Panasonic TH-42PH9WK User manual

©2006 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-42PH9WK
TH-42PH9WS
GPH9D Chassis
High Definition Plasma Display
Specifications
Power Source 220-240 V
A
C, 50/60Hz
Power Consumption
Power on 330 W
Stand-b
y
condition Save off 0.8 W, Save on 0.6 W
Power off condition 0.2 W
Plasma Displa
y
panel Drive method:
A
C type 42-inch,
16:9 aspect ratio
Contrast Ratio Ma
x
10000:1
Screen size
920 mm (W) × 518 mm (H) × 1,056 mm (diagonal)
(No. of pixels) 786,432 (1,024 (W) × 768 (H))
[3,072 × 768 dots]
Operating condition
Temperature 0 °C - 40 °C
Humidit
y
20 % - 80 %
Applicabl
e
signals
Color System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 525 (480) / 60i 60p, 625 (575)
/
50i 50p, 750 (720)
/
60p 50p, 1125 (1080) / 60i 50i 24p 25p
30p 24sF .... SMPTE274M, 1250 (1080) / 50i
PC signals VGA, SVGA, XGA,
SXGA, UXG
A
..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
Connection terminals
A
V VIDEO IN (BNC) 1.0 Vp-p (75-ohm or high impedance)
S VIDEO IN (MINI DIN 4PIN) Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)
A
UDIO IN (RCA PIN JACK × 4) 0.5 Vrms
PC (HIGH-DENSIT
Y
Mini-D-SUB 15PIN)
Y
or G with
/
syn
c
1.0 Vp-p (75-ohm)
Y
or G without / syn
c
0.7 Vp-p (75-ohm)
B
/
PB
/
CB:0.7 Vp-p (75-ohm)
ORDER NO. ITD0609071CE

