Panasonic DMR-E60PP User manual

ORDERNO.DSD0304007C1
B24
DVDVideo Recorder
DMR-E60PP
Colour
(S).......................Silver Type
SPECIFICATIONS
Specifications
Power supply: AC120 V, 60 Hz
Power consumption: 28 W
Recording system: DVD videorecording
standards(DVD-RAM),
DVD videostandards(DVD-
R)
Optical pick-up: System with1lens, 2
integration units(662 nm
wavelengthforDVDs, 790
nmwavelengthforCDs)
Recordablediscs: 12 cm 4.7GB DVD-RAM
discs
12 cm 9.4GB DVD-RAM
discs
8cm 2.8GB DVD-RAM discs
12 cm 4.7GB DVD-R discs
8cm 1.4GB DVD-R discs
(forGeneral Ver. 2.0)
Recording time: Max. 6hours
(using 4.7GB disc)
XP: 60 minutes
SP: 120 minutes
LP: 240 minutes
EP: 360 minutes
Region number: Region No.1
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Discs played: 12 cm 4.7GB DVD-RAM
discs
12 cm 9.4GB DVD-RAM
discs
8cm 2.8GB DVD-RAM discs
12 cm 4.7GB DVD-R discs
8cm 1.4GB DVD-R discs
(forGeneral Ver. 2.0)
DVD-VIDEO discs
CD-Audiodiscs (CD-DA)
VideoCD discs DVD Audio
CD-R/ CD-RWdiscs
(CD-DA, VideoCD, MP3
formatteddiscs)
PC CardSlot: PC CardTypell
CompatibleMedia: APC Cardadaptor
conforming toPC Card
Standards
ATAFlashPC Card, PC
CardAdaptor
(SD memoryCard,
MultiMediaCard, Compact
Flash, Smart Media, Memory
Stick, Dpicture card,
Microdrive)
Format: FAT12, FAT16,
ImageFormat: JPEG DCF(Design rulefor
camera fileSystem) (sub
sampling 4:2:2, 4:2:0)
TIFF (UncompressedRGB
chunky)
DPOFCompatibleNumber
of Pixels320×240-6144×4096
Thawing Time: Approx. 7sec (2Mpixels
JPEG)
Videosystem
TV system: NTSC system, 525 lines, 60
fields
Recording system: MPEG2(HybridVBR)
Input: LINE (pinjack) ×3, 1.0Vp-p;
75
S connector×3
Y: 1.0Vp-p; 75
C: 0.286 Vp-p; 75
Output: LINE (pinjack) ×2, 1.0Vp-p;
75
S connector×2
Y: 1.0Vp-p; 75
C: 0.286 Vp-p; 75
Component videooutput (480p/
480i): Y: 1.0Vp-p; 75
PB: 0.7Vp-p; 75
PR: 0.7Vp-p; 75
D-connectoroutput: Not provided
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Antennareception input: TV Channel: 2ch-69ch, 75
CATV Channel: 1ch-125ch,
75
RFconverter output: Not provided
Audiosystem
Recording system: DolbyDigital (XP/SP/LP/EP)
LINEAR PCM (XP modeonly)
Input: LINE (pinjack) ×3
Reference input: 309 mVrms
FS: 2Vrms (1kHz, 0dB)
Input impedance: 47 k
Output: LINE (pinjack) ×2
Reference output: 309
mVrms
FS: 2Vrms (1kHz, 0dB)
Output impedance: 1k
(Loadimpedance: 10 k )
Number of channels: Recording: 2channels
Playback: 2channels
Other input/output connectors: Digital audiooptical output
connector(PCM, Dolby
Digital, DTS)
Dimensions: Approx.
430 (W)×79 (H)×283 (D) mm
[Approx. 1615 /16 ” (W)×31/8
” (H)×113/16 ” (D)]
(excludingprotrusions)
Mass: Approx. 3.9kg(8.58 lbs)
Operating temperature range: 5 °C-40°C (41 °F-104 °F)
Operating humidityrange: 10 %-80 %RH (no
condensation)
Clock unit: Quartz-controlled12-hour
digital display
LASER Specification
Class LASER Product
Wavelength: 775-815 nm655-666 nm
Laser power: Nohazardousradiation is
emittedwiththesafety
protection.
Power consumption instandbymode:
approx. 3.2W
DV Input: IEEE 1394 Standard, 4pin
Solder:
Thismodel uses leadfree solder (PbF).
Notes:
Mass and dimensionsare approximate.
Specificationsare subject tochangewithout notice.
Notes:
Thepart of DVD RAM Drive(VXY1772) islistedseparately.
Please refer toORDER NO. RAM0301002C0.
3

