Panasonic SA-AK520E User manual

ORDERNO. MD0402036C2
CD StereoSystem
SA-AK520E/ SA-AK520EB/ SA-AK520EG
Colour
(S)... SilverType
SPECIFICATIONS
Specifications
1

AMPLIFIERSECTION
RMSPoweroutput
THD 10%, both channelsdriven
1kHz
(Lowchannel) 65 W perchannel (6)
10 kHz
(High channel) 65 W perchannel (6)
80 Hz
(Subwooferchannel) 160 W perchannel (8)
Total power 420 W (Total)
Inputsensitivity
AUX 250 mV
InputImpedance
AUX 13.3k
FMTUNERSECTION
Frequencyrange
87.50 -108.00 MHz(50 kHz
steps)
Sensitivity 1.8 V(IHF)
S/N26 dB 1.5V
Antennaterminal(s) 75 (unbalanced)
AMTUNERSECTION
Frequencyrange 522 -1629 kHz(9kHzsteps)
Sensitivity
S/N20 dB(at999 kHz) 560 V/m
CASSETTEDECK SECTION
Track system 4 track, 2channel
Heads
Record/playback Solid permalloyhead
Erasure Doublegap ferritehead
Motor DCservo motor
Recording system ACbias 100 kHz
Erasing system ACerase 100 kHz
Tapespeed 4.8cm/s(17/8ips)
Overall frequencyresponse (+3 dB, -6dBatDECK OUT)
NORMAL (TYPEI) 35 Hz-14 kHz
S/N 50 dB(Aweighted)
Wowand flutter 0.18 %(WRMS)
Fastforward and rewind time Approx. 120 secondswith
C-60 cassettetape
CDSECTION
Sampling frequency 44.1kHz
Decoding 16 bitlinear
Pickup
Beam source/wavelength Semiconductorlaser/780 nm
Numberofchannels Stereo
Frequencyresponse 20 Hz-20 kHz(+1, -2dB)
Wowand flutter Belowmeasurablelimit
2

Digital filter 8 fs
D/Aconverter MASH(1bitDAC)
MP3
Bitrate 32 kbps-320 kbps
Sampling frequency 32 kHz, 44.1kHz, 48 kHz
GENERAL
PowerSupply(ForE, EGonly) AC230V, 50Hz
PowerSupply(ForEBonly) AC230 -240 V, 50Hz
Powerconsumption 272 W
PowerConsumption in standby
mode
0.5W
Dimensions(W xHxD) 250 x330 x369 mm
Mass 8.1kg
SYSTEM
SC-AK520 (E) Musiccenter:SA-AK520 (E)
Speaker:SB-AK520 (GC)
Subwoofer:SB-WAK520 (GC)
SC-AK520 (EB) Musiccenter:SA-AK520 (EB)
Speaker:SB-AK520 (GC)
Subwoofer:SB-WAK520 (GC)
SC-AK520 (EG) Musiccenter:SA-AK520 (EG)
Speaker:SB-AK520 (EG)
Subwoofer:SB-WAK520 (EG)
Notes:
1. Specificationsaresubjectto changewithout notice. Mass and
dimensionsareapproximate.
2. Total harmonicdistortion ismeasuredbythedigital spectrum
analyzer.
3. Thelabels“HIGH”and “LOW”on therearof thespeakersreferto
High frequency and Lowfrequency.
1. Caution forACMains Lead
3

2. BeforeRepairand Adjustment
DisconnectACpower, dischargePowerSupplyCapacitorsC520 and C540 through a10 , 5W
resistor toground.
DONOTSHORT-CIRCUITDIRECTLY(withascrewdriverblade, for instance), as thismay destroy
solidstatedevices.
Afterrepairsarecompleted, restorepowergraduallyusing avariac, toavoidovercurrent.
Currentconsumption atAC230V, 50 HzinNOSIGNALmode(volumeminatCD mode)shouldbe
~350mA.
3. Protection Circuitry
Theprotection circuitrymay have operatedifeitherofthefollowing conditionsarenoticed:
4

