Panasonic Viera TH-42PHW5 User manual

PowerSource: AC120V50/60Hz(UY/UZversion)
AC220-240V50/60Hz
(ExceptUY/UZversion)model)
PowerConsumption: 375W
2.4W(stand-bycondition)
(UY/UZversion)
3.0W(stand-bycondition)
(ExceptUY/UZversionmodel)
0.9W(Poweroffcondition)
(UY/UZversionmodel)
1.7W(Poweroffcondition)
(ExceptUY/UZversionmodel)
PlasmaDisplaypanel: DrivemethodACtype
50-inch,16:9aspectratio
ContrastRatio 3000:1
Screensize: 920mm(W)×518mm(H)
1,056mm(diagonal)
No.ofpixels
786,432(1,024(W)×768(H))
[3,072×768dots]
Operatingcondition:
Temperature 34°F-104°F(0°C-40°C)
Humidity 20%-80%
Horizontalscanningfrequency15.6-110kHz
Verticalscanningfrequency48-120Hz
©2002MatsushitaElectricIndustrialCo.,Ltd.All
rightsreserved.Unauthorizedcopyingand
distributionisaviolationoflaw.
TH-42PHD5
TH-42PHW5
GPH5DChassis
Connectionterminals:
AV
Videoin 1.0Vp-p(75-ohm)
S-VIDEOIN
(MINIDIN4PIN) Y:1Vp-p(75-ohm),C:0.286Vp-p (75-ohm)
AUDIOIN
(RCAPINJACK×2) 0.5Vrms(highimpedance)
COMPONENT/RGB
Y/G 1.0Vp-p/composite(75-ohm)
0.7Vp-p/non-composite(75-ohm)
PB/B 0.7Vp-p(75-ohm)
PR/R 0.7Vp-p(75-ohm)
HD 1.0-5.0Vp-p(highimpedance)
VD 1.0-5.0Vp-p(highimpedance)
AUDIOIN
(RCAPINJACK×2)
0.5Vrms(highimpedance)
PC
(HIGH-DENSITY
D-SUB15PIN)
R,G,B/0.7Vp-p(75-ohm)
HD,VD/1.0-5.0Vp-p(high
impedance)
AUDIOIN(M3JACK) 0.5Vrms(highimpedance)
SERIAL
EXTERNALCONTROL
TERMINAL(D-SUB9PIN)
RS-232CCOMPATIBLE
SPEAKERS(External
speakers) 616W[8W+8W](10%THD)
Dimensions(W×H×D): 40.2”(1,020mm)×24”(610mm)×3.5”(89
mm)
Weight(Mass) approx.66.1Ibs(29.5kg)(mainunitonly)
approx.75.4Ibs(33.7kg)(withspeakers)
WidePlasmaDisplay
Specifications
ORDERNO.ITD0207017C0
D10
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1Applicablesignals 3
2SafetyPrecautions 4
2.1.GeneralGuidelines 4
3PreventionofElectroStaticDischarge(ESD)to
ElectrostaticallySensitive(ES)Devices 5
4Aboutleadfreesolder(PbF) 6
5PCBStructuresheetofGPH5Dchassis 7
6ServiceHint 8
7LocationofLeadWiring 9
8AdjustmentProcedure 10
8.1.+BSet-up 10
8.2.DriverSet-up 10
8.3.InitializationPulseAdjust 11
8.4.P.C.B.(PrintedCircuitBoard)exchange 12
8.5.AdjustmentVolumeLocation 12
8.6.TestPointLocation 12
9Servicemode 13
9.1.CAT(computerAidedTest)mode 13
9.2.IICmodestructure(followingitemsvalueissampledata.)