2003 Matsushita ElectricIndustrial CO., Ltd. All rights reserved.
Unauthorized copying and distribution isaviolation of law.
1. SAFETY PRECAUTIONS
1.1. GENERALGUIDELINES
1. When servicing, observe the original lead dress. Ifashort circuit
isfound, replace all parts which have been overheated or
damaged bythe short circuit.
2. After servicing, see to itthat all the protective devices such as
insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to
prevent the customer from being exposed to shock hazards.
1.1.1. LEAKAGE CURRENTCOLD CHECK
1. Unplug the AC cord and connect ajumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the
jumpered AC plug and each exposed metalliccabinet part on the
equipment such as screwheads, connectors, control shafts, etc.
When the exposed metallicpart has areturn path to thechassis,
the reading shouldbe between 1M and 5.2M . / When the
exposed metal does not have areturn path to the chassis, the
reading must be . Figure 1
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1.1.2. LEAKAGE CURRENTHOTCHECK (See Figure 1 .)
1. Plug the AC cord directlyinto the AC outlet. Donot use an
isolation transformer for thischeck.
2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F
capacitors, between each exposed metallicpart on the set and a
good earth ground such as awater pipe, as shownin Figure 1 .
3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to
measure the potential across the resistor.
4. Check each exposed metallicpart, and measure the voltage at
each point.
5. Reverse the AC plug inthe AC outlet and repeat each of the above
measurements.
6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A
leakage current tester (Simpson Model 229 or equivalent) maybe
used to make the hot checks, leakage current mu3st not exceed 1/
2milliamp. Incase ameasurement isoutsideof the limits
specified, there isapossibilityof ashock hazard, and the
equipment shouldbe repaired and rechecked before itisreturned
to the customer.
2. PREVENTION OF ELECTRO STATIC DISCHARGE
(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)
DEVICES
Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such
components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical
ES devices are integratedcircuits and some field-effect transistorsand semiconductor"chip"
components. The following techniques shouldbe usedtohelpreduce the incidence of
component damage causedbyelectrostatic discharge (ESD).
1. Immediatelybefore handling anysemiconductor component or
semiconductor-equipped assembly, drainoff anyESDon your
bodybytouching aknownearth ground. Alternatively, obtainand
wear acommerciallyavailabledischarging ESDwrist strap,
whichshouldbe removed for potential shock reasons prior to
applying power to the unitunder test.
2. After removing an electrical assemblyequipped with ES devices,
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place the assemblyon aconductive surface such as alminum foil,
to prevent electrostaticcharge buildup or exposure of the
assembly.
3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES
devices.
4. Use onlyan anti-staticsolder removal device. Some solder
removal devices not classified as "anti-static(ESDprotected)"
can generate electrical charge sufficient to damage ES devices.
5. Donot use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Donot remove areplacement ES device from its protective
package until immediatelybefore you are readyto install it. (Most
replacement ES devices are packaged with leads electrically
shorted together byconductive foam, alminum foil or
comparableconductive material).
7. Immediatelybefore removing the protective material from the
leads of areplacement ES device, touch the protective material to
the chassisor circuitassemblyinto which the device will be
installed.
Caution
Besure no power isapplied to the chassisor circuit, and observe
all other safetyprecautions.
8. Minimize bodilymotions when handling unpackaged replacement
ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabricor the lifting of your foot from a
carpeted floor can generate staticelectricity(ESD)sufficient
todamage an ES device).
3. Precaution of Laser Diode
6

