Onlogic HX500 User manual

HX500 / HX600 Product Manual


Revision History

Revision History
Date
First release of HX500/HX600 manual
7/10/2020
Table of Contents
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1 - System Overview 4
1.1 System Introduction 4
1.2 In-box Accessories 4
1.3 Product Specifications 5
1.4 Exterior Features and Dimensions 7
1.4.1 - Front I/O 7
1.4.2 - Back I/O 7
1.4.3 - Helix 500 Dimensions (HX500) 8
1.4.4 - Helix 600 Dimensions with PCIe Expansion (HX600) 8
1.5 - System Block Diagram 9
2 - I/O Definitions 10
2.1 - Front I/O definition 10
2.2 Rear I/O definition 12
2.3 - Motherboard Connectors 15
3 - Mounting Instructions 23
3.1 - Wall Mount & DIN Rail Mounting 23
3.1 - VESA Mounting 25
4 - Power Management 26
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4.1 - Wake-Up Events 26
4.2 - Protection Circuitry 26
5 - Test Reports 27
5.1 - EN 60601-1-2 Summary 27
5.1.1 - ESD Immunity Data 27
5.1.2 - Radiated Immunity Data 27
5.1.3 - Magnetic Immunity Data 27
5.1.4 - Electrical Fast Transient Immunity Data 27
5.1.5 Dips/Interrupts Immunity Data 28
6. Appendices 28
6.1 - Appendix A: Power consumption 28
6.2 - Appendix B: Isolated DIO guide 30
6.3 - Appendix C: BIOS manual 30
6.4 - Appendix D: System thermal results 30
6.5 - Appendix E: Expansion port pinout 30
6.5.1 - M.2 B-Key 30
6.5.2 - M.2 E-Key 32
6.5.3 - M.2 M-Key 33
6.5.4 - mPCIe 34
6.6 Appendix F: Safety Information 35
6.6.1 Safe use and installation instructions 35
6.6.2 Précautions et guide d’installation 36
 
