Panasonic SA-PT850EE User manual

lGENERAL
Power Supply:
A
C 230 V, 50 Hz
Power Consumption: 135 W
Power Consumption in Standby Mode:
approx. 0.8 W
Dimensions (W×H×D): 430×60×363 mm
Mass: Main unit approx. 3.5 kg
Operating Temperature Range: +5°C to +35°C (+41°F to
+95°F)
Operating Humidity Range: 5% to 90% RH (no
condensation)
lAMPLIFIER SECTION
RMS Output Power: Dolby Digital Mode
lTotal RMS Dolby Digital mode power:
1000 W
At 1 kHz and total harmonic of 10%
lFront Ch: 125 W / Channel (3 Ω)
lCenter Ch: 250 W / Channel (6 Ω)
lSurround Ch: 125 W / Channel (3 Ω)
At 100 Hz and total harmonic of 10%
lSubwoofer Ch: 250 W / Channel (6 Ω)
©2007 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
SA-PT850EE
Colour
(S).......................Silver Type
(K).......................Black Type
DIN Output Power: Dolby Digital Mode
lTotal DIN Dolby Digital mode power:
590 W
At 1 kHz and total harmonic of 1%
lFront Ch: 75 W / Channel (3 Ω)
lCenter Ch: 145 W / Channel (6 Ω)
lSurround Ch: 75 W / Channel (3 Ω)
At 100 Hz and total harmonic of 1%
lSubwoofer Ch: 145 W / Channel (6 Ω)
lFM TUNER, TERMINALS SECTION
Preset Memory: FM 30 stations
Frequency Modulation (FM)
Frequency range: 87.50-108.00 MHz
(50-kHz step)
Sensitivity: 1.8 µV (IHF)
S/N 26 dB: 1.4 µV
Antenna terminals: 75 Ω(unbalanced)
Digital Audio Input:
Optical digital input: Optical terminal
Sampling frequency: 32 kHz, 44.1 kHz, 48 kHz
Phone Jack:
DVD Home Theater Sound System
Specifications
ORDER NO. MD0705016CE

Terminal: Stereo, 3.5 mm jack
Mic Jack:
Sensitivity: 0.7 mV, 1.2 kΩ
Terminal: Mono, 6.3 mm jack (2 system)
Front Music Port:
Sensitivity: 100 mV, 1.4 kΩ
Terminal: Stereo, 3.5 mm jack
USB Port:
USB standard: USB 2.0 full speed
Media file format support: MP3 (*.mp3)
WMA (*.wma)
JPEG (*.Jpg, *.JPEG)
MPEG4 (*.asf)
USB device file system: (FAT12) (FAT16) (FAT32)
USB Port power: Max. 500 mA
lDISC SECTION
Discs played (8 cm or 12 cm):
(1) DVD [DVD-Video, DivX (*6, *7)]
(2) DVD-RAM [DVD-VR, MP3 (*2, *7), JPEG (*4, *7), MPEG4
(*5, *7), DivX (*6, *7)]
(3) DVD-R [DVD-Video, DVD-VR, MP3 (*2, *7), JPEG (*4, *7),
MPEG4 (*5, *7), DivX (*6, *7)]
(4) DVD-R DL [DVD-Video, DVD-VR]
(5) DVD-RW [DVD-Video, DVD-VR, MP3 (*2, *7), JPEG (*4, *7),
MPEG4 (*5, *7), DivX (*6, *7)]
(6) +R/+RW [Video]
(7) +R DL [Video]
(8) CD, CD-R/RW [CD-DA, Video CD, SVCD (*1), MP3 (*2, *7),
WMA (*3, *7), JPEG (*4, *7), MPEG4 (*5, *7), DivX (*6, *7),
HighMAT Level 2 (Audio and Image)]
*1 Conforming to IEC62107
*2 MPEG-1 Layer 3, MPEG-2 Layer 3
*3 Windows Media Audio Ver.9.0 L3
lNot compatible with Multiple Bit Rate (MBR)
*4 Exif Ver 2.1 JPEG Baseline files
lPicture resolution: between 160 x 120 and 6144 x 4096
pixels (Sub sampling is 4:0:0, 4:2:0, 4:2:2, or 4:4:4).
Extremely long and narrow pictures may not be displayed.
*5 MPEG4 data recorded with the Panasonic SD multi cameras
or DVD video recorders.
lConforming to SD VIDEO specifications (ASF standard)/
MPEG4 (Simple Profile) video system/G.726 audio system.
*6 Plays all versions of DivX® video (including DivX®6) with
standard playback of DivX® media files. Certified to the DivX
Home Theater Profile.
*7 The total combined maximum number of recognizable audio,
picture and video contents and groups: 4000 audio, picture
and video contents and 400 groups.
Pick Up:
Wavelength:
lCD: 785 nm
lDVD: 662 nm
Laser power:
lCD: CLASS 1M
lDVD: CLASS 1
Audio Output (Disc):
Number of channels: 5.1 ch (FL, FR, C, SL, SR,
SW)
lVIDEO SECTION
V
ideo System: PAL 625/50, PAL 525/60,
NTSC
Composite Video Output:
lOutput level: 1 Vp-p (75 Ω)
lTerminal: Scart jack (1 system)
S-video Output:
lY output level: 1 Vp-p (75 Ω)
lC output level: PAL; 0.3 Vp-p (75 Ω)
NTSC; 0.286 Vp-p (75 Ω)
lTerminal Scart jack (1 system)
Component Video Output: (NTSC: 480p/480i, PAL: 576p/576i)
lY output level: 1 Vp-p (75 Ω)
lPBoutput level: 0.7 Vp-p (75 Ω)
lPRoutput level: 0.7 Vp-p (75 Ω)
lTerminal: Pin jack (Y: green, PB: blue,
PR: red) (1 system)
RGB Video Output:
lR output level: 0.7 Vp-p (75 Ω)
lG output level: 0.7 Vp-p (75 Ω)
lB output level: 0.7 Vp-p (75 Ω)
lTerminal: Scart jack (1 system)
HDMI AV Output:
lTerminal: Type A connector (19 pin)
This unit supports “HDAVI Control 2” function.
Note:
1. Specifications are subject to change without notice.
Mass and dimensions are approximate.
2. Total harmonic distortion is measured by the digital spectrum
analyzer.
Solder:
This model uses lead free solder (PbF).
Mechanism:
This model uses DL2S (Single tray) mechanism.
Refer to their respective original service manuals for *1, *2,
*3, *4.
2
SA-PT850EE

