Panasonic TH-50PHW6BX User manual

ORDERNO. ITD0309034C0
D10 Canada:B07
High Definition PlasmaDisplay
TH-50PHW6BX/ TH-50PHW6EX / TH-50PHD6EX / TH-
50PHD6BX/ TH-50PHD6UY
GPH6D2Chassis
SPECIFICATIONS
Specifications
PowerSource: AC120V50 / 60Hz(UYversion)
AC220-240V50 / 60Hz
(ExceptUYversion model)
PowerConsumption:445 W
Saveoff 1.6W, Saveon 0.9W (stand-by
condition)
(UYversion)
Saveoff 1.9W, Saveon 1.1W (stand-by
condition)
(ExceptUYversion model)
0.2W (Poweroff condition)
(UYversion model)
0.4W (Poweroff condition)
(ExceptUYversion model)
Plasma Displaypanel:
Drivemethod ACtype
16:9aspectratio
ContrastRatio 3000:1
Screen size: 1,106 mm (W)×622 mm (H)
1,269 mm (diagonal)
No. ofpixels
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1,049,088 (1,366 (W)×768 (H))
[4,098 ×768 dots]
Operating condition:
Temperature 34 ° F -104 ° F (0° C-40 ° C)
Humidity 20 %-80 %
Horizontal scanning frequency15 -
110kHz
Vertical scanning frequency48 -120Hz
Connection terminals:
AV
Video in 1.0Vp-p (75-ohm)
S-VIDEOIN/
(MINI DIN4PIN) Y:1Vp-p (75-ohm), C:0.286 Vp-p (75-ohm)
AUDIOIN/ (RCA
PINJACK ×2) 0.5Vrms (high impedance)
COMPONENT/ RGB
Y/ G 1.0Vp-p / composite(75-ohm)
0.7Vp-p / non-composite(75-ohm)
P B / B 0.7Vp-p (75-ohm)
P R / R 0.7Vp-p (75-ohm)
HD 1.0-5.0Vp-p (high impedance)
VD 1.0-5.0Vp-p (high impedance)
AUDIOIN
(RCAPINJACK ×2) 0.5Vrms (high impedance)
PC
(HIGH-DENSITY
D-SUB15PIN) R,G,B/ 0.7Vp-p (75-ohm)
HD, VD/ 1.0-5.0Vp-p (high
impedance)
AUDIOIN(M3JACK) 0.5Vrms (high impedance)
SERIAL
EXTERNAL CONTROL
TERMINAL (D-
SUB9PIN)
RS-232CCOMPATIBLE
SPEAKERS(External
speakers)(6) 16W [8W +8W](10 %THD)
Dimensions(W ×H×
D): 1,210 mm ×724 mm 95 mm
Weight(Mass) approx. 43.5kg net(main unitonly)
approx. 48.1kg net(with speakers)
2003 Matsushita ElectricIndustrial Co., Ltd. All rights reserved.
Unauthorizedcopying and distribution isaviolation oflaw.
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1. Applicablesignals
2. SafetyPrecautions
2.1. General Guidelines
1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit
isfound, replace all parts whichhavebeenoverheatedor
damagedbytheshortcircuit.
2. Afterservicing, see toitthat all theprotectivedevices suchas
insulation barriers, insulation papersshieldsareproperlyinstalled.
3. Afterservicing, make thefollowing leakagecurrentchecks to
preventthecustomerfrombeing exposedtoshock hazards.
2.1.1. LeakageCurrentColdCheck
1. Unplug theACcordand connect ajumperbetweenthetwoprongs
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on theplug.
2. Measuretheresistance value, withanohmmeter, betweenthe
jumperedACplug and eachexposedmetalliccabinet parton the
equipmentsuchas screwheads, connectors, control shafts, etc.
Whentheexposedmetallicparthas areturnpathtothechassis,
thereading shouldbebetween1M and 5.2M . / Whenthe
exposedmetal does nothaveareturnpathtothechassis, the
reading must be . Figure1
2.1.2. LeakageCurrentHotCheck (See Figure 1 .)
1. Plug theACcorddirectlyintotheACoutlet. Donotuse an
isolation transformerforthischeck.
