Panasonic SC-HT870 User manual

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Service Manual
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ORDER NO.MD0403138C2
DVD Home Theater Sound System
●SA-HT870E
SA-HT870EB
SA-HT870EG
Colour
(S).......................Silver Type
Specifications
• General
Power Source:
For (E, EG) areas: AC 230 V, 50 Hz
For (EB) area: AC 230-240 V, 50 Hz
Power consumption: 25 W
Dimensions (W× H× D): 430× 68× 359.2 mm
Mass: 3.2 kg
• Amplifier section
RMS Output Power: Dolby Digital Mode
• Total RMS Dolby Digital
mode Power:
1000 W
At 1kHz and total harmonic of 10%
• Front: 170 W/ Channel (6Ω)
• Center: 260 W/ Channel (4Ω)
• Surround: 70 W/ Channel (4Ω)
At 100Hz and total harmonic of 10%
• Active subwoofers: 260 W/ Channel (4Ω)
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DIN Output Power: Dolby Digital Mode:
• Total DIN Dolby Digital mode Power:
750 W
At 1kHz and total harmonic of 1%
• Front: 140 W/ Channel (6Ω)
• Center: 180 W/ Channel (4Ω)
• Surround: 55 W/ Channel (4Ω)
At 100Hz and total harmonic of 1%
• Subwoofer: 180 W/ Channel (4Ω)
• FM tuner section
Frequency Range: 87.5-108.0MHz
(50kHz in step)
Sensitivity: 2μV (IHF)
S/ N 26dB 2μV
Antenna Terminal: 75Ω(non balance)
• AM tuner section (AM/ MW)
Frequency Range: 522-1629kHz (9kHz in step)
520-1630kHz (10kHz in step)
AM Sensitivity S/ N 20dB at 999kHz:
560μV/ m
Phone Jack:
Terminal: Stereo 3.5mm jack
• Disc section
Discs played [8 cm or 12 cm]:
(1) DVD-RAM (DVD-VR compatible, JPEG formatted discs)
(2) DVD-Audio
(3) DVD-Video
(4) DVD-R (DVD-Video compatible)
(5) CD-Audio (CD-DA)
(6) Video CD
(7) SVCD (Conforming to IEC62107)
(8) CD-R/ CD-RW (CD-DA, Video-CD, SVCD, MP3, WMA, JPEG formatted discs)
(9) MP3/ WMA
• Maximum number of recognizable audio and picture contents and groups:
4000 audio and picture contents and 400 groups
• Compatible compression rate:
MP3: between 32 kbps and 320 kbps
WMA: between 48 kbps and 320 kbps
(10) JPEG
• Exif Ver 2.1 JPEG Baseline files
• Picture resolution: between 320 x 240 and 6144 x 4096 pixels (sub sampling is 4:2:2 or 4:2:0)
(11) HighMAT Level 2 (Audio and lmage)
Pick up:
Source of light beam: Semiconductor Laser
Wavelength:
• CD: 785nm
• DVD: 662nm
Audio output (DISC):
Number of channels: 5.1 ch (FL, FR, C, SL, SR, SW)
Audio performance (measured at LINE OUT terminal):
Frequency response:
DVD (linear audio): 4 Hz-22 kHz (48 kHz sampling)
4 Hz-44 kHz (96 kHz sampling)
DVD-Audio: 4 Hz-88 kHz (192 kHz sampling)
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CD-Audio: 4 Hz-20 kHz
S/ N ratio:
CD-Audio: 95 dB
Dynamic range:
DVD (linear audio): 95 dB
CD-Audio: 93 dB
Total harmonic distortion:
CD-Audio: 0.005%
• Video section
Video system:
Signal system: PAL 625/ 50, PAL 525/ 60, NTSC
Composite video output:
Output level: 1 Vp-p (75Ω)
Terminal: Pin jack (1 system)
S-video output:
Y output level: 1 Vp-p (75Ω)
C output level: PAL; 0.3Vp-p (75Ω)
NTSC; 0.286 Vp-p (75Ω)
Terminal S terminal (1 system)
Component video output (480P/ 480I):
Y output level: 1 Vp-p (75Ω)
P B output level: 0.7 Vp-p (75Ω)
P R output level: 0.7 Vp-p (75Ω)
Terminal: Pin jack (Y: green, P B : blue, P R : red) (1 system)
Power consumption in standby mode:
approx 0.7W
Note:
1. Specifications are subject to change without notice.
Mass and dimensions are approximate.