1 Applicable signals 4
2 Safety Precautions 5
2.1. General Guidelines 5
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
4 About lead free solder (PbF) 7
5 Service Hint 8
6 Disassembly 9
6.1. Removal of the Back Cover 9
6.2. Removal of the HU-Board 9
6.3. Removal of the Slot Block 9
6.4. Removal of the J-Board 9
6.5. Removal of the HX-Board 10
6.6. Removal of the PB-Board 10
6.7. Removal of the DA-Board 10
6.8. Removal of the P-Board 11
6.9. Removal of the D-Board 11
6.10. Removal of the H3-Board (L, R) 11
6.11. Removal of the SU-Board and the SD-Board 12
6.12. Removal of the SC-Board 12
6.13. Removal of the SS-Board 12
6.14. Removal of the C1, C2-Board 13
6.15. Removal of the S1-Board 13
6.16. Removal of the Fan 14
6.17. Removal of the V1-Board, V2-Board and the Operation
Button 14
6.18. Removal of the Escutcheon and the Front Glass 15
6.19. Removal of the Plasma Panel 16
7 Location of Lead Wiring 18
7.1. Location of Lead Wiring (1) 18
7.2. Location of Lead wiring (2) 19
7.3. Location of Lead wiring (3) 20
7.4. Location of Lead Wiring (4) 20
8 Adjustment Procedure 21
8.1. Driver Set-up 21
8.2. Initialization Pulse Adjust 22
8.3. P.C.B. (Printed Circuit Board) exchange 22
8.4. Adjustment Volume Location 23
8.5. Test Point Location 23
9 Service mode 24
9.1. CAT (computer Aided Test) mode 24
9.2. IIC mode structure (following items value is sample data.)
27
10 Adjustment 28
10.1. RGB white balance adjustment 28
10.2. HD white balance adjustment 30
10.3. Power control adjustment 32
11 Troubleshooting guide 33
11.1. Self Check 33
11.2. No Power 35
11.3. No Picture 35
11.4. Local screen failure 36
R
/
PR
/
CR:0.7 Vp-p (75-ohm)
HD
/
VD:1.0 - 5.0 Vp-p (high impedance)
VBS (use HD port) with
/
picture 1.0 Vp-p (high impedance)
without
/
picture 0.3 Vp-p (high impedance)
A
UDIO IN (M3 JACK) 0.5 Vrms
SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE
SPEAKERS (6Ω) 16 W [8 W + 8 W] (10 % THD)
Accessories Supplied
Remote Control Transmitter EUR7636090R
Batteries 2 × R6 Size
Fixing bands (TMME203 or TMME187) × 2
Dimensions (
W
×H×D) 1,020 mm × 610 mm × 89 mm
Mass (weight)
main unit onl
y
approx. 27.0kg net
with speakers approx. 31.0kg
Notes:
· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
· This equipment complies with the EMC standards listed below.EN55022, EN55024, EN61000-3-2, EN61000-3-3.
CONTENTS
Page Page
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12 Option Setting 37
13 Conductor Views 39
13.1. P-Board 39
13.2. PB-Board 42
13.3. HU-Board 43
13.4. HX-Board 44
13.5. H3, S1, V1 and V2-Board 45
13.6. J-Board 46
13.7. DA-Board 48
13.8. D-Board 50
13.9. C1-Board 52
13.10. C2-Board 53
13.11. SC-Board 54
13.12. SU-Board 57
13.13. SD-Board 58
13.14. SS-Board 59
14 Block and Schematic Diagram 61
14.1. Schematic Diagram Notes 61
14.2. Main Block Diagram 62
14.3. P-Board Block Diagram 63
14.4. P-Board (1 of 6) Schematic Diagram 64
14.5. P-Board (2 of 6) Schematic Diagram 65
14.6. P-Board (3 of 6) Schematic Diagram 66
14.7. P-Board (4 of 6) Schematic Diagram 67
14.8. P-Board (5 of 6) Schematic Diagram 68
14.9. P-Board (6 of 6) Schematic Diagram 69
14.10. PB-Board Block and Schematic Diagram 70
14.11. HU-Board Block Diagram 71
14.12. HU-Board (1 of 2) Schematic Diagram 72
14.13. HU-Board (2 of 2) Schematic Diagram 73
14.14. HX-Board Block and Schematic Diagram 74
14.15. V1 and V2-Board Block and Schematic Diagram 75
14.16. J-Board (1 of 2) Block Diagram 76
14.17. J-Board (2 of 2) Block Diagram 77
14.18. J-Board (1 of 5) and H3-Board Schematic Diagram 78
14.19. J-Board (2 of 5) Schematic Diagram 79
14.20. J-Board (3 of 5) Schematic Diagram 80
14.21. J-Board (4 of 5) Schematic Diagram 81
14.22. J-Board (5 of 5) Schematic Diagram 82
14.23. DA-Board (1 of 2) Block Diagram 83
14.24. DA-Board (2 of 2) Block Diagram 84
14.25. DA-Board (1 of 6) Schematic Diagram 85
14.26. DA-Board (2 of 6) Schematic Diagram 86
14.27. DA-Board (3 of 6) Schematic Diagram 87
14.28. DA-Board (4 of 6) Schematic Diagram 88
14.29. DA-Board (5 of 6) Schematic Diagram 89
14.30. DA-Board (6 of 6) Schematic Diagram 90
14.31. D-Board Block Diagram 91
14.32. D-Board (1 of 6) Schematic Diagram 92
14.33. D-Board (2 of 6) Schematic Diagram 93
