Panasonic TH-50PHW6BX User manual

Power Source: AC120V 50/60Hz (UY version)
AC220-240V 50/60Hz
(Except UY version model)
Power Consumption: 445 W
Save off 1.6 W, Save on 0.9 W (stand-by
condition)
(UY version)
Save off 1.9 W, Save on 1.1 W (stand-by
condition)
(Except UY version model)
0.2 W (Power off condition)
(UY version model)
0.4 W (Power off condition)
(Except UY version model)
Plasma Display panel: Drive method AC type
16:9 aspect ratio
Contrast Ratio 3000:1
Screen size: 1,106 mm (W) × 622 mm (H)
1,269 mm (diagonal)
No. of pixels
1,049,088 (1,366 (W) × 768 (H))
[4,098 × 768 dots]
Operating condition:
Temperature 34 °F - 104 °F (0 °C - 40 °C)
Humidity 20 % - 80 %
Horizontal scanning frequency 15 - 110kHz
Vertical scanning frequency 48 - 120Hz
©2003 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-50PHW6BX
TH-50PHW6EX
TH-50PHD6EX
TH-50PHD6BX
TH-50PHD6UY
GPH6D2 Chassis
Connection terminals:
AV
Video in 1.0 Vp-p (75-ohm)
S-VIDEO IN
(MINI DIN 4PIN) Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)
AUDIO IN
(RCA PIN JACK × 2) 0.5 Vrms (high impedance)
COMPONENT/RGB
Y/G 1.0 Vp-p/composite (75-ohm)
0.7 Vp-p/non-composite (75-ohm)
PB/B 0.7 Vp-p (75-ohm)
PR/R 0.7 Vp-p (75-ohm)
HD 1.0 - 5.0 Vp-p (high impedance)
VD 1.0 - 5.0 Vp-p (high impedance)
AUDIO IN
(RCA PIN JACK×2)
0.5 Vrms (high impedance)
PC
(HIGH-DENSITY
D-SUB15PIN)
R,G,B/0.7 Vp-p (75-ohm)
HD, VD/1.0 - 5.0 Vp-p (high
impedance)
AUDIO IN (M3 JACK) 0.5Vrms (high impedance)
SERIAL
EXTERNAL CONTROL
TERMINAL (D-SUB9PIN)
RS-232C COMPATIBLE
SPEAKERS (External
speakers) (69
99
9)16W [8W+8W] (10% THD)
High Definition Plasma Display
Specifications
ORDER NO. ITD0309034C0
D10 Canada: B07

