MSC Technologies Avnet COM Express CXC-BT User manual

COM ExpressTM Compact Module
MSC CXC-BT
Type 2 Pin-out
Intel® AtomTM Series SOC
Rev. 1.8 2020-06-12
User Manual

MSC CXC-BT User Manual
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PREFACE
Copyright Notice
Copyright © 2017 MSC Technologies GmbH. All rights reserved.
Copying of this document, and giving it to others and the use or communication of the contents
thereof, is forbidden without express authority. Offenders are liable to the payment of damages.
All rights are reserved in the event of the grant of a patent or the registration of a utility model or
design.
Important Information
This documentation is intended for qualified audience only. The product described herein is not
an end user product. It was developed and manufactured for further processing by trained
personnel.
Disclaimer
Although this document has been generated with the utmost care no warranty or liability for
correctness or suitability for any particular purpose is implied. The information in this document
is provided “as is” and is subject to change without notice.
EMC Rules
This unit has to be installed in a shielded housing. If not installed in a properly shielded
enclosure, and used in accordance with the instruction manual, this product may cause radio
interference in which case the user may be required to take adequate measures at his or her
owns expense.
Trademarks
All used product names, logos or trademarks are property of their respective owners.
Certification
MSC Technologies GmbH is certified according to DIN EN ISO 9001:2015 standards.
Life-Cycle-Management
MSC products are developed and manufactured according to high quality standards. Our life-
cycle-management assures long term availability through permanent product maintenance.
Technically necessary changes and improvements are introduced if applicable. A product-
change-notification and end-of-life management process assures early information of our
customers.
Product Support
MSC engineers and technicians are committed to provide support to our customers whenever
needed.
Before contacting Technical Support of MSC Technologies GmbH, please consult the
respective pages on our web site at www.msc-technologies.eu for the latest documentation,
drivers and software downloads.
If the information provided there does not solve your problem, please contact our Technical
Support: Email: [e-mail]
Phone: [phone]

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CONTENT
Copyright Notice ............................................................................................................................... 2
Important Information ....................................................................................................................... 2
Disclaimer.......................................................................................................................................... 2
EMC Rules ......................................................................................................................................... 2
Trademarks........................................................................................................................................ 2
Certification....................................................................................................................................... 2
Life-Cycle-Management .................................................................................................................... 2
Product Support................................................................................................................................ 2
General Information......................................................................................................................... 5
1.1 Revision History........................................................................................................................ 5
1.2 Reference Documents............................................................................................................... 6
1.3 Introduction............................................................................................................................... 7
1.4 Module Photos.......................................................................................................................... 8
Technical Description....................................................................................................................... 9
2.1 Key features.............................................................................................................................. 9
2.2 Block diagram..........................................................................................................................10
2.3 COM Express implementation..................................................................................................11
2.4 Functional units........................................................................................................................13
2.5 Power Supply...........................................................................................................................15
2.6 Power Dissipation....................................................................................................................15
2.6.1 Running Mode...................................................................................................................15
2.6.2 Power Dissipation (Standby Modes)..................................................................................15
2.7 System Memory.......................................................................................................................16
2.8 Mechanical Dimensions ...........................................................................................................17
2.8.1 Compact module...............................................................................................................17
2.9 Thermal specifications..............................................................................................................18
2.9.1 Operating Temperature Range..........................................................................................18
2.9.2 CPU Temperature Range..................................................................................................19
2.9.3 Use Conditions..................................................................................................................19
2.10 Signal description.................................................................................................................20
2.10.1 High Definition Audio.........................................................................................................20
2.10.2 Ethernet............................................................................................................................21
2.10.3 IDE ...................................................................................................................................21
2.10.4 Serial ATA.........................................................................................................................22
2.10.5 PCI Bus ............................................................................................................................22
2.10.6 PCI Express Lanes ...........................................................................................................24
2.10.7 Express Card Support.......................................................................................................24
2.10.8 USB..................................................................................................................................25
2.10.9 LPC Bus ...........................................................................................................................26
2.10.10 LVDS Flat Panel ...............................................................................................................26
2.10.11 Analog VGA......................................................................................................................27
2.10.12 Miscellaneous...................................................................................................................27
2.10.13 Power and System Management.......................................................................................28
2.10.14 General Purpose I/O.........................................................................................................29
2.10.15 SDIO.................................................................................................................................29

