NXP Semiconductors SAFE ASSURE FRDMGD3160HB8EVM User manual

UM11777
FRDMGD3160HB8EVM half-bridge evaluation board
Rev. 1 — 6 May 2022 User manual
Document information
Information Content
Keywords automotive, half-bridge, GD3160, gate driver
Abstract This document describes key features and usage requirements for performing
evaluation of GD3160 gate driver with FRDMGD3160HB8EVM.

NXP Semiconductors UM11777
FRDMGD3160HB8EVM half-bridge evaluation board
Rev Date Description
1 20220506 initial version
Revision history
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1 Important notice
IMPORTANT NOTICE
For engineering development or evaluation purposes only
NXP provides the product under the following conditions:
This evaluation kit is for use of ENGINEERING DEVELOPMENT OR
EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered
to a printed-circuit board to make it easier to access inputs, outputs and
supply terminals. This evaluation board may be used with any development
system or other source of I/O signals by connecting it to the host MCU
computer board via off-the-shelf cables. This evaluation board is not
a Reference Design and is not intended to represent a final design
recommendation for any particular application. Final device in an application
heavily depends on proper printed-circuit board layout and heat sinking
design as well as attention to supply filtering, transient suppression, and I/O
signal quality.
The product provided may not be complete in terms of required design,
marketing, and or manufacturing related protective considerations, including
product safety measures typically found in the end device incorporating the
product. Due to the open construction of the product, it is the responsibility of
the user to take all appropriate precautions for electric discharge. In order to
minimize risks associated with the customers’ applications, adequate design
and operating safeguards must be provided by the customer to minimize
inherent or procedural hazards. For any safety concerns, contact NXP sales
and technical support services.
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2 FRDMGD3160HB8EVM
Figure 1. FRDMGD3160HB8EVM
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3 Getting started
NXP analog product development boards provide a platform for evaluating a broad
range of NXP analog, mixed-signal, and power solution products. NXP analog product
development boards incorporate monolithic integrated circuits and system-in-package
devices that use proven high-volume technology. NXP products offer a long battery life,
a small form factor, reduced component counts, low cost, and improved performance in
powering state-of-the-art systems.
The tool summary page for the FRDMGD3160HB8EVM evaluation board is at http://
www.nxp.com/FRDMGD3160HB8EVM. The tool summary page provides information
related to using the evaluation board. The page contains the following sections:
•Overview – A brief summary of the evaluation board and its capabilities
•Supported Devices – A list of devices that the evaluation board supports
•Specifications – An overview of the technical and functional specifications for the board
•Documents and Software/Design Resources – All of the information and resources
required by users who have already purchased the FRDMGD3160HB8EVM. This
section includes:
–Design Tools & Files – Click the download button to download the board bill of
materials and the Gerber files for the printed-circuit board (PCB) assemblies.
–Printed Circuit Boards and Schematics – Click the download button to download
a .pdf version of the FRDMGD3160HB8EVM board schematics.
The Get Started link in the upper left of the menu bar provides information applicable to
using the FRDMGD3160HB8EVM.
3.1 Kit contents/packing list
The FRDMGD3160HB8EVM kit contents include:
•Complete assembly of FRDMGD3160HB8EVM evaluation board
•3.3 V to 5.0 V KITGD31xTREVB translator board connected to FRDM-KL25Z
•USB cable, type A male/type mini B male, 3 ft
•1.27 mm jumpers for configuration (included with kit boards)
•Quick start guide
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3.2 Required equipment
The kit requires the following equipment:
•Compatible P6 SiC module
•DC link capacitor compatible with the SiC module
•30 µH to 50 µH, high current air core inductor for double pulse testing
•HV power supply with protection shield and hearing protection
•25 V, 1.0 A DC power supply
•500 MHz 2.5 GS/s 4-channel oscilloscope
•Rogowski coil, PEM Model CWT Mini HF60R, or CTW MiniHF30 (smaller diameter)
•Isolated high-voltage probe (CAL Test Electric CT2593-1, LeCroy AP030)
•Digital voltmeter
3.3 System requirements
The kit requires the following to function properly with the software:
•Windows 7 or higher operating system
4 Getting to know the hardware
4.1 Overview
The FRDMGD3160HB8EVM is a half-bridge evaluation kit populated with two GD3160
single channel gate drive devices. The kit includes the Freedom KL25Z microcontroller
hardware for interfacing a PC installed with FlexGUI software for communication to the
serial peripheral interface (SPI) registers on the GD3160 gate drive devices in either
daisy chain or standalone configuration.