15
10Alignment 16
10.1.Pedestalsetting 16
10.2.NTSCpanelwhitebalance 17
10.3.PAL/SECAMpanelwhitebalance 18
10.4.PC/RGBpanelwhitebalance 20
10.5.HD/525i/525ppanelwhitebalance 22
10.6.625ipanelbalance 24
10.7.Subbrightnesssetting 25
11Troubleshootingguide 27
11.1.SelfCheck 27
11.2.NoPower 28
11.3.NoPicture 29
11.4.Localscreenfailure 29
12OptionSetting 30
13ConductorViews 33
13.1.F-Board 33
13.2.P1-Board 34
13.3.P3,P5,P6,P7andP8-Board 37
13.4.HX-Board 39
13.5.HY-Board 40
13.6.HZ-Board 42
13.7.D1-Board 44
13.8.D2-Board 46
13.9.C1-Board 49
13.10.C2-Board 50
13.11.C3-Board 51
13.12.C4-Board 52
13.13.SC-Board 53
13.14.SU-Board 56
13.15.SD-Board 57
13.16.SS-Board 58
13.17.SS2andSS3-Board 61
13.18.Z-Board 62
13.19.H3,S1andV1-Board 63
14BlockandSchematicDiagrams 65
14.1.SchematicDiagramNotes 65
14.2.MainBlockDiagram 66
14.3.PowerBlockDiagram 67
14.4.P1-BoardSchematicDiagram 68
14.5.F,P3,P5,P6,P7andP8-BoardSchematicDiagram 69
14.6.HX-BoardBlockDiagram 70
14.7.HX-BoardSchematicDiagram 71
14.8.HYandHZ-BoardBlockDiagram 72
14.9.HY-Board(1of2)SchematicDiagram 73
14.10.HY-Board(2of2)SchematicDiagram 74
14.11.HZ-Board(1of2)SchematicDiagram 75
14.12.HZ-Board(2of2)SchematicDiagram 76
14.13.D1-BoardBlockDiagram 77
14.14.D1-Board(1of6)SchematicDiagram 78
14.15.D1-Board(2of6)SchematicDiagram 79
14.16.D1-Board(3of6)SchematicDiagram 80
14.17.D1-Board(4of6)SchematicDiagram 81
14.18.D1-Board(5of6)SchematicDiagram 82
14.19.D1-Board(6of6)SchematicDiagram 83
14.20.D2-BoardBlockDiagram 84
14.21.D2-Board(1of8)SchematicDiagram 85
14.22.D2-Board(2of8)SchematicDiagram 86
14.23.D2-Board(3of8)SchematicDiagram 87
14.24.D2-Board(4of8)SchematicDiagram 88
14.25.D2-Board(5of8)SchematicDiagram 89
14.26.D2-Board(6of8)SchematicDiagram 90
14.27.D2-Board(7of8)SchematicDiagram 91
14.28.D2-Board(8of8)SchematicDiagram 92
14.29.C1,C2,C3,andC4-BoardBlockDiagram 93
14.30.C1-BoardSchematicDiagram 94
14.31.C2-BoardSchematicDiagram 95
14.32.C3-BoardSchematicDiagram 96
14.33.C4-BoardSchematicDiagram 97
14.34.SC-BoardBlockDiagram 98
14.35.SC-Board(1of2)SchematicDiagram 99
CONTENTS
PagePage
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14.36.SC-Board(2of2)SchematicDiagram 100
14.37.SU-BoardBlockDiagram 101
14.38.SU-Board(1of2)SchematicDiagram 102
14.39.SU-Board(2of2)SchematicDiagram 103
14.40.SD-BoardBlockDiagram 104
14.41.SD-Board(1of2)SchematicDiagram 105
14.42.SD-Board(2of2)SchematicDiagram 106
14.43.SS-BoardBlockDiagram 107
14.44.SS,SS2,SS3andS1-BoardSchematicDiagram 108
14.45.Z-BoardBlockDiagram 109
14.46.H3andZ-BoardSchematicDiagram 110
15PartsLocation 111
15.1.PartsLocation1 111
15.2.PartsLocation2 112
15.3.PartsLocation3 113
16MechanicalReplacementPartsList 114
17ReplacementPartsList 116
17.1.RelpacementPartsListNotes 116
17.2.ElectricalReplacementPartsList 117
1Applicablesignals
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2.1.1.LeakageCurrentColdCheck
1.UnplugtheACcordandconnectajumperbetweenthetwo
prongsontheplug.
