Panasonic TH-103PF9EK User manual

©2006 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-103PF9UK
TH-103PF9EK
GPF9D Chassis
High Definition Plasma Display
Specifications
Power Source (UK) 240 V
A
C, 50 / 60Hz
Power Source (EK) 220 V - 240 V
A
C, 50
/
60Hz
Power Consumption
Power on (UK) 1,550 W
Power on (EK) 1,500 W
Stand-b
y
condition Save OFF 1.5 W, Save ON 1.3 W
Power off condition 0.5 W
Plasma Displa
y
panel Drive method:
A
C type 103-inch, 16:9 aspect ratio
Screen size 89.5” (2,269 mm) (W) × 50.5” (1,277 mm) (H) × 103” (2,604 mm) (diagonal)
(No. of pixels) 2,073,600 (1,920 (W) × 1,080 (H)) [5,760 × 1,080 dots]
Operating condition
Temperature 32 °F - 104 °F (0 °C - 40 °C)
Humidit
y
20 % - 80 %
Applicabl
e
signals
Color System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 525 (480) / 60i 60p, 625 (575)
/
50i 50p, 750 (720)
/
60p 50p, 1125 (1080) / 60i 60p 50i 50p
24p 25p 30p 24sF .... SMPTE274M, 1250 (1080) / 50i
PC signals VGA, SVGA, XGA, SXGA,
UXGA ..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
Connection terminals
DVI-D Video Input DVI-D 24 Pin × 1
compliance with DVI Revision 1.0
A
udio Input Stereo mini
j
ack (M3) × 1
0.5Vrms
Content Protection Compatible with HDCP 1.1
COMPONENT / RGB
Y
/ G (BNC)
Y
or G with
/
syn
c
1.0 Vp-p (75-ohm)
ORDER NO. ITD0610074CE
B34 Canada:D10

1 Applicable signals 4
2 Safety Precautions 5
2.1. General Guidelines 5
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
4 About lead free solder (PbF) 7
5 Service Hint 8
6 Disassembly 10
6.1. Rear Cover and Board 10
6.2. Location of Rear Cover screws 11
6.3. Removal of Side Angle (L), (R) 14
6.4. Removal of HA-Board 15
6.5. Removal of HDD-Board 15
6.6. Removal of DS-Board 15
6.7. Removal of HX-Board 16
6.8. Removal of DN-Board 17
6.9. Removal of PB-Board 17
6.10. Removal of H5-Board 17
6.11. Removal of D-Board 18
6.12. Removal of P-Board (MULTI_1), (MULTI_2) 18
6.13. Removal of P-Board (SUS_1), (SUS_2) 19
6.14. Removal of F-Board 19
6.15. Removal of PC-Board 19
6.16. Removal of SU-Board 20
6.17. Removal of SM-Board 21
6.18. Removal of SD-Board 21
6.19. Removal of SC-Board 22
6.20. Removal of SC2-Board 22
PB
/
B (BNC), PR/ R (BNC) 0.7 Vp-p (75-ohm)
A
UDIO IN (RCA PIN JACK × 2) 0.5 Vrms
PC (HIGH-DENSIT
Y
Mini D-SUB 15PIN)
Y
or G with
/
syn
c
1.0 Vp-p (75-ohm)
Y
or G without
/
syn
c
0.7 Vp-p (75-ohm)
B
/
PB
/
CB:0.7 Vp-p (75-ohm)
R
/
PR
/
CR:0.7 Vp-p (75-ohm)
HD
/
VD:1.0 - 5.0 Vp-p (high impedance)
VBS (use HD port) with
/
picture 1.0 Vp-p (high impedance)
without
/
picture 0.3 Vp-p (high impedance)
A
UDIO IN (M3 JACK) 0.5 Vrms
SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE
A
UDIO OUT RCA PIN JACK × 2 (L / R)
OUTPUT LEVEL : VARIABLE (- - 0 dB)
[INPUT 1KHz / 0dB, 10Kohm Load]
Accessories Supplied
Remote Control Transmitter
(UK)
EUR7636070R
Remote Control Transmitter
(EK)
EUR7636090R
Batteries (UK) 2×
AA
Size
Batteries (EK) 2 × R6 Size
Fixing bands (TMME203 or TMME187) × 2
Dimensions (
W
×H×D) 95.0” (2,414 mm) × 56.0” (1,421 mm) × 5.0” (129 mm) (141 mm when including protruding portion of
slots)
Mass (weight)
main unit onl
y
(UK) approx. 485.0 lbs
main unit onl
y
(EK) approx. 220.0 kg net
Notes:
· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
· This equipment complies with the EMC standards listed below. EN55022, EN55024, EN61000-3-2, EN61000-3-3. (TH-103PF9EK)
CONTENTS
Page Page
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TH-103PF9UK / TH-103PF9EK

