Panasonic TH-37PWD8BK User manual

© 2005 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-37PWD8BK
TH-37PWD8BS
TH-37PWD8EK
TH-37PWD8ES
TH-37PWD8GK
TH-37PWD8GS
TH-37PWD8UK
TH-42PWD8BK
TH-42PWD8BS
TH-42PWD8EK
TH-42PWD8ES
TH-42PWD8GK
TH-42PWD8GS
TH-42PWD8UK
GP8D Chassis
Progressive Wide Plasma Display
Specifications
Power Source (UK, GK/S) 120 V AC, 50/60 Hz (GK/GS/UK)
Power Source (EK/S, BK/S) 220-240 V AC, 50/60 Hz (EK/ES/BK/BS)
Power Consumption (UK, GK/S)
Maximum 225 W (37PWD8GK/GS/UK) 275 W (42PWD8GK/GS/UK)
Stand-by condition Save OFF 1.0 W, Save ON 0.7 W (GK/GS/UK)
Power off condition 0.05 W (GK/GS/UK)
Power Consumption (EK/S, BK/S)
Normal use 215 W (37PWD8EK/ES/BK/BS) 240 W (42PWD8EK/ES/BK/BS)
Stand-by condition Save off 1.2 W, Save on 0.9 W (EK/ES/BK/BS)
Power off condition 0.1 W (EK/ES/BK/BS)
Plasma Display panel Drive method: AC type 37-inch
16:9 aspect ratio (37 inch)
Drive method: AC type 42-inch
16:9 aspect ratio (42 inch)
Contrast Ratio 4000:1
Screen size 32” 13/64 (818 mm) (W) × 18” 9/64 (461 mm) (H) × 36” 31/32 (939 mm) (diagonal) (37 inch)
36” 7/32 (920 mm) (W) × 20” 25/64 (518 mm) (H) × 41” 37/64 (1,056 mm) (diagonal) (42 inch)
(No. of pixels) 408,960 (852 (W) × 480 (H))
[2,556 × 480 dots]
Operating condition
ORDER NO. ITD0506035CE
D10 Canada: B07

Temperatuer 32 °F - 104 °F (0 °C - 40 °C)
Humidity 20 % - 80 %
Applicable signals
Color System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 525 (480) / 60i 60p, 625 (575) / 50i 50p, 750 (720) / 60p 50p, 1125 (1080) / 60i 50i 24p 25p
30p 24sF .... SMPTE274M, 1250 (1080) / 50i
PC signals VGA display
VGA
SVGA, XGA, SXGA, UXGA ..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
Connection terminals
A
V (EK/S, BK, S, UK) VIDEO IN / OUT (BNC) 1.0 Vp-p (75-ohm or high impedance)
S VIDEO IN (MINI DIN 4PIN) Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)
A
UDIO IN (RCA PIN JACK ×2) 0.5 Vrms (high impedance)
COMPONENT / RGB (UK) Y / G (BNC) 1.0 Vp-p / composite (75-ohm)
0.7 Vp-p / non-composite (75-ohm)
PB/ B (BNC), PR/ R (BNC) 0.7 Vp-p (75-ohm)
A
UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)
PC (GK/GS/UK) (HIGH-DENSITY D-SUB 15PIN) R, G, B / 0.7 Vp-p (75-ohm)
Component
Y:1.0 Vp-p (75-ohm : include sync)
PB/C
B:±0.7 Vp-p (75-ohm)
PR/C
R:±0.7 Vp-p (75-ohm)
HD, VD / 1.0 - 5.0 Vp-p (high impedance)
A
UDIO IN (M3 JACK) 0.5 Vrms (high impedance)
PC (EK/ES/BK/BS) (HIGH-DENSITY D-SUB 15PIN) R, G, B / 0.7 Vp-p (75-ohm)
HD, VD / 1.0 - 5.0 Vp-p (high impedance)
A
UDIO IN (M3 JACK) 0.5 Vrms (high impedance)
SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE
SPEAKERS (6 W) 16 W [8 W + 8 W] (10 % THD)
Accessories Supplied
Remote Control Transmitter EUR7636070R
Batteries 2 × AA Size
Fixing bands (TMME203 or TMME187) × 2
Dimensions ( W × H × D ) 36.2” (920 mm) × 21.7” (550 mm) × 3.5” (89 mm)
(exclusive of protruding portion) (37 inch)
40.2” (1,020 mm) × 24” (610 mm) × 3.5” (89 mm)
(exclusive of protruding portion) (42 inch)
Mass (Weight) (UK)
main unit only approx. 55.1 lbs (37PWD8UK) approx. 65.0 lbs (42PWD8UK)
with speakers approx. 63.9 lbs (37PWD8UK) approx. 73.9 lbs (42PWD8UK)
Mass (Weight) (GK/GS)
main unit only approx. 54.0 lbs (37PWD8GK/GS) approx. 63.9 lbs (42PWD8GK/GS)
with speakers approx. 62.8 lbs (37PWD8GK/GS) approx. 72.8 lbs (42PWD8GK/GS)
Mass (Weight) (EK/S, BK/S)
main unit only approx. 25.0 kg net (37PWD8EK/ES/BK/BS) approx. 29.5 kg net (42PWD8EK/ES/BK/BS)
with speakers approx. 29.0 kg (37PWD8EK/ES/BK/BS) approx. 33.5 kg (42PWD8EK/ES/BK/BS)
Notes:
·
· ·
· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
·
· ·
· This equipment complies with the EMC standards listed below. EN55022, EN55024, EN61000-3-2, EN61000-3-3.
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TH-37PWD8BK