-Nosound isheardwhenthepoweristurnedon.
-Sound stopsduring aperformance.
Thefunction ofthiscircuitryistopreventcircuitrydamageif, for example, thepositive and
negative speakerconnection wires are
“shorted”, or ifspeakersystemswithanimpedance less thantheindicatedratedimpedance of
theamplifierareused.
Ifthisoccurs, followtheprocedureoutlines below:
1. Turnoff thepower.
2. Determinethecause oftheproblemand correct it.
3. Turnon thepoweronce againafteroneminute.
Note:
Whentheprotection circuitryfunctions, theunitwill notoperateunless thepowerisfirstturned
off and thenon again.
4. Prevention of ElectroStaticDischarge (ESD) to
ElectrostaticallySensitive(ES) Devices
Somesemiconductor (solidstate)devices canbedamagedeasilybyelectricity. Such
componentscommonlyarecalledElectrostaticallySensitive (ES)Devices. Examples oftypical
ES devices areintegratedcircuitsand somefield-effecttransistorsand semiconductor “chip”
components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of
componentdamagecausedbyelectro staticdischarge(ESD).
1. Immediatelybeforehandling anysemiconductorcomponentor
semiconductor-equipedassembly, drainoff anyESDon yourbody
bytouching aknownearthground. Alternatively, obtainand wear
acommerciallyavailabledischarging ESDwrist strap, which
shouldberemovedforpotential shock reasonspriortoapplying
powertotheunitundertest.
2. Afterremoving anelectrical assemblyequipedwithES devices,
place theassemblyon aconductivesurface suchas aluminium
foil, topreventelectrostaticchargebuildup orexposureofthe
assembly.
3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES
devices.
4. Use onlyananti-staticsolderremoverdevice. Somesolder
removal devices notclassifiedas “anti-static(ESDprotected)”can
generate electrical chargetodamageES devices.
5. Donotuse freon-propelledchemicals. These cangenerate
electrical charges sufficienttodamageES devices.
5

6. DonotremoveareplacementES device fromits protective
packageuntil immediatelybeforeyou arereadytoinstall it. (Most
replacementES devices arepackagedwithleadselectrically
shortedtogetherbyconductivefoam, aluminiumfoil or
comparableconductivematerial).
7. Immediatelybeforeremoving theprotectivematerial fromthe
leadsofareplacementES device, touchtheprotectivematerial to
thechassisorcircuitassemblyintowhichthedevice will be
installed.
Caution
Besureno powerisappliedtothechassisorcircuit, and observe
all othersafetyprecautions.
8. Minimizebodymotionswhenhandling unpackagedreplacement
ES devices. (Otherwise harmless motion suchas thebrushing
togetherofyourclothes fabricorthelifting ofyourfootfroma
carpetedfloorcangenerate staticelectricity(ESD)sufficientto
damageanES device).
5. Handling the Lead-free Solder
5.1. Aboutleadfree solder(PbF)
Distinction ofPbF P.C.B.:
P.C.B.s(manufactured)using leadfree solderwill have aPbF stampon theP.C.B.
Caution:
-Pbfree solderhas ahighermelting pointthanstandardsolder;
Typicallythemelting pointis50 -70°F(30 -40°C)higher. Please
use ahigh temperaturesoldering iron. Incase ofsoldering iron
withtemperaturecontrol, please set itto700 ±20°F(370 ±10°C).
-Pbfree solderwill tend tosplashwhenheatedtoo high (about
1100°F/600°C).
-Whensoldering orunsoldering, please completelyremoveall ofthe
solderon thepinsorsolderarea, and besuretoheat thesoldering
points withthePbfree solderuntil itmelts enough.
6