14.34. D-Board (3 of 6) Schematic Diagram 94
14.35. D-Board (4 of 6) Schematic Diagram 95
14.36. D-Board (5 of 6) Schematic Diagram 96
14.37. D-Board (6 of 6) Schematic Diagram 97
14.38. C1 and C2-Board Block Diagram 98
14.39. C1-Board (1 of 2) Schematic Diagram 99
14.40. C1-Board (2 of 2) Schematic Diagram 100
14.41. C2-Board (1 of 2) Schematic Diagram 101
14.42. C2-Board (2 of 2) Schematic Diagram 102
14.43. SC, SU and SD-Board Block Diagram 103
14.44. SC-Board (1 of 2) Schematic Diagram 104
14.45. SC-Board (2 of 2) Schematic Diagram 105
14.46. SU-Board (1 of 2) Schematic Diagram 106
14.47. SU-Board (2 of 2) Schematic Diagram 107
14.48. SD-Board (1 of 2) Schematic Diagram 108
14.49. SD-Board (2 of 2) Schematic Diagram 109
14.50. SS and S1-Board Block Diagram 110
14.51. SS and S1-Board Schematic Diagram 111
15 Parts Location 113
15.1. Exploded View 113
15.2. Cable relation 115
15.3. Packing summary 116
16 Mechanical Replacement Parts List 118
17 Replacement Parts List 119
17.1. Replacement Parts List Notes 119
17.2. Electrical Replacement Parts List 120
18 Schematic Diagram for printing with A4 143
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1 Applicable signals
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2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screw heads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MΩand 5.2MΩ.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
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3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
ERR
stamped on the back of PCB.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
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5 Service Hint
Board Name Function
DA Digital Signal Processor, Micon
D Format Converter, Plasma AI Processor, Sub-Field Processor
J Slot Interface (Audio / Video / Sync input Switch), SYNC processor, Sound processor
SS Sustain drive
SC Scan drive
SU Scan out (Upper)
SD Scan out (Lower)
C1 Data Drive (Right)
C2 Data Drive (Left)
H3 Speaker terminal
S1 Power switch
V1 Remote receiver, LED-G, R
V2 Key switch
P Power supply
PB Fan control
HX PC / RS-232C_Input terminal
HU Dual Video terminal (BNC / S)
Note:
· Extension cable kit Slot Board is supplied as service fixtures and tools.
(Parts No. TZSC0704)
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6 Disassembly
· To disassemble P.C.B., wait for 1 minute after power was
off for discharge from electrolysis capacitors.
· and marks indicate screw positions.
6.1. Removal of the Back Cover
1. Remove the screws (×18 ,×6 ,×4 ) and then remove
the Back Cover.
6.2. Removal of the HU-Board
1. Remove the 4 screws(A) and then remove the HU Terminal
Block.
2. Remove the 4 screws(B).
3. Remove the 3 screws(C) and then remove the HU-Board.
6.3. Removal of the Slot Block
1. Disconnect the couplers (J1, J2, J3, J4, J5, J6, J7, J8, J10,
J15,J30).
2. Remove the 4 screws and then remove the Slot Block.
6.4. Removal of the J-Board
1. Remove the HU Terminal Block and the HA Terminal Block.
(Reference to Removal of the HU-Board and the HA-Board)
2. Remove the Slot Block.
(Reference to Removal of the Slot Block)
3. The Slot Block is turned inside out.
4. Remove the 6 screws and then remove the Slot cover.
5. Remove the 6 screws.
6. Release the coupler(J14) from HX-Board and then remove
the J-Board.
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6.5. Removal of the HX-Board
1. Remove the HU Terminal Block.
(Reference to Removal of the HU-Board)
2. Remove the Slot Block.
(Reference to Removal of the Slot Block)
3. Remove the J-Board.
(Reference to Removal of the J-Board)
4. Remove the 2 screws and then remove the Slot Case.
5. Remove the 4 Hexagonal-Head screws and the 1 screw
and then remove the HX-Board.
6.6. Removal of the PB-Board
1. Disconnect the couplers(PB30, PB31, PB33, PB35).
2. Remove the 1 screw and then remove the PB-Board.
6.7. Removal of the DA-Board
1. Disconnect the couplers(PB30, PB31, PB33, PB35).
2. Remove the 2 screws and then remove the PB-Board
Block.
3. Disconnect the couplers(DA1, DA3, DA5, DA6).
4. Remove the Flexible Cable from the coupler(DA2).
5. Remove the 2 screws and then remove the DA-Board and
Fixed Plate.