6.21. Removal of S1-Board 23
6.22. Removal of SS2-Board 23
6.23. Removal of SS3-Board 24
6.24. Removal of SS-Board 24
6.25. Removal of Fan 25
6.26. Removal of C1-Board 26
6.27. Removal of C2-Board 26
6.28. Removal of C3-Board 27
6.29. Removal of C4-Board 28
6.30. Removal of C5-Board 28
6.31. Removal of C6-Board 29
6.32. Removal of C7-Board 30
6.33. Removal of C8-Board 30
6.34. Removal of C9-Board 30
6.35. Removal of CX-Board 31
6.36. Removal of CY-Board 32
6.37. Removal of CZ-Board 32
6.38. Removal of DR1-Board (A) 33
6.39. Removal of DR1-Board (B) 33
6.40. Removal of DR2-Board (A) 34
6.41. Removal of DR2-Board (B) 34
6.42. Removal of CD-Board 34
6.43. Removal of AC Inlet 36
6.44. Removal of Escutcheon and Front Glass 36
6.45. Removal of V1-Board and V3-Board 39
7 Removal of Plasma Panel 40
8 Location Lead Wiring 47
8.1. Lead Wiring (1) 47
8.2. Lead Wiring (2) 48
8.3. Lead Wiring (3) 49
8.4. Lead Wiring (4) 50
8.5. Lead Wiring (5) 51
8.6. Lead Wiring (6) 52
8.7. Lead Wiring (7) 53
8.8. Lead Wiring (8) 54
8.9. Lead Wiring (9) 55
9 Adjustment Procedure 56
9.1. Driver Set-up 56
9.2. Initialization Pulse Adjust 57
9.3. P.C.B. (Printed Circuit Board) Replacement 58
9.4. Adjustment Volume Location 59
9.5. Test Point Location 59
10 Service mode 60
10.1. CAT (computer Aided Test) mode 60
10.2. IIC mode structure (following items value is sample data)
64
11 Adjustment 65
11.1. RGB white balance adjustment 65
11.2. HD white balance adjustment 67
11.3. Power control adjustment 69
12 Troubleshooting guide 70
12.1. Self Check 70
12.2. No Power 72
12.3. No Picture 72
12.4. Local screen failure 73
13 Option Setting 74
14 Interconnection and Block Diagram 77
14.1. Diagram Note 77
14.2. Interconnection (1 of 8) Diagram 78
14.3. Interconnection (2 of 8) Diagram 79
14.4. Interconnection (3 of 8) Diagram 80
14.5. Interconnection (4 of 8) Diagram 81
14.6. Interconnection (5 of 8) Diagram 82
14.7. Interconnection (6 of 8) Diagram 83
14.8. Interconnection (7 of 8) Diagram 84
14.9. Interconnection (8 of 8) Diagram 85
14.10. Main (1 of 2) Block Diagram 86
14.11. Main (2 of 2) Block Diagram 87
14.12. P-Board (1 of 2) and F-Board Block Diagram 88
14.13. P-Board (2 of 2) Block Diagram 89
14.14. HA, HX, PC, PB, V1, V2 and V3-Board Block Diagram 90
14.15. HDD-Board Block Diagram 91
14.16. DS-Board (1 of 2) and H3-Board Block Diagram 92
14.17. DS-Board (2 of 2) Block Diagram 93
14.18. DN-Board (1 of 3) Block Diagram 94
14.19. DN-Board (2 of 3) Block Diagram 95
14.20. DN-Board (3 of 3) Block Diagram 96
14.21. D-Board (1 of 2) Block Diagram 97
14.22. D-Board (2 of 2) Block Diagram 98
14.23. C1, C2, CY and CZ-Board Block Diagram 99
14.24. C2, C3, CX and CY-Board Block Diagram 100
14.25. C4, C5, C8 and C9-Board Block Diagram 101
14.26. C5, C6, C7 and C8-Board Block Diagram 102
14.27. SC2 and S1-Board Block Diagram 103
14.28. SC-Board Block Diagram 104
14.29. SU, SM and SD-Board Block Diagram 105
14.30. SS, SS2 and SS3-Board Block Diagram 106
14.31. DR1, DR2 and CD-Board Block Diagram 107
15 Parts Location 109
15.1. Exploded View 109
15.2. Cable and Fan 112
15.3. Board and Fuse 112
15.4. Packing summary 113
16 Replacement Parts List 120
3
TH-103PF9UK / TH-103PF9EK

