MSI P45D3Neo3 Series User manual

i
MS-7514(v3.X)Mainboard
G52-75141XF
P45D3Neo3/
P43D3Neo3 Series

ii
CopyrightNotice
The materialinthisdocumentistheintellectual propertyof MICRO-STAR
INTERNATIONAL.Wetakeeverycareinthe preparationof thisdocument, butno
guaranteeisgivenastothecorrectnessofitscontents.Ourproductsareunder
continualimprovementand wereservetherighttomakechangeswithoutnotice.
Trademarks
Alltrademarksarethepropertiesoftheirrespectiveowners.
NVIDIA,theNVIDIAlogo,DualNet, and nForceareregisteredtrademarksortrade-
marksofNVIDIACorporationin theUnitedStatesand/orothercountries.
AMD,Athlon ,Athlon XP,Thoroughbred ,andDuron areregisteredtrade-
marksofAMDCorporation.
Intel®andPentium®areregisteredtrademarksofIntelCorporation.
PS/2and OS®/2areregisteredtrademarksofInternationalBusiness Machines
Corporation.
Windows®NT/XP/ VISTAareregisteredtrademarksof MicrosoftCorporation.
Netware®isaregisteredtrademarkofNovell,Inc.
Award®isaregisteredtrademarkofPhoenixTechnologiesLtd.
AMI®isaregisteredtrademarkofAmericanMegatrendsInc.
RevisionHistory
Revision RevisionHistory Date
V3.0 ReleaseforPCB3.X December2008
TechnicalSupport
Ifaproblemariseswithyoursystemandnosolutioncanbeobtainedfromtheuser’s
manual,pleasecontactyourplaceofpurchaseorlocaldistributor.Alternatively,
pleasetrythefollowing helpresourcesforfurtherguidance.
Visit theMSI websiteforFAQ,technical guide,BIOSupdates,driverupdates,
andotherinformation: http://global.msi.com.tw/index.php?
func=service
Contactourtechnicalstaff at: http://ocss.msi.com.tw

iii
SafetyInstructions
CAUTION: Dangerofexplosionifbatteryisincorrectlyreplaced.
Replaceonlywiththe sameorequivalenttype recommendedbythe
manufacturer.
1. Alwaysread thesafetyinstructionscarefully.
2. KeepthisUser’sManualforfuturereference.
3. Keepthisequipmentawayfromhumidity.
4. Laythisequipmentonareliableflatsurfacebeforesetting itup.
5. Theopeningsontheenclosureareforairconvectionhenceprotectstheequip-
ment fromoverheating.DONOTCOVERTHEOPENINGS.
6. Makesurethevoltageofthe powersourceandadjustproperly110/220Vbe-
foreconnectingtheequipmenttothepowerinlet.
7. Placethe powercordsuchawaythatpeoplecannotstepon it. Donotplace
anythingoverthepowercord.
8. AlwaysUnplug thePowerCordbeforeinsertinganyadd-oncardormodule.
9. All cautionsand warningsontheequipmentshouldbenoted.
10. Neverpouranyliquidintotheopeningthatcoulddamage orcauseelectrical
shock.
11. If anyofthefollowingsituationsarises,gettheequipmentcheckedbyservice
personnel:
†Thepowercordorplugisdamaged.
†Liquid haspenetratedintotheequipment.
†Theequipmenthasbeen exposedtomoisture.
†The equipmentdoesnotworkwelloryoucannotgetitworkaccordingto
User’sManual.
†Theequipmenthasdroppedand damaged.
†Theequipmenthasobvioussign of breakage.
12.DONOTLEAVETHISEQUIPMENTINANENVIRONMENTUNCONDITIONED,STOR-
AGETEMPERATUREABOVE600C(1400F),IT MAYDAMAGETHEEQUIPMENT.