The KITGD316xTREVB translator board is used to translate 3.3 V signals to 5.0 V
signals between the MCU and the GD3160 gate drivers. The evaluation kit can be
connected to a compatible insulated gate bipolar transistor (IGBT) or SiC module for
half-bridge evaluations and applications development.
4.2 Board features
•Capability to connect to P6 SiC module for half-bridge evaluations
•Negative VEE gate low drive level (−3.9 V DC)
•VCCREG regulated high gate drive level (+15 V DC)
•Jumper configurable for disabling dead time fault protection when short-circuit testing
•Easy access power, ground, and signal test points
•Easy to install and use FlexGUI for interfacing via SPI through PC; software includes
double pulse and short-circuit testing capability
•DC link bus voltage monitor on low-side driver via AMUXIN and AOUT
•Negative temperature coefficient (NTC) connection and configurable for monitoring
module temperature
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4.3 Device features
Device Description Features
GD3160 The GD3160 is an
advanced single
channel gate driver for
IGBT and SiC.
•Compatible with current sense and temp sense
IGBTs
•DESAT detection capability for detecting VCE
desaturation condition
•Fast short-circuit protection for IGBTs with current
sense feedback
•Compliant with automotive safety integrity level
(ASIL) C/D ISO 26262 functional safety requirements
•SPI interface for safety monitoring, programmability,
and flexibility
•Integrated galvanic signal isolation
•Integrated gate drive power stage capable of 10 A
peak source and sink
•Interrupt pin for fast response to faults
•Compatible with negative gate supply
•Compatible with 200 V to 1700 V IGBTs,
power range > 125 kW
Table 1. Device features
4.4 Board description
The FRDMGD3160HB8EVM is a half-bridge evaluation board populated with two
GD3160 single channel IGBT or SiC gate drive devices. The board supports connection
to an FRDM-KL25Z microcontroller for SPI communication configuration programming
and monitoring. The board includes DESAT circuitry for short-circuit detection and
implementation of GD3160 shutdown protection capabilities.
The evaluation board is designed to connect to a P6 SiC metal-oxide-semiconductor
field-effect transistor (MOSFET) for evaluation of the GD3160 performance and
capabilities.
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Figure 2. Connecting FRDM-KL25Z, FRDMGD3160HB8EVM and KITGD316xTREVB translator board
4.4.1 Low-voltage logic and control connector
The low-voltage domain is 12 V VSUP domain that interfaces with the MCU and GD3160
control registers through the 24-pin connector interface.
The low-side driver and high-side driver domains are driver control interfaces to SiC
module single phase connections and test points.
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Figure 3. FRDMGD3160HB8EVM board voltage and interface domains
Pin Name Function
1 AOUTL analog output duty cycle encoded signal (low side) for reading temperature via
TSENSEA or voltage via AMUXIN
2 n.c. not connected
3 CSBL chip select bar (low side)
4 n.c. not connected
5 PWML pulse width modulation (PWM) input (low side)
6 INTBL interrupt bar (low side)
7 MOSIL master out slave in (low side)
8 SCLK serial clock input
9 MISOL master in slave out (low side)
10 EN_PS MCU signal to enable flyback power supply for high-side VCC and low-side VCC
11 FSSTATEL fail-safe state (low side)
12 GND ground
13 FSENB fail-safe enable (high side and low side)
14 MISOH master in slave out (high side)
15 n.c. not connected
Table 2. Low-voltage domain 24-pin connector definitions
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Pin Name Function
16 MOSIH master out slave in (high side)
17 n.c. not connected
18 CSBH chip select bar (high side)
19 LED_PWR USB 3.3 V power for INTB LEDs (high side and low side)
20 AOUTH duty cycle encoded signal (high side)
21 PWMH PWM input (high side)
22 FSSTATEH fail-safe state (high side)
23 GND ground
24 INTBH interrupt bar (high side)
Table 2. Low-voltage domain 24-pin connector definitions...continued
4.4.2 Test point definitions
All test points are clearly marked on the evaluation board. Figure 4 shows the location of
various test points.