6. Handling Precautions ForTraverse Deck
Thelaserdiodeinthetraverse deck (optical pickup)may break downduetopotential difference
causedbystaticelectricityofclothes or humanbody.
So, becareful ofelectrostaticbreakdownduring repairofthetraverse deck (optical pickup).
-Handling oftraverse deck (optical pickup)
1. Donotsubject thetraverse deck (optical pickup)tostatic
electricityas itisextremelysensitivetoelectrical shock.
2. Theshortland betweentheNo.4(LD)and No.5(GND)pinson the
flexibleboard(FFC)isshortedwithasolderbuild-up toprevent
damagetothelaserdiode.To connect tothePCboard, besureto
openbyremoving thesolderbuild-up, and finishtheworkquickly.
3. Take carenottoapplyexcessivestress totheflexibleboard(FFC).
4. Donotturnthevariableresistor(laserpoweradjustment). Ithas
alreadybeenadjusted.
Fig6-1
-Grounding forelectrostaticbreakdownprevention
1. Humanbodygrounding
7

Use theanti-staticwrist straptodischargethestaticelectricity
fromyourbody.
2. Worktablegrounding
Putaconductivematerial (sheet) orsteel sheet on thearea where
thetraverse deck (optical pickup)isplaced, and ground thesheet.
Caution :
Thestaticelectricityofyourclothes will notbegroundedthrough
thewrist strap. So, take carenottolet yourclothes touchthe
traverse deck (optical pickup).
Caution whenReplacing theTraverse Deck :
Thetraverse deck has ashortpointshortedwithsoldertoprotect
thelaserdiodeagainst electroststics breakdown. Besureto
removethesolderfromtheshortpointbeforemaking connections.
Fig6-2
7. Precaution of LaserDiode
Caution :
Thisproduct utilizes alaserdiodewiththeunitturned"ON",
invisiblelaserradiation isemittedfromthepick up lens. /
Wavelength:780 nm/ Maximumoutputradiation powerfrompick
up :100 W/VDE/ Laserradiation frompick up unitissafetylevel,
butbesurethefollowings:
1. Donotdisassembletheoptical pick up unit, since radiation from
exposedlaserdiodeisdangerous.
2. Donotadjust thevariableresistoron thepick up unit. Itwas
alreadyadjusted.
3. Donotlookat thefocuslensusing optical instruments.
8

4. Recommend nottolookat pick up lensforalong time.
ACHTUNG:
Dieses Produkt enthälteineLaserdiode. ImeingeschaltetenZustand
wirdunsichtbareLaserstrahlung von derLasereinheitabgestrahlt. /
Wellenlänge:780nm/ MaximaleStrahlungsleistung der
Lasereinheit:100 W/VDE/ DieStrahlung anderLasereinheitist
ungefährlich, wenn folgendePunkte beachtet werden:
1. DieLasereinheitnichtzerlegen, dadieStrahlung ander
freigelegtenLaserdiodegefährlichist.
2. DenwerkseitigjustiertenEinstellreglerderLasereinhitnicht
verstellen.
3. NichtmitoptischenInstrumentenindieFokussierlinse blicken.
4. NichtüberlängereZeitindieFokussierlinse blicken.
ADVARSEL:Idetteaapparatanvendes laser.
CAUTION!
THIS PRODUCTUTILIZES ALASER.
USE OFCONTROLS ORADJUSTMENTS ORPERFORMANCE OFPROCEDURES OTHERTHAN
THOSE
SPECIFIEDHEREINMAYRESULTINHAZARDOUS RADIATIONEXPOSURE.
Use ofcaution label
9

8. Accessories
RemoteControl Transmitter
FMIndoor Antenna
ACPowerSupplyCord (For E &EGony)
10

ACPowerSupplyCord (For EBony)
AMLoop Antenna
AntennaPlug Adapter(For EBonly)
9. Operation Procedures
10. Disassemblyand Assemblyof MainComponent
10.1. Disassemblyflow chart
Thefollowing chartistheprocedurefor disassembling thecasing and insidepartsfor internal
inspection whencarrying outtheservicing.
Toassembletheunit, reverse thestepsshowninthechartas below.
11

