MSC Technologies MSC C6B-8S User manual

User Manual
COM ExpressTM Module MSC C6B-8S
Type 6 Pin-out
4th Generation Intel®CoreTM Processor Family
Intel®8 Series Chipset
Rev. 1.1 2017-03-14

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Preface
Copyright Notice
Copyright © 2017 MSC Technologies GmbH. All rights reserved.
Copying of this document, and giving it to others and the use or communication of the contents
thereof, is forbidden without express authority. Offenders are liable to the payment of damages.
All rights are reserved in the event of the grant of a patent or the registration of a utility model or
design.
Important Information
This documentation is intended for qualified audience only. The product described herein is not
an end user product. It was developed and manufactured for further processing by trained
personnel.
Disclaimer
Although this document has been generated with the utmost care no warranty or liability for
correctness or suitability for any particular purpose is implied. The information in this document
is provided “as is” and is subject to change without notice.
EMC Rules
This unit has to be installed in a shielded housing. If not installed in a properly shielded
enclosure, and used in accordance with the instruction manual, this product may cause radio
interference in which case the user may be required to take adequate measures at his or her
owns expense.
Trademarks
All used product names, logos or trademarks are property of their respective owners.
Certification
MSC Technologies GmbH is certified according to DIN EN ISO 9001:2015 standards.
Life-Cycle-Management
MSC products are developed and manufactured according to high quality standards. Our life-
cycle-management assures long term availability through permanent product maintenance.
Technically necessary changes and improvements are introduced if applicable. A product-
change-notification and end-of-life management process assures early information of our
customers.
Product Support
MSC engineers and technicians are committed to provide support to our customers whenever
needed.
Before contacting Technical Support of MSC Technologies GmbH, please consult the
respective pages on our web site at www.msc-technologies.eu for the latest documentation,
drivers and software downloads.
If the information provided there does not solve your problem, please contact our Technical
Support: Email: [e-mail]
Phone: [phone]

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Content
1General Information......................................................................................................................... 5
1.1 Revision History........................................................................................................................ 5
1.2 Reference Documents............................................................................................................... 6
1.3 Introduction............................................................................................................................... 7
1.4 Module Photos.......................................................................................................................... 8
2Technical Description....................................................................................................................... 9
2.1 Key Features ............................................................................................................................ 9
2.2 Block Diagram .........................................................................................................................10
2.3 COM Express Implementation..................................................................................................11
2.4 Functional units........................................................................................................................13
2.5 Power Supply...........................................................................................................................15
2.6 Power Dissipation....................................................................................................................15
2.6.1 Running Mode...................................................................................................................15
2.6.2 Power Dissipation (Standby Modes)..................................................................................16
2.7 System Memory.......................................................................................................................16
2.8 Mechanical Dimensions ...........................................................................................................17
2.8.1 Compact module...............................................................................................................17
2.9 Thermal specifications..............................................................................................................18
2.10 Signal description.................................................................................................................19
2.10.1 High Definition Audio.........................................................................................................19
2.10.2 Ethernet............................................................................................................................20
2.10.3 Serial ATA.........................................................................................................................20
2.10.4 PCI Express Lanes ...........................................................................................................21
2.10.5 PCI Express x16 Graphic Lanes........................................................................................21
2.10.6 Express Card Support.......................................................................................................21
2.10.7 USB..................................................................................................................................22
2.10.8 LPC Bus ...........................................................................................................................22
2.10.9 LVDS Flat Panel ...............................................................................................................23
2.10.10 Analog VGA......................................................................................................................23
2.10.11 Digital Display Interfaces...................................................................................................24
2.10.12 Miscellaneous...................................................................................................................27
2.10.13 Power and System Management.......................................................................................27
2.10.14 General Purpose I/O.........................................................................................................29
2.10.15 SPI Interface.....................................................................................................................29
2.10.16 Module Type Definition......................................................................................................30
2.10.17 Power and GND................................................................................................................31
2.11 Pin List for MSC C6B-8S module (Type 6)............................................................................32
3Jumpers and Connectors................................................................................................................34
3.1 Jumpers...................................................................................................................................34
3.2 Fan Connector.........................................................................................................................34
4Watchdog .......................................................................................................................................35
5System resources ...........................................................................................................................36
5.1 PCI IRQ Routing......................................................................................................................36
5.2 IRQ Lines in APIC Mode..........................................................................................................37
5.3 SMB Address Map...................................................................................................................37
6BIOS...............................................................................................................................................38
6.1.1 Introduction.......................................................................................................................38
6.1.2 Startup Screen Overview...................................................................................................38
6.1.3 Activity Detection Background...........................................................................................38
6.1.4 Aptio Setup Utility..............................................................................................................38