2. Connect a1.5k , 10 watts resistor, inparallel witha0.15 F
capacitors, betweeneachexposedmetallicparton theset and a
good earthground suchas awaterpipe, as shownin Figure 1.
3. Use anACvoltmeter, with1000 ohms/voltormoresensitivity, to
measurethepotential across theresistor.
4. Check eachexposedmetallicpart, and measurethevoltageat
eachpoint.
5. Reverse theACplug intheACoutlet and repeat eachoftheabove
measurements.
6. Thepotential at anypointshouldnotexceed0.75 volts RMS. A
leakagecurrenttester(Simpson Model 229 orequivalent) maybe
usedtomake thehotchecks, leakagecurrentmust notexceed1/2
milliamp. Incase ameasurementisoutsideofthelimits specified,
thereisapossibilityofashock hazard, and theequipmentshould
berepairedand recheckedbeforeitisreturnedtothecustomer.
3. Prevention of ElectroStaticDischarge (ESD) to
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ElectrostaticallySensitive(ES) Devices
Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such
componentscommonlyarecalledElectrostaticallySensitive (ES)Devices. Examples oftypical
ES devices areintegratedcircuitsand somefield-effecttransistorsand semiconductor "chip"
components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of
componentdamagecausedbyelectro staticdischarge(ESD).
1. Immediatelybeforehandling anysemiconductorcomponentor
semiconductor-equippedassembly, drainoff anyESDon your
bodybytouching aknownearthground. Alternatively, obtainand
wearacommerciallyavailabledischarging ESDwrist strap,
whichshouldberemovedforpotential shock reasonspriorto
applying powertotheunitundertest.
2. Afterremoving anelectrical assemblyequippedwithES devices,
place theassemblyon aconductivesurface suchas alminumfoil,
topreventelectrostaticchargebuildup orexposureofthe
assembly.
3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES
devices.
4. Use onlyananti-staticsolderremoval device. Somesolder
removal devices notclassifiedas "anti-static(ESDprotected)"can
generate electrical chargesufficienttodamageES devices.
5. Donotuse freon-propelledchemicals. These cangenerate
electrical charges sufficienttodamageES devices.
6. DonotremoveareplacementES device fromits protective
packageuntil immediatelybeforeyou arereadytoinstall it. (Most
replacementES devices arepackagedwithleadselectrically
shortedtogetherbyconductivefoam, alminumfoil or
comparableconductivematerial).
7. Immediatelybeforeremoving theprotectivematerial fromthe
leadsofareplacementES device, touchtheprotectivematerial to
thechassisorcircuitassemblyintowhichthedevice will be
installed.
Caution
Besureno powerisappliedtothechassisorcircuit, and observe
all othersafetyprecautions.
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8. Minimizebodilymotionswhenhandling unpackagedreplacement
ES devices. (Otherwise hamless motion suchas thebrushing
togetherofyourclothes fabricorthelifting ofyourfootfroma
carpetedfloorcangenerate staticelectricity(ESD)sufficient
todamageanES device).
4. About lead free solder(PbF)
Note:Leadislistedas (Pb)intheperiodictableofelements.
Intheinformation below, Pbwill refertoLeadsolder, and PbF will refertoLeadFree Solder.
TheLeadFree Solderusedinour manufacturing process and discussedbelowis(Sn+Ag+Cu).
ThatisTin(Sn), Silver(Ag)and Copper(Cu)although othertypes areavailable.
Thismodel uses PbFree solderinit’smanufactureduetoenvironmental conservation issues.
For service and repairwork, we’dsuggesttheuse ofPbfree solderas well, although Pbsolder
may beused.
PCBsmanufacturedusing leadfree solderwill have thePbF withinaleafSymbol
stampedon theback ofPCB.
Caution
-Pbfree solderhas ahighermelting pointthanstandardsolder.
