NXP Semiconductors SAFE ASSURE FRDMGD3160HBIEVM User manual

UM11492
FRDMGD3160HBIEVM half-bridge evaluation board
Rev. 2 — 25 January 2021 User guide
1 FRDMGD3160HBIEVM
Figure 1. FRDMGD3160HBIEVM

NXP Semiconductors UM11492
FRDMGD3160HBIEVM half-bridge evaluation board
2 Important notice
NXP provides the enclosed product(s) under the following conditions:
This evaluation kit is intended for use of ENGINEERING DEVELOPMENT OR
EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered to a printed
circuit board to make it easier to access inputs, outputs, and supply terminals. This
evaluation board may be used with any development system or other source of I/O
signals by simply connecting it to the host MCU or computer board via off-the-shelf
cables. This evaluation board is not a Reference Design and is not intended to represent
a final design recommendation for any particular application. Final device in an
application will be heavily dependent on proper printed circuit board layout and heat
sinking design as well as attention to supply filtering, transient suppression, and I/O
signal quality.
The goods provided may not be complete in terms of required design, marketing, and
or manufacturing related protective considerations, including product safety measures
typically found in the end product incorporating the goods. Due to the open construction
of the product, it is the user's responsibility to take any and all appropriate precautions
with regard to electrostatic discharge. In order to minimize risks associated with the
customers applications, adequate design and operating safeguards must be provided
by the customer to minimize inherent or procedural hazards. For any safety concerns,
contact NXP sales and technical support services.
Should this evaluation kit not meet the specifications indicated in the kit, it may be
returned within 30 days from the date of delivery and will be replaced by a new kit.
NXP reserves the right to make changes without further notice to any products herein.
NXP makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does NXP assume any liability arising out of the
application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation consequential or incidental damages. Typical parameters
can and do vary in different applications and actual performance may vary over time. All
operating parameters, including Typical, must be validated for each customer application
by customer’s technical experts.
NXP does not convey any license under its patent rights nor the rights of others. NXP
products are not designed, intended, or authorized for use as components in systems
intended for surgical implant into the body, or other applications intended to support or
sustain life, or for any other application in which the failure of the NXP product could
create a situation where personal injury or death may occur.
Should the Buyer purchase or use NXP products for any such unintended or
unauthorized application, the Buyer shall indemnify and hold NXP and its officers,
employees, subsidiaries, affiliates, and distributors harmless against all claims, costs,
damages, and expenses, and reasonable attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or
unauthorized use, even if such claim alleges NXP was negligent regarding the design or
manufacture of the part.
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3 Getting started
The NXP analog product development boards provide an easy-to-use platform for
evaluating NXP products. The boards support a range of analog, mixed-signal, and
power solutions. They incorporate monolithic integrated circuits and system-in-package
devices that use proven high-volume technology. NXP products offer longer battery life, a
smaller form factor, reduced component counts, lower cost, and improved performance in
powering state-of-the-art systems.
The tool summary page for FRDMGD3160HBIEVM is at http://www.nxp.com/
FRDMGD3160HBIEVM. The overview tab provides an overview of the device, product
features, a description of the kit contents, a list of (and links to) supported devices, a list
of (and links to) any related products, and a Get Started section.
The Get Started section provides links to everything needed to start using the
device and contains the most relevant, current information applicable to the
FRDMGD3160HBIEVM.
1. Go to http://www.nxp.com/FRDMGD3160HBIEVM.
2. On the Overview tab, locate the Jump To navigation feature on the left side of the
window.
3. Select the Get Started link, review each entry, and download an entry by clicking the
title.
4. After reviewing the Overview tab, visit the other product-related tabs for additional
information:
• Documentation: download current documentation
• Software & Tools: download current hardware and software tools
• Buy/Parametrics: purchase the product and view the product parametrics
After downloading files, review each file, including the user guide, which includes setup
instructions. If applicable, the bill of materials (BOM) and supporting schematics are also
available for download in the Get Started section of the Overview tab.