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1 - System Overview
1.1 System Introduction
The OnLogic Helix series puts Intel® 10th generation Comet Lake processing anywhere you
need it. Helix gives you installation flexibility, reliable solid state performance, and unique
expandability to help make your next innovation possible.
Helix leverages desktop processing in a form factor that would previously have been limited
to lower wattage, mobile CPUs. Our unique Hardshell™ Fanless Technology lets you reap
the benefits of the improved performance and thermal management of Intel 10th gen
processing while offering triple independent display support, an extended operating
temperature range and a wide input power range.
1.2- In-box Accessories
●4x Rubber Feet
If you purchased additional items such as mounting brackets, power supplies or terminal
block connectors, they will be located in the system box or within the outer shipping carton.
All drivers and product guides can be found on the corresponding product page. For more
information on accessories and additional features, visit the Helix series page.
Helix Series Page: https://www.onlogic.com/computers/industrial/fanless/helix/
Helix 500 Product Page: https://www.onlogic.com/hx500/
Helix 600 Product Page: https://www.onlogic.com/hx600/
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1.3 - Product Specifications
Model
Helix 500
Helix 600
System Dimensions
8.26" x 2" x 6.06"
210 x 50.8 x 154 mm
8.26" x 2.55" x 11.9"
210 x 64.8 x 303mm
Board Dimensions
8" x 5.5"
8" x 5.5"
CPU (on solder side
of board)
Socket LGA 1200 - Comet Lake S
Socket LGA 1200 - Comet Lake S
PCH
Q470
Q470
Memory
2 x SO-DIMM (2 x 32GB max Dual Channel)
64 GB Total
2 x SO-DIMM (2 x 32GB max Dual Channel)
64 GB Total
LAN Controller
1x Intel 219 -with AMT
1x Intel 210
1x Intel 219 -with AMT
1x Intel 210
Expansion
1x M.2 2280/60/3042 B-Key (PCIe x2, USB
3.2 5Gb/s, SATA)
1x M.2 2230 E-key (Wi-Fi) (PCIe / USB 2.0 /
CNVi)
1x M.2 2280 M-key (PCIe x 4, SATA III)
1x mPCIe (PCIe x 1, USB 2.0)
1x M.2 2260/3042 B-Key (PCIe x 2, USB 3.2
5Gb/s, SATA)
1x M.2 2230 E-key (Wi-Fi) (PCIe / USB 2.0 /
CNVi)
1x M.2 2280 M-key (PCIe x 4, SATA III)
1x 16x PCIe Gen 3
1x mPCIe (PCIe x 1, USB 2.0)
Back I/O
3x Full size DisplayPort 1.2 with CEC
support by optional add-on module
2x Gb LAN (2 x Intel)
2x USB 3.2 10 Gb/s
2x USB 3.2 5 Gb/s
4pin Mini DIN with 12~24 V input
3x Full size DisplayPort 1.2 with CEC
support by optional add-on module
2x Gb LAN (2 x Intel)
2x USB 3.2 10 Gb/s
2x USB 3.2 5 Gb/s
4pin Mini DIN with 12~24 V input
Expansion bay I/O (GPU, hot swap drive, Etc)
Front I/O
1x Power LED button
1x 3.5 mm Audio headset (mic-in, line-out) -
CTIA
3FF-Sim slot (Mapped to the B-Key and
mPCIe, BIOS selected)
4x USB 3.2 10Gb/s
1x Power LED button
1x 3.5 mm Audio headset (mic-in, line-out) -
CTIA
3FF-Sim slot (Mapped to the B-Key and
mPCIe, BIOS selected)
4x USB 3.2 10Gb/s
Onboard Headers &
Connectors
1x Battery on a cable
2x Serial Header
2x USB 2.0 (2x5 header 2.54mm)
1x 4-Pin power for devices, 12V and 5V
1x 4-Pin power for Terminal Block
Power/GPU power
Auto Power On (AT/ATX Mode Select)
1x PCIe x16 mating connector
2x SATA III connector
1x 4-Pin Fan Header
1x CEC Header
1x Battery on a cable
2x Serial Header
2x USB 2.0 (2x5 header 2.54mm)
1x 4-Pin power for devices, 12V and 5V
1x 4-Pin power for Terminal Block
Power/GPU power
Auto Power On (AT/ATX Mode Select)
1x PCIe x16 mating connector
2x SATA III connector
1x 4-Pin Fan Header
1x CEC Header
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Voltage Input
8~24V via DC jack or Aux power header
12~24V via DC jack or Aux power header
(without GPU)
19~24V via DC jack or Aux power header
(with GPU present)
Power Input
4 Pin Din with optional 4-pin Terminal Block
(support remote switch, 4 Pin Din covered
when not in use.)
4 Pin Din with optional 4-pin Terminal Block
(support remote switch, 4 Pin Din covered
when not in use.)
BIOS
Insyde H2O BIOS
Insyde H2O BIOS
Operating Systems