3
SA-PT850EE

1 Safety Precautions 6
1.1. GENERAL GUIDELINES 6
1.2. Before Repair and Adjustment 6
1.3. Protection Circuitry 6
1.4. Safety Parts Information 7
2 Prevention of Electrostatic Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 8
3 Precaution of Laser Diode 9
4 About Lead Free Solder (PbF) 10
4.1. Service caution based on legal restrictions 10
5 Handling Precautions for Traverse Unit 11
5.1. Cautions to Be Taken in Handling the Optical Pickup Unit
11
5.2. Grounding for electrostatic breakdown prevention 11
6 Accessories 13
7 Operation Procedures 14
7.1. Remote Control Key Buttons Operations 14
7.2. Main Unit Key Buttons Operations 15
7.3. Using the VIERA Link "HDAVI Control™" 16
7.4. Music Port Connection and Operation 17
7.5. USB Connection and Operation 18
7.6. Audio & Video Connections 19
7.7. Disc Information 20
8 New Features 22
8.1. About HDMI 22
9 Self-Diagnosis and Special Mode Setting 24
9.1. Service Mode Summary Table 24
9.2. Service Mode Table 24
9.3. DVD Self Diagnostic Function-Error Code 32
9.4. Sales Demonstration Lock Function 35
9.5. Service Precautions 36
10 Assembling and Disassembling 37
10.1. Disassembly Flow Chart 38
10.2. Main Components and P.C.B. Locations 39
10.3. Disassembly of Top Cabinet 40
10.4. Disassembly of the DVD Lid (When taking out disc
manually) 40
10.5. Disassembly of Front Panel 41
10.6. Disassembly of Volume P.C.B. 41
10.7. Disassembly of Mic P.C.B. 42
10.8. Disassembly of Panel P.C.B. 42
10.9. Disassembly of USB P.C.B. 43
10.10. Disassembly of Scart P.C.B. 43
10.11. Disassembly of Rear Panel 43
10.12. Disassembly of DVD Mechanism Unit 44
10.13. Disassembly of Relay P.C.B. 44
10.14. Disassembly of DVD Module P.C.B. 44
10.15. Disassembly of Main P.C.B. 45
10.16. Replacement of Regulator IC (IC2903) 45
10.17. Disassembly of D-Amp P.C.B. 46
10.18. Replacement of Digital Amp IC (IC5000) 47
10.19. Disassembly of SMPS & AC-Inlet P.C.B. 47
10.20. Replacement of Switch Regulator IC/Diode
(IC5701/D5702) 48
10.21. Replacement of Regulator Diode (D5801/D5802) 48
10.22. Replacement of Regulator Diode (D5803) 49
11 Assembly and Disassembly of DVD Mechanism Unit 50
11.1. Disassembly Procedure 50
12 Service Position 55
12.1. Checking & Repairing Scart P.C.B. 55
12.2. Checking & Repairing Panel P.C.B. 55
12.3. Checking & Repairing Mic P.C.B. 55
12.4. Checking & Repairing Main P.C.B. 55
12.5. Checking & Repairing D-Amp P.C.B. 56
12.6. Checking & Repairing DVD Module P.C.B. 56
12.7. Checking & Repairing SMPS P.C.B. 57
13 Measurements and Adjustments 58
13.1. Service Tools and Equipment 58
13.2. Important points in adjustment 58
13.3. Storing and handling of test discs 58
13.4. Optical adjustment 59
14 Abbreviations 60
15 Voltage and Waveform Chart 62
15.1. DVD Module P.C.B. 62
15.2. Main P.C.B. 64
15.3. D-Amp P.C.B. 65
15.4. SMPS P.C.B. 65
15.5. Panel & Tray Loading P.C.B. 66
15.6. Scart P.C.B. 66
15.7. Mic P.C.B. 66
15.8. Waveform Chart 67
16 Illustration of IC's, Transistors and Diodes 69
17 Wiring Connection Diagram 71
18 Block Diagram 73
18.1. System Control 73
18.2. DVD (Servo) 74
18.3. DVD (Audio) 75
18.4. DVD (Video) 76
18.5. DVD (HDMI) 77
18.6. Audio 78
CONTENTS
Page Page
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SA-PT850EE

