Panasonic DVD-S35GD User manual

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Table Of Contents
COVER
1 SAFETY PRECAUTIONS
1.1 GENERAL GUIDELINES
1.1.1 LEAKAGE CURRENT COLD CHECK
1.1.2 LEAKAGE CURRENT HOT CHECK (See Figure 1 .)
2 PREVENTION OF ELECTRO STATIC DISCHARGE (ESD) TO ELECTROSTATICALLY SENSITIVE (ES) DEVICES
3 Precaution of Laser Diode
4 About lead free solder (PbF)
5 General Description
5.1 Operating instructions
6 PREVENTION OF STATIC ELECTRICITY DISCHARGE
6.1 Grounding for electrostatic breakdown prevention
6.1.1 Worktable grounding
6.1.2 Human body grounding
6.1.3 Handling of optical pickup
6.2 Handling Precautions for Traverse Unit (Optical Pickup)
7 Disassembling the Casing and Checking P.C.B.s
7.1 Dissasembly Procedure
7.2 Casing Parts and P.C.B. Positions
7.3 Top Panel
7.4 Front Panel
7.5 Rear panel
7.6 Power supply P.C.B.
7.7 Main P.C.B. and Mechanism Unit
7.8 Motor P.C.B.
7.9 Operation (L) P.C.B. and Operation (R) P.C.B.
7.10 Service Position
7.10.1 Servicing position of the Main P.C.B. and the Operation P.C.B.
7.10.2 List of the Extension Cables
8 ASSEMBLING AND DISASSEMBLING THE MECHANISM UNIT
8.1 Disassembly Procedure
8.2 Motor P.C.B.
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8.3 Clamp Plate Unit
8.4 Tray
8.5 Traverse Block
8.6 Traverse Gear
8.7 Optical Pickup Unit
8.7.1 Precautions in optical pickup replacement
8.7.2 Disassembling the Optical Pickup Unit
8.7.3 Cautions to Be Taken When Replacing the Optical Pickup
8.8 Disassembling the Middle Chassis
8.9 Disassembling the Traverse Gear A/ FG P.C.B.
8.10 Disassembling the Spindle Motor Unit
9 Self-Diagnosis Function and Service Modes
9.1 Optical Pickup Breakdown Diagnosis
9.2 Service Mode Table 1
9.3 DVD Self Diagnostic Function-Error Code
9.4 Last Error Code saved during NO PLAY
9.5 Service mode table 2
9.6 Sales demonstration lock function
9.6.1 Setting
9.6.2 Cancellation
9.7 Handling After Completing Repairs
9.7.1 Method
9.7.2 Precautions
10 Servicw Precautions
10.1 Recovery after the dvd player is repaired
10.2 Firmware version-up of the DVD player
11 ADJUSTMENT PROCEDURES
11.1 Service Tools and Equipment
11.2 Important points in adjustment
11.2.1 Important points in optical adjustment
11.2.2 Important points in electrical adjustment
11.3 Storing and Handling Test Discs
11.4 Optical adjustment
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11.4.1 Optical pickup tilt adjustment