iv
FCC-BRadio Frequency Interference Statement
Thisequipmenthasbeen
tested and found tocomply
withthe limitsforaClassB
digitaldevice,pursuanttoPart
15of the FCCRules.Theselimitsaredesignedtoprovidereasonable protection
againstharmful interferenceinaresidentialinstallation.Thisequipmentgenerates,
usesand canradiateradiofrequencyenergyand,ifnotinstalledand used in accor-
dancewiththeinstructions,maycauseharmful interferencetoradiocommunications.
However,thereisno guarantee thatinterferencewill notoccurin aparticular
installation.Ifthisequipmentdoescauseharmful interferencetoradioortelevision
reception,whichcanbedeterminedbyturning theequipmentoff and on,the useris
encouragedtotrytocorrecttheinterferencebyone ormoreof themeasureslisted
below.
†Reorientorrelocatethereceiving antenna.
†Increasetheseparationbetweentheequipmentand receiver.
†Connecttheequipmentintoanoutleton acircuitdifferentfromthatto
whichthereceiverisconnected.
†Consultthedealeroranexperiencedradio/televisiontechnicianforhelp.
Notice1
Thechangesormodificationsnotexpresslyapprovedbythepartyresponsible for
compliancecould void theuser’sauthoritytooperatetheequipment.
Notice2
Shieldedinterfacecablesand A.C.powercord,ifany,mustbeusedinorderto
complywiththeemissionlimits.
VOIRLANOTICED’INSTALLATIONAVANTDERACCORDERAURESEAU.
Micro-StarInternational
MS-7514
ThisdevicecomplieswithPart15oftheFCCRules.Operationissubjecttothe
followingtwoconditions:
(1)thisdevicemaynotcauseharmfulinterference,and
(2)thisdevicemustaccept anyinterferencereceived,includinginterferencethat
maycauseundesiredoperation.

v
WEEE (WasteElectricaland ElectronicEquipment) Statement

vi

vii

viii
CONTENTS
CopyrightNotice.........................................................................................................ii
Trademarks..................................................................................................................ii
RevisionHistory.........................................................................................................ii
TechnicalSupport......................................................................................................ii
SafetyInstructions...................................................................................................iii
FCC-BRadioFrequencyInterferenceStatement.............................................iv
WEEE (WasteElectricaland ElectronicEquipment) Statement.......................v
English......................................................................................................................En-1
MainboardSpecifications.................................................................................En-2
Quick ComponentsGuide..................................................................................En-4
CPU(CentralProcessingUnit)..........................................................................En-5
Memory...............................................................................................................En-9
PowerSupply...................................................................................................En-11
BackPanel........................................................................................................En-12
Connectors......................................................................................................En-14
Jumper..............................................................................................................En-21
Switch..............................................................................................................En-22
Slots..................................................................................................................En-23
LEDStatusIndicators......................................................................................En-24
BIOSSetup.......................................................................................................En-25
SoftwareInformation......................................................................................En-34
Deutsch....................................................................................................................De-1
Spezifikationen..................................................................................................De-2
Komponenten-Übersicht...................................................................................De-4
CPU(CentralProcessingUnit)..........................................................................De-5
Speicher.............................................................................................................De-9
Stromversorgung............................................................................................De-11
Rücktafel..........................................................................................................De-12
Anschlüsse......................................................................................................De-14
Jumper..............................................................................................................De-21
Steckbrücken...................................................................................................De-22
Steckplätze......................................................................................................De-23
LEDStatusdikatoren........................................................................................De-24
BIOSSetup.......................................................................................................De-25
Software-Information......................................................................................De-34