Note:
A re-setup of the destination is performed by MS mode
after DA-Board exchange.
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6.8. Removal of the P-Board
1. Disconnect the couplers(P2, P5, P9, P10, P11, P12, P23,
P25)
2. Remove the 6 screws and then remove the P-Board.
6.9. Removal of the D-Board
1. Remove the Slot Block.
(Reference to Removal of the Slot Block)
2. Disconnect the couplers(D5, D20, D25)
3. Remove the Flexible Cable from the couplers (D3, D31,
D32).
4. Remove the 4 screws and then remove the D-Board.
6.10. Removal of the H3-Board (L,
R)
1. Remove the each 1 screw and then remove the Speaker
Terminal Block (L, R).
2. Disconnect the coupler(H37).
3. Remove the 3 screws (D) and then remove the H3-Board.
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6.11. Removal of the SU-Board and
the SD-Board
1. Remove the Speaker Terminal Block(R).
(Reference to Removal of the H3-Board(L, R))
2. Remove the Flexible Cable from the couplers(SU1, SU2,
SU3, SU4, SD1, SD2, SD3, SD4) and then remove the SU-
Board.
3. Remove the 3 screws.
4. Disconnect the couplers(SU45, SD46).
5. Slide the SU-Board and the SD-Board to the left, remove
the SU-Board and the SD-Board from the couplers(SC41,
SC42).
6.12. Removal of the SC-Board
1. Remove the Speaker Terminal Block(R).
(Reference to Removal of the H3-Board(L, R))
2. Disconnect the couplers(SU45, SD46).
3. Remove the 3 screws ( ) and then slide the SU-Board and
the SD-Board to the left.
4. Disconnect the couplers(SC2, SC20, SC23).
5. Remove the 6 screws and then remove the SC-Board.
6.13. Removal of the SS-Board
1. Disconnect the couplers(SS11, SS12, SS23, SS34).
2. Remove the Flexible Cable from the couplers(SS41, SS42,
SS43, SS44).
3. Remove the 6 screws and then remove the SS-Board.
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6.14. Removal of the C1, C2-Board
1. Remove the Slot Block.
(Reference to Removal of the Slot Block)
2. Remove the Speaker Terminal Block(L, R).
(Reference to Removal of the H3-Board(L, R))
3. Remove the each 3 screws and then remove the Stand
Block(L, R).
6.14.1. Removal of the C1-Board
1. Remove the Flexible Cable from the couplers(C11, C12).
2. Remove the 8 screws ( ) and then remove the Flexible
Cable from the couplers(CB1, CB2, CB3, CB4).
3. Remove the 4 screws ( ) and then remove the C1-Board.
6.14.2. Removal of the C2-Board
1. Remove the Flexible Cable from the couplers(C21, C22).
2. Remove the 8 screws ( ) and then remove the Flexible
Cable from the couplers(CB5, CB6, CB7, CB8).
3. Remove the 4 screws ( ) and then remove the C2-Board.
6.15. Removal of the S1-Board
1. Disconnect the coupler(SS34).
2. Remove the 2 screws(E) and then remove the S1-Board
Block.
3. Disconnect the coupler(S34).
4. Remove the 1 screw(F) and then remove the S1-Board.
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6.16. Removal of the Fan
1. Disconnect the Fan Relay Couplers.
2. Remove the each 3 screws and then remove the 3 Fan
Blocks.
3. Remove the each 4 screws (G) and then remove the Fans.
4. Reassemble the Fans in reverse order.
5. Stick the Cushion (Fan) around the Fan.
Note:
The Cushion (Fan) are unsuitable to reuse.
Please use a new one at the time of Fan exchange.
6.17. Removal of the V1-Board, V2-
Board and the Operation
Button
1. Remove the S1-Board Block.
(Reference to Removal of the S1-Board)
2. Disconnect the couplers(J2, J15).
3. Remove the 2 screws of the Escutcheon.
4. Pull the bottom of the Plasma Panel forward (arrow1).
5. Slide the Plasma Panel and then remove the Plasma Panel
(arrow2).
