NETGEAR AXM751 - ProSafe XFP Transceiver Module Operation manual

350 E. Plumeria Drive
San Jose, CA 95134-1911 USA
1-888-NETGEAR (638-4327)
E-mail: [email protected]
www.NETGEAR.com
10GBASE-SR XFP
Optical Transceiver
AXM751

AXM751
1 Revision: S3.0
10GBASE-SR XFP Optical Transceiver
FEATURES
 RoHS compliant
 850nm Vertical Cavity Surface Emitting aser
(VCSE ) light source
 Standard C duplex fiber-optic connector
 Compliant with XFP MSA
 I
2
C for integrated Digital Optical Monitoring
 Power consumption <1.37 W
 User friendly Plug-and-play style "Hot Swap"
 Small footprint which enables high board
density
 XFI high speed I/O electrical interface
 Integrated signal conditioner to extend
200mm FR4 PCB trace signaling
Descripti n
The AXM751 is a hot pluggable 10Gbps
small form factor transceiver module integrated
with the high performance 850nm VCSE
transmitter, high sensitivity PIN receiver and
signal conditioner for 10Gbps applications. It is
compliant with the INF-8077i XFP Multi-source
Agreement (MSA).
The AXM751 is designed to be compliant
with INF-8077i XFP Multi-source Agreement
(MSA) with five digital monitoring functions:
Temperature, Vcc, Tx optical power, TX laser
bias current and RX received optical power.
Applicati n
 10G AN switch
 10G Ethernet switch/router
 10G Fiber channel
 SAN applications

AXM751
2 Revision: S3.0
1. Abs lute Maximum Ratings
Parameter Symb l Min Typ Max Units N tes
Storage Temperature T
S
-40 85 °C
Storage Ambient Humidity
H
A
5 90 %
+5V Power Supply V
CC5
0 6.0 V
+3.3V Power Supply V
CC3
0 3.6 V
2. Rec mmended Operating C nditi ns
Parameter Symb l Min Typ Max Units N tes
Operating Ambient
Temperature T
A
0 70 °C
Ambient Humidity
H
A
5 85 % [1]
+3.3V Power Supply V
CC3
3.135 3.3 3.465 V
+5V Power Supply V
CC5
4.75 5 5.25 V
+3.3V Supply Current I
VCC3
270 350 mA
+5V Supply Current I
VCC5
10 30 mA
Total Power Dissipation P
D
1.37 W
Differential TX Data Input TD
+
- TD
-
150 500 1000 mVp-p
[2,3]
Differential RX Data Output
RD
+
- RD
-
500 650 800 mVp-p
[4]
Notes:
1. Non-condensing
2. The data rate of input data is 10.3125Gb/s
3. Input voltage swing (differential) measured peak-to-peak
4. Output voltage swing (differential) measured peak-to-peak
ASIC / SerDes
XFP
ASIC / SerDes
XFP
10Gbps optical signal 10Gbps XFI electrical signal 10Gbps XFI electrical signal
Application Block Diagram

AXM751
3 Revision: S3.0
3. Optical Transmitter Characteristics (T
A
=0 ºC t 70 ºC)
Parameter Symb l
Min Typ Max Units N tes
Data Rate R 10.3125 Gb/s
Signaling speed variation from
nominal ±100 ppm
Average Output Power
P
avg
-5 -1.8 dBm
Wavelength λ 840 860 nm
Spectral Width RMS 0.45 nm
Transmitter OFF Output Power
P
off
-30 dBm
Extinction Ratio ER 3.0 dB
Optical Modulaion Amplitude OMA Compliant with Minimum OMA relation table
dBm
Relative Intensity Noise
RIN 12 OMA
-128
dB/Hz
Optical Return oss Tolerance
OR T
12
dB
Transmitter eye mask definition
{X1, X2, X3, Y1, Y2, Y3}
{0.25, 0.40, 0.45, 0.25, 0.28, 0.40}
Transmitter eye mask definition
Minimum optical modulation amplitude (dBm) relation table
Up to
0.05
0.05 to
0.1
0.1 to
0.15
0.15 to
0.2
0.2 to
0.25
0.25 to
0.3
0.3 to
0.35
0.35 to
0.4
0.4 to
0.45
840 to 842 -4.2 -4.2 -4.1 -4.1 -3.9 -3.8 -3.5 -3.2 -2.8
842 to 844 -4.2 -4.2 -4.2 -4.1 -3.9 -3.8 -3.6 -3.3 -2.9
844 to 846 -4.2 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.3 -2.9
846 to 848 -4.3 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.3 -2.9
848 to 850 -4.3 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.3 -3.0
850 to 852 -4.3 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.4 -3.0
852 to 854 -4.3 -4.2 -4.2 -4.1 -4.0 -3.9 -3.7 -3.4 -3.1
854 to 856 -4.3 -4.3 -4.2 -4.1 -4.0 -3.9 -3.7 -3.4 -3.1
856 to 858 -4.3 -4.3 -4.2 -4.1 -4.0 -3.9 -3.7 -3.5 -3.1
858 to 860 -4.3 -4.3 -4.2 -4.2 -4.1 -3.9 -3.7 -3.5 -3.2
Center
Wavelength
(nm)
RMS Specrtal wi th (nm)
Triple tradeoff curve

