Panasonic KX-TGP500B04 User manual

© Panasonic System Networks Co., Ltd. 2010
Unauthorized copying and distribution is a
violation of law.
ORDER NO. KM41003071CE
F24
Telephone Equipment
Model No. KX-TGP500B04
KX-TPA50B04
SIP Cordless Phone
Matte Black Version
(for U.S.A.)

2
KX-TGP500B04/KX-TPA50B04

3
KX-TGP500B04/KX-TPA50B04
TABLE OF CONTENTS
PAGE PAGE
1 Safety Precautions----------------------------------------------- 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (PbF: Pb free)-------------- 4
2.3. Discarding of P. C. Board-------------------------------- 5
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7
4.1. IP PHONE Description ----------------------------------- 7
4.2. US-DECT Description ------------------------------------ 8
4.3. Explanation of Link Data Communication ----------10
4.4. Block Diagram (Base Unit_Main)---------------------11
4.5. Block Diagram (Base Unit_RF Part) -----------------12
4.6. Circuit Operation (Base Unit) --------------------------13
4.7. Block Diagram (Handset)-------------------------------16
4.8. Block Diagram (Handset_RF Part)-------------------17
4.9. Circuit Operation (Handset)----------------------------18
4.10. Circuit Operation (RF Part)-----------------------------21
4.11. Circuit Operation (Charger Unit) ----------------------22
4.12. Signal Route -----------------------------------------------23
5 Location of Controls and Components ------------------24
6 Installation Instructions ---------------------------------------24
7 Operating Instructions-----------------------------------------24
8 Test Mode ----------------------------------------------------------25
8.1. Adjustment and Test Mode Flow Chart -------------25
8.2. Peer to Peer Mode Test---------------------------------32
8.3. USB Test Mode -------------------------------------------43
9 Service Mode -----------------------------------------------------48
9.1. How to Clear User Setting------------------------------48
9.2. Handset Operation Using the Direct
Commands for IP Settings -----------------------------49
9.3. Web User Interface --------------------------------------50
9.4. IP Reset-----------------------------------------------------55
9.5. How to Change MAC Address Label
(Procedure after Replacing the Main
P.C.Board of Base Unit)---------------------------------56
10 Troubleshooting Guide ----------------------------------------58
10.1. Troubleshooting Flowchart -----------------------------58
10.2. Failure Analysis of DSP, FLASH ROM and
RAM (Base Unit)------------------------------------------80
11 Disassembly and Assembly Instructions ---------------85
11.1. Disassembly Instructions -------------------------------85
11.2. How to Replace the Handset LCD -------------------88
12 Measurements and Adjustments---------------------------90
12.1. Things to Do after Replacing IC ----------------------90
12.2. Base Unit Reference Drawing-------------------------91
12.3. Handset Reference Drawing---------------------------92
12.4. Frequency Table ------------------------------------------93
13 Miscellaneous ----------------------------------------------------94
13.1. Explanation of IC Terminals (RF Part)---------------94
13.2. How to Replace the Flat Package IC----------------95
13.3. How to Replace the Shield Case ---------------------97
13.4. Terminal Guide of the ICs, Transistors and
Diodes ----------------------------------------------------- 100
14 Schematic Diagram ------------------------------------------- 101
14.1. For Schematic Diagram------------------------------- 101
14.2. Schematic Diagram (Base Unit_Main_DSP
Block) ------------------------------------------------------ 102
14.3. Schematic Diagram (Base Unit_Main_LAN
Block) ----------------------------------------------------- 104
14.4. Schematic Diagram (Base Unit_Main_Power) - 105
14.5. Schematic Diagram (Base Unit_RF Part)-------- 106
14.6. Schematic Diagram (Handset_Main) ------------- 108
14.7. Schematic Diagram (Handset_RF Part)-----------110
14.8. Schematic Diagram (Charger Unit)-----------------112
15 Printed Circuit Board -----------------------------------------113
15.1. Circuit Board (Base Unit_Main) ---------------------113
15.2. Circuit Board (Base Unit_RF Part)------------------115
15.3. Circuit Board (Handset_Main) -----------------------117
15.4. Circuit Board (Handset_RF Part) -------------------119
15.5. Circuit Board (Charger Unit)------------------------- 120
16 Exploded View and Replacement Parts List --------- 121
16.1. Cabinet and Electrical Parts (Base Unit) --------- 121
16.2. Cabinet and Electrical Parts (Handset)----------- 122
16.3. Cabinet and Electrical Parts (Charger Unit) ----- 123
16.4. Accessories and Packing Materials --------------- 124
16.5. Replacement Parts List------------------------------- 126