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2.10.16 SPI Interface.....................................................................................................................30
2.10.17 Module Type Definition......................................................................................................31
2.10.18 Power and GND................................................................................................................32
2.11 Pin List for MSC CXC-BT module (Type 2) ...........................................................................33
Jumpers and Connectors................................................................................................................35
3.1 Jumpers...................................................................................................................................35
3.2 Fan Connector.........................................................................................................................35
Watchdog .......................................................................................................................................36
System resources ...........................................................................................................................37
5.1 PCI IRQ Routing......................................................................................................................37
5.2 SMB Address Map...................................................................................................................38
BIOS...............................................................................................................................................38
6.1 Introduction..............................................................................................................................38
6.1.1 Startup Screen Overview................................................................................................38
6.1.2 Activity Detection Background.......................................................................................38
6.1.3 Aptio Setup Utility...........................................................................................................38
6.1.4 Configuring the System BIOS.........................................................................................39
6.2 The Main Menu........................................................................................................................41
6.2.1 MSC Board Info ................................................................................................................42
6.2.2 Hardware Monitoring Measurement...................................................................................43
6.2.3 Firmware Update...............................................................................................................43
6.3 The Advanced Menu................................................................................................................44
6.3.1 Trusted Computing ( TPM 1.2)..........................................................................................45
6.3.2 Trusted Computing ( TPM 2.0 ).........................................................................................45
6.3.3 ACPI Settings....................................................................................................................45
6.3.4 Serial Port Console Redirection.........................................................................................46
6.3.5 Console Redirection Submenu..........................................................................................46
6.3.6 CPU Configuration............................................................................................................47
6.3.7 PPM Configuration............................................................................................................49
6.3.8 IDE Configuration..............................................................................................................49
6.3.9 Internal Devices Configuration...........................................................................................50
6.3.10 AMI Graphic Output Policy................................................................................................50
6.3.11 Network stack Configuration..............................................................................................50
6.3.12 CSM Configuration............................................................................................................51
6.3.13 NVMe ...............................................................................................................................52
6.3.14 SDIO Configuration...........................................................................................................52
6.3.15 USB Configuration ............................................................................................................52
6.3.16 Security Configuration.......................................................................................................53
6.3.17 SIO WB627/SMSC 311x Configuration..............................................................................54
6.3.18 EC Hardware Monitoring...................................................................................................55
6.3.19 Legacy IRQ Reservation...................................................................................................58
6.3.20 Module-specific Initialization..............................................................................................58
6.3.21 I210 Gigabit Connection Settings ......................................................................................59
6.4 Chipset ....................................................................................................................................59
6.4.1 Flat Panel Configuration....................................................................................................60
6.4.2 North Bridge......................................................................................................................61
6.4.3 South Bridge.....................................................................................................................62
6.4.4 Security.............................................................................................................................65
6.4.5 Boot..................................................................................................................................67
6.4.6 The Save & Exit Menu.......................................................................................................69
Bios and Firmware Update..............................................................................................................71
7.1 Setup Controlled Update..........................................................................................................71

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7.2 Bios Update from EFI Shell......................................................................................................72
7.3 Bios Update from Linux............................................................................................................72
7.4 Bios Update from Windows......................................................................................................72
7.5 Blind Restoration of Bios default settings (no display available)................................................72
7.6 Bios Recovery..........................................................................................................................73
7.7 Bios Recovery (for BIOS version older than V1.50 )..................................................................73
7.8 Clear CMOS and Recovery Jumper .........................................................................................74
7.9 Post Codes..............................................................................................................................74
Technotes.......................................................................................................................................75
EAPI...............................................................................................................................................77
BIOS Configurator Tool ...............................................................................................................78
Troubleshooting...........................................................................................................................78
GENERAL INFORMATION
1.1 Revision History
Rev.
Date
Description
1.0
2017-01-26
First release
1.1
2017-05-18
Bios corrections
1.2
2018-01-03
Clear Backup jumper changed to BIOS Default jumper
1.3
2018-07-11
TPM corrected from SLB9635 to SLB9660
1.4
2018-08-29
8GB SO-DIMM support added
1.5
2018-10-15
Bios chapter updated
1.6
2018-10-22
Add WD Info
1.7
2020-05-14
Changed to Avnet CI
1.8
2020-06-12
Added Use Conditions