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6.1.5 Configuring the System BIOS............................................................................................38
6.1.6 The BIOS Menu Structure.................................................................................................39
6.1.7 The Main Menu.................................................................................................................42
6.1.8 The Advanced Menu.........................................................................................................45
6.1.9 The Chipset Menu.............................................................................................................69
6.1.10 Boot..................................................................................................................................82
6.1.11 Security.............................................................................................................................84
6.1.12 The Save & Exit Menu.......................................................................................................85
6.2 BIOS and Firmware Update .....................................................................................................87
6.3 Blind Restoration of Bios default settings (no display available)................................................88
6.4 Restore Bios settings from file..................................................................................................88
6.5 Bios Recovery..........................................................................................................................89
6.6 Post Codes..............................................................................................................................89
6.7 Tech Notes..............................................................................................................................90
7EAPI...............................................................................................................................................93
8Troubleshooting..............................................................................................................................94

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1 General Information
1.1 Revision History
Rev.
Date
Description
1.0
2017-02-16
First release
1.1
2018-03-14
Updated Bios chapter

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1.2 Reference Documents
[1] COM Express Module Base Specification
COM Express Revision 2.1
Last update: April 10th, 2012
[2] PCI Local Bus Specification Rev. 2.1
PCI21.PDF
Last update: June 1st, 1995
http://www.pcisig.com
[3] ATA/ATAPI-6 Specification
d1410r3b.pdf
http://www.t13.org/
[4] Serial ATA Specification
Serial ATA 1.0 gold.pdf
Last update: August 29th, 2002 Rev.1.0
http://www.sata-io.org/
[5] IEEE Std. 802.3-2002
802.3-2002.pdf
http://www.ieee.org
[6] VESA Embedded DisplayPort Standard
eDP_v1_3 mem.pdf
Last update: 13.01.2012
http://www.vesa.org/
[7] Universal Bus Specification
usb_20.pdf
Last update: April 27th, 2000
http://www.usb.org
[8] Universal Serial Bus Revision 3.0 Specification
usb_30_spec_xxxxxx.zip
Last update: 13.08.2012
http://www.usb.org
[9] Mobile 4th Gen Intel® Core™ Processor Family Datasheet – Volume 1 of 2
4th-gen-core-family-mobile-m-h-processor-lines-vol-1-datasheet.pdf
Last update: June 2013
http://www.intel.de/content/www/de/de/processors/core/4th-gen-core-family-mobile-m-h-
processor-lines-vol-1-datasheet.html
[10]Mobile 4th Gen Intel® Core™ Processor Family Datasheet – Volume 2 of 2
4th-gen-core-family-mobile-m-h-processor-lines-vol-2-datasheet.pdf
Last update: June 2013
http://www.intel.de/content/www/de/de/processors/core/4th-gen-core-family-mobile-m-h-
processor-lines-vol-2-datasheet.html
[11]Intel ® 8 Series / C220 Series Chipset Family Platform Controller Hub (PCH) Datasheet:
8-series-chipset-pch-datasheet.pdf
Last update: June 2013
http://www.intel.de/content/www/de/de/chipsets/8-series-chipset-pch-datasheet.html
[12]Intel ® 8 Series / C220 Series Chipset Family Platform Controller Hub (PCH) Family
Specification Update: 8-series-chipset-pch-spec-update.pdf
Last update: June 2013 Revision 001
http://www.intel.de/content/www/de/de/chipsets/8-series-chipset-pch-spec-update.html

