Panasonic BB-HGW700A - Network Camera Router User manual

ORDER NO. KMS0411022C1
F5
Network Camera Management System
BB-HGW700A
(for U.S.A.)
2005 Panasonic Communications Co., Ltd. All rights reserved.
Unauthorized copying and distribution is a violation of law.
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked
PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear please read and follow the special instructions described in this manual
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on the use of PbF and how it might be permissible to use Pb solder during service and repair work.
1. ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard
solder or solder that contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which
is made from Tin, (Sn), Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB.
For service and repair work we suggest using the same type of solder although, with some precautions,
standard Pb solder can also be used.
Caution
- PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher
than Pb solder. Please use a soldering iron with temperature control
and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high
temperature soldering iron, please be careful not to heat too long.
- PbF solder will tend to splash if it is heated much higher than its melting
point, approximately 1100°F, (600°C).
- If you must use Pb solder on a PCB manufactured using PbF solder,
remove as much of the original PbF solder as possible and be sure that
any remaining is melted prior to applying the Pb solder.
- When applying PbF solder to double layered boards, please check the
component side for excess which may flow onto the opposite side (See
figure, below).
1.1. SUGGESTED PbF SOLDER
There are several types of PbF solder available commercially. While this product is manufactured using
Tin, Silver, and Copper, (Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and
Bismuth, (Sn+Zn+Bi). Please check the manufacturer’s specific instructions for the melting points of
their products and any precautions for using their product with other materials. The following lead free
(PbF) solder wire gauge are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
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1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDEmpR IS USED
2. FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
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When replacing, the following precautions will help to prevent recurring malfunctions.
1. Cover the plastic parts with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on the work-table.
4. Do not grasp IC or LSI pins with bare fingers.
3. CAUTION
3.1. SAFETY PRECAUTIONS
1. Before servicing, unplug the power cord to prevent an electrical shock.
2. When replacing parts, use only manufacturer’s recommended
components for safety.
3. Check the condition of power cord. Replace if wear or damage is
evident.
4. After servicing, be sure to restore the lead dress, insulation barriers,
insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, make the
following insulation resistance test to prevent a shock hazard.
3.2. INSULATION RESISTANCE TEST
1. Unplug the AC power cord and short the two prongs of the plug with a
jumper wire.
2. Measure the resistance value with ohmmeter between the jumpered AC
plug and each exposed metal cabinet part, such as screw threads, etc.
Note:
Some exposed parts may be isolated from the chassis by design. These will read infinity.
3. If the measurement is outside the specified limits, there is a possibility
of shock hazard. The equipment should be repaired and rechecked
before it is returned to the customer.
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3.3. POWER CAUTION
The power socket wall outlet should be located near this equipment and be easily accessible.
4. SPECIFICATIONS
Main Unit
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Heading Specifications
Power Supply Special AC Adaptor:
(Part Number: PQLV202Y)
INPUT: AC120V, 60 Hz
OUTPUT: DC120 V, 750mA
DC Cord: approx 3m
AC Cord: approx 1.7m (attached separately)
Power
Consumption
Maximum: approx 6W
Dimensions
(Width x Height
x Depth)
About 204mm (8.0inches) x About 36mm (1.4inches) x About 140mm (5.5inches)
(when the antenna is stored)
Weight 330g (0.7 lb)
Environmental
Requirements
Temperature (°C):
Humidity (%):
0 - 40 (32 - 104°F)
20 - 85 (non-condensing)
WAN Interface Number of Ports:
Connector Shape:
Physical Interface:
Throughout between
WAN and LAN (value
measured at Panasonic):
1
8 pin modular jack (RJ-45)
IEEE 802.3 (10Base-T)
IEEE 802.3u (100Base-TX)
Maximum of 98Mbps (IPv4/SmartBits)
Maximum of 77Mbps (IPv6/SmartBits)
Maximum of 16Mbps (FTP[PPTP])
LAN Interface Number of Ports:
Connector Shape:
Physical Interface:
4
8 pin modular jack (RJ-45)
IEEE 802.3 (10Base-T)
IEEE 802.3u (100Base-TX)
Wireless
Interface
Wireless Chip: made by Atheros Communications
IEEE 802.11b
Transmission Method:
Transmission Speed
([Standard value]Mbps):
Frequency Range (MHz):
Number of Channels:
Security:
DS-SS, half-duplex
11/5.5/2/1* (complying to IEEE 802.11b): automatic fallback
2412 - 2462 (center frequency)
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WPA-PSK (TKIP), WPA2-PSK (AES), WEP (64 bit/128 bit/152
bit), SSID, stealth SSID (hidden SSID, permitting/not
permitting connection using the ANY key), MAC address
filtering
IEEE 802.11g
Transmission Method:
Transmission Speed
([Standard value]Mbps):
Frequency Range (MHz):
Number of Channels:
Security:
OFMD (complying to IEEE 802.11g)/DS-SS (compatible with
IEEE 802.11b), half-duplex
54/48/36/24/18/12/9/6* (complying to IEEE 802.11g):
automatic
fallback
2412 - 2462 (center frequency)
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WPA-PSK (TKIP), WPA2-PSK (AES), WEP (64 bit/128 bit/152
bit), SSID, stealth SSID (hidden SSID, permitting/not
permitting connection using the ANY key), MAC address
filtering
-The figures shown are theoretical maximums and not the actual figures when using the product.