Typicallythemelting pointis50 ~70 °F(30~40 °C)higher. Please
use ahigh temperaturesoldering iron and set itto700 ±20 °F(370
±10 °C).
-Pbfree solderwill tend tosplashwhenheatedtoo high (about1100
°For600 °C).
Ifyou must use Pbsolder, please completelyremoveall ofthePb
free solderon thepinsorsolderarea beforeapplying Pbsolder. If
thisisnotpractical, besuretoheat thePbfree solderuntil itmelts,
beforeapplying Pbsolder.
-Afterapplying PbF soldertodoublelayeredboards, please check
thecomponentsideforexcess solderwhichmayflow ontothe
opposite side. (see figurebelow)
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SuggestedPbfree solder
Thereareseveral kindsofPbfree solderavailablefor purchase. Thisproductuses Sn+Ag+Cu
(tin, silver, copper)solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth)soldercan
alsobeused.
5. PCB Structuresheet of GPH6D2chassis
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Board Name Function Remarks
DDigital Signal Processor 1
JSlotInterface &SYNC
processor 1
ZAudioout, DC-DC converter
SS SustainOut 1
SC Scanout 1
SU Sustainconnection (Upper) 1
SD Sustainconnection (Lower) 1
C1 DataDrive (UpperRight)
C2 DataDrive (UpperCenter)
C3 DataDrive (LowerLeft)
C4 DataDrive (LowerLeft)
C5 DataDrive (LowerCenter)
C6 DataDrive (LowerRight)
H3 Speakerterminal
S1 Powerswitch
SS2 Sustainconnection (Upper)
SS3 Sustainconnection (Lower)
V1 FrontSW. &Remotereceiver
PF Linefilter
PPowersupply 1
HX PC_type_Inputterminal
HY BNC Composite/Component
Video 2
HZ BNC ComponentVideo 3
Remarks
1. Recommend PCB'sforinitial service forGPH6D2chassis.
2. ForSystemmodel exceptBX, EX version
3. ForConsumermodel exceptBX, EX version
6. Service Hint
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7. Location of Lead Wiring
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10

8. Adjustment Procedure
8.1. DriverSet-up
8.1.1. Item/ Preparation
1. InputanAPL100 %white signal.
2. Set thepicturecontrols:-
Picturemode:Normal
White balance:Cool
Aspect:16:9
8.1.2. Adjustments
Adjustdriversection voltages referring thepanel dataon thepanel datalabel.
Name Test
Point Voltage Volume Remarks
Vsus TPVSUS
(SS) 173V ±2V VR641 (P)
Vset TPVSET
(SC) 220V ±5V ---
Vbk TPVBK
(SC) 140V ±1V R6670 (SC)
Vad TPVAD
(SC) -85V ±1V R6477 (SC)
Vscn TPVSCN
(SC) Vad*+118V ±2V ---
Ve TPVE
(SS) 150V ±1V R6770 (SS)
Vda TPVDA
(SS) 75V ±1V VR665 (P)
*See thePanel label.
8.2. Initialization Pulse Adjust
1. InputaCross hatchsignal.
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2. Set thepicturecontrols:-
Picturemode:Normal
White balance:Cool
Adjusttheindicatedtestpointfor thespecifiedwave form.
Testpoint Volume Level
T1 TPSC1(SC) --- 20 ±15 Sec
T2 TPSS1(SS) R6557 (SC) 155 ±10 Sec
8.3. P.C.B. (PrintedCircuitBoard)exchange
8.3.1. Caution
1. To removeP.C.B. , wait1minute afterpowerwas off fordischarge
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fromelectrolysiscapacitors.