4
KX-TGP500B04/KX-TPA50B04
1 Safety Precautions
1.1. For Service Technicians
•Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
•ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2Warning
2.1. Battery Caution
Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the instructions.
2.2. About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50°F ~ 70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).

5
KX-TGP500B04/KX-TPA50B04
2.2.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3. Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.

6
KX-TGP500B04/KX-TPA50B04
3 Specifications
VoIP
Items Specifications
Support Codec • G.711 µ-law, G.711 A-law, G.726 (32k), G.729A, G.722
Interface • 10 base-T/100 base-TX Ethernet RJ-45 connector ×1
VoIP Status indication • STATUS indicator on the Base Unit
Supported Protocols • SIP, DNS, DHCP, HTTP (client/server), FTP, TFTP
• Telnet (Server), Syslog, RTP, RTCP, SNTP
Firmware Upgrading • local upgrading by web browser
Security • encrypted firmware and profile transmission (AES128, 192, 256 bit)

7
KX-TGP500B04/KX-TPA50B04
4 Technical Descriptions
4.1. IP PHONE Description
IP PHONE
IP phone is a telephone service provided by utilizing IP of the packet communication protocol used in the Internet.
Communicating with other party through the IP network by sending a voice, which is transformed into the digital data and
divided into Packet at IP phone.
SIP (Session Initiation Protocol)
The protocol which exchanges message for call control between both called and calling party and has the sequence control of
connection request, invitation, response and termination of sessions etc.
RTP (Real-time Transport Protocol)
Transport protocol to provide network delivery services for the transmission of real time data such as audio and video.
UDP (User Datagram Protocol) type that doesn’t carry packet loss measure and does not ensure timely delivery.

8
KX-TGP500B04/KX-TPA50B04
4.2. US-DECT Description
The frequency range of 1.92 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is same
frequency. Refer to Frequency Table (P.93).
4.2.1. TDD Frame Format (Full Slot)
4.2.2. TDD Frame Format (Long Slot) for G.722 CODEC
4.2.3. TDMA system
This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy
bearer use.
In 1 slot 417 µs, the 10 ms of voice data is transmitted.
•2 - Handsets Link
Traffic Bearer
A link is established between base unit and handset.
The state where duplex communication is performed.
Handset doesn't make up duplex in no free RF channels because of interference. (*1)
Dummy Bearer
Base unit sends Dummy-data to the all stand-by state handsets.
Handsets receive that data for synchronization and monitoring request from the base unit.
Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)
Note:
(*1) It is a feature under FCC 15 regulation and for interference avoidance.
In the case of checking RF parts, it is better in least interference condition.

9
KX-TGP500B04/KX-TPA50B04
4.2.4. Signal Flowchart in the Radio Parts
Reception
A voice signal from TEL line is encoded to digital data "TXDATA" (*1) by DSP (IC504) in a base unit.
Then TXDATA goes to RF PART, and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a selected antenna.
As for a handset RF, RF signal is received in two antennas.
RFIC (IC701) compares RF signal levels and selects the antenna to be used. Then RFIC down-converts to 864 kHz IF signal
from RX signal in the selected antenna, and demodulates it to digital data "RXDATA"(*1).
DSP (IC504) converts RXDATA into a voice signal and outputs it to speaker.
Transmission
A voice signal from microphone is encoded to digital data "TXDATA" by DSP (IC501) in a handset.
Then TXDATA goes to RF PART, and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a selected antenna.
As for a base unit RF, RF signal is received in two antennas.
RFIC (IC701) compares RF signal levels and selects the antenna to be used. Then RFIC down-converts to 864 kHz IF signal
from RX signal in the selected antenna, and demodulates it to digital data "RXDATA".
DSP (IC501) converts RXDATA into a voice signal and outputs it to TEL line.
Note:
(*1) TXDATA and RXDATA are bundled to one signal as "RXTXDATA" of DSP(IC504) in base unit.