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1.2 Reference Documents
[1] COM Express Module Base Specification
COM Express Revision 2.1
Last update: April 10th, 2012
[2] PCI Local Bus Specification Rev. 2.1
PCI21.PDF
Last update: June 1st, 1995
http://www.pcisig.com
[3] ATA/ATAPI-6 Specification
d1410r3b.pdf
http://www.t13.org/
[4] Serial ATA Specification
Serial ATA 1.0 gold.pdf
Last update: August 29th, 2002 Rev.1.0
http://www.sata-io.org/
[5] IEEE Std. 802.3-2002
802.3-2002.pdf
http://www.ieee.org
[6] VESA Embedded DisplayPort Standard
eDP_v1_3 mem.pdf
Last update: 13.01.2012
http://www.vesa.org/
[7] Universal Bus Specification
usb_20.pdf
Last update: April 27th, 2000
http://www.usb.org
[8] Universal Serial Bus Revision 3.0 Specification
usb_30_spec_xxxxxx.zip
Last update: 13.08.2012
http://www.usb.org

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1.3 Introduction
COM Express™, an open specification of the PICMG (PCI Industrial Computer Manufacturer
Group), is a module concept to bring PCI Express and other latest technologies like SATA, USB
2.0 and LVDS on a COM (Computer On Module).
A COM Express™ module is plugged onto an application-specific base board and offers a
migration path to future CPU technologies as they become available. Utilizing different form
factors, COM Express™ can be used for deeply embedded solutions all the way up to high
performance platforms.
The design of the MSC CXC-BT module supports the Intel® Atom-Series System-on-Chip
(SOC) platform enabling the embedded application to provide high power efficiency.
For evaluation and design-in of the COM Express™ modules MSC offers evaluation
baseboards and development motherboards providing the interface infrastructure for the COM
Express™ module using PC type connectors for external access.
Currently four module sizes are defined in the COM Express Specification 2.1: the Mini Module,
the Compact Module, the Basic Module and the Extended Module. The main difference
between them is the over-all physical size and the performance envelope supported.
All module sizes of the same type use the same connectors and pin-outs and utilize several
common mounting hole positions. This level of compatibility permits a carrier board designed to
accommodate an Extended Module to also support a Basic or Compact Module.
Up to 440 pins are available between COM Express™ modules and the Carrier Board.
To enhance interoperability between COM Express™ modules and Carrier Boards, seven
common signaling configurations (Pin-out Types) have been defined to ease system integration.

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1.4 Module Photos
Top Side View
Bottom Side View
1
Top side memory socket
2
MAC address label
3
BIOS label
4
System On Chip (SOC)
5
Layout revision
6
Board Identification
number (BID)
7
Fan connector
8
Micro SD card socket
9
COM Express®connector
10
Bottom side memory
socket
1
2
3
5
6
7
8
4
10
9

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TECHNICAL DESCRIPTION
2.1 Key features
The MSC CXC-BT COM Express module is designed as a type 2 module according to COM
Express® Module Base Specification Revision 2.1.
Key features include:
Module size: 95 mm x 95 mm
Intel® Atom-Series System-on-Chip (SOC)
Dual 220 pin connector (440 pins)
2x DDR3L SO-DIMM module up to 4 GB each one or one 8 GB module
Eight USB 2.0 ports, 4 shared over-current lines
Two Serial ATA 3.0 Gbit/s ports (one must be used for PATA option)
Optional PATA interface (only one ATA device useable)
Micro SD card socket (max. speed UHS-I, bootable)
2 PCI Express lanes (on A-B), optionally 4 PCI Express lanes with PCIe switch variant
32 bit PCI interface
Support pins for two Express Cards
Display interfaces
oDual 24-bit LVDS channel
oAnalog VGA
High definition digital audio interface (external CODEC)
Single Gbit Ethernet interface (Intel® Ethernet Controller I210-AT)
LPC interface
BIOS support for Super IO Winbond 83627 and SMSC311x (on carrier board via LPC
interface)
Four GPI pins
Four GPO pins
+12V primary power supply input
+5V standby (optional) and 3.3V RTC power supply inputs
TPM module (optional TPM 1.2, SLB9660)
Automatic fan control
Watchdog timer