4. How to replace the Lithium Battery
REPLACEMENTPROCEDURE
1. Remove the Top cover and DVD-RAMdrive unitwith MainP.C.B.
byreferring the Disassembling Procedure.
2. Unsolder the Lithium Batteries: B7501 and then replace itinto
new one.
(Asshownin15.2.1. The MainP.C.B. )
NOTE:
The lithiumbatteryis a critical component. ( Type No.: CR2032-1GUFManufacturedby
Panasonic. )
It must neverbe subjectedtoexcessive heat ordischarge.
It must therefore onlybe fittedinequipment designedspecificallyforits use.
Replacement batteries must be of the same type and manufacture.
Theymust be fittedinthe same mannerand location as the original battery, withthe correct
polaritycontacts observed.
Donot attempt tore-charge the oldbatteryorre-use it foranyotherpurpose.
It shouldbe disposedof inwaste products destinedforburial ratherthanincineration.
7

5. Handling the Lead-free Solder
5.1. About lead free solder (PbF)
Caution:
-Pb free solder has ahigher melting point than standard solder;
Typicallythe melting point is50 -70°F (30 -40°C)higher. Please
use ahigh temperature soldering iron. Incase of the soldering
iron with temperature control,please set itto 700 ± 20°F (370 ±
10°C).
-Pb free solder will tend to splash when heated too high (about
1100°F/600°C).
-When soldering or unsoldering, please completelyremove all of
the solder on the pins or solder area, and be sure to heat the
soldering points with the Pb free solder until itmelts enough.
6. Service Explorer
The Service Explorerprovides information about all possible causes basedon the symptoms
and gives stepbystepinstructions making parts. It consists of twoparts, basedon applications:
the first is the “Service ExplorerExpress” andthe second is “Service ExplorerinDetail”.
1. For detailsabout the service / test modesetting mentioned inthe
description, refer to the “List of various modes”.
-Service mode setting: Whilethe power isoff, press TIME
SLIP, STOP, and OPEN/ CLOSE simultaneouslyfor five
seconds.
-Process mode 1setting: Whilethe power isoff, press
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SKIP(R), TIME SLIP, and OPEN/ CLOSE simultaneouslyfor
five seconds.
2. For disassemblyand replacement procedures, refer to the
“Assembling and Disassemling”.
6.1. Service Explorer Express
The following steps allowyou tocheck eachblock separately(Digital P.C.B., RAM drive, Main/
PowerSupply/ Front P.C.B.).
Items needed: RAM drive, Digital P.C.B., Digital extension cable, Remote control.
Conditions: Nothing special.
9

6.2. Service Explorer inDetail
6.2.1. Does not operate
items needed: RAM drive, digital P.C.B., remote control.
Conditions: Nothing special.
10

6.2.2. PoorPictures
Items needed: RAM drive, Digital P.C.B., RFcable, AV cable.
Conditions: Check withTU IN-AV OUT(EE). Whenrecording orplayback is partiallyneeded,
followthe instructions.
11

