NETGEAR AXM751 - ProSafe XFP Transceiver Module Operation manual

350 E. Plumeria Drive
San Jose, CA 95134-1911 USA
1-888-NETGEAR (638-4327)
E-mail: [email protected]
www.NETGEAR.com
10GBASE-SR XFP
Optical Transceiver
AXM751

AXM751
1 Revision: S3.0
10GBASE-SR XFP Optical Transceiver
FEATURES
 RoHS compliant
 850nm Vertical Cavity Surface Emitting aser
(VCSE ) light source
 Standard C duplex fiber-optic connector
 Compliant with XFP MSA
 I
2
C for integrated Digital Optical Monitoring
 Power consumption <1.37 W
 User friendly Plug-and-play style "Hot Swap"
 Small footprint which enables high board
density
 XFI high speed I/O electrical interface
 Integrated signal conditioner to extend
200mm FR4 PCB trace signaling
Descripti n
The AXM751 is a hot pluggable 10Gbps
small form factor transceiver module integrated
with the high performance 850nm VCSE
transmitter, high sensitivity PIN receiver and
signal conditioner for 10Gbps applications. It is
compliant with the INF-8077i XFP Multi-source
Agreement (MSA).
The AXM751 is designed to be compliant
with INF-8077i XFP Multi-source Agreement
(MSA) with five digital monitoring functions:
Temperature, Vcc, Tx optical power, TX laser
bias current and RX received optical power.
Applicati n
 10G AN switch
 10G Ethernet switch/router
 10G Fiber channel
 SAN applications

AXM751
2 Revision: S3.0
1. Abs lute Maximum Ratings
Parameter Symb l Min Typ Max Units N tes
Storage Temperature T
S
-40 85 °C
Storage Ambient Humidity
H
A
5 90 %
+5V Power Supply V
CC5
0 6.0 V
+3.3V Power Supply V
CC3
0 3.6 V
2. Rec mmended Operating C nditi ns
Parameter Symb l Min Typ Max Units N tes
Operating Ambient
Temperature T
A
0 70 °C
Ambient Humidity
H
A
5 85 % [1]
+3.3V Power Supply V
CC3
3.135 3.3 3.465 V
+5V Power Supply V
CC5
4.75 5 5.25 V
+3.3V Supply Current I
VCC3
270 350 mA
+5V Supply Current I
VCC5
10 30 mA
Total Power Dissipation P
D
1.37 W
Differential TX Data Input TD
+
- TD
-
150 500 1000 mVp-p
[2,3]
Differential RX Data Output
RD
+
- RD
-
500 650 800 mVp-p
[4]
Notes:
1. Non-condensing
2. The data rate of input data is 10.3125Gb/s
3. Input voltage swing (differential) measured peak-to-peak
4. Output voltage swing (differential) measured peak-to-peak
ASIC / SerDes
XFP
ASIC / SerDes
XFP
10Gbps optical signal 10Gbps XFI electrical signal 10Gbps XFI electrical signal
Application Block Diagram