6. Remove the 5 screws and then remove the Fixed Angle(C).
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7. Remove the 1 screw(L).
8. Disconnect the coupler(V2) and then remove the V1-Board.
9. Remove the operation button from the V2-Board.
10. Disconnect the coupler(V15) and then remove the V2-
Board.
6.18. Removal of the Escutcheon
and the Front Glass
1. Remove the S1-Board Block.
(Reference to Removal of the S1-Board)
2. Disconnect the couplers(J2, J15).
3. Remove the 2 screws of the Escutcheon.
4. Pull the bottom of the Plasma Panel forward (arrow1).
5. Slide the Plasma Panel and then remove the Plasma Panel
(arrow2).
6. Remove the 18 screws and then remove the Fixed Angle
(A, B, C, D).
7. Remove the Front Glass
Note: when Front Glass is exchanged
· Each Front Glass Sponge must be stuck along the
edge of Fixed Angle.
Note
· The sponges are parts which cannot be recycled.
Please use the new article when you exchange the
Front Glass.
8. Remove the 1 screw (L) and then remove the V1-Board.
9. Remove the V2-Board and Operation Button.
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6.19. Removal of the Plasma Panel
· The C1,C2 module is connected with the plasma panel
for the repair.
1. Disconnect the Fan Relay Couplers.
2. Remove the each 3 screws ( ) and then remove the 3 Fan
Blocks.
3. Remove the each 3 screws ( ) and then remove the Stand
Block(L, R).
4. Disconnect the couplers(J1, J2, J3, J4, J5, J6, J7, J8, J10,
J15, J30).
5. Remove the 4 screws and then remove the Slot Block.
6. Disconnect the coupler(DA5).
7. Remove the Flexible Cable from the coupler(DA2).
8. Remove the 4 screws and then remove the DA-Board
Block.
9. Disconnect the couplers(P2, P9, P11, P12, P23, P25).
10. Remove the 6 screws ( ) and then remove the P-Board.
11. Remove the each 1 screw ( ) and then remove the
Speaker Terminal Block(L, R).
12. Disconnect the coupler(D20).
13. Remove the Flexible Cable from the couplers(C11,C21).
14. Remove the 4 screws and then remove the D-Board.
15. Remove the SU-Board and the SD-Board.
(Reference to Removal of the SU-Board and the SD-Board)
16. Remove the 1 screw ( ) and then remove the clamper.
17. Remove the 6 screws ( ) and then remove the SC-Board.
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18. Disconnect the couplers(SS23, SS34).
19. Remove the Flexible Cable from the couplers(SS41, SS42,
SS43, SS44)
20. Remove the 6 screws and then remove the SS-Board.
21. Remove the Flexible Cable from the couplers(C12,C22).
22. Remove the 2 screws ( ) and then remove the S1-Board
Block.
23. Remove the 3 screws ( ) and then remove the AC-Inlet
Block.
24. Remove the 2 screws of the Escutcheon.
25. Remove the 18 Spacers and Spacer Rings from the Plasma
Panel.
Caution
· Please confirm the installation place of Spacer and
Spacer Ring when you exchange the Plasma Panel,
and install Spacer and Spacer Ring in an original
installation place after exchanging the Plasma
Panel.
26. Lift up the bottom of the Plasma Panel in the direction of the
arrow 1 and pull the Plasma Panel in the direction of the
arrow 2 and then remove the Plasma Panel.
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7 Location of Lead Wiring
7.1. Location of Lead Wiring (1)
The lead wiring is dressed as shown in figure.
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7.2. Location of Lead wiring (2)
The lead wiring is dressed as shown in figure.
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7.3. Location of Lead wiring (3)
The lead wiring is dressed as shown in figure.
7.4. Location of Lead Wiring (4)
The lead wiring is dressed as shown in figure.
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