6.2.3. Somedefective functions
Items needed: PC cardadaptor(media), Digital P.C.B.
conditions: Nothing special
12

6.2.4. Other
Items needed: Digital P.C.B., HDD.
Conditions: Nothing special.
13

7. Standard Inspection Specifications after Making
Repairs
Aftermaking repairs, we recommend performing the following inspection, tocheck normal
operation.
No. Procedure ItemtoCheck
1Turnon the power. The Panasonic RAM disc shouldbe
recognized.
2Enterthe EE (TU IN / AV IN - AV OUT) mode. Noabnormalityshouldbe seeninthe
picture,
sound oroperation.
3Perform autorecording and playback forone
minute using the RAM disc. Noabnormalityshouldbe seeninthe
picture,
sound oroperation.
4If a problemis causedbya VCD, DVD-R, DVD-
Video, Audio-CD, orMP3, playback the test disc. Noabnormalityshouldbe seeninthe
picture,
sound oroperation.
5Incase of that the trouble is causedbySD/PC
cardand/orDV terminal. 1) SD/PC card: Check tobe able to
display
copythe picture.
2) DV terminal: Check tobe able to
record
DVC.
6 Afterchecking and making repairs, upgrade the
firmware tothe latest version. Make sure that [FIRM_SUCCESS]
appears
FL displays.
7Transfer[9][9] inthe service mode setting, and
initialize the service settings (returnvarious
settings and errorinformation totheirdefault
values. The lasertime is not includedinthis
initialization).
Make sure that [FACTINIT] appears in
the
display.
Afterchecking it, turnthe poweroff.
8To replace the RAM drive, reset all the
information (including the lasertime) inthe
process mode 1 setting.
*The lasertime is the total time that DVDs orCDs
have beenplayedorrecorded.It is recordedon
the Digital P.C.B..
Make sure that [TESTL1] appears inthe
FL
display.
Afterchecking it, turnthe poweroff.
Use the following checklist toestablishthe judgement criteria forthe picture and sound.
Item Contents Item Contents Check
Picture Sound
Block noise Distortedsound
Crosscut noise noise (static, background noise,
etc.)
Dot noise The sound level is too low.
Picture disruption The sound level is too high.
Not bright enough The sound level changes.
Too bright
Flickering color
Colorfading
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8. Assembling and Disassembling
8.1. Disassemblyflow chart
The following chart is the procedure fordisassembling the casing and inside parts forinternal
inspection whencarrying out the servicing.
To assemble the unit, reverse the steps showninthe chart below.
8.2. P.C.B. Positions
8.3. The Top Cover
1. Remove the 2screws(A)and 3screws(B).
2. Open the both ends at the front side of the Top cover abitand lift
the Top cover inthe direction of the arrows.
15

8.4. The Front panel
1. Remove the 2tab (A)and 3tab (B)inthisorder. (The tab (A)and
the tab (B)shouldbe removed at the same time, respectively.)
2. Move the front panel to your side slowlyand remove it.
8.5. The Front (R)P.C.B.
16

1. Remove the 2screwsand remove the Front Anglewith Earth Plate.
2. Remove the 4screwsand remove the Front (R)P.C.B.
8.6. The Front (L) and DVJack P.C.B.
1. Remove 1screw inside of the Front panel door with aprecision
screw driver.
2. Remove the 2screwsand remove the Front anglewith Earth Plate.
3. Remove the 2screwswith Earth plate and remove the Front (L)
and DVJack P.C.B.
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8.7. The SD&PCcard P.C.B.
1. Remove the 4screws.
2. Pull out the SD&PCcard P.C.B. vertically.
8.8. The Digital P.C.B.
1. Remove the 4screwsand 3tabs and remove the angle.
2. Remove the FFC.
CAUTION:
When replacing Digital P.C.B., payattention as below.
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3. Pull out the Digital P.C.B. verticallywith paying attention to 3
Connectors.
8.9. The DVD-RAMDrive
1. Remove the 4screws.
2. Pull out the DVD-RAMDrive verticallyand remove the connector.
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8.10. The Rear panel
1. Remove the Fan Motor connector.
2. Remove the 5screws(A)and 1screw (B).
3. Remove the 2tabs and remove the Rear panel.
8.10.1. Incase of removing Fan motorfrom Rearpanel
1. Remove ascrew.
2. Push tipof rivet to remove it.
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