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2.2 Block diagram

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2.3 COM Express implementation
COM Express™ required and optional features for pin-out type 2 are summarized in the
following table. The features identified as Minimum (Min.) shall be implemented by all modules.
Features identified up to Maximum (Max) may be additionally implemented by a module.
The column MSC CXC-BT shows the features implemented by the MSC module.
Type 6
MSC CXC-BT
Note
Min / Max
System I/O
A-B
PCI Express Lanes 0 - 5
1 / 6
2 (x1) (4 (x1))
Four PCIe lanes only with PCIe switch
option
A-B
LVDS Channels
0 / 2
2
1x dual channel, 2x24 Bit
A-B
eDP on LVDS CH A pins
NA
0
A-B
VGA Port
0 / 1
1
A-B
TV-Out
NA
0
A-B
DDI 0
NA
0
A-B
Serial Ports 1- 2
NA
0
A-B
CAN interface on SER1
NA
0
A-B
SATA Ports
1 / 4
1 (2)
SATA 3.0 Gbit/s (second port is shared
with PATA)
A-B
HDA Digital Interface
0 / 1
1
A-B
USB 2.0 Ports
4 / 8
8
A-B
USB Client
0 / 1
0
A-B
USB 3.0 Ports
NA
0
A-B
LAN Port 0
1 / 1
1
Intel® Ethernet Controller I210-AT
A-B
Express Card Support
1 / 2
2
A-B
LPC Bus
1 / 1
1
A-B
SPI
1 / 2
1
An external SPI BIOS Flash is not
supported.
C-D
PCI Express Lanes 16-31
0 / 16
0
C-D
PCI Express Graphics (PEG)
0 / 1
0
C-D
Muxed SDVO Channels
0 / 2
0
C-D
PCI Express Lanes 6-15
NA
0
C-D
PCI Bus - 32 Bit
1 / 1
1
C-D
PATA Port
1 / 1
1
Not available together with second
SATA port. Only one ATA device.
C-D
LAN Ports 1-2
NA
0
C-D
DDI 1-3
NA
0
C-D
USB 3.0 Ports
NA
0
System Management
A-B
SDIO (muxed on GPIO)
NA
0
Max. UHS-I
A-B
General Purpose Inputs
4 / 4
4
A-B
General Purpose Outputs
4 / 4
4
A-B
SMBus
1 / 1
1
A-B
I2C
1 / 1
1
A-B
Watchdog Timer
0 / 1
1
A-B
Speaker Out
1 / 1
1
A-B
External BIOS ROM support
0 / 2
1
A-B
Reset Functions
1 / 1
1

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Power Management
A-B
Thermal Protection
0 / 1
0
A-B
Battery Low Alarm
0 / 1
1
A-B
Suspend
0 / 1
1
A-B
Wake
0 / 2
2
A-B
Power Button Support
1 / 1
1
A-B
Power Good
1 / 1
1
A-B
VCC_5V_SBY Contacts
4 / 4
4
A-B
Sleep Input
NA
0
A-B
Lid Input
NA
0
A-B
Fan Control Signals
NA
0
A-B
Trusted Platform Modules
NA
0
optional on module TPM 1.2

