Panasonic TH-60PF30W User manual

© Panasonic Corporation 2011
Unauthorized copying and distribution is a violation
of law.
Order Number ITD1109117CE
High Definition Plasma Display
Model No. TH-60PF30W
GPF14DMON Chassis

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TABLE OF CONTENTS
PAGE PAGE
1 Safety Precautions -----------------------------------------------3
1.1. General Guidelines ----------------------------------------3
1.2. Touch-Current Check--------------------------------------3
2Warning--------------------------------------------------------------4
2.1. Prevention of Electrostatic Discharge (ESD)
to Electrostatically Sensitive (ES) Devices ----------4
2.2. About lead free solder (PbF) ----------------------------5
3 Service Navigation------------------------------------------------6
3.1. Service Hint--------------------------------------------------6
3.2. Applicable signals------------------------------------------7
4 Specifications ------------------------------------------------------9
5 Operating Instructions ---------------------------------------- 10
6 Service Mode ----------------------------------------------------- 12
6.1. CAT (Computer Aided Test) mode ------------------- 12
6.2. IIC mode structure (following items value is
sample data)----------------------------------------------- 16
7 Troubleshooting Guide---------------------------------------- 17
7.1. Self Check ------------------------------------------------- 17
7.2. No Power--------------------------------------------------- 19
7.3. No Picture-------------------------------------------------- 19
7.4. Local screen failure-------------------------------------- 20
8 Service Fixture & Tools --------------------------------------- 21
8.1. SC jig -------------------------------------------------------- 21
9 Disassembly and Assembly Instructions --------------- 22
9.1. Removal of Rear Cover--------------------------------- 22
9.2. Removal of Slot Block----------------------------------- 22
9.3. Removal of DS-Board----------------------------------- 22
9.4. Removal of D-Board------------------------------------- 22
9.5. Removal of HX-Board----------------------------------- 22
9.6. Removal of A-Board------------------------------------- 23
9.7. Removal of Fan------------------------------------------- 23
9.8. Removal of P-Board (MAIN) -------------------------- 24
9.9. Removal of P-Board (SUS)---------------------------- 24
9.10. Removal of AC Inlet Assy------------------------------ 24
9.11. Removal of H3-Board ----------------------------------- 24
9.12. Removal of SU-Board and SD-Board--------------- 25
9.13. Removal of SC-Board----------------------------------- 25
9.14. Removal of SS-Board----------------------------------- 25
9.15. Removal of SS2-Board --------------------------------- 26
9.16. Removal of C1-Board ----------------------------------- 26
9.17. Removal of C2-Board ----------------------------------- 26
9.18. Removal of C3-Board ----------------------------------- 27
9.19. Removal of S1-Board ----------------------------------- 27
9.20. Removal of Front Glass, V1, V2-Board and
Cabinet Assy ---------------------------------------------- 27
9.21. Removal of Plasma Display Panel------------------- 29
10 Measurements and Adjustments -------------------------- 33
10.1. Adjustment------------------------------------------------- 33
10.2. Adjustment------------------------------------------------- 34
11 Block Diagram --------------------------------------------------- 39
11.1. Main Block Diagram ------------------------------------ 39
11.2. Block (1 of 6) Diagram ---------------------------------- 40
11.3. Block (2 of 6) Diagram ---------------------------------- 41
11.4. Block (3 of 6) Diagram ---------------------------------- 42
11.5. Block (4 of 6) Diagram ---------------------------------- 43
11.6. Block (5 of 6) Diagram ---------------------------------- 44
11.7. Block (6 of 6) Diagram ---------------------------------- 45
12 Wiring Connection Diagram --------------------------------- 47
12.1. Wiring (1) -------------------------------------------------- 47
12.2. Wiring (2) -------------------------------------------------- 48
13 Schematic Diagram
14 Printed Circuit Board
15 Exploded Viewand Replacement Parts List
15.1. Exploded View
15.2. Electrical Replacement Parts List

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TH-60PF30W
1 Safety Precautions
1.1. General Guidelines
1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the
wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3. When conducting repairs and servicing, do not twist the Fasten connectors but plug them straight in or unplug them straight
out.
4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.2. Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground
such as a water pipe, as shown in Figure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUCH CURRENT) expressed as voltage U1and U2, does not exceed the following values:
For a. c.: U1= 35 V (peak) and U2= 0.35 V (peak);
For d. c.: U1= 1.0 V,
Note:
The limit value of U2= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
mA d. c.
The limit value U1= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
Figure 1

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2Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).