2.Measuretheresistancevalue,withanohmmeter,between
thejumperedACplugandeachexposedmetalliccabinet
partontheequipmentsuchasscrewheads,connectors,
controlshafts,etc.Whentheexposedmetallicparthasa
returnpathtothechassis,thereadingshouldbebetween
1M and5.2M .
Whentheexposedmetaldoesnothaveareturnpathto
thechassis,thereadingmustbe .
Figure1
2.1.2.LeakageCurrentHotCheck(See
Figure1.)
1.PlugtheACcorddirectlyintotheACoutlet.Donotusean
isolationtransformerforthischeck.
2.Connecta1.5k ,10wattsresistor,inparallelwitha0.15µF
capacitors,betweeneachexposedmetallicpartontheset
andagoodearthgroundsuchasawaterpipe,asshownin
Figure1.
3.UseanACvoltmeter,with1000ohms/voltormore
sensitivity,tomeasurethepotentialacrosstheresistor.
4.Checkeachexposedmetallicpart,andmeasurethe
voltageateachpoint.
5.ReversetheACplugintheACoutletandrepeateachofthe
abovemeasurements.
6.Thepotentialatanypointshouldnotexceed0.75volts
RMS.Aleakagecurrenttester(SimpsonModel229or
equivalent)maybeusedtomakethehotchecks,leakage
currentmustnotexceed1/2milliamp.Incasea
measurementisoutsideofthelimitsspecified,thereisa
possibilityofashockhazard,andtheequipmentshouldbe
repairedandrecheckedbeforeitisreturnedtothe
customer.
2SafetyPrecautions
2.1.GeneralGuidelines
1.Whenservicing,observetheoriginalleaddress.Ifashortcircuitisfound,replaceallpartswhichhavebeenoverheatedor
damagedbytheshortcircuit.
2.Afterservicing,seetoitthatalltheprotectivedevicessuchasinsulationbarriers,insulationpapersshieldsareproperly
installed.
3.Afterservicing,makethefollowingleakagecurrentcheckstopreventthecustomerfrombeingexposedtoshockhazards.
4
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3PreventionofElectroStaticDischarge(ESD)to
ElectrostaticallySensitive(ES)Devices
Somesemiconductor(solidstate)devicescanbedamagedeasilybystaticelectricity.Suchcomponentscommonlyarecalled
ElectrostaticallySensitive(ES)Devices.ExamplesoftypicalESdevicesareintegratedcircuitsandsomefield-effecttransistorsand
semiconductor"chip"components.Thefollowingtechniquesshouldbeusedtohelpreducetheincidenceofcomponentdamage
causedbyelectrostaticdischarge(ESD).
1.Immediatelybeforehandlinganysemiconductorcomponentorsemiconductor-equippedassembly,drainoffanyESDonyour
bodybytouchingaknownearthground.Alternatively,obtainandwearacommerciallyavailabledischargingESDwriststrap,
whichshouldberemovedforpotentialshockreasonspriortoapplyingpowertotheunitundertest.
2.AfterremovinganelectricalassemblyequippedwithESdevices,placetheassemblyonaconductivesurfacesuchasalminum
foil,topreventelectrostaticchargebuilduporexposureoftheassembly.
3.Useonlyagrounded-tipsolderingirontosolderorunsolderESdevices.
4.Useonlyananti-staticsolderremovaldevice.Somesolderremovaldevicesnotclassifiedas"anti-static(ESDprotected)"can
generateelectricalchargesufficienttodamageESdevices.
5.Donotusefreon-propelledchemicals.ThesecangenerateelectricalchargessufficienttodamageESdevices.
6.DonotremoveareplacementESdevicefromitsprotectivepackageuntilimmediatelybeforeyouarereadytoinstallit.(Most
replacementESdevicesarepackagedwithleadselectricallyshortedtogetherbyconductivefoam,alminumfoilorcomparable
conductivematerial).
7.ImmediatelybeforeremovingtheprotectivematerialfromtheleadsofareplacementESdevice,touchtheprotectivematerial
tothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.
Caution
Besurenopowerisappliedtothechassisorcircuit,andobserveallothersafetyprecautions.
