL
Operating
Temperature
15W TDP/cTDP: -40 ~ 70°C
28W TDP: -40 ~ 60°C
*with 0.7m/s Air Flow (w/ Extended Temp. SSD/mSATA/RAM)
Operating Humidity
10%~95% R/H (Non-condensing)
Vibration Resistance
Operating, 5 Grms, 5-500 Hz, 3 Axes
(w/ SSD, according to IEC60068-2-64)
Shock Resistance
Operating, 50 Grms, Half-sine 11 ms Duration
(w/ SSD, according to IEC60068-2-27)
Certification
EMC: CE & FCC
Safety: compliant with LVD, EN62368-1
OS
OS Support
Windows®10 64-bit, Linux (support by request)
*Notes1: Installation in Restricted Access Location (RAL)
A restricted access location is a designated area within an incident area
(High or Low temperature environment)
With authorized people can enter for a period of time and for a specific
purpose.
1. Access can only be gained by service people or by users who have been
instructed about the reasons for the Restrictions applied to the location
and about any precautions that shall be taken.
2. Access is through the use of a tool or lock and key, or other means of
security, and is controlled by the authority Responsible for the location.
*Notes2: Please make sure that the power consumption is in the spec of the
power supply output capability from AC adaptor (72W or 120W). Please
choose the suitable AC adaptor for your application.
AC/DC 24V/3A, 72W 3PIN Terminal Block Power Adaptor
AC/DC 24V/5A, 120W 3PIN Terminal Block Power Adaptor

*Note3: The safety ambient operating temperature is 40 degree C if the
external AC adapter model: EA10681V or EA11011M will be placed in the
same high temperature area with the embedded system.
*Note4: In the PXE application, please install i219-LM driver in OS image in
advance before installing OS via PXE server.
*Note5: CAUTION - Lithium battery is included in this embedded system.
Please do not puncture, mutilate, or dispose of battery in fire. There will be
danger of explosion if battery is incorrectly replaced. Replace only with the
same or equivalent type recommended by manufacturer. Dispose of used
battery according to manufacturer instructions and in accordance with your
local regulations.

1.4 Mechanical Specification
MP1-11TGS
Mechanical Dimension: 210 mm x 150 mm x 63 mm
MP1-11TGS-D
Mechanical Dimension: 210 mm x 150 mm x 103 mm

1.5 System I/O Placement
MP1-11TGS
Front I/O:
Rear I/O:

MP1-11TGS-D
Front I/O:
Rear I/O:

Xpansion Module (Optional) Configuration Table
MP1-11TGS
MP1-11TGS-D

DIP SWITCH SETTING AND PIN DEFINITION
This chapter provides information about how to set up the
dip switch and use internal I/Os of MP1-11TGS Embedded
System hardware.
2

CHAPTER 2: DIP SWITCH SETTING AND PIN DEFINITION
This chapter provides information about how to set up the dip switch, and use internal I/Os of
MP1-11TGS Embedded System hardware.
2.1 Jumper and Internal Connector Overall Placement