3.1 Kit contents/packing list
The FRDMGD3160HBIEVM kit contents include:
•Assembled and tested FRDMGD3160HBIEVM board in an anti-static bag
•3.3 V to 5.0 V translator board (KITGD3160TREVB) connected to FRDM-KL25Z
•USB cable, type A male/type mini B male, 3 ft
•Quick start guide
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3.2 Required equipment
To use this kit, you need:
•Compatible HybridPACK Drive IGBT or SiC MOSFET module
•DC link capacitor compatible with the HybridPACK Drive module
•1.27 mm jumpers for configuration (included with kit)
•30 µH to 50 µH, high current air core inductor for double pulse testing
•HV power supply with protection shield and hearing protection
•25 V, 1.0 A DC power supply
•500 MHz 2.5 GS/s 4-channel oscilloscope
•Rogowski coil, PEM Model CWT Mini HF60R, or CTW MiniHF30 (smaller diameter)
•Isolated high-voltage probe (CAL Test Electric CT2593-1, LeCroy AP030)
•Digital voltmeter
3.3 System requirements
The kit requires the following to function properly with the software:
•Windows 7 or higher operating system
4 Getting to know the hardware
4.1 Overview
The FRDMGD3160BHIEVM is a half-bridge evaluation kit populated with two GD3160
single channel gate drive devices. The kit includes the Freedom KL25Z microcontroller
hardware for interfacing a PC installed with FlexGUI software for communication to the
serial peripheral interface (SPI) registers on the GD3160 gate drive devices in either
daisy chain or standalone configuration.
The KITGD3160TREVB translator board is used to translate 3.3 V signals to 5.0 V
signals between the MCU and GD3160 gate drivers. The evaluation kit can be connected
to a compatible insulated gate bipolar transistor (IGBT) or SiC module for half-bridge
evaluations and applications development.
4.2 Board features
•Capability to connect to HybridPACK Drive module for half-bridge evaluations
•Negative VEE gate low drive level (−3.9 V DC)
•VCCREG regulated high gate drive level (+15 V DC)
•Jumper configurable for disabling dead time fault protection when short-circuit testing
•Easy access power, ground, and signal test points
•Easy to install and use FlexGUI for interfacing via SPI through PC; software includes
double pulse and short-circuit testing capability
•DC link bus voltage monitor on low-side driver via AMUXIN and AOUT
•Negative temperature coefficient (NTC) connection and configurable for monitoring
module temperature
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4.3 Device features
Device Description Features
GD3160 The GD3160 is an
advanced single
channel gate driver for
IGBT and SiC.
•Compatible with current sense and temp sense
IGBTs
•DESAT detection capability for detecting VCE
desaturation condition
•Fast short-circuit protection for IGBTs with current
sense feedback
•Compliant with automotive safety integrity level
(ASIL) C/D ISO 26262 functional safety requirements
•SPI interface for safety monitoring, programmability,
and flexibility
•Integrated galvanic signal isolation
•Integrated gate drive power stage capable of 10 A
peak source and sink
•Interrupt pin for fast response to faults
•Compatible with negative gate supply
•Compatible with 200 V to 1700 V IGBTs,
power range > 125 kW
Table 1. Device features
4.4 Board description
The FRDMGD3160HBIEVM is a half-bridge evaluation board populated with two GD3160
single channel IGBT or SiC gate drive devices. The board supports connection to
an FRDM-KL25Z microcontroller for SPI communication configuration programming
and monitoring. The board includes DESAT circuitry for short-circuit detection and
implementation of GD3160 shutdown protection capabilities.
The evaluation board is designed to connect to a HybridPACK Drive module for
evaluation of the GD3160 performance and capabilities.
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Figure 2. Connecting FRDM-KL25Z, GD31xx half-bridge EVB and translator board
4.4.1 Low-voltage logic and control connector
Low-voltage domain is 12 V VSUP domain that interfaces with the MCU and GD3160
control registers through the 24-pin connector interface.
Low-side driver and high-side driver domains are driver control interfaces to HybridPACK
Drive module single phase connections and test points.
