Panasonic DVD-XV10E User manual

ORDERNO.ODSD020319C2
DVDPlayer
DVD-XV10E / DVD-XV10EB / DVD-XV10EG / DVD-XV10EE
Colour
(S).......................Silver Type
SPECIFICATIONS
Specifications
Power supply: AC220-240 V, 50 Hz
Power consumption: 14 W
Dimensions: 430 (W)×300 (D)×52 (H) mm
(excluding protrusions)
Mass: 2.9kg
Signal system: PAL625/50, PAL525/60,
NTSC
Operating temperature range: +5to+35°C
Operating humidityrange: 5 to90 %RH (no
condensation)
Region number: Region No.2
(DVD-XV10E, EB, EG)
Region No.5
(DVD-XV10EE only)
Discs played[8cm or12 cm]:
(1) DVD-Video
DVD-R (DVD-Videocompatible)
(2) CD-Audio(CD-DA)
(3)VideoCD
(4)CD-R/CD-RW(CD-DA, VideoCD formatteddiscs)
(5) MP3
Maximumnumber of tracks and groupsrecognizable:
999 tracks and 99 groups
Compatiblecompression rate:between32 kbpsand
320 kbps
Videooutput:
Output level: 1Vp-p(75 )
Output terminal: Pinjack (1system)/AV
S videooutput:
1

Y output level: 1Vp-p(75 )
C output level: NTSC; 0.286 Vp-p(75 )
PAL; 0.300 Vp-p(75 )
Output terminal: S terminal (1system)/AV
RGB videooutput:
R output level: 0.7Vp-p(75 )
G output level: 0.7Vp-p(75 )
B output level: 0.7Vp-p(75 )
Output terminal: AV (1system)
Audiooutput:
Output level: 2Vrms (1kHz, 0dB)
Output terminal: Pinjack/AV
Number of terminals:
2CH: 1system
Subwoofer output (0.1ch): 1system
Audioperformance:
(1)Frequencyresponse:
DVD (linear audio): 4Hz-22 kHz (48 kHz
sampling)
4Hz-44 kHz (96 kHz
sampling)
CD audio: 4Hz-20 kHz
(2)S/N ratio:
CD audio: 115 dB
(3)Dynamicrange:
DVD (linear audio): 102 dB
CD audio: 98 dB
(4)Total harmonicdistortion:
CD audio: 0.0025 %
Digital audiooutput:
Optical digital output: Optical terminal
Pickup:
Wavelength: 658 nm/790 nm
Laser power: CLASS 2/CLASS 1
Power consumption instandbymode:
approx. 3W
Note:
Specificationsare subject tochangewithout notice.
Mass and dimensionsare approximate.
2002 Matsushita ElectricIndustrial CO., Ltd. All rights reserved.
Unauthorized copying and distribution isaviolation of law.
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1. SAFETY PRECAUTIONS
1.1. GENERALGUIDELINES
1. When servicing, observe the original lead dress. Ifashort circuit
isfound, replace all parts which have been overheated or
damaged bythe short circuit.
2. After servicing, see to itthat all the protective devices such as
insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to
prevent the customer from being exposed to shock hazards.
1.1.1. LEAKAGE CURRENTCOLD CHECK
1. Unplug the AC cord and connect ajumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the
jumpered AC plug and each exposed metalliccabinet part on the
equipment such as screwheads, connectors, control shafts, etc.
When the exposed metallicpart has areturn path to thechassis,
the reading shouldbe between 1M and 5.2M . / When the
exposed metal does not have areturn path to the chassis, the
reading must be . Figure 1
1.1.2. LEAKAGE CURRENTHOTCHECK (See Figure 1 .)
1. Plug the AC cord directlyinto the AC outlet. Donot use an
isolation transformer for thischeck.
2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F
capacitors, between each exposed metallicpart on the set and a
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good earth ground such as awater pipe, as shownin Figure 1 .
3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to
measure the potential across the resistor.
4. Check each exposed metallicpart, and measure the voltage at
each point.
5. Reverse the AC plug inthe AC outlet and repeat each of the above
measurements.
6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A
leakage current tester (Simpson Model 229 or equivalent) maybe
used to make the hot checks, leakage current mu3st not exceed 1/
2milliamp. Incase ameasurement isoutsideof the limits
specified, there isapossibilityof ashock hazard, and the
equipment shouldbe repaired and rechecked before itisreturned
to the customer.
2. PREVENTION OF ELECTRO STATIC DISCHARGE
(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)
DEVICES
Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such
components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical
ES devices are integratedcircuits and some field-effect transistorsand semiconductor"chip"
components. The following techniques shouldbe usedtohelpreduce the incidence of
component damage causedbyelectrostatic discharge (ESD).
1. Immediatelybefore handling anysemiconductor component or
semiconductor-equipped assembly, drainoff anyESDon your
bodybytouching aknownearth ground. Alternatively, obtainand
wear acommerciallyavailabledischargingESDwrist strap, which
shouldbe removed for potential shock reasons prior to applying
power to the unitunder test.
2. After removing an electrical assemblyequipped with ES devices,
place the assemblyon aconductive surface such as alminum foil,
to prevent electrostaticcharge buildup or exposure of the
assembly.
3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES
devices.
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4. Use onlyan anti-staticsolder removal device. Some solder
removal devices not classified as "anti-static(ESDprotected)"
can generate electrical charge sufficient to damage ES devices.
5. Donot use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Donot remove areplacement ES device from its protective
package until immediatelybefore you are readyto install it. (Most
replacement ES devices are packaged with leads electrically
shorted together byconductive foam, alminum foil or
comparableconductive material).
7. Immediatelybefore removing the protective material from the
leads of areplacement ES device, touch the protective material to
the chassisor circuitassemblyinto which the device will be
installed.
Caution
Besure no power isapplied to the chassisor circuit, and observe
all other safetyprecautions.
8. Minimize bodilymotions when handling unpackaged replacement
ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabricor the lifting of your foot from a
carpeted floor can generate staticelectricity(ESD)sufficient
todamage an ES device).
3. Precaution of Laser Diode
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4. General Description
4.1. Operating instructions
5. Disassembling the Casing and Checking P.C.B.s
5.1. DissasemblyProcedure
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5.2. Caseing Parts and P.C.B. Positions
5.3. Top Cover
1. Unscrew the screws.
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5.4. Tray
1. Insert the screwdriver into the trayopen/close hole.
2. Move screwdriver from the left to the right to open the tray.
3. Remove the traydressing from the traysection.
5.5. Front Panel
1. Remove the connectors
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1. Unscrew the screws.
2. Release the tabs.
5.6. Mechanism Unit
1. Unscrew the screws.
2. Remove the connectors.
3. Pull out the mechanism unitvertically.
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5.7. Terminal P.C.B.
1. Unscrew the screws.
2. Remove the connectors.
5.8. ModuleP.C.B.
1. Unscrew the screws.
2. Remove the connectors.
3. Press each tab with the nipper to pull out the modulePCB
vertically.
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