AXM751
4 Revision: S3.0
4. Optical Receive Characteristics
(T
A
=0 ºC t 70 ºC)
Parameter Symb l Min Typ Max Units N tes
Signaling speed (nominal) Ts 10.3125 Gb/s
Signaling speed variation from
nominal ±100 ppm
Center Wavelength λ 840 860 nm
Overload P
O
-1 dBm
Receiver sensitivity in OMA RSO -11.1 dBm [1]
OS De-assert OS
D
-13 dBm
OS Assert OS
A
-30 dBm [2]
OS Hysteresis OS
D
– OS
A
0.5
dB
Receiver Reflectance
-12 dB
[3]
Stressed Receive sensitivity
OMA
-7.5
dBm
Notes:
1. Measured by reference TX with 4.75dB extinction ratio at
12
10
−
BER
2. When OS asserted, the data output is ow-level (fixed)
3. When the terminal is viewed from the optical path, the reflection toward the optical path of the optical
signal with a central wavelength of 840nm to 860nm transmitted to terminal.
5. XFI M dule Receiver Output Jitter Specificati ns at C’
Parameter – C’ Symb l Min Typ Max Units N tes

AXM751
5 Revision: S3.0
Deterministic Jitter DJ 0.18 UI (p-p) [1]
Total Jitter TJ 0.34 UI (p-p) [1]
X1 0.17 UI
X2 0.42 UI
Y1 170 mV
Eye Mask
Y2 425 mV
Notes:
1. Includes jitter transferred from the optical receiver during any valid operational input condition.
XFI Module eceiver Differential Output Compliance Mask
XFI Termination and AC Coupling

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6. Pin Descripti n
XFP Host Board Connector Pad Layout (Top View)
ecommended Host Board Supply Filtering Network

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7 Revision: S3.0
M dule Electrical Pin Functi n Definiti n
Pin
L gic Symb l Name/Descripti n N te
1 GND Module Ground [1]
2 VEE5 Optional -5.2V Power Supply --Not Required
3 VTT -I Mod_DeSel Module De-select; When held low allows module to respond to
2-wire serial interface
4 VTT -O Interrupt Bar
Interrupt Bar; Indicates presence of an important condition
which can be read over the 2-wire serial interface [2]
5 VTT -I TX_DIS Transmitter Disable; Turns off transmitter laser output
6 VCC5 +5V Power Supply
7 GND Module Ground [1]
8 VCC3 +3.3V Power Supply
9 VCC3 +3.3V Power Supply
10
VTT -I/O SC 2-Wire Serial Interface Clock [2]
11
VTT -I/O SDA 2-Wire Serial Interface Data ine [2]
12
VTT -O Mod_Abs Indicates Module is not present. Grounded in the Module [2]
13
VTT -O Mod_NR Module Not Ready; Indicating Module Operational Fault [2]
14
VTT -O RX_ OS Receiver oss Of Signal Indicator [2]
15
GND Module Ground [1]
16
GND Module Ground [1]
17
CM -O RD- Receiver Inverted Data Output
18
CM -O RD+ Receiver Non-Inverted Data Output
19
GND Module Ground [1]
20
VCC2 +1.8V Power Supply --Not Required
21
VTT -I P_Down/RST
Power down; When high, requires the module to limit power
consumption to 1.5W or below. 2-Wire serial interface must be
functional in the low power mode.
22
VCC2 +1.8V Power Supply --Not Required
23
GND Module Ground [1]
24
PEC -I RefC K-
Reference Clock Non-Inverted Input, AC coupled on the host board,
Not required
25
PEC -I RefC K+
Reference Clock Inverted Input, AC coupled on the host board,
Not required
26
GND Module Ground [1]
27
GND Module Ground [1]
28
CM -I TD- Transmitter Inverted Data Input
29
CM -I TD+ Transmitter Non-Inverted Data Input
30
GND Module Ground [1]
Notes:
1. Module ground pins Gnd are isolated from the module case and chassis ground within the module.
2. Shall be pulled up with 4.7K-10Kohms to a voltage between 3.15V and 3.45V on the host board.