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Figure 3. Evaluation board voltage and interface domains
Pin Name Function
1 AOUTL analog output duty cycle encoded signal (low side) for reading temperature via
TSENSEA or voltage via AMUXIN
2 n.c. not connected
3 CSBL chip select bar (low side)
4 n.c. not connected
5 PWML pulse width modulation (PWM) input (low side)
6 INTBL interrupt bar (low side)
7 MOSIL master out slave in (low side)
8 SCLK serial clock input
9 MISOL master in slave out (low side)
10 EN_PS MCU control of flyback power supply
11 FSSTATEL fail-safe state (low side)
12 GND ground
13 FSENB fail-safe enable (high side and low side)
14 MISOH master in slave out (high side)
Table 2. Low-voltage domain 24-pin connector definitions
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Pin Name Function
15 INTAL fault reporting and real time VCE and VGE monitoring (low side)
16 MOSIH master out slave in (high side)
17 INTAH fault reporting and real time VCE and VGE monitoring (high side)
18 CSBH chip select bar (high side)
19 LED_PWR USB 3.3 V power for INTB LEDs (high side and low side)
20 AOUTH duty cycle encoded signal (high side)
21 PWMH PWM input (high side)
22 FSSTATEH fail-safe state (high side)
23 GND ground
24 INTBH interrupt bar (high side)
Table 2. Low-voltage domain 24-pin connector definitions...continued
4.4.2 Test point definitions
All test points are clearly marked on the evaluation board. Figure 4 shows the location of
various test points.
Figure 4. Key test point locations
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Test point Definition
Low-voltage domain
VSUP DC voltage source connection point for VSUP power input of GD3160 devices. Typically supplied by vehicle
battery +12 V DC.
GND grounding points for low-voltage domain
INTAH fault monitor and VCE/VGE monitor high-side test point
INTBL interrupt bar low-side test point
INTAL fault monitor and VCE/VGE monitor low-side test point
INTBH interrupt bar high-side test point
Low-side driver domain
GNDL low-side domain ground point
VCCL positive voltage supply test point for isolated circuitry and low-side driver domain
VRFL 5.0 V reference test point for isolated analog circuitry on low-side driver
TSNSL temperature sense connection low-side test point
GL module gate test point on low-side driver domain which is the charging pin of gate; including MMCX probe
connection
FSISOL high-voltage domain fail-safe low-side test point
DSTL VCE desaturation test point connected to low-side driver DESAT pin and circuitry
VCCREGL VCC regulator low-side test point
VEEL negative voltage supply test point for low-side driver gate of IGBT or SiC module
CLMPL active clamping low-side test point
VDC DC link voltage test point at voltage divider
COLL collector test point/connection terminal on low side
High-side driver domain
VCCH positive voltage supply test point for isolated circuitry and high-side driver domain
GNDH high-side domain ground point
COLH collector test point/connection high side
TSENSEH temperature sense connection high-side test point
VCCREGH VCC regulator high-side test point
VRFH 5.0 V reference test point for isolated analog circuitry on high-side driver
FSISOH high-voltage domain fail-safe high-side test point
GH module gate test point on high-side driver domain which is the charging pin of gate; including MMCX probe
connection
CLMPH active clamping high-side test point
DSTH VCE desaturation test point connected to high-side driver DESAT pin and circuitry
VEEH negative voltage supply test point for high-side driver gate of IGBT or SiC module
AMXH analog MUX input test point for high-side driver
Table 3. Test point definitions
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4.4.3 Power supply and jumper configuration
Figure 5. Power supply and jumper configuration
Jumper Position Function
1-2 dead time fault protection enabled (high side)PWMHSEL (J10)
2-3 dead time fault protection disabled (use for short-circuit testing)
1-2 dead time fault protection enabled (low side)PWMLSEL (J9)
2-3 dead time fault protection disabled (use for short-circuit testing)
open VCCREG controls gate voltageVCCH and VCCL
closed VCC and VCCREG are tied together
open internally regulated supply derived from VSUPVDDH and VDDL
closed VSUP = VDD for 5 V or 3.3 V operation depending on the part number
1-2 chip select for normal operationCSB
2-3 chip select for daisy chain operation
closed normal operationMOSI
open daisy chain operation
Table 4. Jumper definitions
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Jumper Position Function
1-2 normal operationMISO
2-3 daisy chain operation
1-2 MCU control of flyback supply enablePS_EN
2-3 flyback supply enable tied to VSUP
Table 4. Jumper definitions...continued
4.4.4 Bottom view
Figure 6. Evaluation board bottom view
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4.4.5 Gate drive resistors
•RGH - gate high resistor in series with the GH pin at the output of the GD3160 gate
high driver and HybridPACK Drive module gate that controls the turn-on current for SiC
MOSFET gate.