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2.4 Functional units
CPUs
(FCBGA 1170
package)
Intel® AtomTM Processor E3845, 1.91 GHz, Quad Core, 2MB L2, TDP 10W,
Intel® HD Graphics.
Intel® AtomTM Processor E3827, 1.75 GHz, Dual Core, TDP 8W, 1MB L2,
Intel® HD Graphics.
Intel® AtomTM Processor E3826, 1.46 GHz, Dual Core, TDP 7W, 1MB L2,
Intel® HD Graphics.
Intel® AtomTM Processor E3825, 1.33 GHz, Dual Core, TDP 6W, 1MB L2,
Intel® HD Graphics.
Intel® AtomTM Processor E3815, 1.46 GHz, Single Core, TDP 5W, 512KB
L2, Intel® HD Graphics.
Intel® Celeron® Processor J1900, 2 GHz, Burst 2.41 GHz, Quad Core, TDP
10W, 2MB L2, Intel® HD Graphics.
Intel® Celeron® Processor N2930, 1.83 GHz, Burst 2.16 GHz, Quad Core
TDP 7.5W, 2MB L2, Intel® HD Graphics.
E3815, E3825, E3826, E3827, E3845: TJUNCTION = - 40°C to 110°C,
J1900: TJUNCTION max. 105°C, N2930: TJUNCTION max. 100°C
Memory
Two 204-pin DDR3L SO-DIMM sockets for up to 8GB non-ECC unbuffered
DDR3L. (E3815 and E3825: Only one socket.)
Maximal height 1250mil = 31.75mm.
PC3-8500 DDR3/L SDRAM (DDR3-1066) (E3815, E3825, E3826)
PC3-10600 DDR3/L SDRAM (DDR3-1333).
(Module topside socket should be filled first.)
SATA
2 SATA channels up to 3.0 Gbit/s.
(Second SATA port is optional. It is used for PATA interface by default.)
EIDE
One Enhanced IDE port for only one ATA device. (Only available when
second SATA option is not used.)
USB
8 x USB 2.0.
COM Express™
Type 2 interface, fully compliant to COM Express Base Specification R2.1.
PCI Express™
Up to four channels PCIe x1. (Without PCIe switch option, there are only two
PCI Express lanes available.)
PCI
One 32 bit standard interface.
LPC
Low Pin Count Bus for heritage interfaces.
SPI
Serial Peripheral Interface for one SPI flash device.
Graphics
Controller
Integrated Intel® 7th generation graphics engine.
LVDS
Dual channel 24-bit LVDS
CRT Interface
VGA

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Ethernet
10/100/1000Base-TX (Intel® Ethernet Controller I210-AT).
Sound Interface
High Definition Audio Interface.
Support for up to two external codec.
Watchdog Timer
Embedded controller creates watchdog alert and system reset.
TPM (option)
Optional TPM module, TPM 1.2, SLB9660.
Fan Supply
4-pin header for support of a 12V PWM fan.
Real Time Clock
RTC integrated in Intel® Atom SOC.
CMOS Battery
External.
System
Monitoring
Voltages, temperatures, fan
Core voltage
3.3V onboard voltage
12V input voltage
5V SBY input voltage
CPU temperature (0°C - 105°C)
System memory temperature
Board temperature
Fan speed and automatic fan speed control
Socket
Micro SD Card socket (max. UHS-I). This socket is designed for system
internal use, so there is no ESD protection implemented.

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2.5 Power Supply
+12V primary power supply input
+5V standby
Option, is not required for module operation.
If not present, customer must ensure that the supply voltages which are generated on the
carrier board are switched off during suspend states, so that no current from the carrier
board’s signal lines can flow to the CPU board.
3.3V RTC power supply
Option, is not required for module operation.
BIOS SETUP data is stored in a nonvolatile backup memory device, therefore configuration
data will not get lost after power removal (except for time and date information)
Voltage
Input range
Power Consumption
+12V
+5V - 17.0 V
Refer to chapter 2.6
+5V Standby
+4.75V - 5.25 V
+3V RTC power supply
+2.5V - 3.3V
< 4 µA
2.6 Power Dissipation
2.6.1 Running Mode
All measurements were made by plugging the MSC CXC-BT module onto a MSC MB-EVA2
carrier. The module was equipped with two 4GByte memory modules Hynix
HMT351S6EFR8A-PB N0 AA, 4GB 2Rx8 PC3L-12800S-11-12-F3. The table below shows
typical values which refer to consumption of the module itself without consumption of the
base board and CPU fan.
The following applications have been tested.
1. DOS prompt.
2. Windows desktop (idle) under Microsoft Windows 7 Professional 64-bit SP1.
3. Running Intel® Thermal Analysis Tool (TAT) Ver. 5.x to achieve 100% CPU workload on
each processor core/thread, 100% Graphics workload and 100% Memory Read Stress
workload under Microsoft Windows 7 Professional 64-bit SP1.
Module / CPU
DOS
Win 7 Idle
Win 7 TAT
long term
max.
CXC-BT-001 (Intel® AtomTM E3815, single core,
512 KB cache, 1.46GHz, 5W, 1ch DDR3L)
4.8 W
4.5 W
7.4 W
7.9 W
CXC-BT-002 (Intel® AtomTM E3825, dual core,
1 MB cache, 1.45GHz, 6W, 1ch DDR3L)
4.9 W
4.6 W
7.4 W
9.5 W
CXC-BT-004 (Intel® AtomTM E3827, dual core,
1 MB cache, 1.75GHz, 8W, 2ch DDR3L)
5.8 W
5.1 W
10.0 W
14.5 W
CXC-BT-005 (Intel® AtomTM E3845, quad core,
2 MB cache, 1.91GHz, 10W, 2ch DDR3L)
5.9 W
5.4 W
15.4 W
16.7 W
CXC-BT-007 (CeleronTM J1900, quad core, 2 MB
cache, 2 GHz, 2.41 GHz, 10W, 2ch DDR3L)
5.8 W
4.9 W
12.6 W
21.9 W 1)
1) Burst
2.6.2 Power Dissipation (Standby Modes)
1. System is shut down into “Soft Off” (S5) or “Suspend to Disk” (S4) by Windows 7
Professional 64-bit SP1.
2. System is shut down into “Soft Off” (S5) or “Suspend to Disk” (S4) by Windows 7
Professional 64-bit SP1 with Wake On LAN enabled.
3. System is shut down into “Suspend to RAM” (S3) by Windows 7 Professional 64-bit SP1.