AXM751
3 Revision: S3.0
3. Optical Transmitter Characteristics (T
A
=0 ºC t 70 ºC)
Parameter Symb l
Min Typ Max Units N tes
Data Rate R 10.3125 Gb/s
Signaling speed variation from
nominal ±100 ppm
Average Output Power
P
avg
-5 -1.8 dBm
Wavelength λ 840 860 nm
Spectral Width RMS 0.45 nm
Transmitter OFF Output Power
P
off
-30 dBm
Extinction Ratio ER 3.0 dB
Optical Modulaion Amplitude OMA Compliant with Minimum OMA relation table
dBm
Relative Intensity Noise
RIN 12 OMA
-128
dB/Hz
Optical Return oss Tolerance
OR T
12
dB
Transmitter eye mask definition
{X1, X2, X3, Y1, Y2, Y3}
{0.25, 0.40, 0.45, 0.25, 0.28, 0.40}
Transmitter eye mask definition
Minimum optical modulation amplitude (dBm) relation table
Up to
0.05
0.05 to
0.1
0.1 to
0.15
0.15 to
0.2
0.2 to
0.25
0.25 to
0.3
0.3 to
0.35
0.35 to
0.4
0.4 to
0.45
840 to 842 -4.2 -4.2 -4.1 -4.1 -3.9 -3.8 -3.5 -3.2 -2.8
842 to 844 -4.2 -4.2 -4.2 -4.1 -3.9 -3.8 -3.6 -3.3 -2.9
844 to 846 -4.2 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.3 -2.9
846 to 848 -4.3 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.3 -2.9
848 to 850 -4.3 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.3 -3.0
850 to 852 -4.3 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.4 -3.0
852 to 854 -4.3 -4.2 -4.2 -4.1 -4.0 -3.9 -3.7 -3.4 -3.1
854 to 856 -4.3 -4.3 -4.2 -4.1 -4.0 -3.9 -3.7 -3.4 -3.1
856 to 858 -4.3 -4.3 -4.2 -4.1 -4.0 -3.9 -3.7 -3.5 -3.1
858 to 860 -4.3 -4.3 -4.2 -4.2 -4.1 -3.9 -3.7 -3.5 -3.2
Center
Wavelength
(nm)
RMS Specrtal wi th (nm)
Triple tradeoff curve

AXM751
4 Revision: S3.0
4. Optical Receive Characteristics
(T
A
=0 ºC t 70 ºC)
Parameter Symb l Min Typ Max Units N tes
Signaling speed (nominal) Ts 10.3125 Gb/s
Signaling speed variation from
nominal ±100 ppm
Center Wavelength λ 840 860 nm
Overload P
O
-1 dBm
Receiver sensitivity in OMA RSO -11.1 dBm [1]
OS De-assert OS
D
-13 dBm
OS Assert OS
A
-30 dBm [2]
OS Hysteresis OS
D
– OS
A
0.5
dB
Receiver Reflectance
-12 dB
[3]
Stressed Receive sensitivity
OMA
-7.5
dBm
Notes:
1. Measured by reference TX with 4.75dB extinction ratio at
12
10
−
BER
2. When OS asserted, the data output is ow-level (fixed)
3. When the terminal is viewed from the optical path, the reflection toward the optical path of the optical
signal with a central wavelength of 840nm to 860nm transmitted to terminal.
5. XFI M dule Receiver Output Jitter Specificati ns at C’
Parameter – C’ Symb l Min Typ Max Units N tes

AXM751
5 Revision: S3.0
Deterministic Jitter DJ 0.18 UI (p-p) [1]
Total Jitter TJ 0.34 UI (p-p) [1]
X1 0.17 UI
X2 0.42 UI
Y1 170 mV
Eye Mask
Y2 425 mV
Notes:
1. Includes jitter transferred from the optical receiver during any valid operational input condition.
XFI Module eceiver Differential Output Compliance Mask
XFI Termination and AC Coupling

AXM751
6 Revision: S3.0
6. Pin Descripti n
XFP Host Board Connector Pad Layout (Top View)
ecommended Host Board Supply Filtering Network