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1.3 Introduction
COM Express™, an open specification of the PICMG (PCI Industrial Computer Manufacturer
Group), is a module concept to bring PCI Express and other latest technologies like SATA, USB
3.0 and different display interfaces on a COM (Computer On Module).
A COM Express™ module is plugged onto an application-specific base board similar to the ETX
concept, but offers more options and a growth path to future CPU technologies. Utilizing
different sizes, COM Express™ can be used for highly embedded solutions up to high
performance platforms.
The design of the MSC C6B-8S module supports the 4th Generation Intel® Core Processor
Family enabling you to boost your embedded application to highest performance levels.
For evaluation and design-in of the COM Express™ modules we offer evaluation baseboards
and develop motherboards providing the interface infrastructure for the COM Express™ module
using PC type connectors for external access.
Currently there are four module sizes defined in the COM Express Specification 2.1: The Mini
Module, the Compact Module, the Basic Module and the Extended Module. The primary
difference between them is the over-all physical size and the performance envelope supported
by each. The Extended Module is the largest and can support larger processor and memory
solutions. The Basic Module is the most common supporting typical processor platforms in the
embedded world. The Compact Module is the smallest one and is intended to be used when
designing with processors and chipsets in small form factor footprints (SFF).
All module sizes use the same connectors and pin-outs and utilize several common mounting
hole positions. This level of compatibility allows that a carrier board designed to accommodate
an Extended Module can also support a Basic or Compact Module.
Up to 440 pins of connectivity are available between COM Express™ modules and the Carrier
Board. Legacy buses such as PCI, parallel ATA, LPC, HDA are supported as well as new high
speed serial interconnects such as PCI Express, Serial ATA and Gigabit Ethernet.
To enhance interoperability between COM Express™ modules and Carrier Boards, seven
common signaling configurations (Pin-out Types) have been defined to ease system integration.

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1.4 Module Photos
Top Side View
Bottom Side View
1
Top side memory socket
2
MAC address label
3
Layout revision
4
Board Identification number (BID)
5
Fan connector
6
CPU
7
PCH
8
Bottom side memory socket
9
COM Express® connector
10
BIOS label
1
2
3
4
5
6
7
8
9
10

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2 Technical Description
2.1 Key Features
The MSC C6B-8S COM Express module is designed as a type 6 module according to COM
Express® Module Base Specification Revision 2.1.
Key features include:
Module size: 125 mm x 95 mm
Various 4th Generation Intel® Core Processors
Dual 220 pin connector (440 pins)
2x DDR3L SO-DIMM module up to 16 GB total
Eight USB 2.0 ports; 4 shared over-current lines
Four USB 3.0 ports (with HM86 only two)
Four Serial ATA ports
Seven PCI Express x1 lanes
Support pins for two Express Cards
Analog VGA
Dual 24-bit LVDS channel (shared with eDP)
Three Digital Display Interfaces (DDI) configurable as HDMI, DVI or Display Port
High definition digital audio interface (external CODEC)
Single GBit Ethernet interface (Intel® Ethernet Connection I217-LM) with Wake On Lan
support (S3,S4,S5) ( Device ID 0x153A )
LPC interface
Support for following Super IO: Winbond 83627
Four GPI pins
Four GPO pins
+12V primary power supply input
+5V standby (optional) and 3.3V RTC power supply inputs
23 PCI Express lanes (6 on A-B and 17 on C-D)
16 of 23 PCI Express lanes used for PCI Express Graphics
TPM module (option, TPM 1.2, SLB9635)
Automatic fan control
Watchdog timer
EAPI support

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2.2 Block Diagram

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2.3 COM Express Implementation
COM Express™ required and optional features of pin-out type 6 are summarized in the
following table. The features identified as Minimum (Min.) shall be implemented by all modules.
Features identified up to Maximum (Max) may be additionally implemented by a module.
The column MSC C6B-8S shows the implemented features of the MSC module.
Type 6
MSC C6B-8S
Note
Min / Max
System I/O
A-B
PCI Express Lanes 0 - 5
1 / 6
6 (x1)
A-B
LVDS Channels
0 / 2
2
1x dual channel, 2x24 Bit
A-B
eDP on LVDS CH A pins
0 / 1
1
A-B
VGA Port
0 / 1
1
A-B
TV-Out
NA
0
A-B
DDI 0
NA
0
A-B
Serial Ports 1- 2
0 / 2
0
A-B
CAN interface on SER1
0 / 1
0
A-B
SATA Ports
1 / 4
4
2x SATA 6 Gb/s with QM87 PCH or 2x
SATA 3 Gb/s with HM86 PCH (ports 0-
1); 2x SATA 6 Gb/s (ports 2-3)
A-B
HDA Digital Interface
0 / 1
1
A-B
USB 2.0 Ports
4 / 8
8
All ports use EHCI controller 1.
A-B
USB Client
0 / 1
0
A-B
USB 3.0 Ports
0 / 4
4/2
With HM86 only two USB 3.0 ports
A-B
LAN Port 0
1 / 1
1
Intel® I217-LM GbE PHY
A-B
Express Card Support
1 / 2
2
A-B
LPC Bus
1 / 1
1
A-B
SPI
1 / 2
2
C-D
PCI Express Lanes 16-31
(same as PEG pins)
0 / 16
1 (x16)
off-module x16 PCI Express Graphics
C-D
PCI Express Graphics (PEG)
0 / 1
1
C-D
Muxed SDVO Channels
NA
0
C-D
PCI Express Lanes 6-15
0 / 2
1
C-D
PCI Bus - 32 Bit
NA
0
C-D
PATA Port
NA
0
C-D
LAN Ports 1-2
NA
0
C-D
DDI 1-3
0 / 3
3
HDMI/DVI/DP
C-D
USB 3.0 Ports
0 / 4
4
System Management
A-B
SDIO (muxed on GPIO)
0 / 1
0
A-B
General Purpose Inputs
4 / 4
4
A-B
General Purpose Outputs
4 / 4
4
A-B
SMBus
1 / 1
1
A-B
I2C
1 / 1
1
A-B
Watchdog Timer
0 / 1
1
A-B
Speaker Out
1 / 1
1
A-B
External BIOS ROM support
0 / 2
2
A-B
Reset Functions
1 / 1
1
Power Management