11.4.1.1 Adjustment procedure
11.4.1.2 Important points
11.4.1.3 Check after adjustment
11.4.1.4 Procedure for screw lock
12 Abbreviations
13 VOLTAGE CHART
13.1 POWER SUPPLY P.C.B.
13.2 MAIN P.C.B.
13.3 OPERATION P.C.B.
14 BLOCK DIAGRAM
14.1 OVERALL BLOCK DIAGRAM
14.2 POWER SUPPLY BLOCK DIAGRAM (DVD-S35GCS/GCU/GC/GCA/GD/EE/GN/PL/PX/PLA)
14.3 POWER SUPPLY BLOCK DIAGRAM (DVD-S35PLA)
14.4 SERVO BLOCK DIAGRAM
14.5 VIDEO BLOCK DIAGRAM
14.6 AUDIO BLOCK DIAGRAM
15 INTERCONNECTION SCHEMATIC DIAGRAM& SCHEMATIC DIAGRAM NOTES
15.1 INTERCONNECTION SCHEMATIC DIAGRAM
15.2 SCHEMATIC DIAGRAM NOTES
16 SCHEMATIC DIAGRAM
16.1 POWER SUPPLY SCHEMATIC DIAGRAM (DVD-S35GCS/GCU/GC/GCA/GD/PL/PX)
16.2 POWER SUPPLY SCHEMATIC DIAGRAM (DVD-S35EE/GN)
16.3 POWER SUPPLY SCHEMATIC DIAGRAM (DVD-S35PLA)
16.4 PRE SECTION (MAIN P.C.B. (1/3)) SCHEMATIC DIAGRAM (DVD-S35GCS/GCU/GC/GCA/GD/EE/GN/PL/PLA)
16.5 DV1 SECTION (MAIN P.C.B. (2/3)) SCHEMATIC DIAGRAM (DVD-S35GCS/GCU/GC/GCA/GD/EE/GN/PL/PLA)
16.6 AUDIO/VIDEO SECTION (MAIN P.C.B. (3/3)) SCHEMATIC DIAGRAM (DVD-S35GCS/GCU/GC/GCA/GD/EE/GN/PL/PLA)
16.7 PRE SECTION (MAIN P.C.B. (1/3)) SCHEMATIC DIAGRAM (DVD-S35PX)
16.8 DV1 SECTION (MAIN P.C.B. (2/3)) SCHEMATIC DIAGRAM (DVD-S31PX)
16.9 AUDIO/VIDEO SECTION (MAIN P.C.B. (3/3)) SCHEMATIC DIAGRAM (DVD-S35PX)
16.10 MOTOR SCHEMATIC DIAGRAM
16.11 OPERATION SCHEMATIC DIAGRAM
17 PRINT CIRCUIT BOARD
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17.1 POWER SUPPLY P.C.B. (DVD-S35GCS/GCU/GC/GCA/GD/PL/PX)
17.2 POWER SUPPLY P..B. (DVD-S35EE/GN)
17.3 POWER SUPPLY P.C.B. (DVD-S35PLA)
17.4 MAIN P.C.B. (1/2) (COMPONENT SIDE) (DVD-S35GCS/GCU/GC/GCA/GD/EE/GN/PL/PLA)
17.5 MAIN P.C.B. (2/2) (FOIL SIDE) (DVD-S35GCS/GCU/GC/GCA/GD/EE/GN/PL/PLA)
17.6 MAIN P.C.B. ADDRESS INFORMATION
17.7 MAIN P.C.B. (1/2) (COMPONENT SIDE) (DVD-S35PX)
17.8 MAIN P.C.B. (2/2) (FOIL SIDE) (DVD-S35PX)
17.9 MOTOR P.C.B.
17.10 OPERATION P.C.B.
18 EXPLODED VIEWS
18.1 Casing Parts& Mechanism Section Exploded View
18.2 Mechanism Section Exploded View
18.3 Packing& Accessories Section Exploded View
19 REPLACEMENT PARTS LIST
20 Schematic Diagram for printing with A4 size
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Service Manual
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ORDER NO.CHM0306017C0
DVD Player
●DVD-S35EE
DVD-S35GN
DVD-S35PL
DVD-S35PLA
DVD-S35PX
❍DVD-S35GCS
DVD-S35GCU
DVD-S35GC
DVD-S35GCA
DVD-S35GD
DL1S Mechanism Series
Colour
(S).......................Silver Type
(K).......................Black Type (S35EE Only)
Specifications
Power supply: AC120 V, 60 Hz
(DVD-S35PLA only)
AC220-240V, 50Hz
(DVD-S35EE/GN only)
AC110-240V, 50/60Hz
(except DVD-S35PLA/EE/GN)
Power consumption: 14 W
Dimensions: 430 (W)×267 (D)×60 (H) mm
[1615/ 16”(W) x 108/ 16”(D) x 27/ 16” (H)]
(excludingprotrusions)
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Mass: 2.1 kg (4.7 lb.)
Signal system: NTSC
(DVD-S35PX only)
PAL625/50, PAL525/60, NTSC
(except DVD-S35PX)
Operating temperature range: +5 to+35°C (+41 to 95°F)
Operating humidity range: 5 to 90% RH (no condensation)
Region number: Region No.1
(DVD-S35PX only)
Region No.2
(DVD-S35GC/GCA)
Region No.3
(DVD-S35GCS/GCU/GD)
Region No.4
(DVD-S35GN/PL/PLA)
Region No.5
(DVD-S35EE only)
Discs played [8 cm (3”) or 12 cm (5”)]:
(1) DVD-RAM (DVD-VR compatible)
(2) DVD-Audio (except DVD-S35PX)
(3) DVD-Video
(4) DVD-R (DVD-Video compatible)
(5) CD-Audio (CD-DA)
(6) Video CD
(7) SVCD (Conforming to IEC62107)
(8) CD-R/CD-RW (CD-DA, Video CD formatted discs)
(9) WMA/MP3
•Maximum number of tracks and groups recognizable:
999 tracks and 99 groups
•Compatible compression rate:
WMA: between 48 kbps and 192 kbps
MP3: between 32 kbps and 320 kbps
(10) JPEG
•Exif Ver 2.1 JPEG Baseline files
•Maximum number of pictures and groups recognizable:
3000 pictures and 300 groups
•Picture resolution:
between 320× 240 and 6144× 4096 pixels (sub sampling is 4:2:2 or 4:2:0)
Video output:
Output level: 1 Vp-p (75Ω)
Output terminal: Pin jack
Number of terminal: 1 system
S video output:
Y output level: 1 Vp-p (75Ω)
C output level: NTSC; 0.286 Vp-p (75Ω)
PAL; 0.300Vp-p (75Ω)
(except DVD-S35PX)
Output terminal: S terminal
Number of terminal: 1 system
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Component video output (480P/480I)
(DVD-S35PXonly)
(NTSC:480p/480I,PAL:576I)
(exceptDVD-S35PX)
Y output level: 1 Vp-p (75Ω)
PB output lebel: 0.7 Vp-p (75Ω)
PR output level 0.7 Vp-p (75Ω)
Output terminal: Pin jack
(Y:green, PB :blue, PR :red)
Number of terminal: 1 system
Audio output:
Output level: 2 Vrms (1 kHz, 0 dB)
Output terminal: Pin jack
Number of terminal
2 channel: 1 system
Audio performance:
(1) Frequency response:
•DVD (linear audio): 4 Hz-22 kHz (48 kHz sampling)
4 Hz-44 kHz (96 kHz sampling)
•DVD-Audio:
(exept DVD-S35PX) 4 Hz-88 kHz (192 kHz sampling)
•CD audio: 4 Hz-20 kHz
(2) S/N ratio:
•CD audio: 115 dB
(3) Dynamic range:
•DVD (linear audio): 100 dB
•CD audio: 98 dB
(4) Total harmonic distortion:
•CD audio: 0.0025%
Digital audio output:
Optical digital output: Optical terminal
Pickup
Wave length: 658 nm/790 nm
Laser power: CLASS Ua/ CLASS I
