Panasonic KX-TG5671BXS User manual

©2006 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
KX-TG5671BXS
KX-TGA560BXS
Digital Cordless Answering System
Silver Version
(for Middle Near East and Africa)
Telephone Equipment
ORDER NO. KM40511937CE

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 4
1.1. Suggested PbF Solder 4
1.2. How to Recognize that Pb Free Solder is Used 5
2 FOR SERVICE TECHNICIANS 5
3 CAUTION 5
4 OPERATING INSTRUCTIONS 6
4.1. Battery 6
4.2. Location of Controls 8
4.3. Displays 10
4.4. Settings 11
4.5. Troubleshooting 15
5 DISASSEMBLY INSTRUCTIONS 18
5.1. Base Unit 18
5.2. Handset 19
6 HOW TO REPLACE THE HANDSET LCD 20
7 TROUBLESHOOTING GUIDE 21
7.1. Check Power 22
7.2. Error Message Table 22
7.3. Check Record 23
7.4. Check Playback 24
7.5. Check Sp-phone Transmission 24
7.6. Check Sp-phone Reception 25
7.7. Check Battery Charge 25
7.8. Check Link 26
7.9. Check the RF part 27
7.10. Check Handset Transmission 33
7.11. Check Handset Reception 33
7.12. Check Caller ID 33
8 ADJUSTMENT AND TEST MODE 34
8.1. Test Mode Flow Chart for Base Unit 34
8.2. Test Mode Flow Chart for Handset 38
8.3. X501 (Base Unit), X201 (Handset) Check 42
8.4. Adjust Battery Low Detector Voltage (Handset) 42
8.5. Base Unit Reference Drawing 43
8.6. Handset Reference Drawing 44
8.7. Frequency Table 45
8.8. How to Clear User Setting 47
9 DESCRIPTION 48
9.1. Frequency 48
9.2. FHSS (Frequency Hopping Spread Spectrum) 48
9.3. Signal Flowchart in the Whole System 50
10 EXPLANATION OF LINK DATA COMMUNICATION 51
10.1. Calling 51
10.2. To Terminate Communication 51
10.3. Ringing 51
11 BLOCK DIAGRAM (BASE UNIT_MAIN) 52
12 CIRCUIT OPERATION (BASE UNIT_MAIN) 53
12.1. DSP (Digital Speech/Signal Processing: IC501) 53
12.2. Flash Memory: IC601 53
12.3. Power Supply Circuit 54
12.4. Reset Circuit 56
12.5. Telephone Line Interface 57
12.6. Auto Disconnect Circuit 58
12.7. Parallel Connection Detect Circuit 59
12.8. Calling Line Identification (Caller ID) 60
13 BLOCK DIAGRAM (BASE UNIT_RF PART) 61
14 BLOCK DIAGRAM (HANDSET_RF PART) 62
15 CIRCUIT OPERATION (RF PART) 63
15.1. Power Supply Circuit 64
15.2. 2.4GHz Mod/Demod Circuit 65
15.3. 5.8GHz Converter Circuit 66
15.4. 5.8GHz PA (Power Amplifier), 5.8GHz LNA (Low Noise
Amplifier) and Antenna Switch Circuit 67
16 BLOCK DIAGRAM (HANDSET) 68
17 CIRCUIT OPERATION (HANDSET) 69
17.1. Construction 69
17.2. Power Supply Circuit 70
17.3. Charge Circuit 71
17.4. Ringer and Handset SP-Phone 71
17.5. Sending Signal 72
17.6. Reception Signal 72
18 SIGNAL ROUTE 73
19 CPU DATA (BASE UNIT) 75
19.1. IC501 75
Note:
Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can
download and refer to the original Operating Instructions on TSN Server for further information.
CONTENTS
Page Page
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KX-TG5671BXS / KX-TGA560BXS