AXM751
8 Revision: S3.0
7. L w Speed Electrical Hardware Pins
In addition to the 2-wire serial interface the XFP module has the following low speed pins for control and status:
‧ Mod_NR
‧ Mod_DeSel
‧ Interrupt
‧ TX_DIS
‧ Mod_ABS
‧ RX_ os
‧ P_Down/RST.
1 MOD_NR
The Mod_NR is an output pin that when High, indicates that the module has detected a condition that renders
transmitter and or receiver data invalid, shall consist of logical OR of the following signals:
‧ Transmit Signal Conditioner oss of ock
‧ Transmitter aser Fault
‧ Receiver Signal Conditioner oss of ock
2 MOD_DESEL
The Mod_DeSel is an input pin. When held ow by the host, the module responds to 2-wire serial communication
commands. The Mod_DeSel allows the use of multiple XFP modules on a single 2-wire interface bus.
When the Mod_DeSel pin is “High”, the module shall not respond to or acknowledge any 2-wire interface
communication from the host. Mod_DeSel pin must be pulled to VCC3 in the module.
In order to avoid conflicts, the host system shall not attempt 2-wire interface communications within the Mod_DeSel
assert time after any XFP modules are deselected. Similarly, the host must wait at least for the period of the
Mod_DeSel deassert time before communicating with the newly selected module. The assertion and de-assertion
periods of different modules may overlap as long as the above timing requirements are met.
3 INTERRUPT
Interrupt is an output pin. When “ow”, indicates possible module operational fault or a status critical to the host
system. The Interrupt pin is an open collector output and must be pulled up to Host_Vcc the host board.
4 TX_DIS
TX_DIS is an input pin. When TX_DIS is asserted High, the XFP module transmitter output must be turned off. The
TX_DIS pin must be pulled up to VCC3 in the XFP module.
5 MOD_ABS
Mod_ABS is pulled up to Host_Vcc on the host board and grounded in the XFP module. Mod_ABS is then asserted
“High” when the XFP module is physically absent from a host slot.
6 RX_LOS
The RX_ OS when High indicates insufficient optical power for reliable signal reception. The RX_ OS pin is an open
collector output and must be pulled up to Host_Vcc on the host board.

AXM751
9 Revision: S3.0
7 P_DOWN/RST
This is a multifunction pin for module Power Down and Reset. The P_Down/RST pin must be pulled up to VCC3 in the
XFP module.
7.1 POWER DOWN FUNCTION
The P_Down pin, when held High by the host, places the module in the standby ( ow Power) mode with a maximum
power dissipation of 1.5W.
7.2 RESET FUNCTION
The negative edge of P_Down/RST signal initiates a complete module reset.

AXM751
10 Revision: S3.0
8. Mem ry Map f Management Interface
The lower memory table (Byte 0~127) is for digital diagnostics and control functions. Besides, it has
been allocated three upper memory tables for serial ID, user writable and vendor specific functions. The
detail definition of memory content is listed as following table.

AXM751
11 Revision: S3.0
9. EEPROM Serial ID Mem ry C ntents (2-Wire Address A0h)
Address Hex ASCII Address Hex ASCII Address Hex ASCII
128 06 171 37 7 214 DC
129 10 172 35 5 215 DC
130 07 173 31 1 216 DC
131 80 174 20 217 DC
132 00 175 20 218 DC
133 00 176 20 219 DC
134 00 177 20 220 08
135 00 178 20 221 60
136 00 179 20 222 67
137 00 180 20 223 Note 4
138 00 181 20 224 VS Note 5
139 90 182 20 225 VS
140 64 183 20 226 VS
141 68 184 41 227 VS
142 00 185 20 228 VS
143 96 186 42 3 229 VS
144 52 187 68 230 VS
145 21 188 07 231 VS
146 00 189 D0 232 VS
147 00 190 46 233 VS
148 4E N 191 Note 1 234 VS
149 45 E 192 44 235 VS
150 54 T 193 82 236 VS
151 47 G 194 03 237 VS
152 45 E 195 00 238 VS
153 41 A 196 SN Note 2 239 VS
154 52 R 197 SN 240 VS
155 20 198 SN 241 VS
156 20 199 SN 242 VS
157 20 200 SN 243 VS
158 20 201 SN 244 VS
159 20 202 SN 245 VS
160 20 203 SN 246 VS
161 20 204 SN 247 VS
162 20 205 SN 248 VS
163 20 206 SN 249 VS
164 C1 207 SN 250 VS
165 00 208 SN 251 VS
166 00 209 SN 252 VS
167 00 210 SN 253 VS
168 41 A 211 SN 254 VS
169 58 X 212 DC Note 3 255 VS
170 4D M 213 DC
N tes:
1) CC_BASE : Check code for Base ID Fields (address 120~190)
2) Vendor SN (address 196–211)
3) Date Code (address 212–219)
4)
CC_EXT : Check code for Extended ID Fields (address 192~222)
5) Address 224~255 is reserved for vendor specific EEPROM

