Panasonic TH42PS9UK - 42" PLASMA TV User manual

©2006 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-42PS9UK
GP9D Chassis
Progressive Wide Plasma Display
Specifications
Power Source 120 V
A
C, 50/60Hz
Power Consumption
Power on 290W
Stand-b
y
condition Save OFF 0.6W, Save ON 0.4 W
Power off condition 0.1 W
Plasma Displa
y
panel Drive method:
A
C type 42-inch,
16:9 aspect ratio
Contrast Ratio Ma
x
10000:1
Screen size 36.2” (920 mm) (W) × 20.4” (518 mm) (H) × 42” (1,056 mm) (diagonal)
(No. of pixels) 408,960 (852 (W) × 480(H))
[2,556 × 480 dots]
Operating condition
Temperature 32 °F - 104 °F (0 °C - 40 °C)
Humidit
y
20% - 80%
Applicabl
e
signals
Color System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 525 (480) / 60i 60p, 625 (575)
/
50i 50p, 750 (720)
/
60p 50p, 1125 (1080) / 60i 50i 24p 25p
30p 24sF.... SMPTE274M, 1250 (1080) / 50i
PC signals VG
A
SVGA, XGA, SXGA, UXGA..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
Connection terminals
A
V
VIDEO IN (BNC) 1.0 Vp-p (75 Ωor high impedance)
VIDEO OUT (BNC) 1.0 Vp-p (high impedance)
S VIDEO IN (MINI DIN 4PIN) Y: 1 Vp-p (75 Ω), C: 0.286 Vp-p (75Ω)
A
UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)
COMPONENT/RGB Y/G (BNC) 1.0 Vp-p
/
composite (75Ω)
0.7 Vp-p
/
non-composite (75Ω)
PB/ B (BNC), PR
/
R (BNC) 0.7 Vp-p (75Ω)
ORDER NO. MNTC060479CE
D10 Canada: B07