Windows 10, Ubuntu 18.04, Ubuntu 20.04
LTS, Yocto, Win10 IOT Core, ThinManager
Windows 10, Ubuntu 18.04, Ubuntu 20.04
LTS, Yocto, Win10 IOT Core, ThinManager
Special Features
Watchdog timer
RTC
PTT in BIOS,
TPM header - support TPM01
Support for Vision Processing Units
Support for 4G LTE and GPS expansion
cards
Hardware Auto Power On
Rapid Branding
Watchdog timer
RTC
PTT in BIOS,
TPM header - support TPM01
Support for Vision Processing Units
Support for 4G LTE and GPS expansion
cards
Hardware Auto Power On
Rapid Branding
Thermal Standards
(Subject to change
through RFI and
RFQ steps)
Board Operating Temperature: 0-50C
Storage Temperature: -10-85C
Operating Humidity: 0% - 90%
(non-condensing)
Board Operating Temperature: 0-50C
Storage Temperature: -10-85C
Operating Humidity: 0% - 90%
(non-condensing)
Extra Chassis
Features
6 Antenna holes
Wall Mount
DIN Rail Mount
VESA Mount
6 Antenna holes
2.5" Hard drive hot swap bracket (later
release, Q3 2020)
GPU Fan array
Regulatory
SAFETY IEC/UL/EN 62368-1
EMC CISPR 32/35 Class A
FCC Part 15 Class A
IEC/EN 60601-1-2:2014 EMC Ready
Radio Equipment Directive (2014/53/EU) -
Only applicable for configurations with
wireless transmitters
RoHS 3 Directive (2015/863/EU)
WEEE Directive (2012/19/EU)
SAFETY IEC/UL/EN 62368-1
EMC CISPR 32/35 Class A
FCC Part 15 Class A
IEC/EN 60601-1-2:2014 EMC Ready
Radio Equipment Directive (2014/53/EU) -
Only applicable for configurations with
wireless transmitters
RoHS 3 Directive (2015/863/EU)
WEEE Directive (2012/19/EU)
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1.4 - Exterior Features and Dimensions
1.4.1 - Front I/O
Note: the HX500 is pictured, the HX600 has the same I/O configuration.
1.4.2 - Back I/O
Note: the HX500 is pictured, the HX600 has the same I/O configuration.
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1.4.3 - Helix 500 Dimensions (HX500)
1.4.4 - Helix 600 Dimensions with PCIe Expansion (HX600)
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1.5 - System Block Diagram
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2 - I/O Definitions
2.1 - Front I/O definition
Note: the HX500 is pictured, the HX600 has the same I/O configuration. The location of the DIO
option is different for the HX600.
Power button / Power LED
The front power button can be used to turn on and off the Helix system. The power button is a
momentary contact button with a blue LED backlight used to display the status of the system. A
single press while the system is on will initiate a graceful shutdown operation from the OS. Pressing
and holding the button for 4 seconds while the system is running will cause a hard reset of the
system. The system can be woken by a single press of the power button from any state.
The LED backlight will indicate the system status. A solid blue light indicates that the system is
powered in the S0 state. A flashing blue light indicates the system is in the sleep state. The LED is off
in S5 and deep sleep states.
SIM card
A 3FF Subscriber Identity Module (SIM) card slot is present on the front panel of the Helix platform
allowing native support for OnLogic Extrovert 4G LTE modules. The SIM signals can be connected to
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either the mPCIe or M.2 B-Key internal expansion slots. This selection is controlled in BIOS with the
default BIOS setting being mPCIe. Please refer to the BIOS user manual for more information.
The SIM slot is a Push-Push type receptacle. To insert or remove the SIM card from the front panel of
the Helix platform, please use a small implement to push the card into the slot until it clicks. To
remove the card, push with a small implement until the card clicks, then remove pull on the free end
of the card to remove it.
COM DB9 option
The serial port mode and voltage between Off/5V on Pin 9 on Helix can be selected in the BIOS
configuration. The serial ports support RS-232, RS-422, and RS-485 configurations. Refer to the BIOS
manual in Appendix C for configuration instructions. 