20 CPU DATA (HANDSET) 76
20.1. IC201 76
21 EXPLANATION OF IC TERMINALS (RF PART) 77
21.1. IC701 77
21.2. IC801 78
21.3. IC851 79
22 HOW TO REPLACE THE FLAT PACKAGE IC 80
22.1. Preparation 80
22.2. How to Remove the IC 80
22.3. How to Install the IC 81
22.4. How to Remove a Solder Bridge 81
23 HOW TO REPLACE THE LLP (Leadless Leadframe Package)
IC 82
23.1. Preparation 82
23.2. Caution 82
23.3. How to Remove the IC 82
23.4. How to Install the IC 83
23.5. How to Remove a Solder Bridge 83
24 CABINET AND ELECTRICAL PARTS (BASE UNIT) 84
25 CABINET AND ELECTRICAL PARTS (HANDSET) 85
26 ACCESSORIES AND PACKING MATERIALS 86
27 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
87
27.1. Base Unit 87
27.2. Handset 87
28 REPLACEMENT PARTS LIST 88
28.1. Base Unit 88
28.2. Handset 90
28.3. Accessories and Packing Materials 92
28.4. Fixtures and Tools 92
29 FOR SCHEMATIC DIAGRAM 93
29.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT_MAIN))
93
29.2. Handset (SCHEMATIC DIAGRAM (HANDSET_MAIN)) 93
30 SCHEMATIC DIAGRAM (BASE UNIT_MAIN) 94
31 SCHEMATIC DIAGRAM (BASE UNIT_RF PART) 96
32 SCHEMATIC DIAGRAM (BASE UNIT_OPERATION) 98
33 SCHEMATIC DIAGRAM (HANDSET_MAIN) 100
34 SCHEMATIC DIAGRAM (HANDSET_RF PART) 102
35 CIRCUIT BOARD (BASE UNIT_MAIN) 105
35.1. Component View 105
35.2. Flow Solder Side View 106
36 CIRCUIT BOARD (BASE UNIT_OPERATION) 107
36.1. Component View 107
36.2. Flow Solder Side View 108
37 CIRCUIT BOARD (BASE UNIT_RF PART) 109
38 CIRCUIT BOARD (HANDSET_MAIN) 111
38.1. Component View 111
38.2. Flow Solder Side View 112
39 CIRCUIT BOARD (HANDSET_RF PART) 113
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KX-TG5671BXS / KX-TGA560BXS

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
· PbF solder has a melting point that is 50°F ~ 70° F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20° F (370°C ± 10°C).
· Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
· PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
· If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
· When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TG5671BXS / KX-TGA560BXS

1.2. How to Recognize that Pb Free Solder is Used
(Example: Handset P.C.B.)
IC201
IC241
PbF
IC801 IC701
IC851
1
4
8
5
125
114
2815
26
50 51 7576
100
IC246
Marked
(Component View)
Note:
The location of the “PbF”mark is subject to change without notice.
2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1.Cover plastic parts boxes with aluminum foil.
2.Ground the soldering irons.
3.Use a conductive mat on worktable.
4.Do not grasp IC or LSI pins with bare fingers.
3 CAUTION
1.Danger of explosion if battery is incorrectly replaced.
2.Replace only with the same or equivalent type recommended by the manufacturer.
3.Dispose of used batteries according to the manufacturer´s Instructions.
5
KX-TG5671BXS / KX-TGA560BXS

4 OPERATING INSTRUCTIONS
4.1. Battery
4.1.1. Battery Installation/Replacement
4.1.2. Battery Charge
Note for service:
The battery strength may not be indicated correctly if the battery is disconnected and connected again, even after it is fully
charged. In that case, by recharging the battery as mentioned above, you will get a correct indication of the battery strength.
6
KX-TG5671BXS / KX-TGA560BXS

4.1.3. Battery Level
4.1.4. Panasonic Battery Performance
7
KX-TG5671BXS / KX-TGA560BXS

4.2. Location of Controls
4.2.1. Base Unit
8
KX-TG5671BXS / KX-TGA560BXS

4.2.2. Handset
9
KX-TG5671BXS / KX-TGA560BXS

4.3. Displays
4.3.1. Display Items
4.3.2. Troubleshooting (Handset LCD)
10
KX-TG5671BXS / KX-TGA560BXS

4.4. Settings
4.4.1. Connecting the AC Adaptor and Telephone Line Cord
11
KX-TG5671BXS / KX-TGA560BXS

4.4.2. Programmable Settings
4.4.2.1. Programming by Scrolling through the Display Menus
12
KX-TG5671BXS / KX-TGA560BXS

4.4.2.2. Programming Using the Direct Commands
13
KX-TG5671BXS / KX-TGA560BXS

4.4.3. Dial Lock
14
KX-TG5671BXS / KX-TGA560BXS

4.5. Troubleshooting
15
KX-TG5671BXS / KX-TGA560BXS

16
KX-TG5671BXS / KX-TGA560BXS

17
KX-TG5671BXS / KX-TGA560BXS

5 DISASSEMBLY INSTRUCTIONS
5.1. Base Unit
Shown in Fig.- To Remove - Remove -
1Cabinet Cover Screws (2.6 ×12).....(A) ×5
Main P. C. Board Tapes, Solders and Cable
Main P. C. Board
2Operational P. C. Board Tape
Screws (2.6 ×8).......(B) ×8
Operational P. C. Board
18
KX-TG5671BXS / KX-TGA560BXS

5.2. Handset
Shown in Fig.- To Remove - Remove -
3Cabinet Cover Screws (2 ×14)........(C) ×2
4Follow the procedure.
5Main P. C. Board Tape and Solders
Screws (2 ×9).............(D) ×3
Main P. C. Board
19
KX-TG5671BXS / KX-TGA560BXS

6 HOW TO REPLACE THE HANDSET LCD
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KX-TG5671BXS / KX-TGA560BXS