1 Applicable signals 4
2 Safety Precautions 5
2.1. General Guidelines 5
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
4 About lead free solder (PbF) 7
5 PCB Structure sheet of GP9D chassis 8
6 Service Hint 9
7 Disassembly 10
7.1. Removal of the Back Cover 10
7.2. Removal of the HU-Board 10
7.3. Removal of the HA-Board 10
7.4. Removal of the Slot Block 10
7.5. Removal of the J-Board 11
7.6. Removal of the HX-Board 11
7.7. Removal of the DA-Board 11
7.8. Removal of the P-Board 12
7.9. Removal of the D-Board 12
7.10. Removal of the H3-Board (L, R) 12
7.11. Removal of the SU-Board and the SD-Board 12
7.12. Removal of the SC-Board 13
7.13. Removal of the SS-Board 13
7.14. Removal of the C1, C2-Board 13
7.15. Removal of the S1-Board 14
7.16. Removal of the Escutcheon 14
7.17. Removal of the V1-Board and the V2-Board 15
7.18. Removal of the Plasma Panel 15
8 Location of Lead Wiring 18
8.1. Location of Lead Wiring (1) 18
8.2. Location of Lead wiring (2) 18
8.3. Location of Lead wiring (3) 19
8.4. Location of Lead Wiring (4) 19
9 Adjustment Procedure 20
9.1. Driver Set-up 20
9.2. Initialization Pulse Adjust 21
9.3. P.C.B. (Printed Circuit Board) exchange 21
9.4. Adjustment Volume Location 22
9.5. Test Point Location 22
10 Service mode 23
10.1. CAT (computer Aided Test) mode 23
10.2. IIC mode structure (following items value is sample data.)
26
11 Adjustment 27
11.1. RGB white balance adjustment 27
11.2. HD white balance adjustment 29
11.3. Power control adjustment 31
12 Trouble shooting guide 32
12.1. Self Check 32
A
UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)
PC (HIGH-DENSIT
Y
Mini-D-SUB 15PIN) R,G,B
/
0.7 Vp-p (75Ω)
HD, VD
/
1.0-5.0 Vp-p (high impedance)
Component
Y
:1.0 Vp-p (75Ω: include sync)
PB
/
CB:0.7 Vp-p (75Ω)
PR
/
CR:0.7 Vp-p (75Ω)
A
UDIO IN (M3 JACK) 0.5 Vrms (high impedance)
SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE
SPEAKERS (6Ω) 16W [8 W + 8W] (10% THD)
Accessories Supplied
Remote Control Transmitter EUR7636070R
Batteries 2×
AA
Size
Fixing bands (TMME203 or TMME187) × 2
Dimensions (
W
×H×D) 40.2” (1,020 mm) × 24” (610 mm) × 3.5” (89 mm)
Mass (weight)
main unit onl
y
approx. 57.3 lbs
with speakers approx. 66.1 lbs
Notes:
· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
CONTENTS
Page Page
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12.2. No Power 34
12.3. No Picture 34
12.4. Local screen failure 35
13 Option Setting 36
14 Conduct Views 39
14.1. P-Board 39
14.2. HA-Board 42
14.3. HU-Board 43
14.4. HX-Board 44
14.5. H3, S1, V1and V2-Board 45
14.6. J-Board 46
14.7. DA-Board 48
14.8. D-Board 50
14.9. C1-Board 52
14.10. C2-Board 53
14.11. SC-Board 54
14.12. SU-Board 57
14.13. SD-Board 58
14.14. SS-Board 59
15 Block and Schematic Diagram 61
15.1. Schematic Diagram Notes 61
15.2. Main Block Diagram 62
15.3. P-Board Block Diagram 63
15.4. P-Board (1 of 6) Schematic Diagram 64
15.5. P-Board (2 of 6) Schematic Diagram 65
15.6. P-Board (3 of 6) Schematic Diagram 66
15.7. P-Board (4 of 6) Schematic Diagram 67
15.8. P-Board (5 of 6) Schematic Diagram 68
15.9. P-Board (6 of 6) Schematic Diagram 69
15.10. HA-Board Block and Schematic Diagram 70
15.11. HU-Board Block Diagram 71
15.12. HU-Board (1 of 2) Schematic Diagram 72
15.13. HU-Board (1 of 2) Schematic Diagram 73
15.14. V1 and V2Board Block and Schematic Diagram 74
15.15. HX-Board Block and Schematic Diagram 75
15.16. J-Board (1 of 2) Block Diagram 76
15.17. J-Board (2 of 2) Block Diagram 77
15.18. J-Board (1 of 5) Schematic Diagram 78
15.19. J-Board (2 of 5) Schematic Diagram 79
15.20. J-Board (3 of 5) Schematic Diagram 80
15.21. J-Board (4 of 5) Schematic Diagram 81
15.22. J-Board (5 of 5) Schematic Diagram 82
15.23. DA-Board (1 of 2) Block Diagram 83
15.24. DA-Board (2 of 2) Block Diagram 84
15.25. DA-Board (1 of 6) Schematic Diagram 85
15.26. DA-Board (2 of 6) Schematic Diagram 86
15.27. DA-Board (3 of 6) Schematic Diagram 87
15.28. DA-Board (4 of 6) Schematic Diagram 88
15.29. DA-Board (5 of 6) Schematic Diagram 89
15.30. DA-Board (6 of 6) Schematic Diagram 90
15.31. D-Board Block Diagram 91
15.32. D-Board (1 of 6) Schematic Diagram 92
15.33. D-Board (2 of 6) Schematic Diagram 93
15.34. D-Board (3 of 6) Schematic Diagram 94
15.35. D-Board (4 of 6) Schematic Diagram 95
15.36. D-Board (5 of 6) Schematic Diagram 96
15.37. D-Board (6 of 6) Schematic Diagram 97
15.38. C1 and C2-Board Block Diagram 98
15.39. C1-Board (1 of 2) Schematic Diagram 99
15.40. C1-Board (2 of 2) Schematic Diagram 100
15.41. C2-Board (1 of 2) Schematic Diagram 101
15.42. C2-Board (2 of 2) Schematic Diagram 102
15.43. SC, SU and SD-Board Block Diagram 103
15.44. SC-Board (1 of 2) Schematic Diagram 104
15.45. SC-Board (2 of 2) Schematic Diagram 105
15.46. SU-Board Schematic Diagram 106
15.47. SD-Board Schematic Diagram 107
15.48. SS and S-Board Block Diagram 108
15.49. SS and S-Board Schematic Diagram 109
16 Parts Location 111
16.1. Parts Location (1) 111
16.2. Parts Location (2) 112
16.3. Accessories Box 113
16.4. Cable relation 114
17 Mechanical Replacement Parts List 115
18 Replacement Parts List 116
18.1. Replacement Parts List Notes 116
18.2. Electrical Replacement Parts List 117
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1 Applicable signals
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2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screw heads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MΩand 5.2MΩ.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
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3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
7
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5 PCB Structure sheet of GP9D chassis
Board Name Function Remarks
DA Digital Signal Processor, Micon 1
D Format Converter, Plasma AI Processor
Sub-Field Processor
1
J Slot Interface (Audio/Video/Sync input Switch),
SYNC processor, Sound processor,
1
SS Sustain drive 1
SC Scan drive 1
SU Scan out (Upper) 1
SD Scan out (Lower) 1
C1 Data Drive (Right)
C2 Data Drive (Left)
H3 Speaker terminal
S1 Power switch
V1 LED (Stand-by/Power on) & Remote receiver
V2 Key switch
P Power supply 1
HX PC / RS-232C_Input terminal
HU BNC Dual Video
HA BNC Component Video
Remarks
1: Recommend PCB´s for initial service for GP9D chassis.
