Panasonic DMR-EH50EB User manual

ORDERNO.DSD0503040C2
DVDVideo Recorder
DMR-EH50EB / DMR-EH50EG / DMR-EH50EP / DMR-EH52EG
Vol.1
Colour
(K).......................Black Type
(S).......................Silver Type
SPECIFICATIONS
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2005 Matsushita ElectricIndustrial CO., Ltd. All rights reserved.
Unauthorized copying and distribution isaviolation of law.
1. Safety precautions
1.1. General guidelines
1. When servicing, observe the original lead dress. Ifashort circuit
isfound, replace all parts which have been overheated or
damaged bythe short circuit.
2. After servicing, see to itthat all the protective devices such as
insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to
prevent the customer from being exposed to shock hazards.
1.1.1. Leakage current coldcheck
1. Unplug the AC cord and connect ajumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the
jumpered AC plug and each exposed metalliccabinet part on the
equipment such as screwheads, connectors, control shafts, etc.
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When the exposed metallicpart has areturn path to the chassis,
the reading shouldbe between 1M and 5.2M . / When the
exposed metal does not have areturn path to the chassis, the
reading must be . Figure 1
1.1.2. Leakage current hot check / (See Figure 1 .)
1. Plug the AC cord directlyinto the AC outlet. Donot use an
isolation transformer for thischeck.
2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F
capacitors, between each exposed metallicpart on the set and a
good earth ground such as awater pipe, as shownin Figure 1.
3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to
measure the potential across the resistor.
4. Check each exposed metallicpart, and measure the voltage at
each point.
5. Reverse the AC plug inthe AC outlet and repeat each of the above
measurements.
6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A
leakage current tester (Simpson Model 229 or equivalent) maybe
used to make the hot checks, leakage current must not exceed 1/2
milliampere. Incase ameasurement isoutside of the limits
specified, there isapossibilityof ashock hazard, and the
equipment shouldbe repaired and rechecked before itisreturned
to the customer.
2. Prevention of Electrostatic Discharge (ESD) to
Electrostatic Sensitive (ES) Devices
Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such
components commonlyare calledElectrostatic Sensitive (ES) Devices. Examples of typical ES
devices are integratedcircuits and some field-effect transistor-sand semiconductor"chip"
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components. The following techniques shouldbe usedtohelpreduce the incidence of
component damage causedbyelectrostatic discharge (ESD).
1. Immediatelybefore handling anysemiconductor component or
semiconductor-equipped assembly, drainoff anyESDon your
bodybytouching aknownearth ground. Alternatively, obtainand
wear acommerciallyavailabledischarging ESDwrist strap, which
shouldbe removed for potential shock reasons prior to applying
power to the unitunder test.
2. After removing an electrical assemblyequipped with ES devices,
place the assemblyon aconductive surface such as aluminum
foil, to prevent electrostaticcharge buildup or exposure of the
assembly.
3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES
devices.
4. Use onlyan anti-staticsolder removal device. Some solder
removal devices not classified as "anti-static(ESDprotected)"
can generate electrical charge sufficient to damage ES devices.
5. Donot use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Donot remove areplacement ES device from its protective
package until immediatelybefore you are readyto install it. (Most
replacement ES devices are packaged with leads electrically
shorted together byconductive foam, aluminum foil or
comparableconductive material).
7. Immediatelybefore removing the protective material from the
leads of areplacement ES device, touch the protective material to
the chassisor circuitassemblyinto which the device will be
installed.
Caution
Besure no power isapplied to the chassisor circuit, and observe
all other safetyprecautions.
8. Minimize bodilymotions when handling unpackaged replacement
ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabricor the lifting of your foot from a
carpeted floor can generate staticelectricitysufficient to damage
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an ES device).
3. Precaution of Laser Diode
4. Handling the Lead-free Solder
4.1. About lead free solder (PbF)
Distinction of PbF P.C.B.:
P.C.B.s (manufactured) using leadfree solderwill have a PbF stampon the P.C.B.
Caution:
-Pb free solder has ahigher melting point than standard solder;
Typicallythe melting point is50 -70°F (30 -40°C)higher. Please
use ahigh temperature soldering iron. Incase of the soldering
iron with temperature control, please set itto 700 ± 20°F (370 ±
10°C).
-Pb free solder will tend to splash when heated too high (about
1100°F/600°C).
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-When soldering or unsoldering, please completelyremove all of
the solder on the pins or solder area, and be sure to heat the
soldering points with the Pb free solder until itmelts enough.
5. Each Button
6. New Feature
6.1. Quick start function(REC)
1. General
Afew seconds after tuning on the unit,you can start recording
to DVD-RAM,HDD.
You can switch the operation of thisfunction (ON/OFF) on the
menu screen. .
2. Quick start(REC)principle
Inthe power-off at Quick start, onlypower supplies for video
IC,tuner and storage mediaare cut off.
When the RECbutton ispushed afew second after the
power button ispushed, Audioand Video data are stored in
DDR SDRAMbefore astorage media(DVD-RAMor HDD)
preparation.
*Preparation time DVD-RAM: Fabout 8seconds
HDD:about 18seconds
After astorage media(DVD-RAMor HDD)
preparation,Audioand Video data are transfer from DDR SDRAM
to the storage media.
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7. Taking out the Disc from RAM-Drive Unit when the
Disc cannot be ejected by OPEN/CLOSE button
7.1. ForcibleDisc Eject
7.1.1. When the powercan be turned off.
1. Turn off the power and press [STOP] [CH UP] keyson the front
panel simultaneouslyfor 5seconds.
7.1.2. When the powercan not be turned off.
1. Press [POWER]keyon the front panel for over 10 seconds to turn
off the power forcibly, and press [STOP] [CH UP] keyson the front
panel simultaneouslyfor 5seconds.
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7.2. When the ForcibleDisc Eject can not be done.
1. Turn off the power and pull out AC cord.
2. Remove the Top Case.
3. Remove the Front Panel.
4. Remove 4screwsand Upper Base Unitfrom DVD-RAMDrive.
5. Take out the disc and put the Opener Roller on fullyposition for
direction of Arrow.
6. Put the Upper Base Unitso that the Opener Roller isinserted into
the groove.
7. Check Opener Roller isseen through the Opener position
Checking Hole, and tighten 4screws.
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