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2.2. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

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TH-60PF30W
3 Service Navigation
3.1. Service Hint
Board Name Function Board Name Function
A Digital Signal Processor, Microcomputer
Audio Processor, Speaker Out Amplifier
C1 Data drive (Right)
C2 Data drive (Center)
DS Slot Interface C3 Data drive (Left)
D Format Converter, Plasma AI Processor
Sub-Field Processor, Sync Processor
S1 Power switch
V1 Remote receiver, LED-G, R
SC Scan drive V2 Key switch
SU Scan out (Upper)
Non serviceable.
SU-Board should be exchanged for service.
P (MAIN) Power supply
SD Scan out (Lower)
Non serviceable.
SD-Board should be exchanged for service.
P (SUS) Power supply
SS Sustain drive H3 Speaker terminal
SS2 Sustain out HX PC / RS-232C_Input terminal, 3D Signal out, Speaker
terminal (L)

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3.2. Applicable signals

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4 Specifications
Power Source 220 - 240 V AC, 50/60 Hz
Power Consumption
Power on 475 W
Stand-by condition Save off 0.8 W, Save on 0.5 W
Power off condition 0.3 W
Plasma Display panel Drive method: AC type 60-inch,
16:9 aspect ratio
Screen size 1,330 mm (W) ×748 mm (H) ×1,526 mm (diagonal)
(No. of pixels) 2,073,600 (1,920 (W) ×1,080 (H)) [5,760 ×1,080 dots]
Operating condition
Temperature 0 °C - 40 °C
Humidity 20 % - 80 %
Applicable signals
Color System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 525 (480) / 60i 60p, 625 (575) / 50i 50p, 750 (720) / 60p 50p, 1125 (1080) /
60i 60p 50i 50p 24p 25p 30p 24sF, 1250 (1080) / 50i
PC signals VGA, SVGA, XGA, SXGA
UXGA ..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
Connection terminals
LAN RJ45 10BASE-T/100BASE-TX, compatible with PJLinkTM
AV IN
VIDEO BNC 1.0 Vp-p (75 Ω)
AUDIO L-R RCA Pin jack ×2 0.5 Vrms
HDMI TYPE A Connector
COMPONENT / RGB IN
Y / G BNC with sync 1.0 Vp-p (75 Ω)
PB/CB/B BNC 0.7 Vp-p (75 Ω)
PR/CR/R BNC 0.7 Vp-p (75 Ω)
AUDIO L-R RCA Pin jack ×2 0.5 Vrms
DVI-D IN DVI-D 24 Pin Compliance with DVI Revision 1.0
Content Protection Compatible with HDCP 1.1
AUDIO Stereo mini jack (M3) ×1 0.5 Vrms, Shared with PC IN
PC IN High-Density Mini D-sub 15 Pin Y or G with sync 1.0 Vp-p (75 Ω)
Y or G without sync 0.7 Vp-p (75 Ω)
PB/ CB/ B:0.7 Vp-p (75 Ω)
PR/ CR/ R:0.7 Vp-p (75 Ω)
HD / VD:1.0 - 5.0 Vp-p (high impedance)
AUDIO Stereo mini jack (M3) ×1 0.5 Vrms, Shared with DVI-D IN
SERIAL External Control Terminal
D-sub 9 Pin RS-232C compatible
3D IR TRANSMITTER for 3D IR TRANSMITTER
3D SHUTTER OUT M3 jack ×1
DC 8V OUT Center plus, for EIAJ 4mm plug
EXT SP 6 Ω, 16 W [8 W + 8 W] (10 % THD)
Accessories Supplied
Remote Control Transmitter N2QAYB000535
Batteries R6 Size ×2
Clamper TMME289 ×1
Ferrite Core J0KG00000014 ×2
Dimensions (W ×H ×D) 1,434 mm ×852 mm ×99 mm
Mass (weight)
main unit only approx. 49.0 kg net
with speakers approx. 55.0 kg
Note:
• Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.