ix
Fran ais.....................................................................................................................Fr-1
Spécifications.....................................................................................................Fr-2
Guiderapidedescomposants..........................................................................Fr-4
Processeur:CPU...............................................................................................Fr-5
Mémoire...............................................................................................................Fr-9
Connecteurd’alimentation...............................................................................Fr-11
Panneauarrière................................................................................................Fr-12
Connecteurs.....................................................................................................Fr-14
Cavalier.............................................................................................................Fr-21
Interrupteur.......................................................................................................Fr-22
Slots...................................................................................................................Fr-23
IndicateursdestatutsdeLED.........................................................................Fr-24
RéglagesBIOS..................................................................................................Fr-25
InformationdeLogiciel.....................................................................................Fr-34
Русский ....................................................................................................................Ru-1
Характеристики ...............................................................................................Ru-2
Руководство по размещению компонентов ..............................................Ru-4
CPU(Центральный процессор).....................................................................Ru-5
Память ..............................................................................................................Ru-9
Разъем питания .............................................................................................Ru-11
Задняя панель ...............................................................................................Ru-12
Коннекторы ....................................................................................................Ru-14
Перемычки......................................................................................................Ru-21
Переключатели ..............................................................................................Ru-22
Слоты ...............................................................................................................Ru-23
Световые индикаторы .................................................................................Ru-24
Настройка BIOS..............................................................................................Ru-25
Сведения опрограммном обеспечении ...................................................Ru-34

En-1
English
P45D3Neo3/
P43D3Neo3Series
User sGuide
English

En-2
MS-7514Mainboard
MainboardSpecifications
ProcessorSupport
-Intel CoreTM 2Extreme,CoreTM 2Quad,CoreTM 2Duo,Pentium
Dual-Coreand Celeron Dual-Coreprocessorsinthe LGA775
package
-Intel nextgeneration 45nmMulti-coreCPU
*(ForthelatestinformationaboutCPU,pleasevisit
http://global.msi.com.tw/index.php?func=cpuform2)
SupportedFSB
-1600*(OC)/1333/1066/800MHz
Chipset
-NorthBridge:Intel P45/P43chipset
-SouthBridge:Intel ICH10/ICH10R(optional)chipset
MemorySupport
-4DDR3DIMMssupportDDR31333(forP45 chipsetonly)/1066/
800(Memorysize8GBMax)
(Formoreinformationoncompatiblecomponents,pleasevisit
http://global.msi.com.tw/index.php?func=testreport)
LAN
-Supports10/100/1000 FastEthernetbyRealtek RTL8111C
Audio
-ChipintegratedbyRealtek ALC888
-Flexible8-channelaudiowithjack sensing
-Compliant withAzalia1.0Spec
-MeetMicrosoft VistaTM Premiumspec
IDE
-1IDEportbyJMicron JMB363
-SupportsUltraDMA66/100/133 mode
-SupportsPIO,BusMasteroperationmode
SATA
-6SATAII portsbyIntel ICH10/ICH10R(SATA1~6)
-2SATAII portsbyJMicron JMB363 (SATA7~8)
-Supportsstorageand datatransfersatup to3Gb/s
RAID
-SATA1~6supportRAID0/1/5/10/JBODmodebyIntel ICH10R
(optional)
-SATA7&SATA8supportRAID0/RAID1/JBODmodebyJMicron
JMB363

En-3
English
1394 (optional)
-Supports1394byJMicron JMB381
FDD
-1floppyport
-Supports1FDD with360KB, 720KB,1.2MB,1.44MBand 2.88MB
Connectors
Back panel
-1PS/2mouseport
-1PS/2keyboardport
-1Serialport
-6USB2.0Ports
-11394port(optional)
-1LANjack
-6flexibleaudiojacks
On-BoardPinheaders/Connectors/buttons
-3USB 2.0pinheaders
-11394 pinheader(optional)
-1chassisintrusionconnector
-1S/PDIF-outpinheader
-1CD-inconnector
-1frontaudiopinheader
-1TPMModuleconnector(optional)
-1HardwareOverclockFSB Switch
TPM (optional)
-SupportsTPM
Slots
-1PCIExpressx16 slot, support up toPCIExpress2.0x16 speed
-1PCI Expressx1slot
-4PCIslots, support 3.3V/5VPCIbusInterface
FormFactor
-ATX (30.5cmX24.4cm)
Mounting
-9mountingholes