8.MinimizebodilymotionswhenhandlingunpackagedreplacementESdevices.(Otherwisehamlessmotionsuchasthebrushing
togetherofyourclothesfabricortheliftingofyourfootfromacarpetedfloorcangeneratestaticelectricity(ESD)sufficientto
damageanESdevice).
5
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4Aboutleadfreesolder(PbF)
Note:Leadislistedas(Pb)intheperiodictableofelements.
Intheinformationbelow,PbwillrefertoLeadsolder,andPbFwillrefertoLeadFreeSolder.
TheLeadFreeSolderusedinourmanufacturingprocessanddiscussedbelowis(Sn+Ag+Cu).
ThatisTin(n),Silver(Ag)and(Cu)althoughothertypesareavailable.
ThismodelusesPbFreesolderinit’smanufactureduetoenvironmentalconservationissues.Forserviceandrepairwork,we’d
suggesttheuseofPbfreesolderaswell,althoughPbsoldermaybeused.
PCBsmanufacturedusingleadfreesolderwillhavethePbFwithinaleafSymbol stampedonthebackofPCB.
Caution
·Pbfreesolderhasahighermeltingpointthanstandardsolder.Typicallythemeltingpointis50~70°F(30~40°C)higher.
Pleaseuseahightemperaturesolderingironandsetitto700±20°F(370±10°C).
·Pbfreesolderwilltendtosplashwhenheatedtoohigh(about1100°For600°C).
IfyoumustusePbsolder,pleasecompletelyremoveallofthePbfreesolderonthepinsorsolderareabeforeapplyingPb
solder.Ifthisisnotpractical,besuretoheatthePbfreesolderuntilitmelts,beforeapplyingPbsolder.
·AfterapplyingPbFsoldertodoublelayeredboards,pleasecheckthecomponentsideforexcesssolderwhichmayflowonto
theoppositeside.(seefigurebelow)
SuggestedPbfreesolder
ThereareseveralkindsofPbfreesolderavailableforpurchase.ThisproductusesSn+Ag+Cu(tin,silver,copper)solder.
However,Sn+Cu(tin,copper),Sn+Zn+Bi(tin,zinc,bismuth)soldercanalsobeused.
6
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5PCBStructuresheetofGPH5Dchassis
BoardName Function Remarks
D1 FormatConverter 1
D2 PlasmaAISub-FieldProcessor 1
ZAudioout
SS Sustainout 1
SC Scanout 1
SU Sustainconnection(Upper) 1
SD Sustainconnection(Lower) 1
C1 DataDrive(UpperLeft)
C2 DataDrive(UpperRight)
C3 DataDrive(LowerRight)
C4 DataDrive(LowerLeft)
H3 Speakerterminal
S1 Powerswitch
SS2 Sustainconnection(Upper)
SS3 Sustainconnection(Lower)
V1 FrontSW.&Remotereceiver
FLinefilter
PPowersupply 1
P3 Drivevoltageoscillator
P5 Primaryoscillator
P6 PFCoscillator
P7 Drivevoltageprotection
P8 Processvoltageprotection
HX PC_type_Inputterminal
HY BNC_type_Inputterminal 2
HZ RCAtype_Inputterminal 3
Remarks
1.RecommendPCB´sforinitialserviceforGPH5Dchassis.
2.ForSystemmodelexceptBX,EXversion
3.ForConsumermodelexceptBX,EXversion
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6ServiceHint
8
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7LocationofLeadWiring
9
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8.1.+BSet-up
8.1.1.Item/Preparation
1.InputaGreyscalesignal.
2.etthepicturecontrols:-
Picturemode:Normal
Whitebalance:Normal
8.1.2.Adjustments
Adjustandconfirmindicatedtestpointforthespecifiedvoltage.
Adjust
Name Testpoint Voltage Volume
PFC P24pin1 400V±1V R548
Vsus P1pin2 175V±1V R639
Vda P3pin1 75.0V±0.5V R545
Confirm
Name Testpoint Voltage
+18V P4pin1 17.2V±0.5V
+13.5V P5pin1 13.2V±0.5V
Audio+15V P6pin1 13.5V±0.5V
Audio-15V P6pin3 -13.5V±0.5V
5.25V P5pin5 5.1V±0.3V
STB5V P7pin4 5.0V±0.3V
8.2.DriverSet-up
8.2.1.Item/Preparation
1.InputanAPL100%whitesignal.