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4. System is shut down into “Suspend to RAM” (S3) by Windows 7 Professional 64-bit SP1
with Wake On LAN enabled.
Module / CPU
Input Power
S3
S4 / S5
no
WOL
WOL
enabled
no
WOL
WOL
enabled
CXC-BT-001 (Intel® AtomTM
E3815, single core, 512 KB
cache, 1.46GHz, 5W, 1ch
DDR3L)
12V/5V_SBY
0.45 W
0.53 W
0.36 W
0.44 W
12V only
0.48 W
0.55 W
0.36 W
0.44 W
CXC-BT-002 (Intel® AtomTM
E3825, dual core, 1 MB cache,
1.45GHz, 6W, 1ch DDR3L)
12V/5V_SBY
0.44 W
0.52 W
0.36 W
0.43 W
12V only
0.47 W
0.54 W
0.36 W
0.43 W
CXC-BT-004 (Intel® AtomTM
E3827, dual core, 1 MB cache,
1.75GHz, 8W, 2ch DDR3L)
12V/5V_SBY
0.53 W
0.61 W
0.37 W
0.44 W
12V only
0.55 W
0.63 W
0.37 W
0.44 W
CXC-BT-005 (Intel® AtomTM
E3845, quad core, 2 MB cache,
1.91GHz, 10W, 2ch DDR3L)
12V/5V_SBY
0.53 W
0.61 W
0.36 W
0.44 W
12V only
0.56 W
0.63 W
0.36 W
0.44 W
CXC-BT-007 (CeleronTM J1900,
quad core, 2 MB cache, 2 GHz,
2.41 GHz, 10W, 2ch DDR3L)
12V/5V_SBY
0.52 W
0.61 W
0.36 W
0.44 W
12V only
0.54 W
0.62 W
0.35 W
0.43 W
2.7 System Memory
The MSC CXC-BT CPU module provides two sockets for memory modules which have to meet
the following demands:
204pin unbuffered non-ECC DDR3L SO-DIMM.
1.35V Supply Voltage
DDR3L-1333 / PC3L-10600, DDR3L-1067 / PC3L-8500
Maximum module height: 1250mil = 31.75mm.
SPD (Serial Presence Detect) EEPROM.
Max 4GB per socket or one 8GB module.
No mixed Raw Card support
When using only one memory module, insert it into the socket on the topside of
the module.
At temperatures above +60°C the memory refresh rate must be doubled with BIOS
option DDR double Refresh Rate set to Enabled.

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2.8 Mechanical Dimensions
2.8.1 Compact module
There are two height options defined in the COM Express specification: 5mm and 8mm.
The height option is defined by the connectors on the baseboard.

