Panasonic KX-TG5631S User manual

© 2006 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
KX-TG5631S
KX-TG5632M
KX-TG5633B
KX-TGA560S
KX-TGA560M
KX-TGA560B
5.8 GHz Digital Cordless Answering
System
Silver Version
Metallic Gray Version
Black Version
(for U.S.A.)
Telephone Equipment
ORDER NO. KM40512965CE
F12

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 4
1.1. Suggested PbF Solder 4
1.2. How to Recognize that Pb Free Solder is Used 5
2 FOR SERVICE TECHNICIANS 6
3 CAUTION 6
4 OPERATING INSTRUCTIONS 7
4.1. Battery 7
4.2. Location of Controls 9
4.3. Displays 11
4.4. Settings 13
4.5. Troubleshooting 18
5 DISASSEMBLY INSTRUCTIONS 21
5.1. Base Unit 21
5.2. Handset 22
5.3. Charger Unit 23
6 HOW TO REPLACE THE HANDSET LCD 24
7 TROUBLESHOOTING GUIDE 25
7.1. Check Power 26
7.2. Error Message Table 26
7.3. Check Record 27
7.4. Check Playback 28
7.5. Check Battery Charge 28
7.6. Check Link 29
7.7. Check the RF part 30
7.8. Check Handset Transmission 37
7.9. Check Handset Reception 37
7.10. Check Caller ID 37
8 ADJUSTMENT AND TEST MODE 38
8.1. Test Mode Flow Chart for Base Unit 38
8.2. Test Mode Flow Chart for Handset 42
8.3. X501 (Base Unit), X201 (Handset) Check 46
8.4. Adjust Battery Low Detector Voltage (Handset) 46
8.5. Base Unit Reference Drawing 47
8.6. Handset Reference Drawing 48
8.7. Frequency Table 49
8.8. How to Clear User Setting 51
9 DESCRIPTION 52
9.1. Frequency 52
9.2. FHSS (Frequency Hopping Spread Spectrum) 52
9.3. Signal Flowchart in the Whole System 54
10 EXPLANATION OF LINK DATA COMMUNICATION 55
10.1. Calling 55
10.2. To Terminate Communication 55
10.3. Ringing 55
11 BLOCK DIAGRAM (BASE UNIT_MAIN) 56
12 CIRCUIT OPERATION (BASE UNIT_MAIN) 57
12.1. DSP (Digital Speech/Signal Processing: IC501) 57
12.2. Flash Memory (IC601) 57
12.3. Power Supply Circuit 58
12.4. Reset Circuit 60
12.5. Telephone Line Interface 61
12.6. Auto Disconnect Circuit 62
12.7. Parallel Connection Detect Circuit 63
12.8. Calling Line Identification (Caller ID)/Call Waiting Caller ID
64
13 BLOCK DIAGRAM (BASE UNIT_RF PART) 66
14 BLOCK DIAGRAM (HANDSET_RF PART) 67
15 CIRCUIT OPERATION (RF PART) 68
15.1. Power Supply Circuit 69
15.2. 2.4GHz Mod/Demod Circuit 70
15.3. 5.8GHz Converter Circuit 71
15.4. 5.8GHz PA (Power Amplifier), 5.8GHz LNA (Low Noise
Amplifier) and Antenna Switch Circuit 72
16 BLOCK DIAGRAM (HANDSET) 73
17 CIRCUIT OPERATION (HANDSET) 74
17.1. Construction 74
17.2. Power Supply Circuit 75
17.3. Charge Circuit 76
17.4. Ringer and Handset SP-Phone 76
17.5. Sending Signal 77
17.6. Reception Signal 77
18 CIRCUIT OPERATION (CHARGER UNIT) 78
Note:
Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can
download and refer to the original Operating Instructions on TSN Server for further information.
CONTENTS
Page Page
2
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B