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A-B
Thermal Protection
0 / 1
1
A-B
Battery Low Alarm
0 / 1
1
A-B
Suspend
0 / 1
1
A-B
Wake
0 / 2
2
A-B
Power Button Support
1 / 1
1
A-B
Power Good
1 / 1
1
A-B
VCC_5V_SBY Contacts
4 / 4
4
A-B
Sleep Input
0 / 1
1
A-B
Lid Input
0 / 1
1
A-B
Fan Control Signals
0 / 2
2
A-B
Trusted Platform Modules
0 / 1
1
optional TPM 1.2 module

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2.4 Functional units
CPUs
(FCBGA-1023)
Intel® CoreTM i7-4700EQ(Quad Core, 2.4GHz, 6MB, SV 47W).
Intel® CoreTM i5-4400E (Dual Core, 2.7GHz, 3MB, SV 37W).
Intel® CoreTM i5-4402E (Dual Core, 1.6GHz, 3MB, SV 25W).
Intel® CoreTM i3-4100E (Dual Core, 2.4GHz, 3MB, SV 37W).
Intel® CoreTM i3-4102E (Dual Core, 1.6GHz, 3MB, SV 25W).
Intel® Celeron® 2000E (Dual Core, 2.2GHz, 2MB, SV 37W).
Intel® Celeron® 2002E (Dual Core, 1.5GHz, 2MB, SV 25W).
Chipset
Intel® DH82QM87 PCH with CoreTM i7 and CoreTM i5 CPUs.
Intel® DH82HM86 PCH with CoreTM i3 and Celeron® CPUs.
Memory
Two 204-pin DDR3L SO-DIMM sockets for up to 16 GB unbuffered non-
ECC DDR3L. Maximal height 1250mil = 31.75mm.
PC3L-10600 DDR3L SDRAM (DDR3-1333).
PC3L-12800 DDR3L SDRAM (DDR3-1600).
SATA
4 Serial ATA channels;
with QM87 PCH port 0-1 support SATA 6.0 GBit/s, SATA 3.0 Gb/s and
SATA 1.5 Gb/s;
with HM86 PCH port 0-1 support SATA 3.0 Gb/s and SATA 1.5 Gb/s;
port 2-3 support SATA 6.0 GBit/s, SATA 3.0 Gb/s and SATA 1.5 Gb/s.
USB
8 x USB 2.0. (EHCI controller 1)
4 x USB 3.0 with QM87 PCH
2 x USB 3.0 with HM86 PCH
COM Express™
Type 6 interface, fully compliant to COM Express Base Specification R2.1.
PCI Express™
Seven channels PCIe x1.
LPC
Low Pin Count Bus for heritage interfaces.
SPI
Serial Peripheral Interface for up to two SPI flash devices.
Graphics Controller
Intel® HD Graphics 4400/4600 depending on processor SKU.
Video Memory
Intel® Dynamic Video Memory Technology (Intel® DVMT 5.0)
LVDS
Dual channel 24-bit LVDS (1.920 x 1.200 @ 60 Hz).
Digital Display
Ports
DDPort B configurable as
HDMI (4096 x 2304 @ 24 Hz / 2560 x 1600 @ 60 Hz), DVI (1920 x 1200
@ 60 Hz) and DP (3840 x 2160 @ 60 Hz).
DDPort C configurable as
HDMI (4096 x 2304 @ 24 Hz / 2560 x 1600 @ 60 Hz), DVI (1920 x 1200
@ 60 Hz) and DP (3840 x 2160 @ 60 Hz).
DDPort D configurable as
HDMI (4096 x 2304 @ 24 Hz / 2560 x 1600 @ 60 Hz), DVI (1920 x 1200
@ 60 Hz), and DP (3840 x 2160 @ 60 Hz).
PEG
PCIe x16 graphics port (PEG) supports external graphics cards
CRT Interface
180 MHz RAMDAC (1.920 x 1200, 24-bit color @ 60 Hz).
Ethernet
10/100/1000Base-TX (Intel® I217-LM) with WOL support (S3,S4,S5)
( Device ID 0x153A )
Sound Interface
Intel® High Definition Audio Interface.
Support for up to three external codecs.
Integrated DisplayPort/HDMI Audio support.