18.7. Audio Digital Amp 79
18.8. Power 80
19 Schematic Diagram Notes 81
20 Schematic Diagram 83
20.1. DVD Module (DV5/HDMI) Circuit 83
20.2. Main, Panel & Mic Circuit 88
20.3. D-Amp & SMPS Circuit 94
20.4. Scart Circuit 98
20.5. Volume, USB, AC-Inlet, Relay, Tray Loading & Optical
Pickup Unit Circuit 99
21 Printed Circuit Board 101
21.1. DVD Module P.C.B. 101
21.2. Main P.C.B. 102
21.3. Panel, Volume & Mic P.C.B. 103
21.4. D-Amp & USB P.C.B. 104
21.5. SMPS P.C.B. 105
21.6. AC-Inlet, Scart, Relay & Tray Loading P.C.B. 106
22 Basic Troubleshooting Guide 107
22.1. Basic Troubleshooting Guide for Traverse Unit (DVD
Module P.C.B) 107
22.2. Basic Troubleshooting Guide for HDMI AV output 108
23 Overall Block Diagram for PT850 110
23.1. SC-PT850 Simplified Block 110
23.2. SC-PT850 Power Block 111
23.3. SC-PT850 SMPS Block 112
24 Terminal Function of ICs 113
24.1. IC2001 (C2CBYY000418): System Control IC 113
25 Exploded Views 114
25.1. Cabinet Parts Location 115
25.2. Packaging 117
26 Replacement Parts List 118
26.1. Component Parts List 119
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SA-PT850EE

1 Safety Precautions
1.1. GENERAL GUIDELINES
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, carry out the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1. LEAKAGE CURRENT COLD CHECK
1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on
the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the
chassis, the reading should be between 1MΩand 5.2MΩ.
When the exposed metal does not have a return path to the chassis, the reading must be
1.1.2. LEAKAGE CURRENT HOT CHECK
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a
good earth ground such as a water pipe, as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may
be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits
specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to
the customer.
Figure 1
1.2. Before Repair and Adjustment
Disconnect AC power to discharge unit AC Capacitors as such C5700, C5701, C5703, C5706, C5707 through a 10 Ω,10W
resistor to ground.
Caution:
DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices.
After repairs are completed, restore power gradually using a variac, to avoid overcurrent.
Current consumption at AC 230 V, 50 Hz in NO SIGNAL mode volume minimal should be ~ 600 mA.
1.3. Protection Circuitry
The protection circuitry may have operated if either of the following conditions are noticed:
· No sound is heard when the power is turned on.
· Sound stops during a performance.
The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are
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SA-PT850EE