AXM751
7 Revision: S3.0
M dule Electrical Pin Functi n Definiti n
Pin
L gic Symb l Name/Descripti n N te
1 GND Module Ground [1]
2 VEE5 Optional -5.2V Power Supply --Not Required
3 VTT -I Mod_DeSel Module De-select; When held low allows module to respond to
2-wire serial interface
4 VTT -O Interrupt Bar
Interrupt Bar; Indicates presence of an important condition
which can be read over the 2-wire serial interface [2]
5 VTT -I TX_DIS Transmitter Disable; Turns off transmitter laser output
6 VCC5 +5V Power Supply
7 GND Module Ground [1]
8 VCC3 +3.3V Power Supply
9 VCC3 +3.3V Power Supply
10
VTT -I/O SC 2-Wire Serial Interface Clock [2]
11
VTT -I/O SDA 2-Wire Serial Interface Data ine [2]
12
VTT -O Mod_Abs Indicates Module is not present. Grounded in the Module [2]
13
VTT -O Mod_NR Module Not Ready; Indicating Module Operational Fault [2]
14
VTT -O RX_ OS Receiver oss Of Signal Indicator [2]
15
GND Module Ground [1]
16
GND Module Ground [1]
17
CM -O RD- Receiver Inverted Data Output
18
CM -O RD+ Receiver Non-Inverted Data Output
19
GND Module Ground [1]
20
VCC2 +1.8V Power Supply --Not Required
21
VTT -I P_Down/RST
Power down; When high, requires the module to limit power
consumption to 1.5W or below. 2-Wire serial interface must be
functional in the low power mode.
22
VCC2 +1.8V Power Supply --Not Required
23
GND Module Ground [1]
24
PEC -I RefC K-
Reference Clock Non-Inverted Input, AC coupled on the host board,
Not required
25
PEC -I RefC K+
Reference Clock Inverted Input, AC coupled on the host board,
Not required
26
GND Module Ground [1]
27
GND Module Ground [1]
28
CM -I TD- Transmitter Inverted Data Input
29
CM -I TD+ Transmitter Non-Inverted Data Input
30
GND Module Ground [1]
Notes:
1. Module ground pins Gnd are isolated from the module case and chassis ground within the module.
2. Shall be pulled up with 4.7K-10Kohms to a voltage between 3.15V and 3.45V on the host board.

AXM751
8 Revision: S3.0
7. L w Speed Electrical Hardware Pins
In addition to the 2-wire serial interface the XFP module has the following low speed pins for control and status:
‧ Mod_NR
‧ Mod_DeSel
‧ Interrupt
‧ TX_DIS
‧ Mod_ABS
‧ RX_ os
‧ P_Down/RST.
1 MOD_NR
The Mod_NR is an output pin that when High, indicates that the module has detected a condition that renders
transmitter and or receiver data invalid, shall consist of logical OR of the following signals:
‧ Transmit Signal Conditioner oss of ock
‧ Transmitter aser Fault
‧ Receiver Signal Conditioner oss of ock
2 MOD_DESEL
The Mod_DeSel is an input pin. When held ow by the host, the module responds to 2-wire serial communication
commands. The Mod_DeSel allows the use of multiple XFP modules on a single 2-wire interface bus.
When the Mod_DeSel pin is “High”, the module shall not respond to or acknowledge any 2-wire interface
communication from the host. Mod_DeSel pin must be pulled to VCC3 in the module.
In order to avoid conflicts, the host system shall not attempt 2-wire interface communications within the Mod_DeSel
assert time after any XFP modules are deselected. Similarly, the host must wait at least for the period of the
Mod_DeSel deassert time before communicating with the newly selected module. The assertion and de-assertion
periods of different modules may overlap as long as the above timing requirements are met.
3 INTERRUPT
Interrupt is an output pin. When “ow”, indicates possible module operational fault or a status critical to the host
system. The Interrupt pin is an open collector output and must be pulled up to Host_Vcc the host board.
4 TX_DIS
TX_DIS is an input pin. When TX_DIS is asserted High, the XFP module transmitter output must be turned off. The
TX_DIS pin must be pulled up to VCC3 in the XFP module.
5 MOD_ABS
Mod_ABS is pulled up to Host_Vcc on the host board and grounded in the XFP module. Mod_ABS is then asserted
“High” when the XFP module is physically absent from a host slot.
6 RX_LOS
The RX_ OS when High indicates insufficient optical power for reliable signal reception. The RX_ OS pin is an open
collector output and must be pulled up to Host_Vcc on the host board.

AXM751
9 Revision: S3.0
7 P_DOWN/RST
This is a multifunction pin for module Power Down and Reset. The P_Down/RST pin must be pulled up to VCC3 in the
XFP module.
7.1 POWER DOWN FUNCTION
The P_Down pin, when held High by the host, places the module in the standby ( ow Power) mode with a maximum
power dissipation of 1.5W.
7.2 RESET FUNCTION
The negative edge of P_Down/RST signal initiates a complete module reset.