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Heading Specifications
User Interface FACTORY
DEFAULT
RESET button:
Status
Indicators
POWER:
WAN:
PPP:
LAN1-
LAN4:
WIRELESS
:
Returns the product to factory default settings.
Displays the power/main unit status
Displays the WAN link status
Displays the PPP link status
Displays the Ethernet link status
Displays the wireless link status
Software
Heading Specifications
Router Function WAN Side Connection
Mode:
PPPoE Connection:
RIP:
DHCP Server:
DNS Relay (DNS proxy
answering):
IP Packet Filtering:
Address Translation
Method:
PPPoE/DHCP/Static
Always/Manual
Yes (RIPv2)
Yes (128 client setup is possible)
Yes
Yes (64 setup)
IP masquerade, port forwarding
Wireless Device
Function
Security: WPA-PSK (TKIP), WPA2-PSK (AES), WEP (64 bit/128 bit/152
bit), stealth SSID (hidden SSID, permitting/not permitting
connection using the ANY key), MAC address filtering
Access Control ID/Password
Web Browser
Setup
Yes
Firmware Update Yes
5. PARTS LOCATIONS
5.1. FRONT VIEW
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5.2. REAR VIEW
6. SYSTEM REQUIREMWNTS
The PC (Personal Computer) and the network must meet the following technical specifications for the
BB-HGW700A to work properly.
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Item Description
Operating System Microsoft Windows 98 SE / Microsoft Windows Me /
Microsoft Windows 2000 / Microsoft Windows XP
Interface 10/100 Mbps Ethernet card and Ethernet cables for your
network
connection
RAM 64MB or more
Protocol TCP/IP network protocol installed
Web Browser Internet Explorer 6.0 or later
Compatible network cameras (Customer-provided): (as of Nov. 2004)
Indoor type
KX-HCM8
KX-HCM10
KX-HCM250
KX-HCM280
BB-HCM311A
BL-C10A
BL-C30A
Outdoor type
KX-HCM230
KX-HCM270
BB-HCM331A
7. CONNECTIONS
7.1. INTERNET CONFIGURATION WITH OPTICAL CABLE OR CABLE/
xDSL MODEM - (TYPE 1)
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8. DISASSEMBLY INSTRUCTIONS
8.1. HOW TO REMOVE THE CABINET COVER
1. Remove two Screws (A).
2. Remove the Cabinet Cover.
8.2. HOW TO REMOVE THE MAIN BOARD AND ANTENNA
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1. Remove four Screws (B).
2. Remove the Solder (two points) of Antenna Cable.
3. Remove the Main Board.
4. Remove the Antenna.
9. TROUBLE SHOUTING GUIDE
- Press the initializing button to return the unit to initial state.
- Connect Cable/XDSL modem to WAN port with cable.
- Connect PCs to ports of LAN 1 ~ LAN 4 with cable.
- Insert wireless network card (IEEE802.11b) into the PC.