(DVD-S35PX only)
CLASS 2/ CLASS 1
(except DVD-S35PX)
Power consumption in standby mode:
approx. 2W
Solder:
This model uses lead free solder (PbF).
Note:
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Specifications are subject to change without notice.
Mass and dimensions are approximate.
© 2003 China Hualu Matsushita AVC CO., Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law.
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1 SAFETY PRECAUTIONS
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1.1 GENERAL GUIDELINES
1.1.1 LEAKAGE CURRENT COLD CHECK
1.1.2 LEAKAGE CURRENT HOT CHECK (See Figure 1 .)
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1.1 GENERAL GUIDELINES
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1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which
have been overheated or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation
papers shields are properly installed.
3. After servicing, make the following leakage current checks to prevent the customer from being
exposed to shock hazards.
1.1.1 LEAKAGE CURRENT COLD CHECK
1.1.2 LEAKAGE CURRENT HOT CHECK (See Figure 1 .)
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1.1.1 LEAKAGE CURRENT COLD CHECK
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1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each
exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts,
etc. When the exposed metallic part has a return path to thechassis,the reading should be between
1MΩand 5.2MΩ.
When the exposed metal does not have a return path to the chassis, the reading must be
.
Figure 1
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1.1.2 LEAKAGE CURRENT HOT CHECK (See
Figure 1 .)
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1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15μF capacitors, between each exposed
metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1 .
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across
the resistor.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson
Model 229 or equivalent) may be used to make the hot checks, leakage current mu3st not exceed
1/2 milliamp. In case a measurement is outsideofthe limits specified, there is a possibility of a
shock hazard, and the equipment should be repaired and rechecked before it is returned to the
customer.
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2 PREVENTION OF ELECTRO STATIC
DISCHARGE (ESD) TO ELECTROSTATICALLY
SENSITIVE (ES) DEVICES
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Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are
integrated circuits and some field-effect transistorsand semiconductor"chip" components. The following
techniques should be used to help reduce the incidence of component damage caused by electro static
discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped
assembly, drain off any ESD on your body by touching a known earth ground. Alternatively,
obtain and wear a commercially available dischargingESDwrist strap, which should be removed
for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a
conductive surface such as alminum foil, to prevent electrostatic charge buildup or exposure of
the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as
"anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage
ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you
are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted
together by conductive foam, alminum foil or comparableconductivematerial).
7. Immediately before removing the protective material from the leads of a replacement ES device,
touch the protective material to the chassis or circuit assembly into which the device will be
installed.
Caution
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Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise
hamless motion such as the brushing together of your clothes fabric or the lifting of your foot
from a carpeted floor can generate static electricity (ESD) sufficient todamagean ES device).
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3 Precaution of Laser Diode
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4 About lead free solder (PbF)
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Caution:
●Pb free solder has a higher melting point than standard solder; Typically thmelting point is 50 -
70°F (30 - 40°C) higher. Please use a high temperature soldering iron. In case of the soldering
iron with temperature control,pleaseset it to 700 ± 20°F (370 ± 10°C).
●Pb free solder will tend to splash when heated too high (about 1100°F/ 600°C).
When soldering or unsoldering, please completely remove all of the solder on the pins or solder area,
and be sure to heat the soldering points with the Pb free solder until it melts enough.
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5 General Description
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5.1 Operating instructions
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5.1 Operating instructions
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