
1 ABOUT LEAD F EE SOLDE (PbF: Pb free) 4
1.1. Suggested PbF Solder 4
1.2. How to recognize that Pb Free solder is used 5
2 FO SE VICE TECHNICIANS 5
3 CAUTION 5
4 OPE ATING INST UCTIONS 6
4.1. Battery 6
4.2. Location o Controls 8
4.3. Displays 9
4.4. Settings 10
4.5. Troubleshooting 16
5 DISASSEMBLY INST UCTIONS 19
5.1. Base Unit 19
5.2. Handset 20
6 ASSEMBLY INST UCTIONS 21
6.1. Fix the LCD to P.C. Board (Handset) 21
7 T OUBLESHOOTING GUIDE 22
7.1. Check Battery Charge 22
7.2. Check Link 23
7.3. Check the RF Part 24
7.4. Check Handset Transmission 28
7.5. Check Handset Reception 28
7.6. Check Caller ID 28
8 ADJUSTMENT AND TEST MODE 29
8.1. Test Mode Flow Chart or Base Unit 29
8.2. Test Mode Flow Chart or Handset 33
8.3. X801 (Base Unit), X201 (Handset) Check 37
8.4. Adjust Battery Low Detector Voltage (Handset) 37
8.5. Base Unit Re erence Drawing 38
8.6. Handset Re erence Drawing 40
8.7. Frequency Table 41
8.8. How to Clear User Setting (Handset Only) 42
9 DESC IPTION 43
9.1. Frequency 43
9.2. FHSS (Frequency Hopping Spread Spectrum) 43
9.3. Signal Flowchart in the Whole System 45
10 EXPLANATION OF LINK DATA COMMUNICATION 46
10.1. Calling 46
10.2. To Terminate Communication 46
10.3. Ringing 46
11 BLOCK DIAG AM (BASE UNIT_MAIN) 47
12 BLOCK DIAG AM (BASE UNIT_ F PA T) 48
13 CI CUIT OPE ATION (BASE UNIT_MAIN) 49
13.1. DSP (Digital Speech/Signal Processing: IC501) 49
13.2. EEPROM (IC700) 50
13.3. Power Supply Circuit 50
13.4. Reset Circuit 52
13.5. Telephone Line Inter ace 53
13.6. Auto Disconnect Circuit 55
13.7. Parallel Connection Detect Circuit 56
13.8. Calling Line Identi ication (Caller ID) 57
13.9. 2.4GHz Mod/Demod Circuit (Base Unit RF Part) 58
14 BLOCK DIAG AM (HANDSET_MAIN) 59
15 BLOCK DIAG AM (HANDSET_ F PA T) 60
16 CI CUIT OPE ATION (HANDSET) 61
16.1. Construction 61
16.2. Power Supply Circuit 62
16.3. Charge Circuit 63
16.4. Ringer and Handset SP-Phone 63
16.5. Sending Signal 64
16.6. Reception Signal 64
16.7. 2.4GHz Mod/Demod Circuit (Handset RF Part) 65
17 SIGNAL OUTE 66
18 CPU DATA (BASE UNIT) 67
18.1. IC501 67
19 CPU DATA (HANDSET) 68
19.1. IC201 68
20 EXPLANATION OF IC TE MINALS ( F UNIT) 69
20.1. IC901 69
21 HOW TO EPLACE A FLAT PACKAGE IC 70
21.1. PREPARATION 70
21.2. FLAT PACKAGE IC REMOVAL PROCEDURE 70
21.3. FLAT PACKAGE IC INSTALLATION PROCEDURE 71
21.4. BRIDGE MODIFICATION PROCEDURE 71
Note:
Because CONTENTS 4 is the extract rom the Operating Instructions o this model, it is subject to change without notice. You can
download and re er to the original Operating Instructions on TSN Server or urther in ormation.
CONTENTS
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KX-TG2480BXS / KX-TGA248BXS