•RGL - gate low resistor in series with the GL pin at the output of the GD3160 gate low
driver and HybridPACK Drive module gate that controls the turn-off current for SiC
MOSFET gate.
•RAMC - series resistor between HybridPACK Drive module gate and AMC input pin of
the GD3160 driver for gate sensing and active Miller clamping.
Figure 7. Gate drive resistors
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4.4.6 LED interrupt indicators
Figure 8. LED interrupt indicators
LED Description
Low-side INTB connected to the INTB output pin of low-side driver indicating reported
fault status when on (active LOW)
High-side INTB connected to the INTB interrupt output pin of high-side driver indicating
reported fault status when on (active LOW)
Table 5. LED interrupt indicators
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4.5 Kinetis KL25Z Freedom board
The Freedom KL25Z is an ultra low-cost development platform for Kinetis L series MCU
built on Arm Cortex-M0+ processor.
Figure 9. Freedom development platform
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4.6 3.3 V to 5.0 V translator board
KITGD3160TREVB translator enables level shifting of signals from MCU 3.3 V to 5.0 V
SPI communication.
Figure 10. Translator board
Jumper Position Function
1-2 selects 5.0 V for 5.0 V compatible gate driveVCCSEL (J3)
2-3 selects 3.3 V for 3.3 V compatible gate drive
1-2 selects PWM high-side control from KL25Z MCUPWMH_SEL (J4)
2-3 selects PWM high-side control from fiber optic receiver inputs
1-2 selects PWM low-side control from KL25Z MCUPWML_SEL (J5)
2-3 selects PWM low-side control from fiber optic receiver inputs
Table 6. Translator board jumper definitions
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5 Configuring the hardware
FRDMGD3160HBIEVM is connected to compatible SiC MOSFET HybridPACK Drive
module with a DC link capacitor as shown in Figure 11. Double pulse and short-circuit
testing can be conducted utilizing Windows based PC with FlexGUI software.
Suggested equipment needed for test:
•Rogowski coil high-current probe
•High-voltage differential voltage probe
•High sample rate digital oscilloscope with probes
•DC link capacitor compatible with HybridPACK Drive module
•IGBT or SiC MOSFET HybridPACK Drive module
•Windows based PC
•High-voltage DC power supply for DC link voltage
•Low-voltage DC power supply for VSUP
–+12 V DC gate drive board low-voltage domain
•Voltmeter for monitoring high-voltage DC link supply
•Load coil for double pulse and short-circuit testing
DC link capacitor is not shown
Figure 11. Evaluation board and system setup
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Figure 12. Power module
6 Installation and use of software tools
Software for FRDMGD3160HBIEVM is distributed with the FlexGUI tool (available on
NXP.com). Necessary firmware comes pre-installed on the FRDM-KL25Z with the kit.
Even if the user intends to test with other software or PWM, it is recommended to install
this software as a backup or to help debugging.
6.1 Installing FlexGUI on your computer
The latest version of FlexGUI supports the GD3100 and GD3160. It is designed to run on
any Windows 10 or Windows 8 based operating system. To install the software, do the
following:
1. Go to www.nxp.com/FlexGUI and click Download.
2. When the FlexGUI software page appears, click Download and select the version
associated with your PC operating system.