10
KX-TGP500B04/KX-TPA50B04
4.3. Explanation of Link Data Communication
4.3.1. Calling
4.3.2. To Terminate Communication
4.3.3. Ringing

11
KX-TGP500B04/KX-TPA50B04
4.4. Block Diagram (Base Unit_Main)
PHY
X501
DC-jack
13.824MHz
PDN
RESET
I
C
701
I
C
504
KX-TGP500 BLOCK DIAGRAM (Base Unit_Mai
n)
LED
SPI
DECT
RF
KEY
4M
Atmel
128M
SD_RAM
64Mbit
Program Flash
I
C
503
I
C
502
I
C
501
Reset
1.3V
Reg
I
C
301
I
C
505
VDD
25MHz
I
C
401
X401
PDN
3.3V
DCDC
I
C
303
D305
MII RJ45
with Trans
JK401
VCC

12
KX-TGP500B04/KX-TPA50B04
4.5. Block Diagram (Base Unit_RF Part)
V_PA V_RF DVCC
Note: (*1) Antenna Type: wired dipole antenna
KX-TGP500 BLOCK DIAGRAM (Base Unit_RF Part)
PLL 13.824 MHz
IC701
ANT1 (*1)
ANT2 (*1)
Control
Logic
Mixer
A/D
Demodulator
delta-sigma Modulator
D781 D771
BCLK SYN_OUT SYN_EN SYN_CLK SYN_DATA SLOT_CTROL RADIO_EN RXTXDATA RF_RSTN
Divider
1.5
DSP
IC504

13
KX-TGP500B04/KX-TPA50B04
4.6. Circuit Operation (Base Unit)
General Description:
(DSP, Flash Memory) is a digital speech/signal processing system that implements all the functions of speech compression,
and memory management.
The DSP system is fully controlled by a host processor DSP. The host processor provides activation and control of all that
functions as follows.
4.6.1. DSP (Digital Speech/Signal Processing: IC504)
•Caller ID demodulation
The DSP implements monitor that provide CID information from the Central Office.
•Digital Switching
The voice signal from IP line is transmitted to the handset or the voice signal from the handset is transmitted to the IP line, etc.
They are determined by the signal path route operation of voice signal.
•Block Interface Circuit
RF part, LED, Key scan, Ethernet interface.
•VOIP (Voice over Internet Protocol)
The voice data encoding/decoding and RTP (Real-time Transport Protocol) packet conversion are performed at the VoIP part.

14
KX-TGP500B04/KX-TPA50B04
4.6.2. Data Flash Memory (IC501)
Following information data is stored.
•Settings
ex: message numbers, ID code, MAC address, Phone book.
4.6.3. Program Flash Memory (IC502)
• IP-Phone Application program and config Data are stored.
4.6.4. Power Supply Circuit
Function:
The power supply voltage from AC adaptor is converted to the desired voltage of each block.
Circuit Operation:
• IC303: 3.3 V DC DC Converter

15
KX-TGP500B04/KX-TPA50B04
4.6.5. Reset Circuit
Function:
This circuit is used to initialize the microcomputer when it incorporates an AC adaptor.
Circuit Operation:
When the AC Adaptor is inserted into the unit, then the voltage is shifted by IC303 and power is supplied to the DSP.
The set starts to operate when VCC goes up to 3.3 V or more in the circuit voltage diagram.
Note:
• Refer to Circuit Board (Base Unit_Main) (P.113).