2. Total harmonic distortion is measured by the digital spectrum analyzer.
Solder:
This model uses lead free solder (PbF).
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© 2004 Panasonic AVC Networks Singapore Pte. Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law.
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1 Use of Active Subwoofer
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1.1 Checking Player when Active Subwoofer is not used
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1.1 Checking Player when Active Subwoofer is not used
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1. This unit uses the active subwoofer to supply the power of the component, and the active subwoofer should be connected to the component to check operational conditions of the
component.
2. If the active subwoofer is not available due to repair of the unit, use the following equipment.
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Jig product number: RFKZ0182 (110V, 127V, 220V, 230V-240V for overseas domestic use)
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2 Safety Precautions
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2.1 GENERAL GUIDELINES
2.1.1 LEAKAGE CURRENT COLD CHECK
2.1.2 LEAKAGE CURRENT HOT CHECK (See Figure 1 .)
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2.1 GENERAL GUIDELINES
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1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which
have been overheated or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation
papers shields are properly installed.
3. After servicing, make the following leakage current checks to prevent the customer from being
exposed to shock hazards.
2.1.1 LEAKAGE CURRENT COLD CHECK
2.1.2 LEAKAGE CURRENT HOT CHECK (See Figure 1 .)
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2.1.1 LEAKAGE CURRENT COLD CHECK
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1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each
exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts,
etc. When the exposed metallic part has a return path to thechassis,the reading should be between
1MΩand 5.2MΩ.
When the exposed metal does not have a return path to the chassis, the reading must be
.
Figure 1
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2.1.2 LEAKAGE CURRENT HOT CHECK (See
Figure 1 .)
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1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15μF capacitors, between each exposed
metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1 .
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across
the resistor.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson
Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed
1/2 milliamp. In case a measurement is outsideofthe limits specified, there is a possibility of a
shock hazard, and the equipment should be repaired and rechecked before it is returned to the
customer.
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3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
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Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are
integrated circuits and some field-effect transistorsand semiconductor"chip" components. The following
techniques should be used to help reduce the incidence of component damage caused by electro static
discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped
assembly, drain off any ESD on your body by touching a known earth ground. Alternatively,
obtain and wear a commercially available dischargingESDwrist strap, which should be removed
for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a
conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of
the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as
"anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage
ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you
are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted
together by conductive foam, aluminum foil or comparableconductivematerial).
7. Immediately before removing the protective material from the leads of a replacement ES device,
touch the protective material to the chassis or circuit assembly into which the device will be
installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
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8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise
harmless motion such as the brushing together of your clothes fabric or the lifting of your foot
from a carpeted floor can generate static electricity (ESD)sufficientto damage an ES device).
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4 Before Repair and Adjustment (Using Active
Subwoofer)
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Disconnect AC power, discharge Power Supply Capacitors C546~C549 through a 10 Ω, 10 W resistor to
ground.
DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy
solid state devices.
After repairs are completed, restore power gradually using a variac, to avoid overcurrent.
Current consumption at AC 230-240 V, 50 Hz in NO SIGNAL mode should be ~ 1000 mA.
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5 Protection Circuitry
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The protection circuitry may have operated if either of the following conditions are noticed:
●No sound is heard when the power is turned on.
●Sound stops during a performance.
The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative
speaker connection wires are
“shorted”, or if speaker systems with an impedance less than the indicated rated impedance of the
amplifier are used.
If this occurs, follow the procedure outlines below:
1. Turn off the power.
2. Determine the cause of the problem and correct it.
3. Turn on the power once again after one minute.
Note:
When the protection circuitry functions, the unit will not operate unless the power is first turned off and
then on again.
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6 Precaution of Laser Diode
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7 About Lead Free Solder (PbF)
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Distinction of PbF PCB: PCBs (manufactured) using lead free solder will have a Pbf stamp on the PCB.
Caution:
●Pb free solder has a higher melting point than standard solder; Typically the melting point is 50 -
70°F (30 - 40°C) higher. Please use a high temperature soldering iron. In case of the soldering
iron with temperature control,pleaseset it to 700 ± 20°F (370 ± 10°C).
●Pb free solder will tend to splash when heated too high (about 1100°F/ 600°C).
When soldering or unsoldering, please completely remove all of the solder on the pins or solder area,
and be sure to heat the soldering points with the Pb free solder until it melts enough.
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8 General Description
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8.1 Operating instructions
8.2 Disc information
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8.1 Operating instructions
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