AXM751
12 Revision: S3.0
10. Digital Diagn stic M nit ring Interface
Alarm and Warning Thresh lds (2-Wire Address A0h)
Address
#
Bytes
Name Value (Dec.) Unit
01 1 Signal Conditioner Control
02–03 2 Temp High Alarm 85
04–05 2 Temp ow Alarm -10
06–07 2 Temp High Warning 80
08–09 2 Temp ow Warning -5
℃
10–17 8 Reserved
18–19 2 Bias High Alarm
Iop+10 mA
20–21 2 Bias ow Alarm
Iop-5 mA
22–23 2 Bias High Warning
Iop+7 mA
24–25 2 Bias ow Warning
Iop-3 mA
mA
26–27 2 TX Power High Alarm P+3
28–29 2 TX Power ow Alarm P –3
30–31 2 TX Power High Warning P +2
32–33 2 TX Power ow Warning P –2
dBm
34–35 2 RX Power High Alarm 0
36–37 2 RX Power ow Alarm -13.1
38–39 2 RX Power High Warning -1
40–41 2 RX Power ow Warning -11.1
dBm
42–43 2 AUX 1 High Alarm 5.5
44–45 2 AUX 1 ow Alarm 4.5
46–47 2 AUX 1 High Warning 5.3
48–49 2 AUX 1 ow Warning 4.7
Volt
50–51 2 AUX 2 High Alarm 3.6
52–53 2 AUX 2 ow Alarm 3.0
54–55 2 AUX 2 High Warning 3.5
56–57 2 AUX 2 ow Warning 3.1
Volt
96 1 Temperature MSB
97 1 Temperature SB
98–99 10 Reserved
100 1 TX Bias MSB
101 1 TX Bias SB
102 1 TX Power MSB
103 1 TX Power SB
104 1 RX Power MSB
105 1 RX Power SB
106 1 AUX 1 MSB(5V)
107 1 AUX 1 SB (5V)
108 1 AUX 2 SB (3.3V)
109 1 AUX 2 SB (3.3V)
N tes:
1) P: Operating optical power of transmitter at room temperature

AXM751
13 Revision: S3.0
General State/ C ntr l Bits
Byte Bit Name Descripti n
1 0 Signal Conditioner Control Default value of this bit is 0
1 1 XFI oopback XFI loopback enable when this bit set to 1
1 2 ineside oopback Not Implement
1 4-7 Data Rate Control Default setting is 10.3Gbps
110 7 Tx Disable State Digital state of the Tx disable input pin
110 6 Optional Soft TX Disable Read/ Write bit that allow software disable of laser
110 5 MOD_NR State Digital state of Module Not Ready
110 4 P-Down State Digital state Power Down
110 3 Soft P_Down Software Power Down
110 2 Interrupt
_____________
Interrupt Bar State
110 1 OS Digital state of the OS output pin.
110 0 Data_Not_Ready Digital state of Data_Not_Ready
111 7 TX_NR State Digital state of Tx Not Ready State
111 6 TX_Fault State Digital state of Tx Fault State
111 5 TX_CDR not ocked Digital state of Tx CDR not ocked
111 4 RX_NR State Digital state of Rx Not Ready
111 3 RX_CDR not ocked Digital state of Rx CDR not ocked
119–122
All New Password Entry ocation for Entry of New Optional Password
123–126
All Password Entry ocation for Entry of Optional Password
127 All Table Select Entry ocation for Table Select Byte
Opti nal Set f Alarm and Warning
Byte Bit Name Descripti n
80 7 Temp High Alarm Set when internal temperature exceeds high alarm level
80 6 Temp ow Alarm Set when internal temperature is below low alarm level
80 5 Reserved
80 4 Reserved
80 3 Tx Bias High Alarm Set when Tx Bias current exceeds high alarm level
80 2 Tx Bias ow Alarm Set when Tx Bias current is below low alarm level
80 1 Tx Power High Alarm Set when Tx output power exceeds high alarm level
80 0 Tx Power ow Alarm Set when Tx output power is below low alarm level
81 7 Rx Power High Alarm Set when received power exceeds high alarm level
81 6 Rx Power ow Alarm Set when received power is below low alarm level
81 5 AUX1 High Alarm Set when internal 5V supply voltage exceeds high alarm level
81 4 AUX1 ow Alarm Set when internal 5V supply voltage is below low alarm level
81 3 AUX2 High Alarm Set when internal 3.3V supply voltage exceeds high alarm
level
81 2 AUX2 ow Alarm Set when internal 3.3V supply voltage is below low alarm
level
81 1 Reserved
81 0 Reserved
82 7 Temp High Warning Set when internal temperature exceeds high warning level
82 6 Temp ow Warning Set when internal temperature is below low warning level
82 5 Reserved
82 4 Reserved
82 3 Tx Bias High Warning Set when Tx Bias current exceeds high warning level
82 2 Tx Bias ow Warning Set when Tx Bias current is below low warning level
82 1 Tx Power High Warning Set when Tx output power exceeds high warning level
82 0 Tx Power ow Warning Set when Tx output power is below low warning level