1 Applicable signals 5
2 Safety Precautions 6
2.1. General Guidelines 6
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 7
4 About lead free solder (PbF) 8
5 PCB Structure sheet of GP8D chassis 9
6 Service Hint 10
7 P.C.Board and Plasma panel replacement 11
7.1. Removal of the back cover 11
7.2. Removal of the Slot block 11
7.3. Removal of the J-Board 11
7.4. Removal of the HX-Board 11
7.5. Removal of the P-Board 12
7.6. Removal of the D-Board 12
7.7. Removal of the AC-Inlet 12
7.8. Removal of the H3-Board 12
7.9. Removal of the S1-Board 13
7.10. Removal of the SU-Board 13
7.11. Removal of the SD-Board 13
7.12. Removal of the SC-Board 14
7.13. Removal of the SS-Board 14
7.14. Removal of the C1-Board 14
7.15. Removal of the C2-Board 15
7.16. Removal of the Front frame (glass) 15
7.17. Removal of the V1-Board and the V2-Board 15
7.18. Removal of stand brackets 16
7.19. Replacement of the plasma panel 16
8 Location of Lead Wiring 17
8.1. Wiring for 37 inch model 17
8.2. Wiring for 42 inch model 18
9 Adjustment Procedure 19
9.1. Driver Set-up 19
9.2. Initialization Pulse Adjust 20
9.3. P.C.B. (Printed Circuit Board) exchange 21
9.4. Adjustment Volume Location 21
9.5. Test Point Location 21
10 Service mode 22
10.1. CAT (computer Aided Test) mode 22
10.2. IIC mode structure (following items value is sample data.)
24
11 Alignment 25
11.1. PC/RGB panel white balance 25
11.2. HD/ 525ip /625ip panel white balance 27
12 Trouble shooting guide 29
12.1. Self Check 29
12.2. No Power 30
12.3. No Picture 30
12.4. Local screen failure 31
13 Option Setting 32
14 Circuit Board Layout 35
14.1. P-Board 35
14.2. HA-Board 38
14.3. HB-Board 39
14.4. HX-Board (37 inch) 40
14.5. HX-Board (42 inch) 41
14.6. J-Board (37 inch) 42
14.7. J-Board (42 inch) 44
14.8. D-Board 46
14.9. C1-Board (37 inch) 48
14.10. C1-Board (42 inch) 49
14.11. C2-Board (37 inch) 50
14.12. C2-Board (42 inch) 51
14.13. SC-Board 52
14.14. SU-Board (37 inch) 55
14.15. SU-Board (42 inch) 56
14.16. SD-Board (37 inch) 57
14.17. SD-Board (42 inch) 58
14.18. SS-Board 59
14.19. H3, S1, V1 and V2-Board 61
15 Block and Schematic Diagrams 63
15.1. Schematic Diagram Notes 63
15.2. Main Block Diagram 64
15.3. P-Board Block Diagram 65
15.4. P-Board (1 of 6) Schematic Diagram 66
15.5. P-Board (2 of 6) Schematic Diagram 67
15.6. P-Board (3 of 6) Schematic Diagram 68
15.7. P-Board (4 of 6) Schematic Diagram 69
15.8. P-Board (5 of 6) Schematic Diagram 70
15.9. P-Board (6 of 6) Schematic Diagram 71
15.10. HA-Board Block and Schematic Diagram 72
15.11. HB-Board Block Diagram 73
15.12. HB-Board (1 of 2) Schematic Diagram 74
15.13. HB-Board (2 of 2) Schematic Diagram 75
15.14. HX-Board Block Diagram 76
15.15. HX-Board Schematic Diagram 77
15.16. S1, V1 and V2-Board Block Diagram and Schematic
Diagram 78
15.17. J-Board (1 of 2) and H3-Board Block Diagram 79
15.18. J-Board (2 of 2) Block Diagram 80
15.19. J-Board (1 of 4) Schematic Diagram (37 inch) 81
15.20. J-Board (2 of 4) Schematic Diagram (37 inch) 82
CONTENTS
Page Page
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TH-37PWD8BK