3. FlexGUI wizard creates a shortcut, an NXP FlexGUI icon appears on the desktop. By
default, the FlexGUI executable file is installed at C:\flexgui-app-des-gd31xx.exe.
Installing the device drivers overwrites any previous FlexGUI installation and replaces
it with a current version containing the GD31xx drivers. However, configuration files
(.spi) from the previous version remain intact.
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6.2 Configuring the FRDM-KL25Z microcode
Figure 13. FRDM-KL25Z setup and interface
By default, the FRDM-KL25Z delivered with this kit is preprogrammed with the current
and most up-to-date firmware available for the kit.
A way to check quickly that the microcode is programmed and the board is functioning
properly, is to plug the KL25Z into the computer, open FlexGUI, and verify that the
software version at the bottom is 6.4 or later (see Figure 14).
If a loss of functionality following a board reset, reprogramming, or a corrupted data
issue, the microcode may be rewritten per the following steps:
1. To clear the memory and place the board in boot loader mode, hold down the reset
button while plugging a USB cable into the OpenSDA USB port.
2. Verify that the board appears as a BOOTLOADER device and continue with step 3. If
the board appears as KL25Z, you may go to step 6.
3. Download the Firmware Apps .zip archive from the PEmicro OpenSDA webpage
(http://www.pemicro.com/opensda/). Validate your email address to access the files.
4. Find the most recent MDS-DEBUG-FRDM-KL25Z_Pemicro_v118.SDA and
copy/drag-and-drop into the BOOTLOADER device.
5. Reboot the board by unplugging and replugging the connection to the OpenSDA port.
Verify now that the device appears as a KL25Z device to continue.
6. Locate the most recent KL25Z firmware; which is distributed as part of the FlexGUI
package.
a. From the FlexGUI install directory, which is located in the
flexgui-app-des-gd31xx\bin folder and is named in the form
“flexgui-fw-KL25Z_usb_hid_gd31xxC_vx.x.x.bin”.
b. This .bin file is a product/family-specific configuration file for FRDM-KL25Z
containing the pin definitions, SPI/PWM generation code, and pin mapping
assignments necessary to interface with the translator board as part of
FRDMGD3160HBIEVM.
7. With the KL25Z still plugged through the OpenSDA port, copy/drag-and-drop the .bin
file into the KL25Z device memory. Once done, disconnect the USB and plug into the
other USB port, labeled KL25Z.
a. The device may not appear as a distinct device to the computer while connected
through the KL25Z USB port, this is normal.
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8. The FRDM-KL25Z board is now fully set up to work with FRDMGD3160HBIEVM and
the FlexGUI.
a. There is no software stored or present on either the driver or translator boards,
only on the FRDM-KL25Z MCU board.
All uploaded firmware is stored in non-volatile memory until the reset button is hit on the
FRDM-KL25Z. There is no need to repeat this process upon every power up, and there is
no loss of data associated with a single unplug event.
6.3 Using the FlexGUI
The FlexGUI is available from http://www.nxp.com/FlexGUI as an evaluation tool
demonstrating GD31xx-specific functionality, configuration, and fault reporting. FlexGUI
also includes basic capacity for the FRDMGD3160HBIEVM to control an IGBT or SiC
module, enabling double pulse or short-circuit testing.
SPI messages can be realized graphically or in hexadecimal format. CSB is selectable to
address one or both GD31xx on the board via daisy chain. See Figure 14 to Figure 33 for
FlexGUI for GD31xx internal register read and write access.
Starting FlexGUI for GD31xx
•FlexGUI install program (flexgui-app-des-gd31xx-0.x.x.exe)
•Download FlexGUI and run the install program on your PC.
•When you start the application, Figure 14 allows you to select the target application
board, feature set (standard or daisy chain), target MCU, and USB interface. Leave all
settings as shown.
Figure 14. Kit selection
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FlexGUI settings
•Access settings by selecting Settings from the File menu
Figure 15. GUI settings menu
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