10.2. DisassemblyofTop Cabinet and RearPanel
Step1Remove 3screwseachsideand 5screwsatrearpanel.
Step2Lift up bothsides oftop cabinet, pushthecabinetass’ytoward therearand remove it.
12

-DisassemblyofRearPanel
Step3Remove 8screws.
Step4DetachwireatCN305 (Fan).
13

Step5Drawrearpanel backward toremove.
10.2.1. Disassemblyfor CD Lid
(TheCD changerunitcanberemovedaftertheCD Lidisremoved)
-Follow the(Step1) -(Step5) ofItem10.2-DisassemblyofTop
Cabinet and RearPanel
Whenopening thedisc tray automatically(Using PowerSupply)
Step1ConnecttheACpowercord.
Step2Press thePOWERbutton topowerup themainunit.
Step3Press theOPEN/CLOSE button, thedisc tray will beopenautomatically.
14

Step4Release the2claws, and thenremove theCD Lid.
Step5Press theOPEN/CLOSE button, thedisc tray will beclose.
[Openthedisc tray manually(Using service tools)]
15

Step1Insertthegeartool intotheholeon theundersideofCD chassisand thenrotateinthe
direction ofarrow. Thedisc tray will beopen.
Step2Release the2claws, and thenremove theCD lidcover.
16

Step3RepeatStep2butrotatethegeartoolsinanti-clockwise direction.
Step4Thedisc tray will beclose.
10.3. DisassemblyofCD MechanismUnit
-Follow the(Step1) -(Step2) ofItem10.2-DisassemblyofTop
Cabinet and RearPanel
-Follow the(Step1) -(Step5) ofItem10.2.1-DisassemblyforCD Lid
Step1DetachtheFFCboards(CN309 &CN310).
17

Step2Release theclawsofbothends, and thenlift up theCD Mechanism Unit.
Step3Remove 4screws.
Step4Remove theCD chassis.
Step5Lay theCD mechanism unitas shown.
-Note:
FordisassemblyofCD mechanismunit, please refertoSection
10.7ofthismanual.
18

10.4. DisassemblyMainP.C.B., TransformerP.C.B. &PowerP.C.B.
10.4.1. Disassemblyfor theMainP.C.B.
-Follow the(Step1) -(Step5) ofItem10.2-DisassemblyofTop
Cabinet and RearPanel
-Follow the(Step1) -(Step5) ofItem10.2.1-DisassemblyforCD Lid
-Follow the(Step1) -(Step5) ofItem10.3-DisassemblyoftheCD
MechanismUnit
Step1DisconnectFFCboard atCN303, CN302 &CN304 .
Step2Lift up MainP.C.B. bydisconnectCN500 &CN501 as arrowshownabove.
10.4.2. DisassemblyoftheTransformerP.C.B.
-Follow the(Step1) -(Step5) ofItem10.2-DisassemblyofTop
Cabinet and RearPanel
-Follow the(Step1) -(Step5) ofItem10.2.1-DisassemblyforCD Lid
-Follow the(Step1) -(Step5) ofItem10.3-DisassemblyoftheCD
19

MechanismUnit
Step1Remove 3screws.
Step2Disconnectconnector CN950.
10.4.3. DisassemblyofthePowerP.C.B.
-Follow the(Step1) -(Step5) ofItem10.2-DisassemblyofTop
Cabinet and RearPanel
-Follow the(Step1) -(Step5) ofItem10.2.1-DisassemblyforCD Lid
-Follow the(Step1) -(Step5) ofItem10.3-DisassemblyoftheCD
MechanismUnit
-Follow the(Step1) -(Step2) ofItem10.4.1-Disassemblyforthe
MainP.C.B.
Step1Remove 2screws.
Step2Remove the2screwsfixedatheatsink.
NOTE:
20