8
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6 Service Hint
Note:
· Extension cable kit for Slot Board is supplied as service fixtures and tools.
(Parts No. TZSC0704)
9
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7 Disassembly
· To disassemble P.C.B., wait for 1 minute after power was
off for discharge from electrolysis capacitors.
· and marks indicate screw positions.
7.1. Removal of the Back Cover
1. Remove the screws (×16 ,×6 ,×4 ) and then remove
the Back Cover.
7.2. Removal of the HU-Board
1. Remove the 4 screws(A) and then remove the HU Terminal
Block.
2. Remove the 4 screws(B).
3. Remove the 3 screws(C) and then remove the HU-Board.
7.3. Removal of the HA-Board
1. Remove the 4 screws(D) and then remove the HA Terminal
Block.
2. Remove the 4 screws(E).
3. Remove the 2 screws(F) and then remove the HA-Board.
7.4. Removal of the Slot Block
1. Disconnect the couplers (J1, J2, J3, J4, J5, J6, J7, J8, J10,
J15).
2. Remove the 4 screws and then remove the Slot Block.
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7.5. Removal of the J-Board
1. Remove the HU Terminal Block and the HA Terminal Block.
(Reference to Removal of the HU-Board and the HA-Board)
2. Remove the Slot Block.
(Reference to Removal of the Slot Block)
3. The slot block is turned inside out.
4. Remove the 6 screws and then remove the Slot cover.
5. Remove the 6 screws, release the coupler(J14) from HX-
Board and then remove the J-Board.
7.6. Removal of the HX-Board
1. Remove the HU Terminal Block and the HA Terminal Block.
(Reference to Removal of the HU-Board and the HA-Board)
2. Remove the Slot Block.
(Reference to Removal of the Slot Block)
3. Remove the J-Board.
(Reference to Removal of the J-Board)
4. Remove the 2 screws and then remove the Slot Case.
5. Remove the 4 Hexagonal-Head screws and the 1 screw
and then remove the HX-Board.
7.7. Removal of the DA-Board
1. Disconnect the couplers(DA1, DA3, DA5, DA6).
2. Remove the Flexible Cable from the coupler(DA2).
3. Remove the 4 screws and then remove the DA-Board.
Note:
A re-setup of the destination is performed by MS mode
after DA-Board exchange.
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7.8. Removal of the P-Board
1. Disconnect the couplers(P2, P5, P9, P10, P11, P12, P23,
P25)
2. Remove the 6 screws and then remove the P-Board.
7.9. Removal of the D-Board
1. Remove the Slot Block.
(Reference to Removal of the Slot Block)
2. Disconnect the couplers(D5, D20, D25)
3. Remove the Flexible Cable from the couplers (D3, D31,
D32).
4. Remove the 4 screws and then remove the D-Board.
7.10. Removal of the H3-Board (L,
R)
1. Remove the each 1 screw and then remove the Speaker
Terminal Block (L, R).
2. Disconnect the coupler(H37).
3. Remove the 3 screws and then remove the H3-Board.
7.11. Removal of the SU-Board and
the SD-Board
1. Remove the each 2 screws.
2. Remove the Flexible Cable from the couplers(SU1, SU2,
SU3).
3. Remove the Flexible Cable from the couplers(SD1, SD2,
SD3).
4. Disconnect the couplers(SU45, SD46).
5. Slide the SU-Board and the SD-Board to the left, remove
the SU-Board and the SD-Board from the couplers(SC41,
SC42).
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7.12. Removal of the SC-Board
1. Disconnect the couplers(SU45, SD46).
2. Remove the 4 screws ( ) and then slide the SU-Board and
the SD-Board to the left.
3. Disconnect the couplers(SC2, SC20, SC23).
4. Remove the 6 screws and then remove the SC-Board.
7.13. Removal of the SS-Board
1. Disconnect the couplers(SS11, SS12, SS23, SS34).
2. Remove the Flexible Cable from the couplers(SS41, SS42,
SS43, SS44)
3. Remove the 6 screws and then remove the SS-Board.
7.14. Removal of the C1, C2-Board
1. Remove the Slot Block.
(Reference to Removal of the Slot Block)
2. Remove the each 3 screws and then remove the Stand
Block(L,R).
7.14.1. Removal of the C1-Board
1. Remove the Flexible Cable from the couplers(C11, C12).
2. Remove the 6 screws ( ) and then remove the Flexible
Cable from the couplers(CB1, CB2, CB3).
3. Remove the 3 screws ( ) and then remove the C1-Board.
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7.14.2. Removal of the C2-Board
1. Remove the Flexible Cable from the couplers(C21, C22).
2. Remove the 8 screws ( ) and then remove the Flexible
Cable from the couplers(CB4, CB5, CB6, CB7).