19 SIGNAL ROUTE 79
20 CPU DATA (BASE UNIT) 81
20.1. IC501 81
21 CPU DATA (HANDSET) 82
21.1. IC201 82
22 EXPLANATION OF IC TERMINALS (RF PART) 83
22.1. IC701 83
22.2. IC801 84
22.3. IC851 85
23 HOW TO REPLACE THE FLAT PACKAGE IC 86
23.1. PREPARATION 86
23.2. FLAT PACKAGE IC REMOVAL PROCEDURE 86
23.3. FLAT PACKAGE IC INSTALLATION PROCEDURE 87
23.4. BRIDGE MODIFICATION PROCEDURE 87
24 CABINET AND ELECTRICAL PARTS (BASE UNIT) 88
25 CABINET AND ELECTRICAL PARTS (HANDSET) 89
26 CABINET AND ELECTRICAL PARTS (CHARGER UNIT) 90
27 ACCESSORIES AND PACKING MATERIALS 91
27.1. KX-TG5631S 91
27.2. KX-TG5632M 92
27.3. KX-TG5633B 93
27.4. KX-TGA560M/B 94
28 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
95
28.1. Base Unit 95
28.2. Handset 95
29 REPLACEMENT PARTS LIST 96
29.1. Base Unit 96
29.2. Handset 98
29.3. Charger Unit 101
29.4. Accessories and Packing Materials 101
29.5. Fixtures and Tools 102
30 FOR SCHEMATIC DIAGRAM 103
30.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT_MAIN))
103
30.2. Handset (SCHEMATIC DIAGRAM (HANDSET_MAIN))
103
30.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
103
31 SCHEMATIC DIAGRAM (BASE UNIT_MAIN) 104
32 SCHEMATIC DIAGRAM (BASE UNIT_RF PART) 106
33 SCHEMATIC DIAGRAM (BASE UNIT_OPERATION) 108
34 SCHEMATIC DIAGRAM (HANDSET_MAIN) 110
35 SCHEMATIC DIAGRAM (HANDSET_RF PART) 112
36 SCHEMATIC DIAGRAM (CHARGER UNIT) 114
37 CIRCUIT BOARD (BASE UNIT_MAIN) 115
37.1. Component View 115
37.2. Flow Solder Side View 116
38 CIRCUIT BOARD (BASE UNIT_OPERATION) 117
38.1. Component View 117
38.2. Flow Solder Side View 118
39 CIRCUIT BOARD (BASE UNIT_RF PART) 119
40 CIRCUIT BOARD (HANDSET_MAIN) 121
40.1. Component View 121
40.2. Flow Solder Side View 122
41 CIRCUIT BOARD (HANDSET_RF PART) 123
42 CIRCUIT BOARD (CHARGER UNIT) 124
42.1. Component View 124
42.2. Flow Solder Side View 124
3
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
• • •
• PbF solder has a melting point that is 50°F ~ 70° F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20° F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
• • •
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
• • •
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
• • •
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B

1.2. How to Recognize that Pb Free Solder is Used
(Example: Handset P.C.B.)
IC201
IC241
PbF
IC801
IC701
IC851
1
4
8
5
125
114
2815
26
50
51 75
76
100
IC246
Marked
(Component View)
Note:
The location of the “PbF”mark is subject to change without notice.
5
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B

2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
3 CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer´s Instructions.
6
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B

4 OPERATING INSTRUCTIONS
4.1. Battery
4.1.1. Battery Installation/Replacement
4.1.2. Battery Charge
Note for service:
The battery strength may not be indicated correctly if the battery is disconnected and connected again, even after it is fully
charged. In that case, by recharging the battery as mentioned above, you will get a correct indication of the battery strength.
7
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B

4.1.3. Battery Level
4.1.4. Panasonic Battery Performance
8
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B

4.2. Location of Controls
4.2.1. Base Unit
9
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B

4.2.2. Handset
10
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B

4.3. Displays
4.3.1. Display Items
11
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B

4.3.2. Troubleshooting (Handset LCD)
12
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B

4.4. Settings
4.4.1. Connecting the AC Adaptor and Telephone Line Cord
13
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B

4.4.2. Connecting the Charger (KX-TG5632/KX-TG5633 only)
14
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B

4.4.3. Programmable Settings
4.4.3.1. Programming by Scrolling through the Display Menus
15
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B

4.4.3.2. Programming Using the Direct Commands
16
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B

17
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B

4.5. Troubleshooting
If the handset display shows error messages, see “Troubleshooting (Handset LCD) (P.12)”for the Cause & Solution.
18
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B

19
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B

20
KX-TG5631S / KX-TG5632M / KX-TG5633B / KX-TGA560S / KX-TGA560M / KX-TGA560B