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5 Operating Instructions

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GPF14DMON chassis series have special function and operation setting facility called Option Menu. This Option Menu is
useful for special function required customers. This should be set at the installation stage.
Note:
When both main unit buttons and remote control are disabled due to the “Button lock”, “Remocon User level” or “Remote ID”
adjustments, set all the values “Off” so that all the buttons are enabled again.
Press the “Volume down” button on main unit together with “R” button on the remote control and hold for more than 5 seconds.
The “Shipping“ menu is displayed and the lock is released when it disappears.
Option Menu for GPF14DMON series
Option menus default setting Contents
Weekly Command Timer --- Sets Weekly Command Timer.
Audio input select --- Set up the sound when an image input is selected.
Touch Panel settings --- Set while using Touch Panel (available as an option).
Onscreen display On Enable/Disable to display input mode indication after power on and no signal
indication.
Initial input Off Sets the initial input mode when the power is turned on. Allow input mode selec-
tion while power is on.
Initial VOL level Off Sets the initial volume level when the power is turned on. Allow Volume control
while power is on.
Maximum VOL level Off Sets the maximum volume to desired level. Volume cannot exceed this level.
Input lock Off Fixes the input mode to PC, VIDEO, Component/RGB, HDMI or DVI. Can not
change input mode by input selection key.
Button lock Off Enable/Disable bottom operation buttons (Input, Menu, Enter and/or volume up/
down)
Remocon User level Off Remote key invalidation.
Off: Valid key is all key of remote.
User1: Valid key are only Stand-by (ON/OFF), Input, RECALL, Sound mute On/
Off, and volume adjustment.
User2: Valid key is only Stand-by (ON/OFF).
User3: All keys are null and void
Off-timer function Enable Off-timer operation Enable/Disable.
Initial Power Mode Normal Sets the power mode of the unit for when the power recovers from failure or
after plugging off and in again.
ID select 0 Sets panel ID number when panel is used in “Remote ID”or ”Serial ID”.
Set value range: 0 - 100.
(Standard value: 0)
Remote ID Off Remote ID function On/Off.
(While the Remote ID on, standard remote function can not control the unit.)
Serial ID Off Serial ID function On/Off
Display size Off Display size function On/Off
Studio W/B Off Studio W/B function On/Off
Studio Gain Off Studio Gain function On/Off
Slot power Off Off: Power is not transmitted to the slot power.
Auto: Power is transmitted to the slot power only when main power is on.
On: Power is transmitted to the slot power when main power is on or in the
standby state.
Power On Screen Delay Off You can set the power-on delay time of the displays to reduce the power load,
when you press to turn on the multiple displays that are set together, for
example, on MULTI DISPLAY system.
Set each display’s setting individually.
Clock Display Off The clock is displayed at the lower left of the screen when “RECALL“button is
pressed.
All Aspect Off Aspect mode: default/All aspect mode.
Auto Setup Manual Sets the operational mode of the automatic position adjustment in the POS./
SIZE menu.
Rotate Off Rotate function On/Off
Power On Message (No activity power
off)
On Whether to show/hide No activity power off Precautions at the time of power ON
is set.
3D Safety Precautions On 3D Safety Precautions show/hide is set during power ON.
When the setting changes from “On“to “Off“, the confi rmation screen is dis-
played as below.
Pressing “YES“switches the setting.

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6 Service Mode
6.1. CAT (Computer Aided Test) mode
To exit the CAT mode, access the ID mode and switch off the main power.
6.1.1. IIC mode
Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button on
the remote control.
Subject and item are mentioned on “IIC mode structure”.
To exit the IIC mode, press the R button on the remote control.

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6.1.2. CD mode
Select the CD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on
the remote control more than 3 seconds.
Memory data change
To exit the CD mode, press the R button on the remote control.
6.1.3. NW mode
Note :
To use the network function, set each “Network Setup” setting and make sure to set the “Control I/F Select” to “LAN”.
Select the NW mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button
on the remote control.
To exit the NW mode, press the R button on the remote control.

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6.1.4. SD mode
Select the SD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button on
the remote control.
To exit the SD mode, press the R button on the remote control.
6.1.5. MS mode
Select the MS mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on
the remote control more than 3 seconds.
To exit the MS mode, press the R button on the remote control.
Caution:
Market Select should be set after exchange of A-Board.
Destination number
Default setting
Number Model (Destination)
0 60/65PF30 (Japan)
1 60/65PF30U (North America)
3 60/65PF30W (Asia, Oceania, ME)
5 65PF30T (Taiwan)
15 65PF30G (Global)
18 60/65PF30C (China)
20 60/65PF30ER (Europe, CIS)
Number Destination
1 North America

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6.1.6. ID mode
Select the ID mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on
the remote control more than 3 seconds.
To exit the ID mode, press the R button on the remote control.

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6.2. IIC mode structure (following items value is sample data)

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7 Troubleshooting Guide
7.1. Self Check
7.1.1. Display Indication
1. Self-check is used to automatically check the bus line
controlled circuit of the Plasma display.
2. To get into the Self-check mode, press the volume down
button on the customer controls at the bottom of the set,
at the same time pressing the OFF-TIMER button on the
remote control, and the screen will show.
If the IIC ports have been checked and found to be incorrect
Or not located then “ - - ” will appear in place of “ OK ”
“ 01 ” in the line of the “ PTCT ” means the number of blinks of
the Power LED is 1. (Reference to 7.1.2)
“ H09 ” in the line of the “ PTCT ” is the error code.
To exit the CAT mode switch off the main power.
Note:
The line of the “ PTCT ” displays when you get into the Self-
check mode for the first time only after the Power LED
blinks.

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7.1.2. Power LED Blinking timing chart
1. Subject
Information of LED Blinking timing chart.
2. Contents
When an abnormality has occurred to the unit, the protection circuit operates and resets to the stand by mode. At this time,
the defective block can be identified by the number of blinks of the Power LED on the front panel of the unit.
*Refer to 7.1.1 Display Indication

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7.2. No Power
First check point
There are following 3 states of No Power indication by power LED.
1. No lit.
2. Green is lit then turns red blinking a few seconds later.
3. Only red is lit.
7.3. No Picture

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7.4. Local screen failure
Plasma display may have local area failure on the screen. Fig - 1 is the possible defect P.C.B. for each local area.
Fig - 1