- Program the property of the PC. (Property 1)
9.1. SETTING PC
9.1.1. Setting 1
LAN 1 PC
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IP Address: 192.168.0.200
Netmask: 255.255.255.0
DNS: -
Default Gateway (router) -
LAN 2 PC
IP Address: 192.168.0.201
Netmask: 255.255.255.0
DNS: -
Default Gateway (router): -
LAN 3 PC
IP Address: 192.168.0.202
Netmask: 255.255.255.0
DNS: -
Default Gateway (router): -
LAN 4 PC
IP Address: 192.168.0.203
Netmask: 255.255.255.0
DNS: -
Default Gateway (router): -
Wireless PC
IP Address: 192.168.0.204
Netmask: 255.255.255.0
DNS: -
Default Gateway (router): -
SSID Refer to the Label on the bottom of
the Unit
WEP (128 bit) Refer to the Label on the bottom of
the Unit
Communication mode Infrastructure
9.1.2. Setting 2
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WAN PC
IP Address: 10.0.0.100
Netmask: 255.0.0.0
9.2. PROCEDURE DIAGNOSIS AND REPAIR
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10. BLOCK DIAGRAM
11. CIRCUIT DESCRIPTION
11.1. MAIN BOARD (MAIN UNIT)
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11.1.1. Control Block
CPU (IC101) is a single chip processor with several functions such as protocol control, network control,
and memory control.
The program is stored in the readable/writable Flash ROM (IC222), and SDRAM (IC201, IC202) are used
in data processing.
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11.1.2. WAN Block
CPU (IC101) is connected by RMII (Reduced Media Independent Interface) to the Ether PHY IC (IC471).
The Connector (CN471) incorporates a transformer, which is used to isolate in and out of the set.
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11.1.3. LAN Block
CPU (IC101) is connected by RMII (Reduced Media Independent Interface) to the Ether Switch IC (IC411).
The Ether Switch IC (IC411) is connected to the 4 port Connector (CN411). The 4 port Connector
(CN411) incorporates a transformer, which is used to isolate in and out of the set.
11.1.4. Power Supply Block
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DC12V which is the output of AC adapter is supplied to the main set. The DC/DC converter (IC808)
converts DC12V to around 3.3V, and also generates the DC power supply needed for each block. The
voltage is divided into a 3.3V system, a 2.5V system and a 1.5V system.
The 3.3V system is supplied to each part as VDD33 (Control block), VDD332 (WAN block, LAN block)
and VRF (RF block).
The 2.5V system's voltage is transformed in the regulator IC (IC801) and is supplied to the WAN block
and LAN block as VSW25.
The 1.5V system's voltage is transformed in the regulator IC (IC802, IC803) and is supplied to each block
as VDD15 (Control block), VSWIS (LAN block).
11.2. RF BLOCK
11.2.1. Antenna
A /2 dipole antenna is used.
MAC/BBIC (IC501) controls the antenna switch (IC506). It switches the external antenna so as to
transmit or receive.
11.2.2. Reception Block
The receiving signal from the antenna transits the antenna switch (IC506). The signal is then inputted to
RFIC (IC502) after being amplified by LNA (Low Noise Amp). The RFIC (IC502) incorporates the LNA
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(Low Noise Amp), the Mixer for Frequency Converter and Synthesizer, which generates the received
local signals. The input signal is separated into the baseband signal In-Phase (RxI) and Quadrature
(RxQ) in RFIC (IC502), and is then outputted.
The baseband signal is inputted to MAC/BBIC (IC501) and is converted to A/D, to reproduce original
data.
11.2.3. Transmission Block
The data frame (data packet) generated in the built-in MAC in MAC/BBIC (IC501) is converted to an In-
Phase (TxI) and Quadrature (TxQ) signal, and it is then inputted to RFIC (IC502).
The signal is converted to an RF signal with the transmission frequency band in RFIC (IC502).
Then, an impedance conversion, a level adjustment and a suppression of the unnecessary frequency
component are processed. The processed signal is then transmitted from the antenna via the antenna
switch (IC506).
Meanwhile, the RF signal that was amplified in IC505 is fed-back to RFIC (IC502) after the level
detection. The RFIC (IC502) adjusts the gain in order to keep the output level of the transmission
constant.
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12. HOW TO REPLACE A FLAT PACKAGE IC
12.1. PREPARATION
- PbF (: Pb free) Solder
- Soldering Iron
Tip Temperature of 700°F ± 20°F (370°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be
able to use a 60 to 80 Watt iron where someone with less experience
could overheat and damage the PCB foil.
- Flux
Recommended Flux: Specific Gravity 0.82.
Type RMA (lower residue, non-cleaning type)
Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free) ().
12.2. PROCEDURE
1. Tack the flat pack IC to the PCB by temporarily soldering two
diagonally opposite pins in the correct positions on the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the soldering iron
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