Figure 4. Key test point locations
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Name Test Point Definition
Low-voltage domain
GND TP2 grounding point for low-voltage domain
VSUP TP26 DC voltage source connection point for VSUP power input of GD3160 devices; typically
supplied by vehicle battery +12 V DC
Low-side driver domain
COLL J90 collector test point/connection low side
DSTL TP10 VCE desaturation test point connected to high-side driver DESAT pin and circuitry
GL TP5 module gate test point on low-side driver domain which is the charging pin of gate; including
MMCX probe connection
GND TP13,
TP16, TP27
grounding point for low-side driver domain
GNDL TP3, TP7 grounding point for isolated low-side driver grounding plane
TSNSL TP8 test point connection to low-side gate drive TSENSE pin
VCCL TP1 positive voltage supply test point for isolated circuitry and low-side driver domain
VEEL TP4 negative voltage supply test point for low-side driver gate of IGBT or SiC module
VRFL TP9 5.0 V reference test point for isolated analog circuitry on low-side driver
High-side driver domain
AMXH TP23 high-side driver test point for analog MUX input
COLH J101 collector test point/connection high side
DSTH TP25 VCE desaturation test point connected to high-side driver DESAT pin and circuitry
GH TP28 module gate test point on high-side driver domain which is the charging pin of gate; including
MMCX probe connection
GNDH TP31, TP32 grounding point for isolated high-side driver grounding plane
TSNSH TP21 test point connection to high-side gate drive TSENSE pin
VCCH TP29 positive voltage supply test point for isolated circuitry and high-side driver domain
VEEH TP30 negative voltage supply test point for high-side driver gate of IGBT or SiC module
VRFH TP22 5.0 V reference test point for isolated analog circuitry on high-side driver
Table 3. Test point definitions
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4.4.3 Power supply and jumper configuration
Figure 5. Power supply and jumper configuration
Jumper Position Function
1-2 dead time fault protection enabled (high side)PWMALTL_SEL (J4)
2-3 dead time fault protection disabled (use for short-circuit testing)
1–2 flyback power supply enable controlled from MCUPS_EN (J2)
2–3 flyback power supply enable always on
1–2 normal operationCSB (J3)
2–3 daisy chain operation
1-2 dead time fault protection enabled (low side)PWMALTH_SEL (J7)
2-3 dead time fault protection disabled (use for short-circuit testing)
open daisy chain operationMOSI (J8)
close normal operation
1-2 normal operationMISO (J6)
2-3 daisy chain operation
Table 4. Jumper definitions
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FRDMGD3160HB8EVM half-bridge evaluation board
Component Definition
Flyback MOSFET
(Q1)
AEC Q101-compliant logic level N-channel MOSFET
Potentiometer (R32) adjusts resistor R3 for VCCH/VCCL and VEEH/VEEL
tune VCC-GNDISO for +17 V
Table 5. Power supply definition
4.4.4 Bottom view
Figure 6. FRDMGD3100HB8EVM bottom view
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4.4.5 Gate drive resistors
•RGH - gate high resistor in series with the GH pin at the output of the GD3160 gate
high driver and P6 SiC module gate that controls the turn-on current for SiC MOSFET
gate.
•RGL - gate low resistor in series with the GL pin at the output of the GD3160 gate low
driver and P6 SiC module gate that controls the turn-off current for SiC MOSFET gate.
•RAMC - series resistor between P6 SiC module gate and AMC input pin of the GD3160
driver for gate sensing and active Miller clamping.
Figure 7. Gate drive resistors
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4.4.6 LED interrupt indicators
Figure 8. LED interrupt indicators
LED Description
Low-side INTB connected to the INTB output pin of low-side driver indicating reported
fault status when on (active LOW)
High-side INTB connected to the INTB interrupt output pin of high-side driver indicating
reported fault status when on (active LOW)
Table 6. LED interrupt indicators
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4.5 Kinetis KL25Z Freedom board
The Freedom KL25Z is an ultra low-cost development platform for Kinetis L series MCU
built on Arm Cortex-M0+ processor.
Figure 9. Freedom development platform
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4.6 3.3 V to 5.0 V translator board
KITGD316xTREVB translator enables level shifting of signals from MCU 3.3 V to 5.0 V
SPI communication.
Figure 10. Translator board
Jumper Position Function
1-2 selects 5.0 V for 5.0 V compatible gate driveVCCSEL (J3)
2-3 selects 3.3 V for 3.3 V compatible gate drive
1-2 selects PWM high-side control from KL25Z MCUPWMH_SEL (J4)
2-3 selects PWM high-side control from fiber optic receiver inputs
1-2 selects PWM low-side control from KL25Z MCUPWML_SEL (J5)
2-3 selects PWM low-side control from fiber optic receiver inputs
Table 7. Translator board jumper definitions
5 Configuring the hardware
FRDMGD3160HB8EVM is connected to a GD3160 translator board and a FRDM-KL25Z
board as shown in Figure 11. Double pulse and short-circuit testing can be conducted
using a Windows based PC with FlexGUI software.