8.3.2. Quick adjustmentafterP.C.B. exchange
P.C.B. Name TestPoint Voltage Volume Remarks
P Board Vsus TPVSUS (SS) 173V ±2V R641 (P)
Vda TPVDA(SS) 75V ±1V R665 (P)
SCBoard Vad TPVAD(SC) 85V ±1V R6477 (SC)
Vset TPVSET(SC) 220V ±5V ---
Vscn TPVSCN (SC) Vad+118 ±2V ---
Vbk TPVBK (SC) 140 ±1V R6670 (SC)
SS Board Ve TPVE (SS) 150V ±1V R6770 (SS)
D, JBoard Whiteblance, Pedestal and Sub brightness for NTSC, PAL, HD, PCand 625i
signals
*See thePanel label.
8.4. AdjustmentVolumeLocation
8.5. Test PointLocation
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9. Service mode
9.1. CAT(computerAidedTest) mode
ToexittheCATmode, access theIDmodeand switchoff themainpower.
9.1.1. IICmode
SelecttheIICmodebyUp/Downbutton on theremotecontrol atthefrontpageofCATmodethen
press theAction button on theremotecontrol.
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Subjectand item arementionedon page14.
ToexittheIICmode, press theRbutton on theremotecontrol.
9.1.2. CD mode
SelecttheCD modebyUp/Downbutton on theremotecontrol atthefrontpageofCATmode
thenpress theMutebutton on theremotecontrol morethan5sec.
Micom softwareversion (IC9705), thisversion canbeupgradeby
1. replace ofnew version IC
2. Loading thenew version softwarefromloadertool, TZSC07036.
Memorydatachange
ToexittheCD mode, press theRbutton on theremotecontrol.
9.1.3. SDmode
SelecttheSDmodebyUp/Downbutton on theremotecontrol atthefrontpageofCATmodethen
press theAction button on theremotecontrol.
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ToexittheSDmode, press theRbutton on theremotecontrol.
9.2. IICmodestructure(following itemsvalueissampledata.)
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10. Alignment
10.1. Pedestal setting (C)
Note:
OSDisthedifference betweenUYmodel and ExceptUYmodel. / Picture:Normal (ExceptUY)/
Standard (UYmodel)/ Whitebalance (ExceptUY)/Color Temp(UYmodel)
10.2. Pedestal setting (B)
Note:
OSDisthedifference betweenUYmodel and ExceptUYmodel. / Picture:Normal (ExceptUY)/
Standard (UYmodel)/ Whitebalance (ExceptUY)/Color Temp(UYmodel)
10.3. NTSCpanel white balance
10.4. PAL/ SECAMpanel white balance
10.5. PC/ RGBpanel white balance
10.6. HD / 525i / 525p/ 625I / 625Ppanel white balance
11. Troubleshooting guide
11.1. SelfCheck
1. Self-check isusedtoautomaticallycheck thebuslinecontrolled
circuitofthePlasmadisplay.
2. To get intotheSelf-check mode, press thevolumedownbutton on
thecustomercontrolsat thefrontoftheset, at thesametime
pressing theOFF-TIMERbutton on theremote control, and the
screenwill show :-
IftheCCU portshave beencheckedand found tobeincorrect
Ornotlocatedthen" --" will appearinplace of" OK"
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11.2. NoPower
11.2.1. PowerLEDBlinking timing chart
1. Subject
Information ofLEDFlashing timing chart.
2. Contents
Whenanabnormalityhas occurredtheunit, theprotection circuit
operates and reset tothestand bymode. Atthistime, thedefective
block canbeidentifiedbythenumberofblinkes ofthePowerLED
on thefrontpanel oftheunit.
3. Remarks
AboveFanfunction isoperatedduring thefansareinstalled.
11.2.2. PowerLEDno light
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11.3. NoPicture
11.4. Local screenfailure
Plasmadisplay may have local area failureon thescreen. Fig - 1 isthepossibledefectP.C.B. for
eachlocal area.
Fig-1
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12. Option Setting
12.1. How toaccess and setting
12.2. Contents ofOption Menu
Thischassisseries have special function and operation setting facilitycalledOption Menu. This
Option Menu isuseful for special function requiredcustomers. Thisshouldbesetatthe
installation stage. Theend usercouldnotsetor changethese becauseofhiddenOnscreenmenu.
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