Pin
RS-232
RS-422
RS-485
1
DCD
TX-
TX-/RX-
2
RX
TX+
TX+/RX+
3
TX
RX+
NC
4
DTR
RX-
NC
5
GND
NC
NC
6
DSR
NC
NC
7
RTS
NC
NC
8
CTS
NC
NC
9
RI/PWR
NC/PWR
NC/PWR
COM DB9 pinout
Audio
Audio input and output is provided by way of a 3.5mm CTIA audio jack on the front panel of the Helix
platform. A pinout is provided below. The audio codec used is a Realtek ALC233. Proper drivers must
be installed for both the Q470 chipset and Realtek ALC233 codec. Drivers can be found on the Helix
product pages.
https://www.onlogic.com/hx500/
https://www.onlogic.com/hx600/
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CTIA Pinout
USB 3.2
There are four USB 3.2 Gen 2 ports on the front panel of the Helix platform. These ports are capable
of linking at 10Gb/s transfer rates.
DIO option
The Helix platform supports an optional Isolated Digital I/O add-in card (OnLogic ADP102). This
option allows for integration of the Helix platform with existing PLC integrations or other digital logic
applications. For a complete explanation of features, operating voltages, and safety information,
please refer to the DIO expansion manual on the OnLogic support site.
https://www.onlogic.com/support/documentation/adp102-dio/
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2.2 Rear I/O definition
The rear I/O of the HX500 is shown below. The HX600 has the same connector orientations and
locations on the motherboard. The location of the Terminal block power option is different for the
HX600.
4-Pin DIN power connector
Mainboard power is applied to the Helix platform by way of a locking 4-pin female DIN connector
(Mating part: Kycon #806-KPPX-4P or equivalent). The system is operational from 8V~24V (HX 500)
and 19V~24V (HX600 with GPU option). The maximum rated current of the connector is 7A per pin.
Use a wire gauge that is rated for the operational current. See below for on-board connector pinout.
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Pin
Function
1
DC -
2
DC -
3
DC +
4
DC +
4-Pin DIN power pinout
DisplayPort 1, 2, & 3
Helix utilizes Intel’s Integrated processor graphics that power the onboard DisplayPorts. This means
resolutions up to 4096x2304 @ 60Hz are supported on all three outputs simultaneously. All ports
support Multi-Stream Transport (MST).
An additional CEC module can be included to add CEC (Consumer Electronics Control) functionality
on DisplayPort 1 & 2. This feature is not supported on the DisplayPort 3 connector.
LAN1 - Intel I219-LM
The Intel I219 LAN Port on Helix supports up to 1Gbps link speeds over standard shielded CAT5e or
CAT6 cables. The connector is the industry standard RJ45 connector. This port also features Intel’s
vPro(R) technology enabling remote out-of-band management and security features (requires Intel
Core i5 or higher). The LAN link state is shown by the two LEDs enclosed in the port. The description
is included below.
LAN2 - Intel I210-IT
The second LAN Port on Helix supports up to 1Gbps link speeds over standard shielded CAT5e or
CAT6 cables. The connector is the industry standard RJ45 connector. The LAN link state is shown by
the two LEDs enclosed in the port. The description is included below.
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
LED
Color
State
Function
Link
-
Off
LAN link is
not
established
Green
On
LAN link is
established
Blinking
LAN activity
occurring
Speed
-
Off
10 Mb/s data
rate
Green
On
100 Mb/s
data rate
Yellow
On
1000 Mb/s
data rate
LAN activity light description
USB 3.2
The dual stack USB 3.2 ports on the rear panel are USB 3.2 Gen 2ports, capable of linking at 10Gb/s
transfer rates.
The two USB ports above the RJ45 LAN connectors are USB 3.2 Gen 1 ports, capable of linking at 5
Gb/s.
Terminal block power option
If the terminal block power option is selected, mainboard power is applied to the Helix platform
through a 4-pin terminal block connector (Mating part: Dinkle #2ESDAM-04P or equivalent).
The system is operational from 8V~24V (HX 500) and 19V~24V (HX600 with GPU option). The
maximum rated current of the connector is 15A per pin. Use a wire gauge that is rated for the
operational current. Cables should be properly terminated with wire ferrules. Do not use the terminal
block with tinned wire ends or solid core wire. See below for connector pinout.
When using the remote switch connections with the terminal block option, mating power switch
cables should be a twisted-pair wire with floating shield to assure proper immunity to EMI/RFI. It is
recommended to keep wires at less than 3 meters in length. Switches should be momentary contact
type only.
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Pin
Function
1
DC +
2
DC -
3
SW1
4
SW2
Terminal block power pinout
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2.3 - Motherboard Connectors
The motherboard is the same for HX500 and HX600.
M.2 B-Key
An M.2 B-Key port is present on the Helix motherboard to allow support for B-Key form-factor
expansion cards. Supported cards include 3042, 2242, 2260, 2280 form-factors. The B-Key connector
on the Helix platform supports PCIe Gen 3 x2, USB 3.2 5Gb/s, USB 2.0, SATA Gen I (1.5Gbps), SATA
Gen II (3.0Gbps), and SATA Gen III (6.0Gbps) devices.
The 3FF Micro SIM card slot is multiplexed to both the M.2 B-Key and mPCIe expansion slot.. The
routing can be selected in the BIOS and is set to the mPCIe slot by default. Please refer to the BIOS
user manual (Appendix C) for more information.
The M.2 B-Key slot can be used in tandem with the M.2 M-Key slot to create firmware-level RAID
arrays using Intel Rapid Storage Technology. These arrays can be created with M.2 SATA SSDs;
NVMe RAID is not supported by the chipset. RAID arrays that mix together M.2 SATA and cabled 2.5”
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SATA drives can also be created. Refer to the BIOS user manual (Appendix C) for information about
using Rapid Storage Technology.
A full pinout table for this expansion slot is provided in Appendix E.
M.2 E-Key
An M.2 E-Key port is present on the Helix motherboard to allow support for E-Key form-factor wireless
expansion cards. Only 2230 form-factor cards are supported. The E-Key connector on the Helix
platform supports PCIe Gen 3 x1, USB 2.0, and Intel CNVi devices. A full pinout table for this
expansion slot is provided in Appendix E.
M.2 M-Key
An M.2 M-Key port is present on the Helix motherboard to allow support for M-Key form-factor
expansion cards. Only 2280 form-factor cards are supported. The M-Key connector on the Helix
platform includes support for PCIe Gen 3 x4, PCIe Gen 3 x2, SATA Gen I (1.5Gbps), SATA Gen II
(3.0Gbps), and SATA Gen III (6.0Gbps) devices.
The M.2 M-Key slot can be used in tandem with the M.2 B-Key slot to create firmware-level RAID
arrays using Intel Rapid Storage Technology. These arrays can be created with M.2 SATA SSDs;
NVMe RAID is not supported by the chipset. RAID arrays that mix together M.2 SATA and cabled 2.5”
SATA drives can also be created. Refer to the BIOS user manual (Appendix C) for information about
using Rapid Storage Technology.
A full pinout table for this expansion slot is provided in Appendix E
mPCIe
A mPCIe port is present on the Helix motherboard to allow support for mini-PCIe form-factor
expansion cards. Full length cards and half-length cards (with adapter) are supported. The mPCIe
connector on the Helix platform supports PCIe Gen 3 x1 and USB 2.0 devices. A full pinout table for
this expansion slot is provided in Appendix E.
The 3FF Micro SIM card slot is multiplexed to both the M.2 B-Key and mPCIe expansion slot.. The
routing can be selected in the BIOS and is set to the mPCIe slot by default.. Please refer to the BIOS
user manual (Appendix C) for more information.
SO-DIMM1 & SO-DIMM2
The Helix platform has two onboard DDR4 SO-DIMM Slots. Below find the specifications of the two
SO-DIMM Slots:
○Maximum Capacity: DDR4-2666 64GB with two 32GB SO-DIMM Modules
○Channel configuration: 1DIMM Per Channel (DPC) - 2 Channels
○No ECC Support