15.21. J-Board (3 of 4) Schematic Diagram (37 inch) 83
15.22. J-Board (4 of 4) Schematic Diagram (37 inch) 84
15.23. J-Board (1 of 4) Schematic Diagram (42 inch) 85
15.24. J-Board (2 of 4) Schematic Diagram (42 inch) 86
15.25. J-Board (3 of 4) Schematic Diagram (42 inch) 87
15.26. J-Board (4 of 4) Schematic Diagram (42 inch) 88
15.27. D-Board Block Diagram 89
15.28. D-Board (1 of 12) Schematic Diagram 90
15.29. D-Board (2 of 12) Schematic Diagram 91
15.30. D-Board (3 of 12) Schematic Diagram 92
15.31. D-Board (4 of 12) Schematic Diagram 93
15.32. D-Board (5 of 12) Schematic Diagram 94
15.33. D-Board (6 of 12) Schematic Diagram 95
15.34. D-Board (7 of 12) Schematic Diagram 96
15.35. D-Board (8 of 12) Schematic Diagram 97
15.36. D-Board (9 of 12) Schematic Diagram 98
15.37. D-Board (10 of 12) Schematic Diagram 99
15.38. D-Board (11 of 12) Schematic Diagram 100
15.39. D-Board (12 of 12) Schematic Diagram 101
15.40. C1 and C2-Board Block Diagram 102
15.41. C1-Board (1 of 2) Schematic Diagram (37 inch) 103
15.42. C1-Board (2 of 2) Schematic Diagram (37 inch) 104
15.43. C1-Board (1 of 2) Schematic Diagram (42 inch) 105
15.44. C1-Board (2 of 2) Schematic Diagram (42 inch) 106
15.45. C2-Board (1 of 2) Schematic Diagram (37 inch) 107
15.46. C2-Board (2 of 2) Schematic Diagram (37 inch) 108
15.47. C2-Board (1 of 2) Schematic Diagram (42 inch) 109
15.48. C2-Board (2 of 2) Schematic Diagram (42 inch) 110
15.49. SC-Board Block Diagram 111
15.50. SC-Board (1 of 2) Schematic Diagram 112
15.51. SC-Board (2 of 2) Schematic Diagram 113
15.52. SU-Board Block Diagram 114
15.53. SU-Board Schematic Diagram (37 inch) 115
15.54. SU-Board Schematic Diagram (42 inch) 116
15.55. SD-Board Block Diagram 117
15.56. SD-Board Schematic Diagram (37 inch) 118
15.57. SD-Board Schematic Diagram (42 inch) 119
15.58. SS-Board Block Diagram 120
15.59. SS-Board Schematic Diagram 121
16 Parts Location 123
16.1. Parts Location (1) 123
16.2. Parts Location (2) 124
17 Packing Exploded Views 125
17.1. Packing Exploded Views (1) 125
17.2. Packing Exploded Views (2) 126
17.3. Packing Exploded Views (3) 127
18 Mechanical Replacement Parts List 128
19 Replacement Parts List 131
19.1. Replacement Parts List Notes 131
19.2. Electrical Replacement Parts List (37inch) 132
19.3. Electrical Replacement Parts List (42inch) 153
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TH-37PWD8BK

1 Applicable signals
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TH-37PWD8BK

2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MWand 5.2MW.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
6
TH-37PWD8BK

3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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TH-37PWD8BK

4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
·
· ·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· ·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· ·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
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TH-37PWD8BK