1 Applicable signals
4
TH-103PF9UK / TH-103PF9EK

2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MΩand 5.2MΩ.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3. Use an AC voltmeter, with 1000 ohms / volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Shimpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1 / 2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
5
TH-103PF9UK / TH-103PF9EK

3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder Remove device. Some solder Remove devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
6
TH-103PF9UK / TH-103PF9EK

4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
7
TH-103PF9UK / TH-103PF9EK

5 Service Hint
8
TH-103PF9UK / TH-103PF9EK

Board Name Function Board Name Function
D Digital Signal Processor,
Format Converter,
Plasma AI Processor
Sub-Field Processor
CX Data Drive (X)
CY Data Drive (Y)
CZ Data Drive (Z)
H5 Audio Out
DS Slot Interface (Audio / Video / Sync Input
Switch),
SYNC Processor, Audio Processor,
Speaker Out Amplifier,
DC-DC Converter
S1 Power Switch
SS2 Sustain Out (Upper)
SS3 Sustain Out (Lower)
V1 LED_G, R
SS Sustain Drive V2 Key Scan
SC Scan Drive V3 Remocon Receiver
SC2 DC-DC Converter For Scan Drive PB Fan Control
SU Scan Out (Upper) P(SUS_1/2) Power Supply
SM Scan Out (Middle) P(MULTI_1/2) Power Supply
SD Scan Out (Lower) F Line Filter
C1 Data Drive (1) PC Power Control
C2 Data Drive (2) HX PC / RS-232C
C3 Data Drive (3) HA BNC Component Video
C4 Data Drive (4) DN Digital Signal Processor, Micon
C5 Data Drive (5) HDD DVI-D Terminal
C6 Data Drive (6) CD C-Board / D-Board Connection
C7 Data Drive (7) DR1 Energy Data Recovery
C8 Data Drive (8) DR2 Energy Data Recovery
C9 Data Drive (9)
9
TH-103PF9UK / TH-103PF9EK