3. Remove the 4 screws ( ) and then remove the C2-Board.
7.15. Removal of the S1-Board
1. Disconnect the coupler(SS34).
2. Remove the 2 screws(H) and then remove the S1-Board
Block.
3. Disconnect the coupler(S34).
4. Remove the 1 screw(J) and then remove the S1-Board.
7.16. Removal of the Escutcheon
1. Remove the S1-Board Block.
(Remove to the Removal of the S1-Board)
2. Disconnect the couplers(J2, J15)
3. Remove the 2 screws of the Escutcheon.
4. Pull the bottom of the Escutcheon in the direction of the
arrow 1 and then lift up the Escutcheon to remove in the
direction of the arrow 2.
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7.17. Removal of the V1-Board and
the V2-Board
1. Remove the Escutcheon.
(Reference to Removal of the Escutcheon)
2. Remove the 5 screws and then remove the Fixed Angle.
3. Remove the 1 screw(K).
4. Remove the operation button from the V2-Board.
5. Disconnect the coupler(V15) and then remove the V2-
Board.
6. Disconnect the coupler(V2) and then remove the V1-Board.
7.18. Removal of the Plasma Panel
1. Remove the each 3 screws ( ) and then remove the Stand
Black(L, R).
2. Remove the each 1 screw ( ) and then remove the
Speaker Terminal Black(L, R).
3. Disconnect the couplers(J1, J2, J3, J4, J5, J6, J7, J8, J10,
J15).
4. Remove the 4 screws and then remove the Slot Block.
5. Disconnect the coupler(DA5).
6. Remove the Flexible Cable from the couplers(DA2).
7. Remove the 4 screws and then remove the DA-Board
Block.
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8. Disconnect the couplers(P2, P9, P11, P12, P23, P25).
9. Remove the 6 screws and then remove the P-Board.
10. Disconnect the coupler(D20).
11. Remove the Flexible Cable from the couplers(D31, D32).
12. Remove the 4 screws and then remove the D-Board.
13. Remove the SU-Board and the SD-Board.
(Reference to Removal of the SU-Board and the SD-Board)
14. Remove the 6 screws and then remove the SC-Board.
15. Disconnect the couplers(SS23, SS34).
16. Remove the Flexible Cable from the couplers(SS41, SS42,
SS43, SS44)
17. Remove the 6 screws and then remove the SS-Board.
18. Remove the Flexible Cable from the coupler(C12).
19. Remove the 6 screws and then remove the Flexible Cable
from the couplers(CB1, CB2, CB3).
20. Remove the 3 screws and then remove the C1-Board.
21. Remove the 8 screws and then remove the Flexible Cable
from the couplers(CB4, CB5, CB6, CB7).
22. Remove the 4 screws and then remove the C2-Board.
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23. Remove the 2 screws ( ) and then remove the S1-Board
Block.
24. Remove the 3 screws ( ) and then remove the AC Inlet
Block.
25. Remove the 2 screws of the Escutcheon.
26. Lift up the bottom of the Plasma Panel in the direction of the
arrow 1 and pull the Plasma Panel in the direction of the
arrow 2 and then remove the Plasma Panel.
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8 Location of Lead Wiring
8.1. Location of Lead Wiring (1)
The lead wiring is dressed as shown in figure.
8.2. Location of Lead wiring (2)
The lead wiring is dressed as shown in figure.
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8.3. Location of Lead wiring (3)
The lead wiring is dressed as shown in figure.
8.4. Location of Lead Wiring (4)
The lead wiring is dressed as shown in figure.
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9.1. Driver Set-up
9.1.1. Item / Preparation
1. Input a white signal to plasma video input.
2. Set the picture controls as follows.
Picture menu: Standard
Picture: +25
Aspect: Full
Caution
1. First perform Vsus adjustment.
2. Confirmation of Vscn voltage should be performed after
confirmation of Vad adjustment.
When Vad=-90V, Voltage of Vscn is 35V ±4V.
9.1.2. Adjustments
Adjust driver section voltages referring the panel data on the
panel data label.
Check or adjust the following voltages with the multimeter.
Name Test Point Voltage Volume Remarks
Vsus TPVSUS
(SS)
Vsus ± 1V R628 (P) *
Ve TPVE (SS) Ve ± 1V VR6000 (SS) *
Vset TPVSET
(SC)
232V ± 7V Fixed
Vad TPVAD (SC) -90V ± 1V VR6600
(SC)
Vscn TPVSCN
(SC)
Vad+125V ±
4V
Fixed
Vda TPVDA (SS) 70V ± 1V Fixed
Vdat P12-1, 5 (P) 70.2V ± 0.1V R665 (P)
PFC C446 (+)(-) 396V ± 0.5V R443 (P)
*See the Panel label.
9 Adjustment Procedure
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