Dimensions (W×H×D): 1,210 mm × 724 mm 95 mm
1 Applicable signals 4
2 Safety Precautions 5
2.1. General Guidelines 5
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
4 About lead free solder (PbF) 7
5 PCB Structure sheet of GPH6D2 chassis 8
6 Service Hint 9
7 Location of Lead Wiring 10
8 Adjustment Procedure 11
8.1. Driver Set-up 11
8.2. Initialization Pulse Adjust 12
8.3. P.C.B. (Printed Circuit Board) exchange 13
8.4. Adjustment Volume Location 13
8.5. Test Point Location 13
9 Service mode 14
9.1. CAT (computer Aided Test) mode 14
9.2. IIC mode structure (following items value is sample data.)
16
10 Alignment 17
10.1. Pedestal setting (C) 17
10.2. Pedestal setting (B) 18
10.3. NTSC panel white balance 19
10.4. PAL/SECAM panel white balance 20
10.5. PC/RGB panel white balance 22
10.6. HD/ 525i /525p /625I /625P panel white balance 24
11 Trouble shooting guide 26
11.1. Self Check 26
11.2. No Power 26
11.3. No Picture 28
11.4. Local screen failure 28
12 Option Setting 29
12.1. How to access and setting 29
12.2. Contents of Option Menu 30
13 Conductor Views 31
13.1. PF-Board 31
13.2. P-Board 32
13.3. HX-Board 34
13.4. HY-Board 35
13.5. J-Board 37
13.6. D-Board 39
13.7. C1-Board 42
13.8. C2-Board 43
Weight (Mass) approx. 43.5 kg net (main unit only)
approx. 48.1 kg net (with speakers)
13.9. C3-Board 44
13.10. C4-Board 45
13.11. C5-Board 46
13.12. C6-Board 47
13.13. SC-Board 48
13.14. SU-Board 51
13.15. SD-Board 52
13.16. SS, SS2 and SS3-Board 53
13.17. Z-Board 55
13.18. V1, S1 and H3-Board 56
14 Schematic Diagrams 57
14.1. Schematic Diagram Notes 57
14.2. Main Block Diagram 58
14.3. P and PF-Board Block Diagram 59
14.4. PF-Board Schematic Diagram 60
14.5. P-Board (1 of 6) Schematic Diagram 61
14.6. P-Board (2 of 6) Schematic Diagram 62
14.7. P-Board (3 of 6) Schematic Diagram 63
14.8. P-Board (4 of 6) Schematic Diagram 64
14.9. P-Board (5 of 6) Schematic Diagram 65
14.10. P-Board (6 of 6) Schematic Diagram 66
14.11. HX-Board Block Diagram 67
14.12. HX-Board Schematic Diagram 68
14.13. HY-Board Block Diagram 69
14.14. HY-Board (1 of 3) Schematic Diagram 70
14.15. HY-Board (2 of 3) Schematic Diagram 71
14.16. HY-Board (3 of 3) Schematic Diagram 72
14.17. J-Board Block Diagram 73
14.18. J-Board (1 of 4) Schematic Diagram 74
14.19. J-Board (2 of 4) Schematic Diagram 75
14.20. J-Board (3 of 4) Schematic Diagram 76
14.21. J-Board (4 of 4) Schematic Diagram 77
14.22. D-Board (1 of 2) Block Diagram 78
14.23. D-Board (2 of 2) Block Diagram 79
14.24. D-Board (1 of 15) Schematic Diagram 80
14.25. D-Board (2 of 15) Schematic Diagram 81
14.26. D-Board (3 of 15) Schematic Diagram 82
14.27. D-Board (4 of 15) Schematic Diagram 83
14.28. D-Board (5 of 15) Schematic Diagram 84
14.29. D-Board (6 of 15) Schematic Diagram 85
14.30. D-Board (7 of 15) Schematic Diagram 86
14.31. D-Board (8 of 15) Schematic Diagram 87
14.32. D-Board (9 of 15) Schematic Diagram 88
CONTENTS Page Page
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TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY

14.33. D-Board (10 of 15) Schematic Diagram 89
14.34. D-Board (11 of 15) Schematic Diagram 90
14.35. D-Board (12 of 15) Schematic Diagram 91
14.36. D-Board (13 of 15) Schematic Diagram 92
14.37. D-Board (14 of 15) Schematic Diagram 93
14.38. D-Board (15 of 15) Schematic Diagram 94
14.39. C1, C2, C3, C4, C5, C6 and V1-Board Block Diagram (1
of 2) 95
14.40. C1, C2, C3, C4, C5, C6 and V1-Board Block Diagram (2
of 2) 96
14.41. C1-Board (1 of 2) Schematic Diagram 97
14.42. C1-Board (2 of 2) Schematic Diagram 98
14.43. C2-Board Schematic Diagram 99
14.44. C3-Board (1 of 2) Schematic Diagram 100
14.45. C3-Board (2 of 2) Schematic Diagram 101
14.46. C4-Board (1 of 2) and V1-Board Schematic Diagram 102
14.47. C4-Board (2 of 2) Schematic Diagram 103
14.48. C5-Board Schematic Diagram 104
14.49. C6-Board (1 of 2) Schematic Diagram 105
14.50. C6-Board (2 of 2) Schematic Diagram 106
14.51. SC-Board Block Diagram 107
14.52. SC-Board (1 of 3) Schematic Diagram 108
14.53. SC-Board (2 of 3) Schematic Diagram 109
14.54. SC-Board (3 of 3) Schematic Diagram 110
14.55. SU-Board Block Diagram 111
14.56. SU-Board (1 of 2) Schematic Diagram 112
14.57. SU-Board (2 of 2) Schematic Diagram 113
14.58. SD-Board Block Diagram 114
14.59. SD-Board (1 of 2) Schematic Diagram 115
14.60. SD-Board (2 of 2) Schematic Diagram 116
14.61. SS, S1, SS2 and SS3-Board Block Diagram 117
14.62. SS-Board (1 of 2) and S1-Board Schematic Diagram 118
14.63. SS-Board (2 of 2), SS2 and SS3-Board Schematic
Diagram 119
14.64. Z-Board and H3-Board Block Diagram 120
14.65. Z-Board (1 of 2) and H3-Board Schematic Diagram 121
14.66. Z-Board (2 of 2) Schematic Diagram 122
15 Parts Location 123
16 Mechanical Replacement Parts List 124
17 Replacement Parts List 126
17.1. Relpacement Parts List Notes 126
17.2. Electrical Replacement List 127
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TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY

1 Applicable signals
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TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY

2.1.1. Leakage Current Cold Check
1.Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2.Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1M9and 5.2M9.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1.Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2.Connect a 1.5k9, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3.Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4.Check each exposed metallic part, and measure the
voltage at each point.
5.Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6.The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
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TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY

3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY

4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution


·

Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).


·

Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.


·

After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
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TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY

5 PCB Structure sheet of GPH6D2 chassis
Board Name Function Remarks
DDigital Signal Processor 1
JSlot Interface & SYNC processor 1
ZAudio out, DC-DC converter
SS Sustain Out 1
SC Scan out 1
SU Sustain connection (Upper) 1
SD Sustain connection (Lower) 1
C1 Data Drive (Upper Right)
C2 Data Drive (Upper Center)
C3 Data Drive (Lower Left)
C4 Data Drive (Lower Left)
C5 Data Drive (Lower Center)
C6 Data Drive (Lower Right)
H3 Speaker terminal
S1 Power switch
SS2 Sustain connection (Upper)
SS3 Sustain connection (Lower)
V1 Front SW. & Remote receiver
PF Line filter
PPower supply 1
HX PC_type_Input terminal
HY BNC Composite/Component Video 2
HZ BNC Component Video 3
Remarks
1.Recommend PCB´s for initial service for GPH6D2 chassis.
2.For System model except BX, EX version
3.For Consumer model except BX, EX version
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TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY

6 Service Hint
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TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY

7 Location of Lead Wiring
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TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY

8.1. Driver Set-up
8.1.1. Item / Preparation
1.Input an APL 100 % white signal.
2.Set the picture controls: -
Picture mode: Normal
White balance: Cool
Aspect: 16:9
8.1.2. Adjustments
Adjust driver section voltages referring the panel data on the
panel data label.
Name Test Point Voltage Volume Remarks
Vsus TPVSUS
(SS) 173V ± 2V VR641 (P)
Vset TPVSET
(SC) 220V ± 5V ---
Vbk TPVBK (SC) 140V ± 1V R6670 (SC)
Vad TPVAD (SC) -85V ± 1V R6477 (SC)
Vscn TPVSCN
(SC) Vad*+118V ± 2V ---
Ve TPVE (SS) 150V ± 1V R6770 (SS)
Vda TPVDA (SS) 75V ± 1V VR665 (P)
*See the Panel label.
8 Adjustment Procedure
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TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY

8.2. Initialization Pulse Adjust
1.Input a Cross hatch signal.
2.Set the picture controls: -
Picture mode: Normal
White balance: Cool
Adjust the indicated test point for the specified wave form.
Test point Volume Level
T1 TPSC1 (SC) --- 20 ± 15µ Sec
T2 TPSS1 (SS) R6557 (SC) 155 ± 10µ Sec
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TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY

8.3. P.C.B. (Printed Circuit Board) exchange
8.3.1. Caution
1.To remove P.C.B. , wait 1 minute after power was off for discharge from electrolysis capacitors.
8.3.2. Quick adjustment after P.C.B. exchange
P.C.B. Name Test Point Voltage Volume Remarks
P Board Vsus TPVSUS (SS) 173V ± 2V R641 (P)
Vda TPVDA (SS) 75V ± 1V R665 (P)
SC Board Vad TPVAD (SC) 85V ± 1V R6477 (SC)
Vset TPVSET (SC) 220V ± 5V ---
Vscn TPVSCN (SC) Vad + 118 ± 2V ---
Vbk TPVBK (SC) 140 ± 1V R6670 (SC)
SS Board Ve TPVE (SS) 150V ± 1V R6770 (SS)
D, J Board White blance, Pedestal and Sub brightness for NTSC, PAL, HD, PC and 625i signals
*See the Panel label.
8.4. Adjustment Volume Location
8.5. Test Point Location
13
TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY

9 Service mode
9.1. CAT (computer Aided Test) mode
To exit the CAT mode, access the ID mode and switch off the main power.
9.1.1. IIC mode
Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode then press the Action button on
the remote control.
Subject and item are mentioned on page 14.
To exit the IIC mode, press the R button on the remote control.
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TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY

9.1.2. CD mode
Select the CD mode by Up/Down button on the remote control at the front page of CAT mode then press the Mute button on the
remote control more than 5 sec.
Micom software version (IC9705), this version can be upgrade by
1.replace of new version IC
2.Loading the new version software from loader tool, TZSC07036.
Memory data change
To exit the CD mode, press the R button on the remote control.
9.1.3. SD mode
Select the SD mode by Up/Down button on the remote control at the front page of CAT mode then press the Action button on the
remote control.
To exit the SD mode, press the R button on the remote control.
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TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY

9.2. IIC mode structure (following items value is sample data.)
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TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY

10 Alignment
10.1. Pedestal setting (C)
** Adjust at the dark room.
1
Component
Picture: PANEL W/B
(525i, 525p, 625i,
Normal R cut off 1) Set R,G and B cut off to " 80 ".
720i or 1080i)
White balance: G cut off
Cool B cut off
Gray Scale
Aspect: Chroma Control:
Pattern
16:9
COMPONENT
/RGB-IN: RGB
Gun off 2) Set Gun off to "5". (Only green pixels can emit.)
RGB Sub Adjust:
G Sub Bright 1 3) Adjust G Sub bright to start some of green pixels emission
at black 2% area and no emission at black 0% area.
Chroma Control:
Gun off 4) Set Gun off to "3". (Only blue pixels can emit.)
RGB Sub Adjust:
Black 2 %
B Sub Bright 1 5) Adjust B Sub bright to start some of blue pixels emission
Black 0 %
at black 2% area and no emission at black 0% area.
Chroma Control:
Gun off 6) Set Gun off to "6". (Only red pixels can emit.)
RGB Sub Adjust:
R Sub Bright 1 7) Adjust R Sub bright to start some of red pixels emission
at black 2% area and no emission at black 0% area.
2
RGB(PC)
Picture: 1) Change input to Component signal.
Gray Scale
Normal PANEL W/B
Pattern
White balance: R,G,B cut off 2) Repeat procedure 1) to 7) of RGB input signal.
Cool PANEL W/B
Aspect: R,G,B Drive
16:9
Black 2 %
Black 0 %
INPUT Alignment menu ProcedureEquipment Setting
Note:
OSD is the difference between UY model and Except UY model.
Picture: Normal (Except UY)/Standard (UY model)
White balance (Except UY)/Color Temp (UY model)
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TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY

10.2. Pedestal setting (B)
** Adjust at the dark room.
1
Component
Picture: PANEL W/B
(525i, 525p, 625i,
Normal R cut off 1) Press the SWAP button, change input to signal path.
2) Set R,G and B cut off to "
720i or 1080i)
White balance: G cut off
Cool B cut off
Gray Scale
Aspect: Chroma Control:
Pattern
16:9
COMPONENT
/RGB-IN: RGB
Gun off 3) Set Gun off to "5". (Only green pixels can emit.)
RGB Sub Adjust:
G Sub Bright 2 4) Adjust G Sub bright to start some of green pixels emission
at black 2% area and no emission at black 0% area.
Chroma Control:
Gun off 5) Set Gun off to "3". (Only blue pixels can emit.)
RGB Sub Adjust:
Black 2 %
B Sub Bright 2 6) Adjust B Sub bright to start some of blue pixels emission
Black 0 %
at black 2% area and no emission at black 0% area.
Chroma Control:
Gun off 7) Set Gun off to "6". (Only red pixels can emit.)
RGB Sub Adjust:
R Sub Bright 2 8) Adjust R Sub bright to start some of red pixels emission
at black 2% area and no emission at black 0% area.
2
RGB(PC)
Picture: 1) Change input to Component signal.
Gray Scale
Normal PANEL W/B
Pattern
White balance: R,G,B cut off 2) Repeat procedure 1) to 7) of RGB input signal.
Cool PANEL W/B
Aspect: R,G,B Drive
16:9
Black 2 %
Black 0 %
INPUT Alignment menu ProcedureEquipment Setting
Note:
OSD is the difference between UY model and Except UY model.
Picture: Normal (Except UY)/Standard (UY model)
White balance (Except UY)/Color Temp (UY model)
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TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY

10.3. NTSC panel white balance
1 NTSC Color Picture: 1) Find the nearest area to brightness of 10 cd/m 2 as Low
Gray Scale Analyzer Normal Sub Adjust light by color sensor.
Pattern White balance: Sub Bright 2) Adjust Sub bright to set Low light level to 10 cd/m
2
Cool exactly.
Aspect: PANEL W/B
16:9 G cut off 3) Set G cut off to " 80 ".
PANEL W/B
B cut off 4) Adjust B and R cut off to set color temperature as
R cut off shown Fig.-01.
High light 75% Sub Adjust
Low light 15% Sub Bright 5) If Sub Bright is changed re-adjust it to set Low light
to 10 cd/m
2 .
6)Find 75% of white area by color sensor.
PANEL W/BG Drive 7) Set G Drive to " D8 ".
PANEL W/BB Drive 8) Adjust B and R Drive to set color temperature
R Drive as shown Fig.-01.
9) Repeat item 4) to 7) to set both Low light and
high light.
PANEL W/B
R,G,B Drive 10) Increase same steps of R, G and B Drive to set
R,G,B Drive largest level of 3 color drive to "FC".
PANEL W/B
R,G,B cut off 11) Re-adjust Low light level again.
Color Temp. x y
Cool(Hi) 0.276 0.276
Normal(Mid) 0.288 0.296
Warm(Low) 0.313 0.329
Fig. -01
2 Picture: 1) Change white balance to "Normal".
Normal PANEL W/B
White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.
Normal PANEL W/B
Aspect: R,G,B Drive
16:9
3 Picture: 1) Change white balance to "Warm".
Normal PANEL W/B
White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.
Warm PANEL W/B
Aspect: R,G,B Drive
16:9
4 Picture: Picture Menu 1) Change color templature to "Cool".
Normal Sub Adjust
White balance: Sub Bright 2)Re-set Sub bright to "30"
Cool
Aspect: 16:9
INPUT Alignment menu ProcedureEquipment Setting
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TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY

10.4. PAL/SECAM panel white balance
1 PAL Color Picture: 1) Find the nearest area to brightness of 10 cd/m2 as Low
Gray Scale Analyzer Normal Sub Adjust light by color sensor.
Pattern White balance: Sub Bright 2) Adjust Sub bright to set Low light level to 10 cd/m2
Cool exactly.
Aspect: PANEL W/B
16:9 G cut off 3) Set G cut off to " 80 ".
PANEL W/B
B cut off 4) Adjust B and R cut off to set color temperature as
R cut off shown Fig.-02.
High light 75% Sub Adjust
Low light 15% Sub Bright 5) If Sub Bright is changed re-adjust it to set Low light
to 10 cd/m2.
6)Find 75% of white area by color sensor.
PANEL W/BG Drive 7) Set G Drive to " D8 ".
PANEL W/BB Drive 8) Adjust B and R Drive to set color temperature
R Drive as shown Fig.-02.
9) Repeat procedure 4) to 7) to set both Low light and
high light.
PANEL W/B
R,G,B Drive 10) Increase same steps of R, G and B Drive to set
R,G,B Drive largest level of 3 color drive to "FC".
PANEL W/B
R,G,B cut off 11) Re-adjust Low light level again.
Color Temp. x y
Cool(Hi) 0.276 0.276
Normal(Mid) 0.288 0.296
Warm(Low) 0.313 0.329
Fig. -02
2 Picture: 1) Change white balance to "Normal".
Normal PANEL W/B
White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.
Normal PANEL W/B
Aspect: R,G,B Drive
16:9
3 Picture: 1) Change white balance to "Warm".
Normal PANEL W/B
White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.
Warm PANEL W/B
Aspect: R,G,B Drive
16:9
4 Picture: Picture Menu 1) Change color templature to "Cool".
Normal Sub Adjust
White balance: Sub Bright 2)Re-set Sub bright to "30"
Cool
Aspect: 16:9
INPUT Alignment menu ProcedureEquipment Setting
20
TH-50PHW6BX / TH-50PHW6EX / TH-50PHD6EX / TH-50PHD6BX / TH-50PHD6UY