En-4
MS-7514Mainboard
Quick ComponentsGuide
CPU, En-5
DDR3DIMMs,
En-9
JPWR1,
En-11
SATA,
En-15
JUSB1~3,
En-20
J1394_1,
En-17
FDD1,
En-14
JCD1,
En-18
JTPM1,
En-19
JAUD1,
En-19
PCI,
En-23
Back Panel,
En-12
JPWR2, En-11
JCI1, En-16
JFP1,JFP2
En-18
SYSFAN1,
En-16
SYSFAN2,
En-16
CPUFAN1, En-16
IDE1,
En-14
JSP1,
En-17
PCIE,
En-23
JBAT1,
En-21
OC_SW1,
En-22

En-5
English
CPU(CentralProcessingUnit)
Whenyou areinstalling theCPU, makesuretoinstallthecoolertoprevent
overheating. If youdonothavetheCPUcooler, consultyourdealerbeforeturning
onthecomputer.
ForthelatestinformationaboutCPU,pleasevisit http://global.msi.com.tw/index.
php?func=cpuform2
Introduction toLGA775 CPU
Yellowtriangleisthe Pin1indicator
Thepin-padsideof LGA775
CPU.
Yellowtriangleisthe Pin1indicator
Alignment Key Alignment Key
Important
Overheating
Overheating will seriouslydamage the CPUand system.Always makesure
thecoolingfancanworkproperlytoprotectthe CPUfromoverheating.Make
surethatyouapplyan even layerofthermalpaste(orthermaltape)between
the CPUand the heatsinktoenhanceheatdissipation.
Replacing theCPU
WhilereplacingtheCPU,alwaysturnofftheATXpowersupplyorunplug the
powersupply spowercordfromthegrounded outlet firsttoensurethe safety
ofCPU.
Overclocking
Thismainboardisdesigned tosupportoverclocking.However,pleasemake
sureyourcomponentsareabletotoleratesuchabnormalsetting,while
doing overclocking.Anyattempttooperatebeyond productspecificationsis
notrecommended. Wedonotguaranteethedamages orrisks caused
byinadequateoperation orbeyondproductspecifications.
The surfaceof LGA775CPU.
Remembertoapplysomethermal
pasteonitforbetterheat
dispersion.

En-6
MS-7514Mainboard
Important
1.ConfirmifyourCPUcoolerisfirmlyinstalledbeforeturning on yoursystem.
2.Donottouchthe CPUsocketpinstoavoiddamaging.
3.The availabilityoftheCPUlandside coverdependsonyourCPUpacking.
2.Removethecapfromleverhinge
side(asthearrowshows).
1.The CPUsockethasaplasticcap
onittoprotectthecontactfrom
damage.Beforeyouinstall theCPU,
alwayscoverittoprotect thesocket
pin.
CPU&Cooler Installation
WhenyouareinstallingtheCPU, makesuretheCPUhasacoolerattached on
thetoptopreventoverheating. Meanwhile,donotforgettoapplysomethermal
pasteonCPUbeforeinstalling theheatsink/coolerfanforbetterheatdispersion.
Followthestepsbelowtoinstall theCPU&coolercorrectly.Wrong installationwill
causethedamageofyourCPU&mainboard.
4.Opentheloadlever.3.Thepinsof socketreveal.

En-7
English
6.Afterconfirmingthe CPUdirection
forcorrectmating,putdownthe
CPUin thesockethousingframe.
Besuretograspon the edgeof
the CPUbase.Notethat thealign-
mentkeysarematched.
8.Covertheload plateontothe
package.
5.Lifttheloadleverup andopenthe
loadplate.
7.VisuallyinspectiftheCPUis
seatedwell intothesocket. If not,
takeouttheCPUwithpurevertical
motionand reinstall.
alignment
key

En-8
MS-7514Mainboard
10. Aligntheholeson themainboard
withtheheatsink.Pushdownthe
cooleruntilitsfourclipsget
wedged intothe holesofthe
mainboard.
12.Turnoverthemainboardtocon-
firmthatthe clip-endsarecorrectly
inserted.
9.Press downtheloadleverlightly
ontothe loadplate,and thense-
curetheleverwiththehookunder
retentiontab.
Important
1. Read the CPUstatusinBIOS.
2. WheneverCPUisnot installed,always protect yourCPUsocketpinwiththe
plasticcap covered (showninFigure1)toavoiddamaging.
3.Mainboardphotosshowninthissection arefordemonstration oftheCPU/
coolerinstallation only.The appearanceofyourmainboardmayvarydepend-
ingonthemodel you purchase.
11.Pressthe fourhooks downtofasten
the cooler.Then rotatethelocking
switch(refertothecorrectdirection
markedonit)tolock thehooks.
locking
switch
Mainboard
Hook