6 Disassembly
6.1. Rear Cover and Board
Rear Cover required to remove for each board exchange.
Board Name Rear Cover
D-Board D
DS-Board B
SS-Board F
SC-Board A ,B ,C
SC2-Board A ,C
SU-Board A
SM-Board A
SD-Board A
C1-Board A
C2-Board A ,B
C3-Board B ,D
C4-Board B ,D
C5-Board D ,F
C6-Board F
C7-Board F
C8-Board E ,F
C9-Board C ,E
CX-Board C ,E
CY-Board A ,C
CZ-Board A
H5-Board B
S1-Board A
SS2-Board F
SS3-Board F
V1-Board A ,B ,C ,D ,E ,F
V2-Board A
V3-Board A ,B ,C ,D ,E ,F
PB-Board B
P-Board (MULTI_1) E
P-Board (SUS_1) E
10
TH-103PF9UK / TH-103PF9EK

6.2. Location of Rear Cover screws
Board Name Rear Cover
P-Board (MULTI_2) C
P-Board (SUS_2) C
F-Board E
PC-Board D
HX-Board B
HA-Board B
DN-Board B
HDD-Board B
CD-Board (A) B
CD-Board (B) D
CD-Board (C) D
CD-Board (D) D
CD-Board (E) D
CD-Board (F) B
DR1-Board (A) A
DR1-Board (B) F
DR2-Board (A) A
DR2-Board (B) F
11
TH-103PF9UK / TH-103PF9EK

6.2.1. Removal of Rear Cover ( A )
Remove the hooks and then remove 2 Covers.
(Note)
Be careful not to break the hooks.
1. Remove screws (×21 ,×2 ) and then remove the Rear
Cover ( A ).
6.2.2. Removal of Rear Cover ( B )
1. Remove screws (×21 ,×9 ) and then remove the Rear
Cover ( B ).
Tighten screw first in order of , and when
mounting the Rear cover B .
12
TH-103PF9UK / TH-103PF9EK

6.2.3. Removal of Rear Cover ( C )
1. Remove screws (×19 ) and then remove the Rear Cover
(C ).
Tighten the screw first in order of and when
mounting the Rear Cover C .
6.2.4. Removal of Rear Cover ( D )
1. Remove screws (×21 ) and then remove the Rear Cover
(D ).
Tighten screw first in order of and when mounting
the Rear cover D .
6.2.5. Removal of Rear Cover ( E )
1. Remove screws (×25 ) and then remove the Rear Cover
(E ).
Tighten screw first in order of and when mounting
the Rear cover E .
6.2.6. Removal of Rear Cover ( F )
Remove hooks and then remove 2 Covers.
(Note)
Be careful not to break the hooks.
1. Remove screws (×21 ) and then remove the Rear Cover
(F ).
13
TH-103PF9UK / TH-103PF9EK

6.3. Removal of Side Angle (L), (R)
1. Remove Side Angle (L), (R) beforehand when remove the
following Boards.
Board name Side Angle
SU-Board Side Angle (R)
SM-Board Side Angle (R)
SD-Board Side Angle (R)
SC-Board Side Angle (R)
C1-Board Side Angle (R)
CZ-Board Side Angle (R)
SS2-Board Side Angle (L)
SS3-Board Side Angle (L)
SS-Board Side Angle (L)
C6-Board Side Angle (L)
C7-Board Side Angle (L)
6.3.1. Removal of Side Angle (L)
1. Remove 4 screws (G) of the Plate.
2. Remove 19 screws and then remove the Side Angle (L).
6.3.2. Removal of Side Angle (R)
1. Remove 4 screws and then remove the Customer Control
Unit.
2. Disconnect a connector (S34).
3. Remove 4 screws (F) of the Plate.
14
TH-103PF9UK / TH-103PF9EK

4. Remove 19 screws and then remove the Side Angle (R).
6.4. Removal of HA-Board
1. Remove 4 screws (H) and then pull HA-Terminal Block out
to forward.
2. Remove 4 screws (J) and remove Shield Plate.
3. Remove 2 screws (K) and then remove HA-Board.
6.5. Removal of HDD-Board
1. Remove 4 screws (L) and then pull HDD-Terminal Block out
to forward.
2. Remove 4 screws (M) and remove Shield Plate.
3. Remove 2 Hexagonal-Head screws (N) and then remove
HDD-Board.
6.6. Removal of DS-Board
15
TH-103PF9UK / TH-103PF9EK