5 PCB Structure sheet of GP8D chassis
Board Name Function Remarks
DDigital Signal Processor 1
J Slot Interface (Audio/Video/Sync input
Switch), SYNC processor, Audio
processor, Speaker out amplifier, DC-
DC converter
1
SS Sustain Out 1
SC Scan out 1
SU Sustain connection (Upper) 1
SD Sustain connection (Lower) 1
C1 Data Drive (Lower Right)
C2 Data Drive (Lower Left)
H3 Speaker terminal
S1 Power switch
V1 LED (Stand-by/Power on) & Remote
receiver
1
V2 Key switch 1
P Line filter, Power supply 1
HX PC_type_Input terminal
HB BNC Composite/S Video 2
HA BNC Component Video 3
Remarks
1. Recommend PCB´s for initial service for GP8D chassis.
2. For TH-37/42PWD8UK/BK/BS/EK/ES
3. For TH-37/42PWD8UK
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TH-37PWD8BK

6 Service Hint
Note:
·
· ·
· Extension cable kit for Slot Board is supplied as service fixtures and tools.
(Part No. TZSC0704)
·
· ·
· J13 Slot is not equiped for 37” model.
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TH-37PWD8BK

Prior to the replacement of Plasma panel, place the unit on
the pedestal stand and remove the front frame.
7.1. Removal of the back cover
1. Unscrew the screws (×12 ,×6 ,×4 ,×4 ) and
remove the back cover.
7.2. Removal of the Slot block
Caution:
To remove P.C.B., wait 1 minute after power was off for
discharge from electrolysis capacitors.
1. Remove the couplers (J1, J2, J3, J4, J5, J6, J7, J8, J10,
J15).
2. Release the cable from the clampers at left side of the slot
block.
3. Unscrew the screws (×4 ) and remove the slot block.
7.3. Removal of the J-Board
1. Unscrew the screws (×8 ), release J14 from the HX-
Board and remove the J-Board.
7.4. Removal of the HX-Board
1. Unscrew the screws (×6 ) and remove the slot case.
2. Unscrew the screws (×4 ).
3. Unscrew the screws (×1 ) and remove the HX-Board.
7 P.C.Board and Plasma panel replacement
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TH-37PWD8BK

7.5. Removal of the P-Board
1. Remove the couplers (P2, P5, P7, P9, P10, P11, P12, P23
and P25).
2. Unscrew the screws (×5 ) and remove the P-Board.
7.6. Removal of the D-Board
1. Disconnect the couplers (D1, D3, D5, D20, D25) and the
flexible cables (D31, D32).
2. Unscrew the screws (×5 ) and remove the D-Board.
7.7. Removal of the AC-Inlet
1. Remove the coupler (P9) on the P-Board and release the
cables from the clamper.
2. Unscrew the screws (×2 ) and remove the AC inlet.
7.8. Removal of the H3-Board
1. Unscrew the screws (×2 ), and remove the H3-Board
with the Bracket (right & left).
2. Remove the couplers (H37).
3. Unscrew the screws (×6 ), and remove the H3-Board
(right & left).
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TH-37PWD8BK

7.9. Removal of the S1-Board
1. Release the cable from the clamper.
2. Unscrew the screws (×2 ) and remove the S1-Board with
the bracket.
3. Remove a coupler (S34), unscrew a screw (×1 ) and
remove the S1-Board.
7.10. Removal of the SU-Board
1. Unscrew the screws (×2 ).
2. Slide the SU-Board to the left and disconnect from the
couplers (SC41) on the SC-Board.
3. Remove the coupler (SU45).
4. Remove the flexible cables (SU1, SU2, SU3) connected to
the SU-Board from the plasma panel, and remove the SU-
Board.
7.11. Removal of the SD-Board
1. Unscrew the screws (×2 ).
2. Slide the SD-Board to the left and disconnect from the
couplers (SC42) on the SC-Board.
3. Remove the coupler (SD46).
4. Remove the flexible cables (SD1, SD2, SD3) connected to
the SD-Board from the plasma panel, and remove the SD-
Board.
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TH-37PWD8BK

7.12. Removal of the SC-Board
1. Remove the couplers (SC2, SC20, SC23, SC45, SC46).
2. Unscrew the screws (×6 ) and remove the SC-Board.
7.13. Removal of the SS-Board
1. Remove the couplers (SS11, SS12, SS23, SS34).
2. Remove the flexible cables (SS41, SS42, SS43, SS44).
3. Unscrew the screws (×6 ), and remove the SS-Board.
7.14. Removal of the C1-Board
1. Unscrew the flexible cable holder fastening screws (×6 ).
2. Remove the flexible cables (CB1, CB2, CB3).
3. Remove a flexible cable (C11), a coupler (C12) and release
the speaker cables from a clamper (×1) on the C1-Board.
4. Unscrew the screws (×3 ), and remove the C1-Board.
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TH-37PWD8BK