2.Setthepicturecontrols:-
Picturemode:Normal
Whitebalance:Cool
Aspect:16:9
8.2.2.Adjustments
Adjustdriversectionvoltagesreferringthepaneldataonthe
paneldatalabel.
Name Testpoint Voltage Volume
Vsus TPVSUS
(SS-BOARD) Vsus±1V* R639 (P3-BOARD)
Vbk TPVBK
(SC-BOARD) Vbk±5V* R6670 (SC-BOARD)
Ve TPVE
(SS-BOARD) Ve±1V* R6770 (SS-BOARD)
Vset TPVSET
(SC-BOARD) 218V±6V ---
Vad TPVAD
(SC-BOARD) Vad±1V* R6477 (SC-BOARD)
Vda TP117
(C9-BOARD) 74V±1V R545 (P1-BOARD)
Vscn TPVSCN
(SC-BOARD) Vad+118±2V ---
*SeethePanellabel.
8AdjustmentProcedure
10
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8.3.InitializationPulseAdjust
1.InputaCrosshatchsignal.
2.Setthepicturecontrols:-
Picturemode:Normal
Whitebalance:Cool
Adjusttheindicatedtestpointforthespecifiedwaveform.
Testpoint Volume Level
T1 TPSC1(SC) R6523(SC) 0Sec
T2 TPSC1(SC) R6557(SC) 170±10µSec
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11
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8.4.P.C.B.(PrintedCircuitBoard)exchange
8.4.1.Caution
1.ToremoveP.C.B.,wait1minuteafterpowerwasofffordischargefromelectrolysiscapacitors.
8.4.2.QuickadjustmentafterP.C.B.exchange
P.C.B. Item Volume Testpoint Level
Pboard PFC R548(P3) P24connectorpin1 400V±1V
Vsus R639(P3) TPVsus(SS) Vsus±1V*
Vda R545(P1) TP117(C9) 74V±1V
SCboard Vad R6477(SC) TPVAD(SC) Vad±1V*
Vbk R6670(SC) TPVBK(SC) Vbk±5V*
SSboard Ve R6770(SS) TPVE(SS) Ve±1V*
D1,D2board Whitebalance,PedestalandSubbrightnessforNTSC,PAL,HD,PCand625isignals.
*SeethePanellabel.
8.5.AdjustmentVolumeLocation
8.6.TestPointLocation
12
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9Servicemode
9.1.CAT(computerAidedTest)mode
Toexitthe CATmode,accessthe IDmode andswitchoffthemainpower.
9.1.1.IICmode
SelecttheIICmodeby Up/Downbutton ontheremotecontrolatthefrontpageofCATmodethenpressthe Actionbutton on
theremotecontrol.
Subjectanditemarementionedonpage14.
ToexittheIICmode,pressthe Rbutton ontheremotecontrol.
13
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9.1.2.CDmode
SelecttheCDmodeby Up/Downbutton ontheremotecontrolatthefrontpageofCATmodethenpressthe Mutebutton onthe
remotecontrolmorethan5sec.
Micomsoftwareversion(IC9354),thisversioncanbeupgradeby
1.replaceofnewversionIC
2.Loadingthenewversionsoftwarefromloadertool,TZSC07036.
Memorydatachange
ToexittheCDmode,pressthe Rbutton ontheremotecontrol.
9.1.3.SDmode
SelecttheSDmodebyUp/DownbuttonontheremotecontrolatthefrontpageofCATmodethenpresstheActionbuttononthe
remotecontrol.
ToexittheSDmode,pressthe Rbutton ontheremotecontrol.
14
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9.2.IICmodestructure(followingitemsvalueissampledata.)
15
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10Alignment
10.1.Pedestalsetting
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OSDisthedifferencebetweenUY/UZmodelandExceptUY/UZmodel.
Picture:Normal(ExceptUY/UZ)/Standard(UY/UZmodel)
Whitebalance(ExceptUY/UZ)/ColorTemp(UY/UZmodel)
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10.2.NTSCpanelwhitebalance
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