AXM751
14 Revision: S3.0
83 7 Rx Power High Warning Set when received power exceeds high warning level
83 6 Rx Power ow Warning Set when received power is below low warning level
83 5 AUX1 High Warning Set when internal 5V supply voltage exceeds high warning
level
83 4 AUX1 ow Warning Set when internal 5V supply voltage is below low warning
level
83 3 AUX2 High Warning Set when internal 3.3V supply voltage exceeds high warning
level
83 2 AUX2 ow Warning Set when internal 3.3V supply voltage is below low warning
level
83 1 Reserved
83 0 Reserved

AXM751
15 Revision: S3.0
11. Mechanical Outline Dimensi ns
Transmitter Wavelength / Applicati n
Latch C l r Identifier
850nm / SR Beige
Multi Mode/850nm 10Gbps
AXM751
Complies with
21 CFR 1040.10
nd 1040.11
M de in T iw n
272-10563-01
10GB se-SR
R

AXM751
16 Revision: S3.0
12. Regulat ry C mpliance
Feature Test Meth d Reference Perf rmance
Human Body Model
(HBM)
MI -STD-883E Method 3015.7
EIA-JESD22-A114
Electrostatic Discharge
(ESD) to the Electrical
Pins Machine Model (MM)
EIA-JESD22-A115
Contact Discharge IEC/EN 61000-4-2 Electrostatic Discharge
(ESD) to the Duplex C
Receptacle Air Discharge IEC/EN 61000-4-2
Radio Frequency
Electromagnetic Field
Immunity
IEC/EN 61000-4-3
Electromagnetic
Interference (EMI)
FCC Part 15 Class B
EN 55022 Class B
(CISPR 22A)
(1) Satisfied with
electrical
characteristics of
product spec.
(2) No physical damage
aser Eye Safety
FDA/CDRH
TUV
FDA 21CFR 1040.10, 1040.11
IEC/EN 60825-1
IEC/EN 60825-2
CDRH File # 0420993
TUV Certificate #
R50067719
Component Recognition
TUV
U /CSA
IEC/EN 60950
U 60950
U File # E239394

AXM751
17 Revision: S3.0
Appendix A. D cument Revisi n
Versi n N .
Date Descripti n
S0 2006-04-25 Preliminary datasheet for RoHS version
S1 2006-06-16 Update product label and safety description
S2 2006-08-25 1. Update Digital Diagnostic Memory Map contents
2. Update module characteristics and atch Color
S3 2007-09-27 1.Change the label dimension

© 2008 NETGEAR, Inc. NETGEAR, the NETGEAR Logo, NETGEAR Digital Entertainer Logo, Connect with Innovation,
FrontView, IntelliFi, PowerShift, ProSafe, RAIDar, RAIDiator, X-RAID, RangeMax, ReadyNAS and Smart Wizard are trademarks of
NETGEAR, Inc. in the United States and/or other countries. Other brand names mentioned herein are for identification purposes
only and may be trademarks of their respective holder(s). Information is subject to change without notice. All rights reserved.
D-AXM751-0