NXP Semiconductors SAFE ASSURE FRDMGD3160HB8EVM User manual

UM11777
FRDMGD3160HB8EVM half-bridge evaluation board
Rev. 1 — 6 May 2022 User manual
Document information
Information Content
Keywords automotive, half-bridge, GD3160, gate driver
Abstract This document describes key features and usage requirements for performing
evaluation of GD3160 gate driver with FRDMGD3160HB8EVM.

NXP Semiconductors UM11777
FRDMGD3160HB8EVM half-bridge evaluation board
Rev Date Description
1 20220506 initial version
Revision history
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User manual Rev. 1 — 6 May 2022
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NXP Semiconductors UM11777
FRDMGD3160HB8EVM half-bridge evaluation board
1 Important notice
IMPORTANT NOTICE
For engineering development or evaluation purposes only
NXP provides the product under the following conditions:
This evaluation kit is for use of ENGINEERING DEVELOPMENT OR
EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered
to a printed-circuit board to make it easier to access inputs, outputs and
supply terminals. This evaluation board may be used with any development
system or other source of I/O signals by connecting it to the host MCU
computer board via off-the-shelf cables. This evaluation board is not
a Reference Design and is not intended to represent a final design
recommendation for any particular application. Final device in an application
heavily depends on proper printed-circuit board layout and heat sinking
design as well as attention to supply filtering, transient suppression, and I/O
signal quality.
The product provided may not be complete in terms of required design,
marketing, and or manufacturing related protective considerations, including
product safety measures typically found in the end device incorporating the
product. Due to the open construction of the product, it is the responsibility of
the user to take all appropriate precautions for electric discharge. In order to
minimize risks associated with the customers’ applications, adequate design
and operating safeguards must be provided by the customer to minimize
inherent or procedural hazards. For any safety concerns, contact NXP sales
and technical support services.
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NXP Semiconductors UM11777
FRDMGD3160HB8EVM half-bridge evaluation board
2 FRDMGD3160HB8EVM
Figure 1. FRDMGD3160HB8EVM
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NXP Semiconductors UM11777
FRDMGD3160HB8EVM half-bridge evaluation board
3 Getting started
NXP analog product development boards provide a platform for evaluating a broad
range of NXP analog, mixed-signal, and power solution products. NXP analog product
development boards incorporate monolithic integrated circuits and system-in-package
devices that use proven high-volume technology. NXP products offer a long battery life,
a small form factor, reduced component counts, low cost, and improved performance in
powering state-of-the-art systems.
The tool summary page for the FRDMGD3160HB8EVM evaluation board is at http://
www.nxp.com/FRDMGD3160HB8EVM. The tool summary page provides information
related to using the evaluation board. The page contains the following sections:
•Overview – A brief summary of the evaluation board and its capabilities
•Supported Devices – A list of devices that the evaluation board supports
•Specifications – An overview of the technical and functional specifications for the board
•Documents and Software/Design Resources – All of the information and resources
required by users who have already purchased the FRDMGD3160HB8EVM. This
section includes:
–Design Tools & Files – Click the download button to download the board bill of
materials and the Gerber files for the printed-circuit board (PCB) assemblies.
–Printed Circuit Boards and Schematics – Click the download button to download
a .pdf version of the FRDMGD3160HB8EVM board schematics.
The Get Started link in the upper left of the menu bar provides information applicable to
using the FRDMGD3160HB8EVM.
3.1 Kit contents/packing list
The FRDMGD3160HB8EVM kit contents include:
•Complete assembly of FRDMGD3160HB8EVM evaluation board
•3.3 V to 5.0 V KITGD31xTREVB translator board connected to FRDM-KL25Z
•USB cable, type A male/type mini B male, 3 ft
•1.27 mm jumpers for configuration (included with kit boards)
•Quick start guide
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NXP Semiconductors UM11777
FRDMGD3160HB8EVM half-bridge evaluation board
3.2 Required equipment
The kit requires the following equipment:
•Compatible P6 SiC module
•DC link capacitor compatible with the SiC module
•30 µH to 50 µH, high current air core inductor for double pulse testing
•HV power supply with protection shield and hearing protection
•25 V, 1.0 A DC power supply
•500 MHz 2.5 GS/s 4-channel oscilloscope
•Rogowski coil, PEM Model CWT Mini HF60R, or CTW MiniHF30 (smaller diameter)
•Isolated high-voltage probe (CAL Test Electric CT2593-1, LeCroy AP030)
•Digital voltmeter
3.3 System requirements
The kit requires the following to function properly with the software:
•Windows 7 or higher operating system
4 Getting to know the hardware
4.1 Overview
The FRDMGD3160HB8EVM is a half-bridge evaluation kit populated with two GD3160
single channel gate drive devices. The kit includes the Freedom KL25Z microcontroller
hardware for interfacing a PC installed with FlexGUI software for communication to the
serial peripheral interface (SPI) registers on the GD3160 gate drive devices in either
daisy chain or standalone configuration.