7.15. Removal of the C2-Board
1. Unscrew the flexible cable holder fastening screws (×8 ).
2. Remove the flexible cables (CB4, CB5, CB6, CB7).
3. Remove the couplers (C22, C23), a flexible cable (C21) and
release the speaker cables from the clamper on the C2-
Board.
4. Unscrew the screws (×3 ), and remove the C2-Board.
7.16. Removal of the Front frame
(glass)
1. Remove the screws (×2 ) fixing the front frame and the
plasma panel.
2. Confirm the S1-Board has been removed and the cable to
the V1-Board and V2-Board released.
3. For leaving the front frame from the plasma panel, pull the
bottom of the front frame to forward, lift up, and remove.
7.17. Removal of the V1-Board and
the V2-Board
1. Lay down the front frame on the flat surface of the table
(covered by a soft cloth not to damage the surface.)
2. Remove the couplers (V2 on the V1-Board and V15 on the
V2-Board).
3. Unscrew the screws (×3 ).
4. Remove the V1-Board, the V2-Board hold bracket and the
V2-Board.
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TH-37PWD8BK

7.18. Removal of stand brackets
1. Remove the plasma panel section from the servicing stand
and lay on a table (covered), with the plasma panel surface
facing downward.
Spread a soft cloth for protection, to prevent panel surface
from scratching.
2. Remove the stand bracket (left, right) fastening screws (×4
each) and remove the stand brackets (left, right).
7.19. Replacement of the plasma
panel
1. Place the new plasma panel (finished) on the flat surface of
the table (covered by a soft cloth), with the plasma panel
surface facing downward.
2. Fit the stand brackets (left, right.) fasten 4 screws each on
the new plasma panel.
3. Place the plasma panel section on the servicing stand.
4. Attach the front frame, each P.C.Board and so on, to the
new plasma panel.
* When fitting the front frame, be careful not to allow any
debris, dust or handling residues to remain between the
front glass and plasma panel.
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TH-37PWD8BK

8 Location of Lead Wiring
8.1. Wiring for 37 inch model
17
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8.2. Wiring for 42 inch model
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TH-37PWD8BK

9.1. Driver Set-up
9.1.1. Item / Preparation
1. Input a white signal of the RGB signal generator.
2. Set the picture controls: -
Picture menu: Standard
Color temperature: Middle
Picture: 25
Aspect: Full
Caution
1. First perform Vsus adjustment.
2. Confirmation of Vscn voltage should be performed after
confirmation of Vad adjustment.
When Vad=-90V, Voltage of Vscn is 30V ±3V.
9.1.2. Adjustments
Adjust driver section voltages referring the panel data on the
panel data label.
Name Test Point Voltage Volume Remarks
Vsus TPVSUS
(SS)
Vsus ± 1V R628 (P) *
Ve TPVE (SS) Ve ± 2V VR6074 (SS) *
Vset TPVSET
(SC)
232V ± 7V Fixed
Vad TPVAD (SC) -90V ± 1V VR6477
(SC)
Vscn TPVSCN
(SC)
Vad+120V ±
3V
Fixed
Vda TPVDA (SS) 67V ± 1V R665 (P)
PFC C446 (+)(-) 395V ± 0.5V R443 (P)
Vlow C555 (+)(-) 73V ± 0.1V R661 (P) load
current :
0.4A
Csus TPVSUS
(SS)
164V ± 0.5V R671 (P) load
current :
1.45A
*See the Panel label.
9 Adjustment Procedure
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TH-37PWD8BK

9.2. Initialization Pulse Adjust
1. Input the White signal to plasma video input.
2. Set the picture controls as follows.
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· Picture menu: Standard
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· Color temperature : Middle
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· Picture : 25
3. Connect Oscilloscope to TPSC1 (T1) and check for 15±10µ Sec.
4. Connect Oscilloscope to TPSC1 (T2) and adjust R6557 for 184+5µ /-10µ Sec.
Test point Volume Level
T1 TPSC1 (SC) --- 15 ± 10µ Sec
T2 TPSC1 (SC) R6557 (SC) 184 + 5µ / - 10µ Sec
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TH-37PWD8BK