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Watchdog Timer
Embedded controller creates watchdog alert and system reset
(programmable timeout, 1s … 10min).
TPM (option)
Optional TPM module, TPM 1.2, SLB9635.
Fan Supply
4-pin header for support of a 12V PWM fan.
Real Time Clock
RTC integrated in PCH.
CMOS Battery
External.
System Monitoring
Voltages, temperatures, fan
Core voltage
3.3V onboard voltage
12V input voltage
5V SBY input voltage
CPU temperature (0°C - 100°C)
System memory temperature
Board temperature
Fan speed and automatic fan speed control

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2.5 Power Supply
+12V primary power supply input
+5V standby
Option, is not required for module operation.
If not present, customer has to make sure that the supply voltages generated on the carrier
board are switched off during suspend states, so that no current from the carrier board’s
signal lines can flow to the CPU board.
3.3V RTC power supply
Option, is not required for module operation.
BIOS SETUP data is stored in a non-volatile backup memory device, therefore configuration
data will not get lost during power off. (except for time and date information)
Voltage
Input range
Power Consumption
+12V ±10%
+10.8V - 13.2V
Refer to chapter 2.6
+5V Standby
+4.75V - 5.25V
+3V RTC power supply
+2.0V - 3.3V
Typ. 1.8 µA
2.6 Power Dissipation
2.6.1 Running Mode
All measurements made by plugging the MSC C6B-8S module onto a MSC C6-MB-EVA
evaluation board. The module was equipped with two 4GByte memory modules Hynix
HMT451S6AFR8A-PB NO AA, 4G 1Rx8 PC3L-12800S-11-12 B4. The table below shows
typical values. They refer to consumption of the module itself without consumption of the
carrier board and CPU fan.
The following applications were tested.
1. DOS prompt.
2. Windows desktop (idle) under Microsoft Windows 7 Professional 64-bit SP1.
3. Running Intel® Thermal Analysis Tool (TAT) Ver. 4.x to achieve 70% CPU workload on
each processor core/thread and 100% Graphics workload as recommended by Intel under
Microsoft Windows 7 Professional 64-bit SP1.
Module / CPU
DOS
Win 7 Idle
Win 7 TAT
long term
max. 1)
MSC C6B-8S-008
Intel® CoreTM i7-4700EQ (47W)
17 W
5 W
53 W
59 W
MSC C6B-8S-005
Intel® CoreTM i5-4400E (37W)
17 W
5 W
43 W
45 W
MSC C6B-8S-004
Intel® CoreTM i3-4100E (37W)
15 W
5 W
38 W
- 2)
MSC C6B-8S-001
Intel® Celeron® 2000E (37W)
14W
5 W
34 W
- 2)
1) Due to the Intel® Turbo Boost Technology 2.0 feature Intel® CoreTM i5 and Intel® CoreTM i7 processors the
maximum power consumption for short durations may be higher than the long term power consumption. The
power supply must be able to deliver this additional amount of power.
2) The Intel® Turbo Boost Technology 2.0 feature is not available on Intel® CoreTM i3 and Intel® Celeron®
processors.