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2.9 Thermal specifications
The cooling solution of a COM Express module is based on a heat-spreader concept.
A heat-spreader is a metal plate (typically aluminum) mounted on the top of the module. The
connection between this plate and the module components is typically done by thermal interface
materials like phase change foils, gap pads and copper or aluminum blocks. A very good
thermal conductivity is required in order to conduct the heat from the CPU and the chipset to the
heat-spreader plate.
The heat-spreader of the MSC module is thermally attached using phase change materials and
small aluminium blocks filling the gap between CPU and chipset dies and the heat-spreader
plate.
The heat-spreader is not a heat-sink! It is a defined thermal interface for the system designer
with fixed mechanical dimensions, so it should be possible to interchange different module
types without problems. There must be a cooling solution for the system. The surface
temperature of the heat-spreader should not exceed 80°C.
Main issue for the thermal functionality of a system is that each device of the module is
operated within its specified thermal values. The max value for the SOC is listed in Table 2.9.2.
So there may be system implementations where the heat-spreader temperature could be
higher.
Anyway, in this case it has to be validated that there are no thermal specification violations of
any assembled part or integrated circuit over the system temperature range even at worst case
conditions.
Additionally MSC offers appropriate heat-sink solutions for the different CXC-BT modules
depending on the power dissipation of the implemented CPU. For more information please refer
to www.msc-technologies.eu/support/boards or contact your sales representative.
2.9.1 Operating Temperature Range
There are two operating temperature ranges specified for the MSC CXC-BT COM Express
module:
The operating temperature range for commercial modules is defined from 0°C to +60°C.
The operating temperature range for industrial modules is defined from -40°C to +85°C.
At temperatures above +60°C the memory refresh rate must be doubled with BIOS option DDR
double Refresh Rate set to Enabled.

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2.9.2 CPU Temperature Range
CPU
TJUNCTION in °C
Intel® AtomTM E3805
- 40 to 110
Intel® AtomTM E3815
- 40 to 110
Intel® AtomTM E3825
- 40 to 110
Intel® AtomTM E3826
- 40 to 110
Intel® AtomTM E3827
- 40 to 110
Intel® AtomTM E3845
- 40 to 110
Intel® CeleronTM J1900
0 to 105
Intel® CeleronTM N2807
0 to 105
Intel® CeleronTM N2930
0 to 105
Junction Temperature is the maximum temperature allowed at the processor die.
2.9.3 Use Conditions
The Use Conditions define run-time parameters such as the operating mode (eg. 24/7), activity factor,
max frequency, temperature range etc. for the application being used.
Certain Use Conditions may have an effect on the lifetime of the product.
Please consult MSC Technical Support if there are questions concerning specific Use Conditions when
using the selected MSC module for the target application.

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2.10 Signal description
Pins are listed in the following tables with the power rail associated with that pin, and for input and I/O pins, with the input voltage tolerance. The pin
power rail and the pin input voltage tolerance may be different.
An additional label, “Sus”, indicates that the pin is active during suspend states (S3, S4, S5). If suspend modes are used, then care must be taken to
avoid loading signals that are active during suspend to avoid excessive suspend mode current draw.
I = Input.
O = Output.
OD = Open Drain output.
I/OD = Bi-directional Input/Open Drain Output Pin.
I/O = Bi-directional Input/Output.
ePU = external pull-up resistor on COM Express module.
ePD = external pull-down resistor on COM Express module.
eSR = external series resistor on COM Express module.
iPU = integrated pull-up resistor inside PCH or other IC, real value may vary from nominal one.
iPD = integrated pull-down resistor inside PCH or other IC, real value may vary from nominal one.
2.10.1 High Definition Audio
Signal
Pin
Type
Signal
Level
Power
Rail
Remark /
Tolerance
PU/PD/SR
Description
Source / Target
HDA_RST#
O
CMOS
3.3V Sus
eSR = 33 Ω
Reset output to CODEC, active low.
BT SOC
HDA_SYNC
O
CMOS
3.3V Sus
eSR = 33 Ω
48kHz fixed-rate, sample-synchronization signal to the CODEC(s),
BT SOC
HDA_BITCLK
O
CMOS
3.3V Sus
eSR = 33 Ω
24.00 MHz serial data clock generated by the FCH
BT SOC
HDA_SDOUT
O
CMOS
3.3V Sus
eSR = 33 Ω
Serial TDM data output to the CODEC, functional strap option
BT SOC
HDA_SDIN[0:2]
I
CMOS
3.3V Sus
3.3V
Serial TDM data inputs from up to 3 CODECs.
BT SOC
Note: Do not use a multiplexer or any other signal switcher with the HDA Interface on the carrier.