“shorted”, or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.
If this occurs, follow the procedure outlines below:
1. Turn off the power.
2. Determine the cause of the problem and correct it.
3. Turn on the power once again after one minute.
Note:
When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.
1.4. Safety Parts Information
Safety Parts List:
There are special components used in this equipment which are important for safety.
These parts are marked by in the Schematic Diagrams & Replacement Parts List. It is essential that these critical parts
should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards. Do not modify the original design
without permission of manufacturer.
Table 1
Reference No. Part No. Part Name & Description Remarks
340 RAE2024Z-S TRAVERSE UNIT [M]
PC5701 B3PBA0000402 PHOTO COUPLER [M]
PC5702 B3PBA0000402 PHOTO COUPLER [M]
PC5720 B3PBA0000402 PHOTO COUPLER [M]
PC5799 B3PBA0000402 PHOTO COUPLER [M]
D5701 B0FBAR000041 DIODE [M]
DZ5701 ERZV10V511CS ZENER [M]
TH5701 D4CAC8R00002 THERMISTOR [M]
TH5860 D4CC11040013 THERMISTOR [M]
L2101 J0JBC0000015 CHIP INDUCTOR [M]
L2201 J0JBC0000015 CHIP INDUCTOR [M]
L2802 J0JBC0000015 CHIP INDUCTOR [M]
L2803 J0JBC0000015 CHIP INDUCTOR [M]
L2804 J0JBC0000015 CHIP INDUCTOR [M]
L5001 G0B9R5K00003 LINE CHOKE COIL [M]
L5002 G0B9R5K00003 LINE CHOKE COIL [M]
L5201 G0B9R5K00003 LINE CHOKE COIL [M]
L5301 G0B9R5K00003 LINE CHOKE COIL [M]
L5401 G0B9R5K00003 LINE CHOKE COIL [M]
L5402 G0B9R5K00003 LINE CHOKE COIL [M]
L5701 ELF15N035AN LINE FILTER [M]
L5702 ELF22V035B COIL [M]
L5703 ELF22V020A LINE FILTER COIL [M]
L6101 J0JBC0000019 CHIP INDUCTOR [M]
L6201 J0JBC0000019 CHIP INDUCTOR [M]
L6801 J0JBC0000019 CHIP INDUCTOR [M]
L6904 J0JBC0000019 CHIP INDUCTOR [M]
L6905 J0JBC0000019 CHIP INDUCTOR [M]
L6906 J0JBC0000019 CHIP INDUCTOR [M]
L6907 J0JBC0000019 CHIP INDUCTOR [M]
L6908 J0JBC0000019 CHIP INDUCTOR [M]
L6909 J0JBC0000019 CHIP INDUCTOR [M]
T2900 G4D1A0000117 SWITCHING TRANSFORMER [M]
T5701 ETS42BN1A6AD MAIN TRANSFORMER [M]
T5751 ETS19AB236AG BACK-UP TRANSFORMER [M]
F1 K5D502BNA005 FUSE [M]
FP2900 K5G401A00008 FUSE PROTECTOR [M]
P5701 K2AA2B000015 JACK AC INLET [M]
A2 K2CQ2CA00007 AC CORD [M]
C5700 F1BAF1020020 1000P [M]
C5701 ECQU2A334MLA 0.33 [M]
C5703 ECQU2A104MLC 0.1 [M]
C5706 F1BAF1020020 1000P [M]
C5707 F1BAF1020020 1000P [M]
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SA-PT850EE

2 Prevention of Electrostatic Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).
8
SA-PT850EE

3 Precaution of Laser Diode
CAUTION :
This product utilizes a laser diode with the unit turned on, invisible laser radiation is emitted from the pickup lens.
Wavelength : 662nm/785nm
Maximum output radiation power from pickup : 100µW/VDE
Laser radiation from pickup unit is safety level, but be sure the followings:
1. Do not disassemble the pickup unit, since radiation from exposed laser diode is dangerous.
2. Do not adjust the variable resistor on the pickup unit. It was already adjusted.
3. Do not look at the focus lens using optical instruments.
4. Recommend not to look at pickup lens for a long time.
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SA-PT850EE

4 About Lead Free Solder (PbF)
4.1. Service caution based on legal restrictions
4.1.1. General description about Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that
of the normal solder.
Definition of PCB Lead Free Solder being used
The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)
Service caution for repair work using Lead Free Solder (PbF)
· The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)
· To put lead free solder, it should be well molten and mixed with the original lead free solder.
· Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
· Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt
the lead free solder.
· Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30
degrees C (662±86°F).
Recommended Lead Free Solder (Service Parts Route.)
· The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)
Note
* Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%
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SA-PT850EE