COM1 & COM2
The two on-board COM headers utilize standard 9-pin 2.00mm pitch male pin headers with the pin
configuration in the chart below. These serial ports support RS-232, RS-422 Full-Duplex, and RS-485
half-Duplex configurations. The serial port communication mode can be selected in the BIOS
configuration. In addition, 5V power can be enabled on pin 9 in the same BIOS menu. Pin 9 is rated to
provide 250mA of current. Refer to the BIOS manual (Appendix C) for configuration instructions. 
Pin
RS-232
RS-422
RS-485
1
DCD
TX-
TX-/RX-
2
RX
TX+
TX+/RX+
3
TX
RX+
NC
4
DTR
RX-
NC
5
GND
NC
NC
6
DSR
NC
NC
7
RTS
NC
NC
8
CTS
NC
NC
9
RI/PWR
NC/PWR
NC/PWR
10
(KEY)
(KEY)
(KEY)
Motherboard Serial header pinout

BIOS EEPROM
If the BIOS needs to be updated, please refer to Appendix C for reflashing instructions.
Power Switch Header
The on-board power switch header can be used to control the power state of the Helix platform in
parallel with the front panel power button. Mating power switch cables should be a twisted-pair wire
with floating shield to assure proper immunity to EMI/RFI. Mating connector is a standard 2.54mm
female header. It is recommended to keep wires at less than 3 meters in length. Switches must be
momentary contact type only.
ATX/CMOS Jumper Header
A 2mm pin header and jumpers are used to clear the CMOS settings and select the hardware auto
power-on behavior of the Helix platform.


ATX mode can be selected by moving the pin jumper to connect pins 3 and 5 will select ATX power
mode. The system power-on will be controlled by the system power button or other supported wake
events. When the pin jumper is moved to connect pins 1 and 3, the system will operate in AT mode,
where the system will power on when system power is first applied. The default selection is ATX
mode.
The system CMOS settings can be cleared with the second pin jumper. To clear the CMOS the
following steps shall be followed:
1. Disconnect system power.
2. Place jumper in the “clear” position.
3. Wait 10 seconds.
4. Remove jumper from the “clear” position and return to default position

Jumper
Position
Function
1-3
AT mode
3-5
ATX Mode (Default)
2-4
Clear CMOS
4-6
No Function (Default)
ATX/CMOS header pinout
RTC battery header
The RTC battery on the Helix platform is used to retain BIOS CMOS settings and maintain the
real-time clock for the system. If the RTC battery is low, CMOS settings will not be retained and you
may receive an alert in the operating system. The cabled RTC battery should be replaced with a
Maxell CR2032-WK11 (or UL listed equivalent). An equivalent battery shall use a Hirose
DF13-2S-1.25c connector to mate with the on-board connector.
TPM header
Helix features an onboard TPM (Trusted Platform Module) header. Helix supports OnLogic’s module
(OnLogic part TPM01) featuring TPM 2.0. This gives the option to have a dedicated secure module to
secure Helix through cryptographic keys.
SATA Data 1 & SATA Data 2
The two on-board SATA Data connectors utilize the standard 7-pin SATA Data latching connector with
the standard pin configuration. These connectors support SATA Gen I (1.5Gbps), SATA Gen II
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