1. Disconnect the connectors (DS1, DS2, DS4, DS6, DS7,
DS8, DS9, DS10, DS14, DS15, DS30).
2. Remove 4 screws and then remove the Slot Block Case.
3. Remove 8 screws and then remove DS-Board.
6.7. Removal of HX-Board
1. Remove the HA Terminal Block and the HDD Terminal
Block.
(Refer to Removal of HA-Board and HDD-Board)
2. Remove 4 screws and then remove the Slot Block Case.
(Refer to Removal of DS-Board)
3. Remove 4 Hexagonal-Head screws (P) and 2 screws on
HX-Board, and then remove HX-Board.
16
TH-103PF9UK / TH-103PF9EK

6.8. Removal of DN-Board
1. Remove the flexible cables from the connectors (DN1,
DN6).
2. Disconnect the connectors (DN2, DN3, DN51).
3. Remove 4 screws and then remove DN-Board.
6.9. Removal of PB-Board
1. Disconnect the connectors (PB30, PB31, PB51, PB53,
PB54, PB56, PB59, PB61, PB62, PB64, PB66, PB69,
PB71).
2. Remove 4 screws and then remove PB-Board.
6.10. Removal of H5-Board
1. Disconnect a connector (H51).
2. Remove 2 screws and then remove H5-Board Block.
3. Remove 3 screws (Q) and then remove H5-Board.
17
TH-103PF9UK / TH-103PF9EK

6.11. Removal of D-Board
1. Remove the flexible cables from the connectors (D31, D32,
D33, D34, D35, D36).
2. Disconnect the connectors (D3, D5, D20, D25).
3. Remove 4 screws and then remove D-Board.
6.12. Removal of P-Board
(MULTI_1), (MULTI_2)
The fuses are not included in P-Board for the repair.
1. Disconnect the connectors (P5, P12, P25, P51, P53, P55).
2. Remove 9 screws and then remove P-Board (MULTI_1).
3. Disconnect the connectors (P5, P10, P12, P23, P25, P51,
P53, P55).
4. Remove 9 screw and then remove P-Board (MULTI_1).
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TH-103PF9UK / TH-103PF9EK

6.13. Removal of P-Board (SUS_1),
(SUS_2)
The fuses are not included in P-Board for the repair.
1. Disconnect the connectors (P2, P9, P52, P54, P56).
2. Remove 10 screws and then remove P-Board (SUS_1).
3. Disconnect the connectors (P2, P9, P11, P52, P54, P56).
4. Remove 10 screws and then remove P-Board (SUS_2).
6.14. Removal of F-Board
The fuses (F900, F901, F903, F904) are not included in F-
Board for the repair.
1. Disconnect the connectors (F1, F8, F9).
2. Remove 2 screws and then remove F-Board.
6.15. Removal of PC-Board
1. Disconnect the connectors (PC201, PC202, PC203,
PC204, PC205).
2. Remove 2 screws and then remove PC-Board.
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TH-103PF9UK / TH-103PF9EK

6.16. Removal of SU-Board
1. Remove the Side Angle (R).
(Refer to Removal of the Side Angle (L), (R) )
2. Remove 6 screws and then remove the Reinforcement
Angle (A).
3. Disconnect the Fan relay couplers.
4. Remove 4 screws and then remove the Fan Block (A), (B).
5. Remove the flexible cables from the connectors (SU1, SU2,
SU3, SU4).
6. Disconnect the connectors (SU45, SU55).
7. Remove 9 screws.
8. Slide the SU-Board to the upper direction to remove the
SU-Board from the connectors (SU41, SU42).
Take out so as not to damage SU-Board.
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TH-103PF9UK / TH-103PF9EK