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2.6.2 Power Dissipation (Standby Modes)
1. System is shut down into “Soft Off” (S5) or “Suspend to Disk” (S4) by Windows 7
Professional 64-bit SP1.
2. System is shut down into “Soft Off” (S5) or “Suspend to Disk” (S4) by Windows 7
Professional 64-bit SP1 with Wake On LAN enabled.
3. System is shut down into “Suspend to RAM” (S3) by Windows 7 Professional 64-bit SP1.
4. System is shut down into “Suspend to RAM” (S3) by Windows 7 Professional 64-bit SP1
with Wake On LAN enabled.
Module / CPU
Input
Power
S3
S4 / S5
no
WOL
WOL
enabled
no
WOL
WOL
enabled
MSC C6B-8S-008
Intel® CoreTM i7-4700EQ
12V/5V_SBY
0.8 W
0.9 W
0.4 W
0.5 W
12V only
1.0 W
1.1 W
0.5 W
0.5 W
MSC C6B-8S-005
Intel® CoreTM i5-4400E
12V/5V_SBY
0.8 W
0.9 W
0.4 W
0.5 W
12V only
1.0 W
1.1 W
0.5 W
0.5 W
MSC C6B-8S-004
Intel® CoreTM i3-4100E
12V/5V_SBY
0.8 W
0.9 W
0.4 W
0.5 W
12V only
1.1 W
1.1 W
0.5 W
0.5 W
MSC C6B-8S-001
Intel® Celeron® 2000E
12V/5V_SBY
0.8 W
0.9 W
0.4 W
0.5 W
12V only
1.1 W
1.1 W
0.5 W
0.5 W
2.7 System Memory
The MSC C6B-8S CPU module provides two sockets for memory modules. The memory
modules have to meet the following demands:
204pin unbuffered non-ECC DDR3L SO-DIMM, Raw Card B and F.
1.35V Supply Voltage
DDR3L-1333 / PC3L-10600
DDR3L-1600 / PC3L-12800
Maximum module height: 31.75 mm.
SPD (Serial Presence Detect) EEPROM.

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2.8 Mechanical Dimensions
2.8.1 Compact module
There are two height options defined in the COM Express specification: 5mm and 8mm.
The height option is defined though the connectors on the baseboard.

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2.9 Thermal specifications
The cooling solution of a COM Express module based on a heat-spreader concept.
A heat-spreader is a metal plate (typically aluminum) mounted on the top of the module. The
connection between this plate and the module components is typically done by thermal interface
materials like phase change foils, gap pads and copper or aluminum blocks. A very good
thermal conductivity is required in order to conduct the heat from the CPU and the chipset to the
heat-spreader plate.
The heat-spreader of the MSC module is thermally attached using phase change materials and
small aluminum blocks filling the gap between CPU and chipset dies and the heat-spreader
plate.
The heat-spreader is not a heat-sink! It is a defined thermal interface for the system designer
with fixed mechanical dimensions, so it should be possible to change different module types
without problems. There must be a cooling solution for the system. The surface temperature of
the heat-spreader should not exceed 80°C.
Main issue for the thermal functionality of a system is that each device of the module is
operated within its specified thermal values. The max value for the CPU is 100°C and 108°C for
the chipset. So there may be system implementations where the heat-spreader temperature
could be higher.
Anyway, in this case it has to be validated that there are no thermal specification violations of
any assembled part or integrated circuit over the system temperature range even at worst case
conditions.
Additionally MSC offers adequate heat-sink solutions for the different C6B-8S modules
depending on the power dissipation of the implemented CPU. For more information please refer
to www.msc-technologies.eu or contact your sales representative.