En-9
English
Memory
1
DIMM1
DIMM2
DIMM3
DIMM4
2
DIMM1
DIMM2
DIMM3
DIMM4
Dual-ChannelMemory Population Rules
InDual-Channelmode,thememorymodulescantransmitand receivedatawithtwo
databuslinessimultaneously.EnablingDual-Channelmodecanenhancethesystem
performance.Pleaserefertothe following illustrationsforpopulationrulesunder
Dual-Channel mode.
TheseDIMM slotsareusedforinstalling memorymodules.
Formoreinformationoncompatiblecomponents, pleasevisit http://global.msi.com.
tw/index.php?func=testreport
72x2=144 pin
DDR3
240-pin,1.5V
48x2=96pin
Important
-DDR3memorymodulesarenotinterchangeable withDDR2and the DDR3
standardisnotbackwardscompatible.You shouldalways install DDR3
memorymodulesinthe DDR3DIMM slots.
-InDual-Channelmode,makesurethatyouinstall memorymodulesof the
sametypeand density in different channelDIMM slots.
-Toenable successful systemboot-up,alwaysinsertthememorymodules
intothe DIMM1first.
-Due tothe chipsetresourcedeployment, thesystemdensitywill onlybe
detected up to7+GB(notfull 8GB) when eachDIMM isinstalled witha2GB
memorymodule.
Empty
Installed

En-10
MS-7514Mainboard
Installing Memory Modules
1.Thememorymodulehasonlyonenotchonthecenterand will onlyfitin theright
orientation.
2.Insertthememorymodule verticallyintotheDIMMslot.Thenpushitin until the
goldenfingeronthe memorymoduleisdeeplyinserted inthe DIMMslot.The plastic
clipateachsideoftheDIMM slot will automaticallyclosewhenthememorymodule
isproperlyseated.
3.Manuallycheckifthememorymodulehasbeenlockedin placebytheDIMM slot
clipsatthesides.
Important
You can barelyseethe goldenfingerifthememorymoduleisproperlyinserted
inthe DIMM slot.
Volt Notch

En-11
English
PowerSupply
PIN SIGNAL
13 +3.3V
14 -12V
15 GND
16 PS-ON#
17 GND
18 GND
19 GND
20 Res
21 +5V
22 +5V
23 +5V
24 GND
PIN SIGNAL
1 +3.3V
2 +3.3V
3 GND
4 +5V
5 GND
6 +5V
7 GND
8 PWROK
9 5VSB
10 +12V
11 +12V
12 +3.3V
PinDefinition
pin12
pin13
ATX24-pin PowerConnector:JPWR1
ThisconnectorallowsyoutoconnectanATX24-pinpowersupply.
ToconnecttheATX24-pin powersupply,makesuretheplugofthe
powersupplyisinsertedin theproperorientationand thepinsare
aligned.Then pushdownthe powersupplyfirmlyintotheconnector.
Youmayusethe20-pin ATXpowersupplyasyoulike.If you’dlike
tousethe20-pin ATXpowersupply,pleaseplug yourpowersup-
plyalong withpin 1&pin 13 (refertotheimage attherighthand).
ATX4-pinPower Connector:JPWR2
Thispowerconnectorisusedtoprovide powertotheCPU.
1
12 24
13
PIN SIGNAL
1GND
2GND
312V
4 12V
PinDefinition
Important
1.Makesurethatall the connectorsareconnectedtoproperATXpowersup-
pliestoensurestable operation ofthe mainboard.
2.Powersupplyof400 watts(and above)ishighlyrecommended forsystem
stability.
1
34
2
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