The KITGD316xTREVB translator board is used to translate 3.3 V signals to 5.0 V
signals between the MCU and the GD3160 gate drivers. The evaluation kit can be
connected to a compatible insulated gate bipolar transistor (IGBT) or SiC module for
half-bridge evaluations and applications development.
4.2 Board features
•Capability to connect to P6 SiC module for half-bridge evaluations
•Negative VEE gate low drive level (−3.9 V DC)
•VCCREG regulated high gate drive level (+15 V DC)
•Jumper configurable for disabling dead time fault protection when short-circuit testing
•Easy access power, ground, and signal test points
•Easy to install and use FlexGUI for interfacing via SPI through PC; software includes
double pulse and short-circuit testing capability
•DC link bus voltage monitor on low-side driver via AMUXIN and AOUT
•Negative temperature coefficient (NTC) connection and configurable for monitoring
module temperature
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NXP Semiconductors UM11777
FRDMGD3160HB8EVM half-bridge evaluation board
4.3 Device features
Device Description Features
GD3160 The GD3160 is an
advanced single
channel gate driver for
IGBT and SiC.
•Compatible with current sense and temp sense
IGBTs
•DESAT detection capability for detecting VCE
desaturation condition
•Fast short-circuit protection for IGBTs with current
sense feedback
•Compliant with automotive safety integrity level
(ASIL) C/D ISO 26262 functional safety requirements
•SPI interface for safety monitoring, programmability,
and flexibility
•Integrated galvanic signal isolation
•Integrated gate drive power stage capable of 10 A
peak source and sink
•Interrupt pin for fast response to faults
•Compatible with negative gate supply
•Compatible with 200 V to 1700 V IGBTs,
power range > 125 kW
Table 1. Device features
4.4 Board description
The FRDMGD3160HB8EVM is a half-bridge evaluation board populated with two
GD3160 single channel IGBT or SiC gate drive devices. The board supports connection
to an FRDM-KL25Z microcontroller for SPI communication configuration programming
and monitoring. The board includes DESAT circuitry for short-circuit detection and
implementation of GD3160 shutdown protection capabilities.
The evaluation board is designed to connect to a P6 SiC metal-oxide-semiconductor
field-effect transistor (MOSFET) for evaluation of the GD3160 performance and
capabilities.
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NXP Semiconductors UM11777
FRDMGD3160HB8EVM half-bridge evaluation board
Figure 2. Connecting FRDM-KL25Z, FRDMGD3160HB8EVM and KITGD316xTREVB translator board
4.4.1 Low-voltage logic and control connector
The low-voltage domain is 12 V VSUP domain that interfaces with the MCU and GD3160
control registers through the 24-pin connector interface.
The low-side driver and high-side driver domains are driver control interfaces to SiC
module single phase connections and test points.
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FRDMGD3160HB8EVM half-bridge evaluation board
Figure 3. FRDMGD3160HB8EVM board voltage and interface domains
Pin Name Function
1 AOUTL analog output duty cycle encoded signal (low side) for reading temperature via
TSENSEA or voltage via AMUXIN
2 n.c. not connected
3 CSBL chip select bar (low side)
4 n.c. not connected
5 PWML pulse width modulation (PWM) input (low side)
6 INTBL interrupt bar (low side)
7 MOSIL master out slave in (low side)
8 SCLK serial clock input
9 MISOL master in slave out (low side)
10 EN_PS MCU signal to enable flyback power supply for high-side VCC and low-side VCC
11 FSSTATEL fail-safe state (low side)
12 GND ground
13 FSENB fail-safe enable (high side and low side)
14 MISOH master in slave out (high side)
15 n.c. not connected
Table 2. Low-voltage domain 24-pin connector definitions
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NXP Semiconductors UM11777
FRDMGD3160HB8EVM half-bridge evaluation board
Pin Name Function
16 MOSIH master out slave in (high side)
17 n.c. not connected
18 CSBH chip select bar (high side)
19 LED_PWR USB 3.3 V power for INTB LEDs (high side and low side)
20 AOUTH duty cycle encoded signal (high side)
21 PWMH PWM input (high side)
22 FSSTATEH fail-safe state (high side)
23 GND ground
24 INTBH interrupt bar (high side)
Table 2. Low-voltage domain 24-pin connector definitions...continued
4.4.2 Test point definitions
All test points are clearly marked on the evaluation board. Figure 4 shows the location of
various test points.
Figure 4. Key test point locations
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