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2.10 Signal description
Pins are marked in the following tables with the power rail associated with the pin, and, for input and I/O pins, with the input voltage tolerance. The pin
power rail and the pin input voltage tolerance may be different. For example, the PCI group is defined as having a 3.3V power rail, meaning that the
output signals will only be driven to 3.3V, but the pins are tolerant of 5V signals.
An additional label, “Sus”, indicates that the pin is active during suspend states (S3, S4, S5). If suspend modes are used, then care must be taken to
avoid loading signals that are active during suspend to avoid excessive suspend mode current draw.
I = Input.
O = Output.
OD = Open Drain output.
I/OD = Bi-directional Input/Open Drain Output Pin.
I/O = Bi-directional Input/Output.
ePU = external pull-up resistor on COM Express module.
ePD = external pull-down resistor on COM Express module.
eSR = external series resistor on COM Express module.
iPU = integrated pull-up resistor inside PCH or other IC, real value may vary from nominal one.
iPD = integrated pull-down resistor inside PCH or other IC, real value may vary from nominal one.
2.10.1 High Definition Audio
Signal
Pin
Type
Signal
Level
Power
Rail
Remark /
Tolerance
PU/PD/SR
Description
Source / Target
HDA_RST#
O
CMOS
3.3V Sus
eSR = 24.9 Ω
Reset output to CODEC, active low.
PCH 82QM87
HDA_SYNC
O
CMOS
3.3V Sus
iPD = 15 KΩ
eSR = 24.9 Ω
48kHz fixed-rate, sample-synchronization signal to the codec(s),
iPD is enabled during reset.
PCH 82QM87
HDA_BITCLK
O
CMOS
3.3V Sus
eSR = 24.9 Ω
24.00 MHz serial data clock generated by the PCH
PCH 82QM87
HDA_SDOUT
O
CMOS
3.3V Sus
ePD = 10 KΩ
iPD = 15 KΩ
eSR = 24.9 Ω
Serial TDM data output to the CODEC,
iPD is enabled during reset.
PCH 82QM87
HDA_SDIN[0:2]
I
CMOS
3.3V Sus
3.3V
iPD = 15 KΩ
eSR = 24.9 Ω
Serial TDM data inputs from up to 3 CODECs.
PCH 82QM87

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2.10.2 Ethernet
Signal
Pin
Type
Signal
Level
Power
Rail
Remark /
Tolerance
PU/PD/SR
Description
Source / Target
GBE0_MDI[0:3]+
GBE0_MDI[0:3]-
I/O
Analog
3.3V Sus
3.3V
Gigabit Ethernet Controller 0: Media Dependent Interface Differential
Pairs 0,1,2,3. The MDI can operate in 1000, 100 and 10 Mbit / sec
modes.
MDI[0]+/- B1_DA+/-
MDI[1]+/- B1_DB+/-
MDI[2]+/- B1_DC+/-
MDI[3]+/- B1_DD+/-
I217-LM
GBE0_ACT#
OD
CMOS
3.3V Sus
5V / 20 mA
Gigabit Ethernet Controller 0 activity indicator, active low.
I217-LM
GBE0_LINK#
OD
CMOS
3.3V Sus
5V / 20 mA
Gigabit Ethernet Controller 0 link indicator, active low.
I217-LM
GBE0_LINK100#
OD
CMOS
3.3V Sus
5V / 20 mA
Gigabit Ethernet Controller 0 100 Mbit / sec link indicator, active low.
I217-LM
GBE0_LINK1000#
OD
CMOS
3.3V Sus
5V / 20 mA
Gigabit Ethernet Controller 0 1000 Mbit / sec link indicator, active
low.
I217-LM
GBE0_CTREF
REF
N/A. Center tab voltage not needed by I217-LM.
2.10.3 Serial ATA
Signal
Pin
Type
Signal
Level
Power
Rail
Remark /
Tolerance
PU/PD/SR
Description
Source / Target
SATA0_TX+
SATA0_TX-
O
SATA
3.3V
AC coupled
on module
Serial ATA Channel 0 transmit differential pair.
PCH 82QM87
SATA0_RX+
SATA0_RX-
I
SATA
3.3V
AC coupled
on module
Serial ATA Channel 0 receive differential pair.
PCH 82QM87
SATA1_TX+
SATA1_TX-
O
SATA
3.3V
AC coupled
on module
Serial ATA Channel 1 transmit differential pair.
PCH 82QM87
SATA1_RX+
SATA1_RX-
I
SATA
3.3V
AC coupled
on module
Serial ATA Channel 1 receive differential pair.
PCH 82QM87
SATA2_TX+
SATA2_TX-
O
SATA
3.3V
AC coupled
on module
Serial ATA Channel 2 transmit differential pair.
PCH 82QM87
SATA2_RX+
SATA2_RX-
I
SATA
3.3V
AC coupled
on module
Serial ATA Channel 2 receive differential pair.
PCH 82QM87
SATA3_TX+
SATA3_TX-
O
SATA
3.3V
AC coupled
on module
Serial ATA Channel 3 transmit differential pair.
PCH 82QM87
SATA3_RX+
SATA3_RX-
I
SATA
3.3V
AC coupled
on module
Serial ATA Channel 3 receive differential pair.
PCH 82QM87
ATA_ACT#
OD
CMOS
3.3V
5V /20 mA
SATA activity indicator, active low.
PCH 82QM87