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Suggested equipment needed for test:
•Rogowski coil high-current probe
•High-voltage differential voltage probe
•High sample rate digital oscilloscope with probes
•DC link capacitor
•SiC MOSFET P6 module
•Windows based PC
•High-voltage DC power supply for DC link voltage
•Low-voltage DC power supply for VSUP
–+12 V DC gate drive board low-voltage domain
•Voltmeter for monitoring high-voltage DC link supply
•Load coil for double pulse and short-circuit testing
Figure 11. Evaluation board and system setup
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6 Installation and use of software tools
Software for FRDMGD3160HB8EVM is distributed with the FlexGUI tool (available on
NXP.com). Necessary firmware comes pre-installed on the FRDM-KL25Z with the kit.
Even if the user intends to test with other software or PWM, it is recommended to install
this software as a backup or to help debugging.
6.1 Installing FlexGUI on your computer
The latest version of FlexGUI supports all versions of GD31xx gate drivers. It is designed
to run on any Windows 10 or Windows 8 based operating system. To install the software,
do the following:
1. Go to www.nxp.com/FlexGUI and click Download.
2. When the FlexGUI software page appears, click Download and select the version
associated with your PC operating system.
3. FlexGUI wizard creates a shortcut, an NXP FlexGUI icon appears on the desktop. By
default, the FlexGUI executable file is installed at C:\NXP_GD31xx_GUI-x.x.x.msi.
Installing the device drivers overwrites any previous FlexGUI installation and replaces
it with a current version containing the GD31xx drivers. However, configuration files
from the previous version remain intact.
6.2 Configuring the FRDM-KL25Z microcode
Figure 12. FRDM-KL25Z setup and interface
By default, the FRDM-KL25Z delivered with this kit is preprogrammed with the current
and most up-to-date firmware available for the kit.
A way to check quickly that the microcode is programmed and the board is functioning
properly, is to plug the KL25Z into the computer, open FlexGUI, and verify that the
software version at the bottom is 6.4 or later (see Figure 13).
If a loss of functionality following a board reset, reprogramming, or a corrupted data
issue, the microcode may be rewritten per the following steps:
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1. To clear the memory and place the board in boot loader mode, hold down the reset
button while plugging a USB cable into the OpenSDA USB port.
2. Verify that the board appears as a BOOTLOADER device and continue with step 3. If
the board appears as KL25Z, you may go to step 6.
3. Download the Firmware Apps .zip archive from the PEmicro OpenSDA webpage
(http://www.pemicro.com/opensda/). Validate your email address to access the files.
4. Find the most recent MDS-DEBUG-FRDM-KL25Z_Pemicro_v118.SDA and
copy/drag-and-drop into the BOOTLOADER device.
5. Reboot the board by unplugging and replugging the connection to the OpenSDA
port. Verify now that the device appears as a KL25Z device to continue.
6. Locate the most recent KL25Z firmware; which is distributed as part of the FlexGUI
package.
a. From the FlexGUI install directory or zip file, downloaded, find the firmware bin
file “flexgui-fw-KL25Z_usb_hid_gd31xx-Vx.x.x.bin”.
b. This .bin file is a product/family-specific configuration file for FRDM-KL25Z
containing the pin definitions, SPI/PWM generation code, and pin mapping
assignments necessary to interface with the translator board as part of
FRDMGD3160HB8EVM.
7. With the KL25Z still plugged through the OpenSDA port, copy/drag-and-drop the .bin
file into the KL25Z device memory. Once done, disconnect the USB for OpenSDA
port and plug into the other USB port, labeled KL25Z.
a. The device may not appear as a distinct device to the computer while connected
through the KL25Z USB port, this is normal.
8. The FRDM-KL25Z board is now fully set up to work with FRDMGD3160HB8EVM and
the FlexGUI.
a. There is no software stored or present on either the driver or translator boards,
only on the FRDM-KL25Z MCU board.
All uploaded firmware is stored in non-volatile memory until the reset button is hit on the
FRDM-KL25Z. There is no need to repeat this process upon every power up, and there is
no loss of data associated with a single unplug event.
6.3 Using the FlexGUI
The FlexGUI is available from http://www.nxp.com/FlexGUI as an evaluation tool
demonstrating GD31xx-specific functionality, configuration, and fault reporting. FlexGUI
also includes basic capacity for the FRDMGD3160HB8EVM to control an IGBT or SiC
module, enabling double pulse or short-circuit testing.
SPI messages can be realized graphically or in hexadecimal format. CSB is selectable to
address one or both GD31xx on the board via daisy chain. See Figure 13 to Figure 32 for
FlexGUI for GD31xx internal register read and write access.
Starting FlexGUI for GD31xx
•FlexGUI install program (C:\NXP_GD31xx_GUI-x.x.x.msi)
•Download FlexGUI and run the install program on your PC.
•When you start the application, Figure 13 allows you to select the target application
board, feature set (standard or daisy chain), target MCU, and USB interface. Leave all
settings as shown.
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