16
KX-TGP500B04/KX-TPA50B04
4.7. Block Diagram (Handset)
V_PA
V_RF
V_IO
2.7 V
IC374
IC371
IC501
IC546
MIP
MIN
SPP1
LCD BACKLIGHT
SPN
BELL_LIGHT
HSM
HEADSET_DET
SPP2
SPPN
CI
CI
VCCPA
VCCA
VCC
PDN
DSP
RESET
CHG_CTL
CHG_DET
KEYSTOROBE_A~E
KEYIN_1~5
Q531
CHARGE
DETECT
CHARGE Q361 D361
Q362, Q364
CHARGE
CONTROL
RST
IC561
DC/DC
CONVERTER
REGULATOR
2.7 V
IC741
REGULATOR
MIC
SP
Headset Jack
CN431
R436/R437
LED561
HEADSET
DETECT
Monitor SP
LCD KEYS
RF part
ANT1ANT2
X501
13.824 MHz
Flash
Memory
BATTERY
Q561
LCD
BACK
LIGHT
RST
(BELL)
IC372
DC/DC
CONVERTER
IC373
DC/DC
CONVERTER
SYN_OUT
SYN_EN
SYN_CLK
SYN_DATA
SLOT_CTROL
RADIO_EN
TXDATA
RXDATA
RF_RSTN
RF_POWER
KX-TPA50 BLOCK DIAGRAM (Handset)
BL_LED
Q562
LED551-554
(KEY)

17
KX-TGP500B04/KX-TPA50B04
4.8. Block Diagram (Handset_RF Part)
V_PA V_RF
(*1) Antenna Type ( difference between base unit and handset in Radio parts)
ANT1: patterned antenna
KX-TPA50 BLOCK DIAGRAM (Handset_RF Part)
ANT2: wired dipole antenna
PLL
13.824 MHz
IC701
ANT1 (*1)
ANT2 (*1)
Control
Logic
Mixer A/D
Demodulator
D781 D771
BCLK SYN_OUT SYN_EN SYN_CLK SYN_DATA SLOT_CTROL RADIO_EN
TXDATA
RXDATA RF_RSTN
Note:
delta-sigma Modulator
DSP
IC501
Divider
1.5

18
KX-TGP500B04/KX-TPA50B04
4.9. Circuit Operation (Handset)
4.9.1. Construction
The circuit mainly consists of DSP and RF part as shown in the block diagram.
4.9.1.1. DSP: IC501
Function
• Battery Low, Power down detect circuit
• Ringer Generation
• Interface circuit
RF part, Speaker, Mic, LED, Key scan, LCD, Headset
Initial waves
Note:
(*1) The initializing time of the DSP chip is 20 ms under normal conditions.
4.9.1.2. RF part
Mainly voice signal is modulated to RF, or it goes the other way.
4.9.1.3. FLASH MEMORY: IC546
All setting data is stored.
ex: ID code, user setting (Phonebook, program data)

19
KX-TGP500B04/KX-TPA50B04
4.9.2. Power Supply Circuit
Voltage is supplied separately to each block.
4.9.3. Ringer and Handset SP-Phone

20
KX-TGP500B04/KX-TPA50B04
4.9.4. Sending Signal
The voice signal from the microphone is input to DSP (90, 91). CN431 is the headset jack. When the headphone is connected,
the R436/R437 detects it. The input from the microphone of the handset (MIM, MIP) is cut and the microphone signal from the
headset is input to DSP (95). Also the power for the microphone is supplied from DSP (92) and the power is turned OFF on
standby.
4.9.5. Reception Signal
The voice signal from the base unit is output to DSP (98). This signal is led to the headset jack (CN431). The signal through the
headset jack and the other signal output from DSP (97) drives the speaker. When the headset is inserted to the jack, the voice
signal is cut at the jack, so the sound does not come out from the speaker, but from the headset only.